PCB heat dissipation device

Abstract

The utility model discloses a PCB heat radiation device which comprises a heat radiation flat plate, the heat radiation flat plate is provided with a front surface and a back surface, the front surface is provided with a fan area and a heat radiation area which are adjacent to each other, the surface of the heat radiation area is provided with a plurality of heat radiation fins at equal intervals, the fan area is provided with a blower fan, and a circulation groove is formed between adjacent heat radiation fins. One end of the circulation groove faces the blower fan. According to the technical scheme of the utility model, cold airflow can directionally and laterally blow the heat dissipation fins, the heat dissipation effect is better, and the whole heat dissipation device is light and thin in structure.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a PCB heat dissipation device. Background Technology

[0002] Some PCBs integrate a large number of densely packed electronic components, which generate a lot of heat during operation. Therefore, PCB heat dissipation devices are needed to cool them down and protect the lifespan of the electronic components. Existing PCB heat dissipation devices generally have the following problems: the forced air cooling device has uneven airflow distribution, which easily leads to local heat accumulation; and the fan is top-intake and bottom-exhaust, so the heat sink fins are usually placed at the bottom of the fan, resulting in an excessively thick heat dissipation device, which is not conducive to the design of thinner and lighter devices. Utility Model Content

[0003] The main purpose of this invention is to provide a PCB heat dissipation device that allows cold air to be blown directionally to the heat dissipation fins, resulting in better heat dissipation and a relatively thin and light overall structure.

[0004] To achieve the above objectives, this utility model proposes a PCB heat dissipation device, comprising:

[0005] A heat dissipation plate has a front and a back. The front has an adjacent fan area and a heat dissipation area. Multiple heat dissipation fins are arranged at equal intervals on the surface of the heat dissipation area. A blower fan is provided in the fan area. A flow groove is formed between adjacent heat dissipation fins. One end of the flow groove faces the blower fan.

[0006] In one embodiment of this utility model, the fan area is further provided with a flow guide shell, the blower fan is located inside the flow guide shell, the flow guide shell has an air inlet corresponding to the top of the blower fan, and the flow guide shell has an air outlet on the side facing the heat dissipation fins.

[0007] In one embodiment of this utility model, the corner of the flow guide shell is provided with a connecting part, and the connecting part is threadedly connected to the heat dissipation plate.

[0008] In one embodiment of this utility model, a thermally conductive silicone sheet is attached to the back of the heat dissipation plate.

[0009] In one embodiment of the present invention, the blower fan has a connector that extends out of the guide shell.

[0010] The present invention employs a method of setting adjacent fans and heat dissipation fins on a heat dissipation plate, with the airflow from the fans directed to the side of the heat dissipation fins, resulting in better heat dissipation and a thinner overall structure for the heat dissipation device. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the structure of this utility model from another perspective.

[0014] Explanation of icon numbers:

[0015] 1. Heat dissipation plate; 2. Fan area; 21. Blower fan; 22. Connector; 3. Heat dissipation area; 31. Heat dissipation fins; 32. Flow channel; 4. Air guide shell; 41. Air inlet; 42. Air outlet; 43. Connection part; 5. Thermal conductive silicone pad.

[0016] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] Reference Figures 1 to 2 This utility model proposes a PCB heat dissipation device, including a heat dissipation plate 1. The heat dissipation plate 1 has a front and a back. The front has an adjacent fan area 2 and a heat dissipation area 3. Multiple heat dissipation fins 31 are arranged at equal intervals on the surface of the heat dissipation area 3. The fan area 2 is provided with a blower fan 21. A flow groove 32 is formed between adjacent heat dissipation fins 31. One end of the flow groove 32 faces the blower fan 21.

[0019] Understandably, the heat dissipation plate 1 is the main part of the entire heat dissipation device. It is made of a metal material with fast heat transfer and has two surfaces: a front and a back. The front is used to install the heat dissipation structure, while the back is in contact with the heat source to conduct heat. The front is divided into two different areas: fan area 2, which is where the blower fan 21 is installed. The fan's function is to drive airflow and help dissipate heat; and heat dissipation area 3, on which multiple heat dissipation fins 31 are evenly arranged. The heat dissipation fins 31 are used to increase the heat dissipation surface area, thereby improving the heat dissipation efficiency.

[0020] The heat dissipation fins 31 on the heat dissipation area 3 are arranged at equal intervals to effectively improve heat dissipation. The gaps between the heat dissipation fins 31 form flow channels 32, which facilitate airflow and enhance heat dissipation. One end of the flow channel 32 between adjacent heat dissipation fins 31 faces the blower fan 21. The fan can drive airflow, and the air flows into the flow channel 32 from the side, helping to remove heat from the heat dissipation fins 31 more efficiently.

[0021] Reference Figures 1 to 2 In one embodiment of this application, the fan area 2 is further provided with a guide shell 4, the blower fan 21 is located inside the guide shell 4, the guide shell 4 is provided with an air inlet 41 corresponding to the top of the blower fan 21, and the guide shell 4 is provided with an air outlet 42 on the side facing the heat dissipation fins 31.

