Power module and inverter

Abstract

The utility model relates to the technical field of automobile parts, and provides a power module and an inverter. The power module comprises a chip embedded circuit board which comprises a circuit substrate and a plurality of groups of power units embedded in the circuit substrate; the frame plate is arranged on the front surface of the chip embedded circuit board; wherein each group of power units is connected with an alternating-current busbar, a direct-current positive busbar and a direct-current negative busbar, and the alternating-current busbar, the direct-current positive busbar and the direct-current negative busbar are arranged on the circuit substrate and / or the frame plate; the heat dissipation plate is arranged on the back surface of the chip embedded circuit board; wherein the frame plate, the circuit substrate and the heat dissipation plate respectively form a whole plate structure. According to the utility model, the frame plate, the circuit substrate and the heat dissipation plate respectively form an integral plate structure, so that the plurality of groups of power units of the power module are packaged together, the power module comprising the plurality of groups of power units is packaged into an integral component, the packaging, transportation and other costs of the power module are reduced, and the assembly of the power module and an inverter is simplified.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, specifically to power modules and inverters. Background Technology

[0002] In automotive inverters, power modules are used to convert direct current (DC) to alternating current (AC). For electric drive system applications, power modules typically include multiple power units to convert DC to multiphase (e.g., three-phase) AC for the power drive system.

[0003] Currently, multiple power units of a power module are packaged independently and then assembled into an inverter, which results in high costs for packaging and transportation, as well as complex assembly processes.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] In view of this, the present invention provides a power module and an inverter, which can reduce the packaging and transportation costs of the power module and simplify the assembly of the power module and the inverter.

[0006] According to one aspect of the present invention, a power module is provided, comprising: a chip-embedded circuit board, including a circuit board substrate and a plurality of power units embedded in the circuit board substrate; a frame plate disposed on the front side of the chip-embedded circuit board; wherein each power unit is connected to an AC busbar, a DC positive busbar and a DC negative busbar, the AC busbar, the DC positive busbar and the DC negative busbar being disposed on the circuit board substrate and / or disposed on the frame plate; and a heat sink disposed on the back side of the chip-embedded circuit board; wherein the frame plate, the circuit board substrate and the heat sink are each formed as a single board structure.

[0007] In some embodiments, each group of power units includes an upper bridge power unit and a lower bridge power unit; wherein, on the upper surface of the circuit substrate, along the distribution direction of the upper bridge power unit and the lower bridge power unit, a first creepage gap is reserved between the pad area of ​​the DC negative busbar and the lead-out area of ​​the chip control terminal of the power unit.

[0008] In some embodiments, each group of power units includes an upper bridge power unit and a lower bridge power unit; wherein, on the lower surface of the circuit board, along the distribution direction of the upper bridge power unit and the lower bridge power unit, a second creepage gap is reserved between the upper bridge power unit and the lower bridge power unit.

[0009] In some embodiments, the AC busbar and the DC negative busbar are disposed on the circuit board, and the DC positive busbar is disposed on the frame plate.

[0010] In some embodiments, the chip control terminal of the power unit is connected to a control pin, which is disposed on the frame board.

[0011] In some embodiments, the back side of the power unit is in contact with the heat sink via an insulating thermally conductive pad.

[0012] In some embodiments, a heat dissipation fin area is provided on the back of the heat sink, and the position of the heat dissipation fin area corresponds to the position of the power unit.

[0013] In some embodiments, the heat sink, the circuit board, and the frame plate are provided with mounting holes that are positioned opposite each other, and the heat sink, the circuit board, and the frame plate are fixedly connected by fasteners passing through the mounting holes.

[0014] In some embodiments, the mounting holes include first mounting holes distributed between the heat dissipation fin regions of the heat sink, between the power units of the circuit board, and at opposite positions on the frame plate, and second mounting holes distributed at opposite positions on the edge regions of the heat sink, the edge regions of the circuit board, and the edge regions of the frame plate.

[0015] According to another aspect of the present invention, an inverter is provided, the inverter being configured with a power module as described in any of the above embodiments.

[0016] The beneficial effects of this utility model compared with the prior art include at least the following:

[0017] The frame plate, circuit board, and heat sink of this utility model are each formed into a whole board structure, so that multiple power units of the power module are packaged together. Thus, the power module containing multiple power units is packaged into a whole component, which can reduce the packaging and transportation costs of the power module and simplify the assembly of the power module and the inverter.

