Laser shell and semiconductor spatial light laser

Abstract

The utility model provides a laser housing and a semiconductor spatial light laser, comprising a front panel and a rear panel which are oppositely and vertically arranged, and two side plates used for connecting the front panel and the rear panel, a first area enclosed by the front panel, the rear panel and the two side plates is used for placing the semiconductor spatial light laser, and a second area enclosed by the two side plates is used for placing the semiconductor spatial light laser. Detachably connected cover plates are arranged at the upper end and the lower end of the first area; and a fixing assembly for mounting the laser housing on the semiconductor device, the fixing assembly being disposed on any one or more of the front panel, the rear panel, and the two side plates. According to the utility model, the independent fixing assembly is arranged, and a proper laser fixing position is selected according to the internal structures of different semiconductor devices, so that the semiconductor devices are convenient to assemble and replace; the water cooling assembly is fixed through the front panel and the rear panel of the laser shell, and then the upper and lower layers of light source modules are installed, so that the double-layer semiconductor light source modules have supporting areas in the assembling process, and optical fibers are prevented from being bent.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, specifically to a laser housing and a semiconductor spatial laser. Background Technology

[0002] The current optical system of semiconductor spatial lasers is mostly based on multi-module fiber bundle coupling. Semiconductor spatial lasers specifically include laser water cooling and multiple semiconductor light source modules. This system can add or remove semiconductor light source modules according to the actual power requirements of the laser. For high power requirements, semiconductor light source modules can also be installed in double layers on the front side of the water cooling plate. In actual repair, the damaged semiconductor light source module can be directly replaced.

[0003] Existing semiconductor spatial laser housing designs specify the laser's fixed position based on the designated semiconductor device. The housing structure includes a base plate, a U-shaped sheet metal housing, and a front panel. During assembly, the entire semiconductor spatial laser is first assembled, then mounted on the base plate, followed by the front panel, and finally the U-shaped sheet metal housing is closed to complete the final assembly. However, several problems exist:

[0004] 1. The laser on the housing has only one fixed position, which is inconvenient for use with various semiconductor devices;

[0005] 2. Since the laser is assembled first and then the light source module is installed, when assembling the double-layer semiconductor light source module on the water-cooled plate, the lack of tooling to support the entire light source module makes it very easy for the optical fiber to bend and cause damage.

[0006] 3. When repairing, the entire light source module needs to be removed and placed on a tooling for repair, which is a cumbersome operation. Utility Model Content

[0007] To address the aforementioned technical problems, this utility model provides a laser housing that allows for the selection of a suitable laser mounting position based on the internal structure of different semiconductor devices, facilitating the assembly and replacement of semiconductor devices. The specific technical solution is as follows:

[0008] A laser housing for securing a semiconductor spatial light laser and mounting the semiconductor spatial light laser on a semiconductor device, comprising:

[0009] The front and rear panels are arranged relatively vertically.

[0010] Two side panels for connecting the front panel and the rear panel, the first area enclosed by the front panel, the rear panel and the two side panels for placing a semiconductor spatial light laser;

[0011] The first region is equipped with detachably connected cover plates at both its upper and lower ends; and

[0012] A mounting assembly for mounting a laser housing onto a semiconductor device, the mounting assembly being disposed on one or more of the front panel, rear panel, and two side panels.

[0013] Preferably, the front panel, rear panel, and two side panels are provided with stepped grooves at their upper and lower edges, so that the upper and lower ends of the first area form square mounting grooves for placing the cover plate.

[0014] This utility model also provides a semiconductor spatial laser, characterized in that it includes:

[0015] A water-cooled assembly, wherein a vertically arranged mounting end is formed at the front end of the water-cooled assembly, and the mounting end forms a height difference area with the upper and lower surfaces of the water-cooled assembly in the vertical direction;

[0016] Multiple light source modules are installed on the height difference area between the upper and lower surfaces of the water-cooling assembly; and

[0017] As described above, the front and rear panels of the laser housing are used to fix the water-cooling components, such that the height difference area is located within the first area enclosed by the front panel, the rear panel, and the two side panels.

[0018] As can be seen from the above technical solutions, this utility model, by setting up a separate fixing component, selects a suitable laser fixing position according to the internal structure of different semiconductor devices, which facilitates the assembly and replacement of semiconductor devices; by fixing the water-cooling component first through the front and rear panels of the laser housing, and then installing the upper and lower light source modules, the double-layer semiconductor light source modules have a support area during the assembly process, avoiding bending of the optical fiber; and because the water-cooling component is fixed first to form a support platform, during product repair, it is not necessary to completely remove the housing, but only to remove some components to replace or repair the semiconductor light source module. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the laser housing of this utility model, showing one embodiment of the mounting position of the fixing component;

[0020] Figure 2 This is a disassembled diagram of the laser housing;

[0021] Figure 3 This is a structural schematic diagram of the laser housing of this utility model, showing another embodiment of the mounting position of the fixing component;

[0022] Figure 4 A schematic diagram of the structure of a semiconductor spatial laser without its outer casing;

[0023] Figure 5An assembly diagram showing how the water-cooling components are fixed to the laser housing. Detailed Implementation

[0024] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Before describing the technical solutions of each embodiment of the present invention in detail, the terms and terms involved will be explained. In this specification, components with the same name or the same reference numerals represent similar or the same structures and are limited to illustrative purposes.

