Bottom heat conduction plate for processor and radiator

Abstract

The utility model discloses a bottom heat-conducting plate for a processor and a radiator in the field of radiators. The bottom heat-conducting plate comprises a ceramic bottom plate, a heat-conducting copper column penetrating through the upper surface and the lower surface of the ceramic bottom plate, and a first processor mounting box mounted on the ceramic bottom plate and used for mounting the processor; the radiator comprises the bottom heat-conducting plate, and a heat-conducting assembly and a fan which are arranged on the bottom heat-conducting plate. The ceramic bottom plate is installed between the processor and the main board, the processor and the main board are electrically connected through the heat conduction copper columns, normal work of the processor is guaranteed, and meanwhile heat at the bottom of the processor can be transmitted to the ceramic bottom plate through the heat conduction copper columns and then exhausted through the heat conduction assembly and the fan. Compared with an existing processor top heat radiator, the processor top heat radiator can achieve heat radiation of the top and the bottom of a processor at the same time, the heat radiation area is increased, the overall heat radiation effect of the processor can be greatly enhanced, the temperature of the processor is rapidly reduced, and it is guaranteed that the processor is in the best working state all the time.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of radiator, especially a bottom heat conduction plate for processor and radiator. BACKGROUND

[0002] At present, with the progress of science and technology, the performance of the processor of computer and other terminal machines is getting better and better, and many stacked chips have appeared, but due to the small nanometer process of the processor, the heat accumulation caused by the multi-level cache stacking is serious, and if the heat dissipation is insufficient, it will lead to the processor frequency drop, and even the processor damage and other problems. Taking an ordinary desktop computer as an example, the existing processor cooling method is top cooling, that is, a radiator in contact with the processor is arranged on the top of the processor to dissipate heat, whether it is air cooling or water cooling, this cooling method can only cool the top of the processor, and the heat accumulation at the bottom of the processor cannot be well conducted outward, especially for the stacked structure of multi-level chips. Therefore, in order to improve the heat dissipation effect of the processor, it is necessary to study a structure which can cool the bottom of the processor. SUMMARY

[0003] In order to overcome the defects that the existing radiator can only cool the top of the processor, the technical problem to be solved by the utility model is to provide a bottom heat conduction plate for processor and radiator which can directly cool and dissipate heat from the bottom of the processor.

[0004] The technical scheme adopted by the utility model to solve its technical problems is:

[0005] The bottom heat conduction plate for processor comprises a ceramic bottom plate which can be in contact with the radiator, a first mounting hole for fixing the ceramic bottom plate on the mainboard is arranged around the ceramic bottom plate, a plurality of through holes are arranged in the middle of the ceramic bottom plate, and a heat conduction copper column is fixed in each through hole, the number and position of the heat conduction copper columns correspond to the number and position of the pins on the mainboard for connecting the processor, a first processor mounting box is arranged in the middle of the top surface of the ceramic bottom plate, when the ceramic bottom plate is fixed on the mainboard and the processor is mounted in the first processor mounting box, the heat conduction copper columns realize the electrical connection between the processor and the corresponding pins on the mainboard and the heat conduction between the bottom of the processor and the ceramic bottom plate.

[0006] Further, a fixed back plate is further included, the fixed back plate is located on the side of the mainboard away from the ceramic bottom plate, and the ceramic bottom plate is clamped and fixed on the mainboard by the bolts sequentially passing through the first mounting hole on the ceramic bottom plate, the second mounting hole on the mainboard and the third mounting hole on the fixed back plate.

[0007] Further, a ceramic positioning plate is arranged in the middle of the bottom surface of the ceramic bottom plate, the shape of the ceramic positioning plate is adapted to the shape of the top opening of the original second processor mounting box on the mainboard, and the lower end of the heat conduction copper column exceeds the bottom surface of the ceramic positioning plate.

[0008] Further, the thickness of the ceramic positioning plate satisfies that the bottom surface of the ceramic bottom plate just abuts against the top of the second processor mounting box when the heat-conducting copper column contacts the pin on the mainboard.

[0009] Further, the ceramic positioning plate and the ceramic bottom plate are integrally formed.