[0018] The embedded chip circuit board contains multiple power units that convert direct current (DC) to multiphase alternating current (AC). The AC busbar, DC positive busbar, and DC negative busbar for each power unit can be positioned on the circuit board and / or the frame board, depending on factors such as ease of installation and the complexity of the components after installation. The frame board and heat sink are used to encapsulate and protect the embedded chip circuit board; the heat sink also dissipates heat from the embedded chip circuit board, ensuring the power module's performance.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit the present invention. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments conforming to the present invention and, together with the description, serve to explain the principles of the present invention. It is obvious that the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0021] Figure 1 This diagram shows a frontal perspective view of the power module in an embodiment of the present invention.

[0022] Figure 2 This diagram shows an exploded view of the power module in an embodiment of the present invention.

[0023] Figure 3 This diagram shows the internal perspective structure of the chip-embedded circuit board in an embodiment of the present invention.

[0024] Figure 4 This diagram shows a top view of the power unit's layout structure in an embodiment of the present invention.

[0025] Figure 5 This diagram shows a three-dimensional view of the back of the chip-embedded circuit board in an embodiment of the present invention.

[0026] Figure 6 This diagram shows a three-dimensional view of the back of the power module in an embodiment of the present invention. Detailed Implementation

[0027] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to those described herein. Rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0028] The accompanying drawings are merely illustrative of the present invention and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted.

[0029] The terms "first," "second," and similar words used in the specific description do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms "upper," "lower," "positive," and "negative," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. The term "multiple" means two or more, unless otherwise explicitly specified. Furthermore, in the description of the present invention, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components.

[0030] It should be noted that, unless otherwise specified, the embodiments of this utility model and the features in different embodiments can be combined with each other.

[0031] Figure 1 The diagram illustrates the frontal three-dimensional structure of the power module. Figure 2 This diagram illustrates the exploded structure of the power module. Figure 3 The internal transparent structure of the chip embedded circuit board is shown; combined with Figures 1 to 3 As shown, the power module provided in this embodiment of the present invention includes:

[0032] The chip-embedded circuit board 10 includes a circuit board 11 and multiple power units 12 embedded in the circuit board 11;

[0033] The frame board 20 is disposed on the front side of the chip embedded circuit board 10;

[0034] Each power unit 12 is connected to an AC busbar 31, a DC positive busbar 32, and a DC negative busbar 33. The AC busbar 31, DC positive busbar 32, and DC negative busbar 33 are disposed on the circuit board 11 and / or on the frame plate 20.

[0035] A heat sink 40 is disposed on the back of the chip embedded circuit board 10;

[0036] The frame plate 20, the circuit board 11, and the heat sink 40 are each formed as a single plate structure.

[0037] In this invention, the frame plate 20, circuit board 11, and heat sink 40 are each formed as a single plate structure, which encapsulates multiple power units 12 of the power module together. Thus, the power module containing multiple power units 12 is packaged into an integral component, which can reduce the packaging and transportation costs of the power module and simplify the assembly of the power module and the inverter.

[0038] The heat sink 40 can have the same outline as the circuit board 11 to achieve comprehensive heat dissipation for the chip embedded circuit board 10; the frame plate 20 can have a slightly larger outline than the circuit board 11 so that the power module and other components of the inverter can be assembled through the frame plate 20.

[0039] The power module, packaged as a single component, has the same dimensions and fixed points as a power module with multiple independently packaged power units. Therefore, without any changes to other components of the inverter, the power module of this invention can be conveniently and stably assembled into the inverter.

[0040] The embedded chip circuit board 10 includes multiple power units 12 for converting DC power into multiphase AC power. For example, the embedded chip circuit board 10 may have three power units 12 for converting DC power into three-phase AC power for powering the drive system, but this is not a limitation. The power units 12 are embedded in the circuit board 11, with their upper surfaces lower than the upper surface of the circuit board 11. The electrodes of the power units 12 are led out to the upper surface of the circuit board 11 via lead wires, and their lower surfaces are flush with the lower surface of the circuit board 11. The AC busbar 31, DC positive busbar 32, and DC negative busbar 33 of each power unit 12 may be positioned on the circuit board 11 and / or the frame board 20, depending on factors such as ease of installation and the complexity of the components after installation. The frame board 20 and the heat sink 40 encapsulate and protect the embedded chip circuit board 10. The heat sink 40 also dissipates heat from the embedded chip circuit board 10, especially the power units 12, ensuring the performance of the power module.

