Test system for SSD (Solid State Disk)

Abstract

The utility model discloses a test system for an SSD (Solid State Disk). The test system comprises an electric control board and a back board, an MCU chip and a plurality of power modules are integrated on the electric control board, the power modules supply power to the SSD hard disk, and the MCU chip controls the power modules to achieve power-on and power-off operation on the SSD hard disk. A plurality of high-speed connectors used for being connected with SSDs in an inserted mode are integrated on the back plate. Wherein the electric control board is arranged outside a high-low temperature box of the test system, the back board is arranged inside the high-low temperature box of the test system, and the electric control board and the back board are connected through a cable. According to the utility model, an electric control part and a connector part can be separated, the influence of temperature on electric control components is reduced, and the test result is more accurate.

Description

Technical Field

[0001] This utility model relates to the field of high and low temperature testing, and in particular to a testing system for SSD hard drives. Background Technology

[0002] In the design or manufacturing of some critical components or finished products, high and low temperature tests are typically conducted to understand the product's performance under extreme environments and to verify its reliability under such conditions. SSDs (Solid State Drives) are hard drives made using arrays of solid-state electronic storage chips, offering advantages not found in traditional mechanical hard drives, such as faster read / write speeds, lighter weight, lower power consumption, and smaller size. SSDs require reliability testing under both high and low temperature conditions, including both power-off and peak read speed operation.

[0003] Currently, high and low temperature testing systems for SSDs mainly consist of a power module, an MCU (Micro Control Unit), a power supply section, and a high-speed connector, all typically integrated onto a single board. The SSD is plugged into the high-speed connector. During high and low temperature testing, the entire board is usually placed in the chamber along with the SSD. This exposes the entire board to temperature fluctuations, causing deviations in test parameters. Higher temperatures reduce measurement accuracy and necessitate a reduction in power supply. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a testing system for SSD hard drives. This testing system separates the electronic control section and the connector section, reducing the impact of temperature on the electronic control components and making the test results more accurate.

[0005] This utility model is achieved through the following technical solution:

[0006] A testing system for SSD hard drives, comprising:

[0007] The electronic control board integrates an MCU chip and multiple power modules. The power modules supply power to the SSD hard drive, and the MCU chip controls the power modules to enable power-on and power-off operations for the SSD hard drive.

[0008] The backplate integrates multiple high-speed connectors for connecting SSD hard drives.

[0009] The control board is located outside the high and low temperature chamber of the test system, while the backplate is located inside the high and low temperature chamber of the test system, and the control board and the backplate are connected by cables.

[0010] Furthermore, the cable includes a power cord, one end of which is connected to the power module and the other end to a high-speed connector.

[0011] Furthermore, the cable also includes signal lines, one end of which is connected to the MCU chip and the other end to a high-speed connector.

[0012] Furthermore, the control board also integrates a current and voltage acquisition module, one end of which is electrically connected to the MCU chip and the other end is electrically connected to the power supply module.

[0013] Furthermore, the testing system also includes a power supply module, which is electrically connected to the electronic control board.

[0014] Furthermore, the power supply module outputs 24V.

[0015] Furthermore, an LED display module is integrated on the back panel, which is electrically connected to the MCU chip via signal lines.

[0016] Furthermore, the temperature range of the high and low temperature chamber is -70℃ to 150℃.

[0017] Compared with existing technologies, the advantages of this utility model are:

[0018] 1. By separating the electronic control section and the connector section, placing the electronic control board in a normal temperature environment, and placing the back panel in a high and low temperature chamber for testing, the impact of temperature on the components on the electronic control board is reduced, making the test results more accurate.

[0019] 2. Set the temperature range of the high and low temperature chamber to -70℃ to 150℃ to simulate the impact of harsh environments on SSD hard drives.

[0020] 3. By placing the MCU chip and power module on the control board and the high-speed connector on the backplane, the power ripple is reduced. Furthermore, the low-speed signal generated by the MCU chip is transmitted to the high-speed connector via signal lines, preventing the high-speed signal generated by the high-speed connector from being affected by interference and crosstalk from the low-speed signal during operation, thus ensuring the accuracy of the test.

[0021] 4. By placing the high-speed connector on the backplane, when frequent removal and removal of the SSD causes damage to the high-speed connector, only the backplane needs to be replaced, without replacing the control board, thus reducing maintenance costs. Attached Figure Description

[0022] Figure 1 This is a circuit diagram of a testing system for SSD hard drives according to an embodiment of the present invention.

[0023] Labeling Explanation: 1. Control Board; 11. MCU Chip; 12. Power Supply Module; 13. Current and Voltage Acquisition Module; 2. Backplane; 21. High-Speed ​​Connector; 22. LED Display Module; 31. Power Cord; 32. Signal Line; 4. Power Supply Module; 5. High and Low Temperature Chamber. Detailed Implementation

[0024] The following detailed, non-limiting description of the utility model's technical solution, in conjunction with preferred embodiments and accompanying drawings, is provided. In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0025] like Figure 1 As shown, an embodiment of the present invention provides a testing system for SSD hard drives, including an electronic control board 1 and a backplane 2. The electronic control board 1 integrates an MCU chip 11 and multiple power modules 12, wherein the power modules 12 supply power to the SSD hard drives, and the MCU chip 11 controls the power modules 12 to power on and off the SSD hard drives. The backplane 2 integrates multiple high-speed connectors 21 for connecting the SSD hard drives. Furthermore, the electronic control board 1 is located outside the high-low temperature chamber 5 of the testing system, and the backplane 2 is located inside the high-low temperature chamber 5, and the electronic control board 1 and the backplane 2 are connected by cables. By separating the electronic control components and the connector components, placing the electronic control board 1 in a normal temperature environment, and placing the backplane 2 in the high-low temperature chamber 5 for testing, the impact of temperature on the components on the electronic control board 1 is reduced.