[0010] Further, the top surface of the ceramic bottom plate is further provided with a plurality of heat pipe connecting grooves for contacting and positioning the heat sink and connecting columns for fixing the heat sink, and the periphery of the heat pipe connecting groove is provided with screw holes.

[0011] Further, the heat pipe connecting groove protrudes from the top surface of the ceramic bottom plate and is integrally formed with the ceramic bottom plate, and the top of the heat pipe connecting groove is provided with an arc-shaped groove.

[0012] The heat sink for the processor comprises the bottom heat-conducting plate for the processor, and further comprises a heat-conducting assembly and a fan, the lower end of the heat-conducting assembly contacts the top of the processor mounted in the first processor mounting box through the heat pipe connecting groove and is fixed on the connecting column through a screw, and the fan is mounted on the heat-conducting pipe assembly.

[0013] Further, the heat-conducting assembly comprises an inner heat-conducting assembly and an outer heat-conducting assembly, the inner heat-conducting assembly comprises a heat dissipation bottom plate and an inner heat-conducting pipe fixed on the heat dissipation bottom plate, the inner heat-conducting pipe is provided with a heat dissipation grid, the heat dissipation bottom plate is fixed on the connecting column through a screw so that the heat dissipation bottom plate contacts the top of the processor, the outer heat-conducting assembly comprises an annular grid and an outer heat-conducting pipe inserted in the annular grid, the bottom of the outer heat-conducting pipe is provided with a connecting seat, the connecting seat is covered on the heat pipe connecting groove and is fixed on the ceramic bottom plate through a screw, the inner heat-conducting assembly is located in the annular grid, and the fan is mounted on the annular grid.

[0014] Further, the heat-conducting assembly comprises a circulating water pump, a heat dissipation cold row and a water cooling head, the circulating water pump is fixed on the connecting column, the water cooling head comprises a plurality of water cooling heads which are respectively sealed and covered on the top of the processor and each heat pipe connecting groove through a sealing ring, a circulating branch pipe is arranged between each water cooling head and the circulating water pump, a circulating main pipe is arranged between the circulating water pump and the heat dissipation cold row, and the fan is arranged on the heat dissipation cold row.

[0015] The processor is provided with a ceramic bottom plate between the processor and the mainboard, and the heat-conducting copper column inserted in the ceramic bottom plate is used to realize the electrical connection between the processor and the mainboard, so that the normal work of the processor is ensured, the heat of the bottom of the processor is transmitted to the ceramic bottom plate through the heat-conducting copper column, and then the heat is discharged through the heat sink, so that the bottom heat dissipation of the processor is realized, the overall heat dissipation effect of the processor is greatly enhanced, and the processor is always in the best working state. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the exploded structure of this utility model;

[0017] Figure 2 This is a main sectional view of the present invention;

[0018] Figure 3 This is a wind-cooled radiator of this utility model;

[0019] Figure 4 This is a water-cooled radiator of this utility model.

[0020] The components in the diagram are labeled as follows: 1-Ceramic base plate, 2-Main board, 3-Processor, 4-First processor mounting box, 5-Fixed backplate, 6-Heat conduction component, 7-Fan, 11-First mounting hole, 12-Through hole, 13-Heat conduction copper pillar, 14-Ceramic positioning plate, 15-Heat pipe connection groove, 16-Connecting pillar, 17-Screw hole, 21-Second mounting hole, 22-Second processor mounting box, 51-Third mounting hole, 61-Inner heat conduction component, 62-Outer heat conduction component, 63-Circulating water pump, 64-Cooling radiator, 65-Water cooling head, 66-Sealing ring, 67-Circulation branch pipe, 68-Circulation main pipe, 611-Cooling base plate, 612-Inner heat conduction pipe, 613-Heat fan grille, 621-Annular grille, 622-Outer heat conduction pipe, 623-Connecting seat. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings.

[0022] It should be noted that if this utility model contains directional indicators such as up, down, left, right, front, and back, these are used to describe the relative positional relationships between components and are not specific references to the absolute positions of related components or the positional relationships between components. They are only used to explain the relative positional relationships and movement of components in a specific posture. If the specific posture changes, the directional indicator will also change accordingly. If this utility model contains terms related to quantity, such as "many," "multiple," or "several," these specifically refer to two or more.