[0025] The laser housing of this invention is used to fix a semiconductor spatial light laser and to mount the semiconductor spatial light laser on a semiconductor device.

[0026] like Figure 4 As shown, the semiconductor spatial laser includes a water-cooling assembly 10 and multiple light source modules 20 fixed on the upper and lower surfaces of the water-cooling assembly. The water-cooling assembly 10 has a vertically arranged mounting end 11 at its front end. Preferably, water inlet and outlet pipe connectors 12 of the water-cooling assembly 10 are also provided on the mounting end 11.

[0027] The vertical dimension of the mounting end 11 needs to be greater than the thickness of the middle water-cooling plate of the water-cooling assembly 10. This will create a height difference area 13 between the water-cooling assembly and the upper and lower surfaces of the water-cooling assembly. In a preferred embodiment, multiple light source modules 20 are arranged side by side on both sides of the water-cooling assembly. This height difference area 13 makes it easier to install the light source modules 20.

[0028] like Figure 1-3 As shown, the laser housing 30 of this utility model includes a front panel 31, a rear panel 32, two side panels 33, and two cover plates 34 on the top and bottom.

[0029] The front panel 31 and the rear panel 32 are arranged vertically relative to each other. The front and rear panels are mainly used to install some electronic device connectors and fiber optic output ports. The panel with the fiber optic output port is usually defined as the front panel 31. In this embodiment, the front panel 31 is also provided with a through hole for the water pipe connector to pass through.

[0030] The two side panels 33 are used to connect the front and rear panels, such as... Figure 5 As shown, the two side panels 33 can also be installed with the front and rear panels using a slot structure, so that the entire assembly is placed horizontally, the parts fit together, and the positions of the front and rear panels are relatively symmetrical.

[0031] The front panel, rear panel, and two side panels together form a first area 35, which is used to house the semiconductor spatial laser. During the actual assembly of the semiconductor spatial laser, the front panel and rear panel are fixed to the front and rear mounting ends 11 of the water-cooling assembly. In this way, the water-cooling assembly 10 can be fixed independently without other tooling. The height difference area 13 formed by the upper and lower surfaces of the water-cooling assembly is also located within the enclosed first area 35, and then the multiple light source modules 20 of the upper and lower layers are installed.

[0032] The two cover plates 34 are detachably installed at the upper and lower ends of the first area 35. Specifically, stepped grooves are provided at the upper and lower edges of the front panel, rear panel, and two side plates, so that square mounting grooves 37 for placing the cover plates are formed at the upper and lower ends of the first area. Figure 5 It offers better overall protection and a more aesthetically pleasing appearance, and is also easier to disassemble.

[0033] The laser housing 30 of this invention also includes a fixing component 36 for mounting the laser housing on a semiconductor device, the fixing component 36 being disposed on one or more of the front panel 31, the rear panel 32, and the two side panels 33. Figure 1 As shown, in one embodiment, two separate fixing components 36 are mounted on the front panel 31; they can also be mounted on the rear panel 32 in the same manner. Figure 3 As shown, another embodiment is to install the two separate fixing components 36 on one of the side panels 33, or they can be installed on the side panels at symmetrical positions in the same way; of course, multiple installations can also be selected on the front and rear panels and the two side panels.

[0034] This utility model also provides a semiconductor spatial light laser, including a water-cooling component 10, a plurality of light source modules 20 mounted on a height difference region 13 on the upper and lower surfaces of the water-cooling component; and the aforementioned laser housing 30, wherein the front and rear panels of the laser housing are used to fix the water-cooling component 10, such that the height difference region 13 is located within a first region 35 enclosed by the front panel, the rear panel, and the two side panels.

[0035] The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A laser housing for fixing a semiconductor spatial light laser and mounting the semiconductor spatial light laser on a semiconductor device, characterized in that, include: The front and rear panels are arranged relatively vertically. Two side panels for connecting the front panel and the rear panel, the first area enclosed by the front panel, the rear panel and the two side panels for placing a semiconductor spatial light laser; The first region is equipped with detachable cover plates at both the upper and lower ends; as well as A mounting assembly for mounting a laser housing onto a semiconductor device, the mounting assembly being disposed on one or more of the front panel, rear panel, and two side panels.

2. The laser housing according to claim 1, characterized in that, The two side panels are installed with the front and rear panels using a slot structure.

3. The laser housing according to claim 1, characterized in that, The front panel, rear panel, and two side panels have stepped grooves at their upper and lower edges, forming square mounting grooves at the upper and lower ends of the first area for placing the cover plate.

4. A semiconductor spatial laser, characterized in that, include: A water-cooled assembly, wherein a vertically arranged mounting end is formed at the front end of the water-cooled assembly, and the mounting end forms a height difference area with the upper and lower surfaces of the water-cooled assembly in the vertical direction; Multiple light source modules are installed on the height difference area between the upper and lower surfaces of the water-cooling assembly; and The laser housing as described in any one of claims 1-3, wherein the front and rear panels of the laser housing are used to fix the water-cooling assembly such that the height difference region is located within a first region enclosed by the front panel, the rear panel, and the two side panels.

5. The semiconductor spatial laser according to claim 4, characterized in that, The water-cooling component is provided with a water pipe connector at its mounting end, and a through hole for the water pipe connector is provided on the front panel of the laser housing.

6. The semiconductor spatial laser according to claim 4, characterized in that, The light source modules are arranged side by side on both sides of the water-cooling assembly.

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