[0041] Figure 4 The diagram illustrates the top-view layout of the power unit, combined with... Figure 3 and Figure 4As shown, each power unit 12 includes an upper bridge power unit 12a and a lower bridge power unit 12b; wherein, on the upper surface of the circuit board 11, along the distribution direction W of the upper bridge power unit 12a and the lower bridge power unit 12b, a first creepage gap W1 is reserved between the pad area 330 of the DC negative busbar 33 and the lead-out area 120 of the chip control terminal of the power unit 12; and / or, on the lower surface of the circuit board 11, along the distribution direction W of the upper bridge power unit 12a and the lower bridge power unit 12b, a second creepage gap W2 is reserved between the upper bridge power unit 12a and the lower bridge power unit 12b.

[0042] Creepage gap refers to the shortest distance along the surface of an insulating material between two conductive components. The design of the first creepage gap W1 ensures stable insulation performance between the pad area 330 of the DC negative busbar 33 and the lead-out area 120 of the chip control terminal of the power unit 12 under a specific operating voltage, preventing breakdown on the upper surface of the circuit board 11. The design of the second creepage gap W2 ensures stable insulation performance between the upper bridge power unit 12a and the lower bridge power unit 12b under a specific operating voltage, preventing breakdown on the lower surface of the circuit board 11.

[0043] The specific values ​​of the first creepage gap W1 and the second creepage gap W2 can be set as needed. For example, at an operating voltage of 400V, the first creepage gap W1 and the second creepage gap W2 should be at least 2.9mm; at an operating voltage of 800V, the first creepage gap W1 and the second creepage gap W2 should be at least 5.1mm. To ensure that the power module can be used in various operating conditions, in some embodiments, both the first creepage gap W1 and the second creepage gap W2 are greater than or equal to 5.1mm.

[0044] Figure 4 In the circuit board 11, pad area 310 is used for soldering AC busbar 31 to the upper surface of the circuit board 11, and pad area 320 is used for soldering DC positive busbar 32 to the upper surface of the circuit board 11. The upper bridge power unit 12a and lower bridge power unit 12b can each be equipped with multiple chip units 122, which can include various types of chips such as SiC (silicon carbide) chips and IGBT (insulated gate bipolar transistor) chips. The number of chip units 122 included in the upper bridge power unit 12a and lower bridge power unit 12b can be set as needed, for example... Figure 4 The diagram illustrates that both the upper bridge power unit 12a and the lower bridge power unit 12b contain five chip units 122, but this is not a limitation.

[0045] Reference Figure 2As shown, in some embodiments, the AC busbar 31 and the DC negative busbar 33 are disposed on the circuit board 11, and the DC positive busbar 32 is disposed on the frame board 20. In this way, the structural complexity of the chip embedded circuit board 10 and the frame board 20 is taken into account, and the connection between the AC busbar 31, the DC positive busbar 32 and the DC negative busbar 33 and the power unit 12 is facilitated.

[0046] In other embodiments, the AC busbar 31, DC positive busbar 32, and DC negative busbar 33 can also be arranged in other ways. For example, all three can be arranged on the frame plate 20, or the AC busbar 31 and DC positive busbar 32 can be arranged on the frame plate 20 and the DC negative busbar 33 can be arranged on the circuit board 11. As long as the convenience of arrangement and the complexity of the components after arrangement are taken into account, a reasonable design can be achieved.

[0047] In some embodiments, combined with Figure 1 , Figure 2 and Figure 4 As shown, the chip control terminal of power unit 12 is connected to a control pin 34, which is mounted on the frame board 20. Through the control pin 34, the control signal of power unit 12 is exported from the chip embedded circuit board 10 via the frame board 20 and connected to the inverter's control circuit board. Here, the chip control terminal refers to the control terminal of chip unit 122, typically the gate of chip unit 122.

[0048] Figure 5 This diagram illustrates the three-dimensional structure of the back of the chip-embedded circuit board, combined with... Figure 2 and Figure 5 As shown, in some embodiments, the back side of the power unit 12 contacts the heat sink 40 via an insulating thermally conductive pad 13. The insulating thermally conductive pad 13 serves to both insulate and conduct heat from the power unit 12. The insulating thermally conductive pad 13 can be made of an insulating and thermally conductive medium material such as silicone.