[0023] like Figure 1 , Figure 2As shown, the utility model provides a kind of bottom heat-conducting plate for processor, including the ceramic bottom plate 1 that can be contacted with radiator, the first mounting hole 11 for being fixed on mainboard 2 is equipped with on the periphery of ceramic bottom plate 1, the middle part of ceramic bottom plate 1 is equipped with multiple through holes 12, a heat-conducting copper column 13 is fixed in each through hole 12 correspondingly, the quantity and position of heat-conducting copper column 13 correspond to the quantity and position of pin for connecting processor 3 on mainboard 2, the top surface middle part of ceramic bottom plate 1 is equipped with first processor installation box 4, when ceramic bottom plate 1 is fixed on mainboard 2, and processor 3 is installed in first processor installation box 4, heat-conducting copper column 13 realizes the electric connection of corresponding pin of processor 3 and mainboard 2, and the heat conduction between the bottom of processor 3 and ceramic bottom plate 1.

[0024] Wherein, ceramic bottom plate 1 is made of high thermal conductivity ceramic firing, has heat conduction and insulation double effect, of course can also use other materials with certain rigidity, and at the same time have good heat conduction and insulation function production.Its through hole 12 can be processed by laser drilling technology after ceramic bottom plate 1 is fired into shape;Or first insert array needle plate made of metal rod with higher melting point than ceramic, such as tungsten rod, tantalum hafnium carbide rod, etc. in blank before firing, then fire, finally take out array needle plate after ceramic bottom plate 1 is fired into shape, form through hole 12.Heat-conducting copper column 13 can use copper coating method to make molten copper liquid flow into through hole 12, after solidification, form copper column, copper column and ceramic bottom plate 1 are fixed together tightly during solidification process, so as to realize the heat conduction of heat-conducting copper column 13 and ceramic bottom plate 1;Or etching process is used, first, copper foil is etched into the same array needle plate structure as the pin for connecting processor 3 on mainboard 2, then insert into through hole 12 as a whole, finally remove redundant structure, form array copper column, then copper column and ceramic bottom plate 1 can be fixed tightly by high temperature firing again.Not matter which way is used, it is ensured that the upper and lower ends of heat-conducting copper column 13 slightly exceed the upper and lower surfaces of ceramic bottom plate 1, to ensure the stability of electric connection.The above is existing technology, other methods that can make the above structure exist in prior art, here too much repetition is not described, the present application only limits the arrangement structure of ceramic bottom plate 1 and heat-conducting copper column 13.

[0025] The shape and size of the ceramic base plate 1 and the position of the first mounting hole 11 are designed according to the structure of the motherboard 2, avoiding existing components on the motherboard 2 while ensuring that the first mounting hole 11 is aligned with existing holes on the motherboard 2. The structure of the first processor mounting box 4 is the same as the existing second processor mounting box 22 on the corresponding motherboard 2, ensuring that the processor 3 can be stably installed. The installation process of this utility model is as follows: first, fix the ceramic base plate 1 to the motherboard 2, so that the lower end of the heat-conducting copper pillar 13 is in close contact with the pins on the motherboard 2; then, install the processor 3 into the first processor mounting box 4, so that the processor 3 is in close contact with the upper end of the heat-conducting copper pillar 13; finally, install the heat sink, so that it is in contact with the ceramic base plate 1; for some thin and light products such as laptops or tablets that rely on contact for heat dissipation, the ceramic base plate 1 can be directly in contact with the product casing.

[0026] The heat dissipation principle of this invention is as follows: A vertical electrical connection between the processor 3 and the motherboard 2 is achieved through an array of pins formed by thermally conductive copper pillars 13, ensuring normal chip operation. Simultaneously, heat generated at the bottom of the processor 3 is laterally diffused to the ceramic base plate 1 via the thermally conductive copper pillars 13, thus achieving heat conduction at the bottom of the processor 3. Compared to existing top-heat conduction methods, this invention directly conducts heat to the bottom of the processor 3 where heat is concentrated. The heat-conducting part is closer to the processor core, increasing the final contact area between the processor and the heat sink, thereby improving the cooling speed and ensuring the processor is always in optimal operating condition.