[0022] Understandably, in fan zone 2, in addition to the fan, there is also a housing that encloses the fan. The function of this airflow guide housing 4 is to protect and fix the fan, and to guide the airflow generated by the fan so that the air can flow more effectively to the heat dissipation zone 3, thereby optimizing the heat dissipation effect.

[0023] The air intake 4 has an air inlet 41 located on top of the blower fan 21. The air inlet 41 allows outside air to enter the air intake 4 and be drawn in by the blower fan 21, thus creating airflow. An air outlet 42 is located on the other side of the air intake 4, facing the heat dissipation fins 31. After entering the air intake 4, the air is blown towards the air outlet 42 by the fan and then flows out, carrying away heat from the heat dissipation fins 31. Since the air intake 4 is completely sealed except for the air inlet 41 and the air outlet 42, the airflow can only flow in through the air inlet 41 and out through the air outlet 42, concentrating on the heat dissipation fins 31, resulting in high heat dissipation efficiency.

[0024] Reference Figures 1 to 2 In one embodiment of this application, the corner of the flow guide shell 4 is provided with a connecting part 43, which is threadedly connected to the heat dissipation plate 1.

[0025] Understandably, dedicated connecting parts 43 are designed at the four corners of the airflow guide shell 4. These connecting parts 43 can securely fix the airflow guide shell 4 to the heat dissipation plate 1 with screws. The threaded connection ensures the fixation between the airflow guide shell 4 and the heat dissipation plate 1, providing strong stability, preventing the airflow guide shell 4 from loosening during use, ensuring a firm connection between the airflow guide shell 4 and the heat dissipation plate 1, and guaranteeing the stable and effective operation of the entire heat dissipation device. This threaded connection ensures that the airflow guide shell 4 will not easily shift or fall off after installation, thus maintaining the stability of the entire heat dissipation system and ensuring the effectiveness of the fan and airflow. Furthermore, the tight threaded connection ensures that there are no large gaps between the airflow guide shell 4 and the heat dissipation plate 1, preventing airflow from escaping through any point other than the air outlet 42.

[0026] Reference Figures 1 to 2 In one embodiment of this application, a thermally conductive silicone sheet 5 is attached to the back of the heat dissipation plate 1.

[0027] Understandably, the back side of the heat dissipation plate 1 refers to the side of the heat dissipation plate 1 that contacts the heat source. A thermally conductive silicone pad 5 is installed on this side, tightly adhering to the back side of the heat dissipation plate 1 to ensure good heat conduction. The thermally conductive silicone pad 5 is a material with excellent thermal conductivity; it effectively conducts heat and aids in heat dissipation. The thermally conductive silicone pad 5 is commonly used for heat conduction between two objects, especially in heat dissipation applications, where it reduces the air gap between contact surfaces and improves heat conduction efficiency.

[0028] The thermally conductive silicone pad 5 further enhances the thermal contact between the heat dissipation plate 1 and the heat source, enabling heat to be transferred more efficiently from the heat source to the heat dissipation plate 1, thereby improving the efficiency of the entire heat dissipation system.

[0029] Reference Figures 1 to 2 In one embodiment of this application, the blower fan 21 has a connector 22 that extends out of the guide shell 4.

[0030] Understandably, connector 22 is used to connect to the power supply or to make mechanical connections with other parts. Its design is pluggable, which facilitates the connection and disconnection of the fan with other devices. Connector 22 is not completely hidden inside the airflow housing 4, but extends partially or completely outside the airflow housing 4. This design facilitates the connection of fan power cables and signal cables, or makes it easier for the fan to interface with other devices or cooling systems.

[0031] The present invention employs a method of setting adjacent fans and heat dissipation fins 31 on a heat dissipation plate 1, with the airflow of the fans directed to the side of the heat dissipation fins 31, resulting in better heat dissipation effect and a thinner overall heat dissipation device structure.

[0032] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0033] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A PCB heat dissipation device, characterized in that, include: A heat dissipation plate (1) has a front and a back. The front has an adjacent fan area (2) and a heat dissipation area (3). The surface of the heat dissipation area (3) is provided with a plurality of heat dissipation fins (31) at equal intervals. The fan area (2) is provided with a blower fan (21). A flow groove (32) is formed between adjacent heat dissipation fins (31). One end of the flow groove (32) faces the blower fan (21).

2. The PCB heat dissipation device according to claim 1, characterized in that, The fan area (2) is also provided with a flow guide shell (4), the blower fan (21) is located inside the flow guide shell (4), the flow guide shell (4) has an air inlet (41) corresponding to the top of the blower fan (21), and the flow guide shell (4) has an air outlet (42) on the side facing the heat dissipation fins (31).

3. A PCB heat dissipation device according to claim 2, characterized in that, The flow guide shell (4) is provided with a connecting part (43) at its corner, and the connecting part (43) is threaded to the heat dissipation plate (1).

4. A PCB heat dissipation device according to claim 3, characterized in that, A thermally conductive silicone sheet (5) is attached to the back of the heat dissipation plate (1).

5. A PCB heat dissipation device according to claim 4, characterized in that, The blower fan (21) has a connector (22) that extends out of the guide shell (4).

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