Single-row pin base structure

Abstract

The utility model provides a single-row pin base structure, which is characterized by comprising a bottom plate, a plurality of pins and a plurality of pins, a stamping hole is formed in the bottom plate; sealing and welding glass; the punching plate is arranged in a punching hole in the bottom plate; a pin; the pins are arranged on the bottom plate and sintered in the stamping holes of the bottom plate in an insulating manner through seal welding glass, and one pin is directly and fixedly arranged on the bottom plate; the pins are distributed in a row and located on the center line of the bottom plate. According to the single-row pin base structure provided by the utility model, through optimizing layout and design, multiple beneficial effects of improving the space utilization rate, enhancing the signal transmission reliability, reducing the production cost, optimizing the production process, improving the application flexibility, optimizing the internal layout, reducing the loss and the like are realized. Due to the advantages, the structure has a wide application prospect in the field of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the technical field of 2.5G and 10G high and low speed products, specifically a single-row pin base structure. Background Technology

[0002] In the fields of 2.5G and 10G high- and low-speed products, optical devices are the core components in the signal transmission of optical modules, and their performance and stability directly affect the transmission efficiency and reliability of the entire optical module. These optical devices typically include both transmitting and receiving components, and soldering technology plays a crucial role in the assembly process of these components.

[0003] Currently, most companies in the market rely on manual soldering techniques for welding optical module components. However, this traditional soldering method has gradually revealed some significant problems over time. First, manual soldering is heavily influenced by human factors, making it difficult to maintain consistent soldering quality, which affects product performance and stability to some extent. Second, with increasing production demands, the capacity limitations of manual soldering are becoming increasingly apparent, making it difficult to meet the needs of large-scale production. Furthermore, optical module products contain numerous other components besides optical devices, and the assembly of these components also requires substantial labor costs, resulting in high overall costs. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a single-row pin base structure. Through optimized layout and design, it aims to achieve automated soldering, improve production efficiency, reduce costs, and simultaneously ensure product performance and stability. This innovative structure not only replaces traditional conventional pin bases but also allows for flexible adjustments to meet the diverse needs of different products.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A single-row pin base structure, characterized in that it comprises:

[0007] Base plate; the base plate is provided with stamping holes;

[0008] Sealed glass; set in the stamping holes on the base plate;

[0009] Pins; set on the base plate and sintered into the punching holes of the base plate by sealing glass insulation, one of the pins is directly fixed on the base plate; the pins are distributed in a row and located on the center line of the base plate.

[0010] In a preferred embodiment, a boss is provided on the base plate.

[0011] In a preferred embodiment, the number of pins is four, namely, the first pin, the second pin, the third pin, and the fourth pin, wherein the first pin is a ground pin and is located on the outermost side, and the boss is located near the first pin.

[0012] In a preferred embodiment, the diameter of the punching hole is 0.83 mm.

[0013] In a preferred embodiment, the height of the boss is 1.35mm.

[0014] In a preferred embodiment, the number of pins is 5, namely, the first pin, the second pin, the third pin, the fourth pin, and the fifth pin, wherein the first pin is a ground pin and is located on the outermost side.

[0015] In a preferred embodiment, the diameter of the punching hole is 0.8 mm.

[0016] In a preferred embodiment, the third and fourth pins protrude 0.53 mm above the bottom surface of the upper surface, and the second and fifth pins protrude 0.33 mm above the bottom surface of the upper surface.

[0017] In a preferred embodiment, the sealing glass is provided with a sealing hole, the diameter of which is the same as the diameter of the pin, and the two are concentric.

[0018] In a preferred embodiment, the diameter of the pin is set to 0.25 mm.

[0019] In a preferred embodiment, the width of the boss on the base plate is increased based on the existing design.

[0020] This invention provides a single-row pin base structure. It has the following advantages:

[0021] Improved space utilization: By designing a single-row pin base structure, the pins are distributed in a row and located on the center line of the base plate. This layout optimizes space utilization, making the entire device more compact and facilitating the installation of more components or the reduction of the overall device size in a limited space.

[0022] Enhanced signal transmission reliability: The design of the first pin as a ground pin and its location on the outermost side ensures the stability of signal transmission. Ground pins are typically used to provide a reference potential, and their proper placement helps reduce signal interference and improve the overall circuit performance.

[0023] Reduced production costs: By optimizing the diameters of the punch holes and pins (e.g., punch hole diameter of 0.83mm or 0.8mm, pin diameter of 0.25mm), costs can be reduced while maintaining performance. Smaller pin and punch hole sizes mean less material can be used, thus reducing production costs.

[0024] Manufacturing process optimization: The single-row lead base design facilitates the implementation of manufacturing processes such as reflow soldering. The smaller lead diameter and reasonable layout make the soldering process more precise and efficient, reducing the possibility of soldering errors and improving production efficiency.

[0025] Increased application flexibility: This structure can adapt to different product requirements, such as TO56 and TO46 sockets, by adjusting the number and layout of pins to meet different application scenarios. This flexibility enables the structure to be widely used in various electronic devices.

[0026] Internal layout optimization: The boss design not only provides additional support but also facilitates the arrangement of internal surface-mount components and signal cables. The height and width of the boss can be adjusted as needed to optimize the internal layout and improve the overall performance and reliability of the device.

[0027] Reduced losses: The single-row pin base structure design is more conducive to surface mount and wiring in the internal die bonding, eutectic bonding and wire bonding processes, which can effectively reduce losses and thus improve the energy efficiency and performance of the equipment.