[0027] To achieve a stable connection between the ceramic base plate 1 and the motherboard 2, this invention also includes one or more fixing back plates 5. The fixing back plates 5 are located on the side of the motherboard 2 facing away from the ceramic base plate 1. The ceramic base plate 1 is clamped and fixed to the motherboard 2 by bolts passing sequentially through a first mounting hole 11 on it, a second mounting hole 21 on the motherboard 2, and a third mounting hole 51 on the fixing back plate 5. This fixing method increases the stress-bearing area of ​​the motherboard 2, distributes the stress, and prevents damage to the motherboard 2 during the installation of the ceramic base plate 1.

[0028] This invention can be manufactured directly alongside the motherboard 2 during the production process to form an integrated structure, or it can be made into a separate, retrofitted product. If it is a retrofitted product, it is necessary to ensure that the heat-conducting copper pillars 13 on the ceramic base plate 1 are aligned with the pins on the motherboard 2. Therefore, a further solution is, as... Figure 2As shown, a ceramic positioning plate 14 is provided in the middle of the bottom surface of the ceramic base plate 1. The shape of the ceramic positioning plate 14 is adapted to the shape of the top opening of the existing second processor mounting box 22 on the motherboard 2. The lower end of the heat-conducting copper pillar 13 extends beyond the bottom surface of the ceramic positioning plate 14. The relative position of the top opening of the existing second processor mounting box 22 on the motherboard 2 and the internal pins is relatively precise. Therefore, by using the method of embedding the ceramic positioning plate 14 into the top opening of the second processor mounting box 22 to position and install the ceramic base plate 1, it can be ensured that the heat-conducting copper pillar 13 is aligned with the pins, thereby achieving a stable electrical connection.

[0029] For ease of processing, the ceramic positioning plate 14 and the ceramic base plate 1 are preferably integrally formed by ceramic firing. Furthermore, to prevent excessive compression between the heat-conducting copper pillar 13 and the pins on the motherboard 2 during installation, the thickness of the ceramic positioning plate 14 can be set such that when the heat-conducting copper pillar 13 contacts the pins on the motherboard 2, the bottom surface of the ceramic base plate 1 just abuts against the top of the second processor mounting box 22. This limiting method prevents the pins on the motherboard 2 from being damaged.

[0030] Furthermore, to facilitate the installation of the heat sink and improve the heat transfer effect between the heat sink and the ceramic base plate 1, multiple heat pipe connection slots 15 for contacting and positioning the heat sink, and connecting posts 16 for fixing the heat sink are provided on the top surface of the ceramic base plate 1. Screw holes 17 are provided around the heat pipe connection slots 15. Considering the limited internal space of products such as laptops, the ceramic base plate 1 may be very thin, making it inconvenient to process a slotted structure. Therefore, the heat pipe connection slots 15 can be designed to protrude from the top surface of the ceramic base plate 1, and an arc-shaped groove is provided at the top of the heat pipe connection slots 15. The entire heat pipe connection slot 15 is integrally formed with the ceramic base plate 1, and the number of heat pipe connection slots 15 is determined according to the size of the ceramic base plate 1 and the shape and structure of the corresponding heat sink.

[0031] In addition to the aforementioned bottom heat-conducting plate for the processor, this invention also provides a heat sink for the processor, including a heat-conducting component 6 and a fan 7. The lower end of the heat-conducting component 6 contacts the heat pipe connection groove 15 and the top of the processor 3 installed in the first processor mounting box 4, and is fixed to the connecting post 16 by screws. The fan 7 is mounted on the heat-conducting component 6. Regarding the specific structure of the heat-conducting component 6, this invention provides two solutions: air cooling and water cooling, as detailed below:

[0032] Air-cooled solutions such as Figure 3As shown, the heat-conducting component 6 includes an inner heat-conducting component 61 and an outer heat-conducting component 62. The inner heat-conducting component 61 includes a heat dissipation base plate 611 and an inner heat-conducting pipe 612 fixed on the heat dissipation base plate 611. The inner heat-conducting pipe 612 is provided with a heat-dissipating grille 613. The heat dissipation base plate 611 is fixed to the connecting post 16 with screws so that the heat dissipation base plate 611 contacts the top of the processor 3. The outer heat-conducting component 62 includes an annular grille 621 and an outer heat-conducting pipe 622 inserted in the annular grille 621. The bottom of the outer heat-conducting pipe 622 is provided with a connecting seat 623. The connecting seat 623 covers the heat pipe connecting groove 15 and is fixed to the ceramic base plate 1 with screws. The inner heat-conducting component 61 is located inside the annular grille 621, and the fan 7 is installed on the annular grille 621. The internal heat conduction component 61 and the external heat conduction component 62 are positioned and installed separately and in a nested arrangement, which can avoid problems such as poor contact between the heat conduction component 6 and the processor 3 or the ceramic base plate 1 due to manufacturing errors. At the same time, a single fan 7 can be used to dissipate heat from both the internal heat conduction component 61 and the external heat conduction component 62.

[0033] Water cooling solutions such as Figure 4 As shown, the heat-conducting assembly 6 includes a circulating water pump 63, a heat dissipation radiator 64, and water cooling heads 65. The circulating water pump 63 is fixed to the connecting column 16. Multiple water cooling heads 65 are respectively sealed to the top of the processor 3 and to each heat pipe connection slot 15 via sealing rings 66. The water cooling heads 65 in contact with the top of the processor 3 are pressed onto the processor 3 by the installation of the circulating water pump 63, while the water cooling heads 65 connected to the heat pipe connection slots 15 are fixed to the screw holes 17 around the heat pipe connection slots 15 by screws. A circulation branch pipe 67 is provided between each water cooling head 65 and the circulating water pump 63, and a circulation main pipe 68 is provided between the circulating water pump 63 and the heat dissipation radiator 64. The fan 7 is mounted on the heat dissipation radiator 64. The working process is as follows: the circulating water pump 63 sends cold water from the heat dissipation radiator 64 to each water cooling head 65, and simultaneously sends hot water flowing back from the water cooling heads 65 to the heat dissipation radiator 64 for cooling. Existing water-cooled radiators typically have only one water block 65 in contact with the top of the processor 3, resulting in limited heat dissipation. This invention increases the heat dissipation area of ​​the processor 3 by setting a ceramic base plate 1, thus allowing for the setting of multiple water blocks 65 and improving the heat dissipation effect.

[0034] Compared to the top heatsink currently installed above the processor, the two heatsinks provided by this invention can increase the heat dissipation area and simultaneously dissipate heat from the top and bottom of the processor. Therefore, they can significantly enhance the overall heat dissipation effect of the processor, rapidly reduce the processor temperature, and ensure that the processor is always in the best working condition.

Claims

1. A bottom heat slug for a processor, characterized by: The application relates to a bottom heat-conducting plate for a processor, which comprises a ceramic bottom plate (1) in contact with a heat radiator, a first mounting hole (11) is arranged on the periphery of the ceramic bottom plate (1) for fixing the ceramic bottom plate (1) on a main plate (2), a plurality of through holes (12) are arranged in the middle of the ceramic bottom plate (1), and a heat-conducting copper column (13) is fixed in each through hole (12) correspondingly, the number and position of the heat-conducting copper columns (13) correspond to the number and position of pins on the main plate (2) for connecting a processor (3), a first processor mounting box (4) is arranged in the middle of the top surface of the ceramic bottom plate (1), when the ceramic bottom plate (1) is fixed on the main plate (2) and the processor (3) is mounted in the first processor mounting box (4), the heat-conducting copper columns (13) realize the electric connection of the processor (3) and the corresponding pins on the main plate (2) and the heat conduction between the bottom of the processor (3) and the ceramic bottom plate (1).

2. The bottom heat slug for a processor of claim 1, wherein: The application further comprises a fixing back plate (5) arranged on the side of the main plate (2) away from the ceramic bottom plate (1), and the ceramic bottom plate (1) is fixed on the main plate (2) by a bolt clamping through a first mounting hole (11) on the ceramic bottom plate (1), a second mounting hole (21) on the main plate (2) and a third mounting hole (51) on the fixing back plate (5) in sequence.