[0049] Figure 6 The diagram illustrates the three-dimensional structure of the back of the power module, combined with... Figure 2 , Figure 5 and Figure 6 As shown, in some embodiments, a heat dissipation fin area 42 is provided on the back of the heat sink 40, and the position of the heat dissipation fin area 42 corresponds to the position of the power unit 12. The heat dissipation fin area 42 effectively increases the heat dissipation area and helps the power unit 12 dissipate heat.

[0050] Combination Figure 1 , Figure 2 and Figure 6As shown, in some embodiments, the heat sink 40, the circuit board 11 and the frame plate 20 are provided with mounting holes 50 that are positioned opposite each other, and the heat sink 40, the circuit board 11 and the frame plate 20 are fixedly connected by fasteners passing through the mounting holes 50.

[0051] The mounting holes 50 include first mounting holes 50a distributed between the heat dissipation fin areas 42 of the heat sink 40, between the power units 12 of the circuit board 11, and on the frame plate 20, and second mounting holes 50b distributed between the edge areas of the heat sink 40, the edge areas of the circuit board 11, and the edge areas of the frame plate 20.

[0052] The positional design of the first mounting hole 50a and the second mounting hole 50b ensures that the fixing points between the heat sink 40, the circuit board 11 and the frame plate 20 remain unchanged compared to the power module where multiple power units are independently packaged. Therefore, without changing other components of the inverter, the power module of this utility model can be conveniently and stably assembled into the inverter.

[0053] This utility model embodiment also provides an inverter configured with a power module as described in any of the above embodiments. Using the power module packaged as a single component effectively reduces packaging and transportation costs and simplifies the assembly of the power module with the inverter. Furthermore, the size and fixing points of the power module of this utility model are unchanged compared to power modules with multiple independently packaged power units; therefore, no changes are required to other components of the inverter, allowing for convenient and stable assembly of the power module into the inverter.

[0054] The inverter of this invention can be applied to electric drive systems. It converts DC power into multiphase AC power through a power module to drive the motor of the electric drive system.

[0055] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A power module, characterized in that, include: A chip-embedded circuit board includes a circuit board and multiple power units embedded in the circuit board. A frame board is disposed on the front side of the chip embedded circuit board; Each power unit is connected to an AC busbar, a DC positive busbar, and a DC negative busbar. The AC busbar, the DC positive busbar, and the DC negative busbar are disposed on the circuit board and / or on the frame board. A heat sink is disposed on the back of the chip embedded circuit board; The frame plate, the circuit board, and the heat sink are each formed as a whole plate structure.

2. The power module as described in claim 1, characterized in that, Each group of power units includes an upper bridge power unit and a lower bridge power unit; Specifically, on the upper surface of the circuit substrate, along the distribution direction of the upper bridge power unit and the lower bridge power unit, a first creepage gap is reserved between the pad area of ​​the DC negative busbar and the lead-out area of ​​the chip control terminal in the power unit.

3. The power module as described in claim 1, characterized in that, Each group of power units includes an upper bridge power unit and a lower bridge power unit; Wherein, on the lower surface of the circuit board, along the distribution direction of the upper bridge power unit and the lower bridge power unit, a second creepage gap is reserved between the upper bridge power unit and the lower bridge power unit.

4. The power module as described in claim 1, characterized in that, The AC busbar and the DC negative busbar are disposed on the circuit board, and the DC positive busbar is disposed on the frame plate.

5. The power module as described in claim 1, characterized in that, The power unit's chip control terminal is connected to a control pin, which is located on the frame board.

6. The power module as described in claim 1, characterized in that, The back of the power unit is in contact with the heat sink via an insulating thermal pad.

7. The power module as described in claim 1, characterized in that, The back of the heat sink is provided with a heat dissipation fin area, and the position of the heat dissipation fin area corresponds to the position of the power unit.

8. The power module as described in claim 1, characterized in that, The heat sink, the circuit board, and the frame plate are provided with mounting holes that are positioned opposite each other, and the heat sink, the circuit board, and the frame plate are fixedly connected by fasteners that pass through the mounting holes.

9. The power module as described in claim 8, characterized in that, The mounting holes include first mounting holes distributed between the heat dissipation fin areas of the heat sink, between the power units of the circuit board, and at opposite positions on the frame plate, and second mounting holes distributed at opposite positions on the edge areas of the heat sink, the edge areas of the circuit board, and the edge areas of the frame plate.

10. An inverter, characterized in that, The inverter is equipped with a power module as described in any one of claims 1-9.

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