[0028] In summary, the single-row pin base structure provided by this utility model achieves multiple beneficial effects through optimized layout and design, including improved space utilization, enhanced signal transmission reliability, reduced production costs, optimized manufacturing processes, increased application flexibility, optimized internal layout, and reduced losses. These advantages make this structure a promising candidate for widespread application in the field of electronic devices. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0030] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0031] In the diagram: 1-base plate, 2-sealing glass, 3-pin, 4-punch hole, 5-external heat exchanger, 6-bore, 31-first pin, 32-second pin, 33-third pin, 34-fourth pin, 35-fifth pin. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Example 1

[0034] like Figure 1 As shown, this utility model proposes a single-row pin base structure, which is a TO56 pin socket, comprising:

[0035] Base plate 1; The base plate 1 is provided with stamping holes 4;

[0036] 2. Sealed glass; set in the punching hole 4 on the base plate 1;

[0037] Pin 3; set on the base plate 1 and insulated and sintered into the punching hole 4 of the base plate 1 by sealing glass 2 to achieve good airtight insulation. There are 4 pins 3 and 3 punching holes 4. The pins 3 are respectively the first pin 31, the second pin 32, the third pin 33 and the fourth pin 34. The first pin 31 is the ground pin and is located on the outermost side to ensure the reliability of signal transmission. The third pin 33 is directly fixed on the base plate 1. The base plate 1 is provided with a boss 6, which is located near the first pin 31. The pins 3 are distributed in a row and located on the center line of the base plate 1.

[0038] The diameter of the punched hole 4 is 0.83mm to reduce costs. The height of the boss 6 is 1.35mm, which facilitates internal surface mount technology (SMT) and signal line routing. The diameter of the pin 3 is set to 0.25mm, which reduces costs and is also beneficial for the reflow soldering process. The sealing glass 2 has a sealing hole 5, the diameter of which is the same as the diameter of the pin 3, and the two are concentric.

[0039] Example 2

[0040] like Figure 2 As shown, a single-row pin base structure, which is a TO46 socket, includes:

[0041] Base plate 1; The base plate 1 is provided with stamping holes 4;

[0042] 2. Sealed glass; set in the punching hole 4 on the base plate 1;

[0043] Pin 3; It is set on the base plate 1 and insulated and sintered into the punch hole 4 of the base plate 1 by sealing glass 2 to achieve good airtight insulation. There are 4 punch holes 4 and 5 pins 3, which are respectively the first pin 31, the second pin 32, the third pin 33, the fourth pin 34 and the fifth pin 35. The first pin 31 is the ground pin and is located on the outermost side to ensure the reliability of signal transmission. The first pin 31 is directly fixed on the base plate 1. The pins 3 are distributed in a row and located on the center line of the base plate 1.

[0044] The diameter of the punch hole 4 is 0.8mm to reduce costs. The diameter of pin 3 is set to 0.25mm, which reduces costs and is also beneficial for the reflow soldering process. A sealing hole 5 is provided on the sealing glass 2, the diameter of which is the same as that of pin 3, and the two are concentric. The third pin 33 and the fourth pin 34 protrude from the upper surface of the base plate 1 by 0.53mm, and the second pin 32 and the fifth pin 35 protrude from the upper surface of the base plate 1 by 0.33mm, facilitating internal surface mount and signal line distribution.

[0045] This invention can replace most 2.5G and 10G product structures without significantly altering product performance or manufacturing complexity, and it also improves production efficiency during module welding and assembly. The single-row structure of the TO connector reduces welding errors and improves the production efficiency of conventional products. Furthermore, the novel structure facilitates surface mount technology (SMT) and wiring during internal die bonding, eutectic bonding, and wire bonding processes, effectively reducing losses and thus lowering production costs.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-row pin base structure, characterized in that, include: Base plate (1); the base plate (1) is provided with stamping holes (4); Sealed glass (2); set in the punching hole (4) on the base plate (1); Pin (3); set on the base plate (1) and sintered into the punch hole (4) of the base plate (1) through sealing glass (2), one of the pins (3) is directly fixed on the base plate (1); the pins (3) are distributed in a row and located on the center line of the base plate (1).

2. The single-row pin base structure according to claim 1, characterized in that, The base plate (1) is provided with a boss (6).

3. The single-row pin base structure according to claim 2, characterized in that, The number of pins (3) is 4, namely the first pin (31), the second pin (32), the third pin (33) and the fourth pin (34). The first pin (31) is the ground pin and is located on the outermost side. The boss (6) is located near the first pin (31).

4. The single-row pin base structure according to claim 2, characterized in that, The diameter of the punch hole (4) is 0.83 mm.

5. A single-row pin base structure according to claim 2, characterized in that, The height of the boss (6) is 1.35 mm.

6. The single-row pin base structure according to claim 1, characterized in that, The number of pins (3) is 5, namely the first pin (31), the second pin (32), the third pin (33), the fourth pin (34) and the fifth pin (35), with the first pin (31) being the ground pin and located on the outermost side.

7. A single-row pin base structure according to claim 6, characterized in that, The diameter of the punch hole (4) is 0.8 mm.

8. A single-row pin base structure according to claim 6, characterized in that, The third pin (33) and the fourth pin (34) protrude from the upper surface of the base plate (1) by 0.53 mm, and the second pin (32) and the fifth pin (35) protrude from the upper surface of the base plate (1) by 0.33 mm.

9. A single-row pin base structure according to any one of claims 1-8, characterized in that, The sealing glass (2) is provided with a sealing hole (5), the diameter of which is the same as the diameter of the pin (3), and the two are concentric.

10. A single-row pin base structure according to claim 9, characterized in that, The diameter of the pin (3) is set to 0.25 mm.

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