3. The bottom heat slug for a processor of claim 1, wherein: A ceramic positioning plate (14) is arranged in the middle of the bottom surface of the ceramic bottom plate (1), the shape of the ceramic positioning plate (14) is adapted to the shape of the top opening of a second processor mounting box (22) originally arranged on the main plate (2), and the lower end of the heat-conducting copper column (13) exceeds the bottom surface of the ceramic positioning plate (14).

4. The bottom heat slug for a processor of claim 3, wherein: The thickness of the ceramic positioning plate (14) satisfies that when the heat-conducting copper column (13) is in contact with the pins on the main plate (2), the bottom surface of the ceramic bottom plate (1) is just in abutment with the top of the second processor mounting box (22).

5. The bottom heat slug for a processor of claim 3, wherein: The ceramic positioning plate (14) and the ceramic bottom plate (1) are integrally formed.

6. A base heat slug for a processor as claimed in any one of claims 1 to 5, wherein: A plurality of heat pipe connecting grooves (15) for contacting and positioning the heat radiator and connecting columns (16) for fixing the heat radiator are further arranged on the top surface of the ceramic bottom plate (1), and screw holes (17) are arranged on the periphery of the heat pipe connecting grooves (15).

7. The bottom heat slug for a processor of claim 6, wherein: The heat pipe connecting grooves (15) protrude from the top surface of the ceramic bottom plate (1) and are integrally formed with the ceramic bottom plate (1), and an arc-shaped groove is arranged on the top of the heat pipe connecting grooves (15).