[0026] In this embodiment, since the high-speed connector 21 is separated onto the backplate 2 and placed separately in the high and low temperature chamber 5, the temperature range of the high and low temperature chamber 5 can be increased from the original 0℃~105℃ to -70℃~150℃, so as to simulate the impact of harsh environment on SSD hard drive and make the test results more accurate.

[0027] The test system also includes a power supply module 4 electrically connected to the control board 1. The output voltage of the power supply module 4 is 24V.

[0028] In this embodiment, the cable is made of a high / low temperature resistant material to prevent extreme high / low temperature environments from affecting the cable and causing inaccurate test results. The cable includes a power line 31 and a signal line 32. One end of the power line 31 is connected to the power module 12, and the other end is connected to the high-speed connector 21. One end of the signal line 32 is connected to the MCU chip 11, and the other end is connected to the high-speed connector 21. By placing the MCU chip 11 and the power module 12 on the control board 1 and the high-speed connector 21 on the backplane 2, the power ripple is reduced; and the low-speed signal generated by the MCU chip 11 is transmitted to the high-speed connector 21 through the signal line 32, preventing the high-speed signal generated by the high-speed connector 21 from being affected by interference and crosstalk from the low-speed signal during operation, thus ensuring the accuracy of the test.

[0029] In addition, in this embodiment, the high-speed connector 21 is placed on the backplate 2. When the high-speed connector 21 is damaged due to frequent removal and removal of the SSD, only the backplate 2 needs to be replaced, and there is no need to replace the control board 1, which reduces maintenance costs.

[0030] Further reference Figure 1 The control board 1 also integrates a current and voltage acquisition module 13. One end of the current and voltage acquisition module 13 is electrically connected to the MCU chip 11, and the other end is electrically connected to the power supply module 12, so as to collect data during the test process.

[0031] The back panel 2 also integrates an LED display module 22. The LED display module 22 is electrically connected to the MCU chip 11 via signal line 32 and is used to display the test status of the SSD hard drive.

[0032] This invention discloses a testing system for SSD hard drives. By separating the electronic control unit and the connector unit, the electronic control board 1 is placed in a normal temperature environment, while the backplane 2 is placed in a high-low temperature chamber 5 for testing. This reduces the impact of temperature on the components on the electronic control board 1. Because the high-speed connector 21 is separated from the backplane 2 and placed separately in the high-low temperature chamber 5, the temperature range of the chamber 5 can be increased from the original 0℃~105℃ to -70℃~150℃, facilitating the simulation of the effects of harsh environments on SSD hard drives and making the test results more accurate. The cables are made of high- and low-temperature resistant materials to prevent damage from extremely high / low temperatures that could lead to inaccurate test results. By placing the MCU chip 11 and power module 12 on the electronic control board 1 and the high-speed connector 21 on the backplane 2, power ripple is reduced. Furthermore, the low-speed signal generated by the MCU chip 11 is transmitted to the high-speed connector 21 via the signal line 32, preventing interference and crosstalk between the high-speed signal generated by the high-speed connector 21 and the low-speed signal from affecting the accuracy of the test. By placing the high-speed connector 21 on the backplane 2, when frequent removal and removal of the SSD causes damage to the high-speed connector 21, only the backplane 2 needs to be replaced, without replacing the control board 1, thus reducing maintenance costs.

[0033] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A test system for SSD hard disks, characterized in that, The utility model relates to a test system for SSD hard disk, which comprises the following: An electric control board (1) is integrated with an MCU chip (11) and a plurality of power modules (12), the power modules (12) supply power for the SSD hard disk, and the MCU chip (11) controls the power modules (12) to realize power-on and power-off operations of the SSD hard disk; A backboard (2) is integrated with a plurality of high-speed connectors (21) for plugging the SSD hard disk; The electric control board (1) is arranged outside a high-low temperature box (5) of the test system, the backboard (2) is arranged inside the high-low temperature box (5) of the test system, and the electric control board (1) and the backboard (2) are connected through a cable.

2. The test system for SSD hard disks according to claim 1, characterized in that, The cable comprises a power line (31), one end of the power line (31) is connected with the power module (12), and the other end is connected with the high-speed connector (21).

3. The test system for SSD hard disks according to claim 1, characterized in that, The cable further comprises a signal line (32), one end of the signal line (32) is connected with the MCU chip (11), and the other end is connected with the high-speed connector (21).

4. The test system for SSD hard disks according to claim 1, characterized in that, The electric control board (1) is further integrated with a current-voltage acquisition module (13), one end of the current-voltage acquisition module (13) is electrically connected with the MCU chip (11), and the other end is electrically connected with the power module (12).

5. The test system for SSD hard disks according to claim 1, characterized in that, The test system further comprises a power supply module (4) electrically connected with the electric control board (1).

6. The test system for SSD hard disks according to claim 5, characterized in that, The output voltage of the power supply module (4) is 24V.

7. The test system for SSD hard disks according to claim 3, wherein, The backboard (2) is further integrated with an LED display module (22), the LED display module (22) is electrically connected with the MCU chip (11) through the signal line (32).

8. The test system for SSD hard disks according to claim 1, wherein, The temperature range of the high-low temperature box (5) is -70℃-150℃.

Images