8. A heat sink for a processor, characterized by: The application further relates to a bottom heat-conducting plate for a processor, which comprises a ceramic bottom plate (1) in contact with a heat radiator, a first mounting hole (11) is arranged on the periphery of the ceramic bottom plate (1) for fixing the ceramic bottom plate (1) on a main plate (2), a plurality of through holes (12) are arranged in the middle of the ceramic bottom plate (1), and a heat-conducting copper column (13) is fixed in each through hole (12) correspondingly, the number and position of the heat-conducting copper columns (13) correspond to the number and position of pins on the main plate (2) for connecting a processor (3), a first processor mounting box (4) is arranged in the middle of the top surface of the ceramic bottom plate (1), when the ceramic bottom plate (1) is fixed on the main plate (2) and the processor (3) is mounted in the first processor mounting box (4), the heat-conducting copper columns (13) realize the electric connection of the processor (3) and the corresponding pins on the main plate (2) and the heat conduction between the bottom of the processor (3) and the ceramic bottom plate (1). The application further comprises a fixing back plate (5) arranged on the side of the main plate (2) away from the ceramic bottom plate (1), and the ceramic bottom plate (1) is fixed on the main plate (2) by a bolt clamping through a first mounting hole (11) on the ceramic bottom plate (1), a second mounting hole (21) on the main plate (2) and a third mounting hole (51) on the fixing back plate (5) in sequence. A ceramic positioning plate (14) is arranged in the middle of the bottom surface of the ceramic bottom plate (1), the shape of the ceramic positioning plate (14) is adapted to the shape of the top opening of a second processor mounting box (22) originally arranged on the main plate (2), and the lower end of the heat-conducting copper column (13) exceeds the bottom surface of the ceramic positioning plate (14). The thickness of the ceramic positioning plate (14) satisfies that when the heat-conducting copper column (13) is in contact with the pins on the main plate (2), the bottom surface of the ceramic bottom plate (1) is just in abutment with the top of the second processor mounting box (22). The ceramic positioning plate (14) and the ceramic bottom plate (1) are integrally formed. A plurality of heat pipe connecting grooves (15) for contacting and positioning the heat radiator and connecting columns (16) for fixing the heat radiator are further arranged on the top surface of the ceramic bottom plate (1), and screw holes (17) are arranged on the periphery of the heat pipe connecting grooves (15). The heat pipe connecting grooves (15) protrude from the top surface of the ceramic bottom plate (1) and are integrally formed with the ceramic bottom plate (1), and an arc-shaped groove is arranged on the top of the heat pipe connecting grooves (15). The application further relates to a bottom heat-conducting plate for a processor, which comprises a ceramic bottom plate (1) in contact with a heat radiator, a first mounting hole (11) is arranged on the periphery of the ceramic bottom plate (1) for fixing the ceramic bottom plate (1) on a main plate (2), a plurality of through holes (12) are arranged in the middle of the ceramic bottom plate (1), and a heat-conducting copper column (13) is fixed in each through hole (12) correspondingly, the number and position of the heat-conducting copper columns (13) correspond to the number and position of pins on the main plate (2) for connecting a processor (3), a first processor mounting box (4) is arranged in the middle of the top surface of the ceramic bottom plate (1), when the ceramic bottom plate (1) is fixed on the main plate (2) and the processor (3) is mounted in the first processor mounting box (4), the heat-conducting copper columns (13) realize the electric connection of the processor (3) and the corresponding pins on the main plate (2) and the heat conduction between the bottom of the processor (3) and the ceramic bottom plate (1). The application further comprises a fixing back plate (5) arranged on the side of the main plate (2) away from the ceramic bottom plate (1), and the ceramic bottom plate (1) is fixed on the main plate (2) by a bolt clamping through a first mounting hole (11) on the ceramic bottom plate (1), a second mounting hole (21) on the main plate (2) and a third mounting hole (51) on the fixing back plate (5) in sequence. A ceramic positioning plate (14) is arranged in the middle of the bottom surface of the ceramic bottom plate (1), the shape of the ceramic positioning plate (14) is adapted to the shape of the top opening of a second processor mounting box (22) originally arranged on the main plate (2), and the lower end of the heat-conducting copper column (13) exceeds the bottom surface of the ceramic positioning plate (14). The thickness of the ceramic positioning plate (14) satisfies that when the heat-conducting copper column (13) is in contact with the pins on the main plate (2), the bottom surface of the ceramic bottom plate (1) is just in abutment with the top of the second processor mounting box (22). The ceramic positioning plate (14) and the ceramic bottom plate (1) are integrally formed. A plurality of heat pipe connecting grooves (15) for contacting and positioning the heat radiator and connecting columns (16) for fixing the heat radiator are further arranged on the top surface of the ceramic bottom plate (1), and screw holes (17) are arranged on the periphery of the heat pipe connecting grooves (15). The heat pipe connecting grooves (15) protrude from the top surface of the ceramic bottom plate (1) and are integrally formed with the ceramic bottom plate (1), and an arc-shaped groove is arranged on the top of the heat pipe connecting grooves (15). The application further relates to a bottom heat-conducting plate for a processor, which comprises a ceramic bottom plate (1) in contact with a heat radiator, a first mounting hole (11) is arranged on the periphery of the ceramic bottom plate (1) for fixing the ceramic bottom plate (1) on a main plate (2), a plurality of 9. The heat spreader for a processor of claim 8, wherein: The heat conducting assembly (6) comprises an inner heat conducting assembly (61) and an outer heat conducting assembly (62), the inner heat conducting assembly (61) comprises a heat dissipation bottom plate (611) and an inner heat conducting pipe (612) fixed on the heat dissipation bottom plate (611), a heat dissipation grid (613) is arranged on the inner heat conducting pipe (612), the heat dissipation bottom plate (611) is fixed on the connecting column (16) by screws, so that the heat dissipation bottom plate (611) is in contact with the top of the processor (3); the outer heat conducting assembly (62) comprises an annular grid (621) and an outer heat conducting pipe (622) inserted in the annular grid (621), the bottom of the outer heat conducting pipe (622) is provided with a connecting seat (623), the connecting seat (623) is arranged on the heat pipe connecting groove (15) and is fixed on the ceramic bottom plate (1) by screws, the inner heat conducting assembly (61) is located in the annular grid (621), and the fan (7) is installed on the annular grid (621).

10. The heat spreader for a processor of claim 8, wherein: The heat conducting assembly (6) comprises a circulating water pump (63), a heat dissipation cold row (64) and a water cooling head (65), the circulating water pump (63) is fixed on the connecting column (16), the water cooling head (65) comprises a plurality of water cooling heads, which are respectively sealed and arranged on the top of the processor (3) and each heat pipe connecting groove (15) by a sealing ring (66), and a circulating branch pipe (67) is arranged between each water cooling head (65) and the circulating water pump (63), a circulating main pipe (68) is arranged between the circulating water pump (63) and the heat dissipation cold row (64), and the fan (7) is arranged on the heat dissipation cold row (64).

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