Circuit board golden finger with lead wire to be removed
By setting pre-drilled holes and arc-shaped marking lines on the gold fingers of the circuit board, the CCD back-drilling process is used to simplify the circuit board production process, solve the problem of complex reverse etching process, and achieve more efficient production.
Patent Information
- Application Number
- CN202520361332.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-02-28
AI Technical Summary
The current reverse etching process for processing gold fingers on circuit boards is complex, resulting in a waste of time and resources.
A circuit board gold finger structure for removing leads is designed. By setting pre-drilled holes and arc-shaped marking lines on the connecting leads, the production process is simplified using CCD back drilling technology, and the connecting leads can be directly removed.
It simplifies the production process, shortens the production cycle, saves manpower and material resources, and improves production efficiency.
Smart Images
Figure CN223798417U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a gold finger of a circuit board with leads to be removed. Background Technology
[0002] Due to the development trend of PCB products, many PCBs with gold fingers no longer have the same uniform length of gold fingers as before; some are longer and some are shorter. Customers do not allow residual gold-plated leads below the gold fingers (referring to the free end of the gold fingers). Currently, the industry uses a reverse etching process to process such PCBs. The reverse etching process involves: first, drawing leads directly below the gold fingers; then printing a wet film (covering the fingers and surrounding area); exposure (exposing the fingers to be gold-plated); gold plating; film removal; outer layer 2 (protecting other parts of the board with a wet film, exposing only the drawn gold-plated leads); and etching 2 (etching away the drawn leads). This process adds five steps to the normal process, which is extremely time-consuming. Utility Model Content
[0003] The purpose of this invention is to provide a gold finger for a circuit board with leads to be removed, thereby solving the technical problem that the process of using reverse etching to process circuit boards in the prior art is relatively complex. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are detailed below.
[0004] To achieve the above objectives, the present invention provides the following technical solution:
[0005] This utility model provides a circuit board gold finger with leads to be removed, including a circuit board body, wherein the circuit board body is plated with connecting leads, the connecting leads are connected in series with all the gold fingers on the circuit board body, the connecting leads are located in the upper region of the gold fingers, and a pre-drilled hole is provided between two adjacent gold fingers, the pre-drilled hole being located on the connecting lead.
[0006] Optionally, the connecting lead includes a segment to be removed and a segment to be retained, and there are multiple segments to be removed and multiple segments to be retained. All segments to be removed and all segments to be retained are arranged alternately and connected. The segments to be retained are located on the gold fingers, and the segments to be removed are located between two adjacent gold fingers.
[0007] Optionally, the pre-drilled hole is located in the central region of the segment to be removed.
[0008] Optionally, an arc-shaped marking line is provided on the segment to be removed, and the center of the arc of the marking line coincides with the center of the pre-made hole.
[0009] Optionally, the radius of the arc-shaped marking line is 0.20 mm, and the radius of the pre-drilled hole is 0.05 mm to 0.075 mm smaller than the radius of the arc-shaped marking line.
[0010] Optionally, the segment to be removed includes a first end, a middle region, and a second end, which are fixedly connected in sequence. The first end is close to one of the gold fingers, and the second end is close to another gold finger. The width of the middle region is greater than the width of the first end and the width of the middle region is greater than the width of the second end.
[0011] Optionally, the length of the retained segment is 0.40 mm, the length of the first end is 0.05 mm to 0.10 mm, and the length of the second end is 0.05 mm to 0.10 mm.
[0012] Optionally, the width of the first end is 0.10mm to 0.12mm, and the width of the second end is 0.10mm to 0.12mm.
[0013] This utility model provides a circuit board gold finger with a lead to be removed. The connecting lead is located in the upper area of the gold finger, that is, near the area where the gold finger connects to the circuit board body. Since all the areas where the gold fingers connect to the circuit board body are on the same straight line, it is also applicable to gold fingers of different lengths. This utility model is a semi-finished product. After the connecting lead is plated on the circuit board body, the connecting lead between two adjacent gold fingers can be removed by drilling to form a finished product. The operation steps are simple, which greatly shortens the production cycle, saves a lot of manpower and material resources, and solves the technical problem that the process of using reverse etching to process circuit boards in the prior art is relatively complicated. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of a gold finger on a circuit board with leads to be removed, provided by an embodiment of this utility model.
[0016] Figure 2 This is a partial structural diagram of the gold finger of a circuit board with leads to be removed, provided by an embodiment of this utility model.
[0017] Figure 3 This is a schematic diagram of the structure of a finished product of a circuit board gold finger with leads to be removed, provided by an embodiment of this utility model.
[0018] 1. Circuit board body in the figure;
[0019] 2. Connecting lead wire; 21. Segment to be removed; 211. First end; 212. Middle area; 213. Second end; 22. Retained segment;
[0020] 3. Gold finger. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0022] In the description of this utility model, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0024] This utility model provides a circuit board gold finger with leads to be removed, including a circuit board body 1, wherein the circuit board body 1 is plated with connecting leads 2, the connecting leads 2 are connected in series with all the gold fingers 3 on the circuit board body 1, the connecting leads 2 are located in the upper region of the gold fingers 3, and a pre-drilled hole is provided between two adjacent gold fingers 3. The pre-drilled hole is located on the connecting leads 2. The pre-drilled hole does not need to penetrate the connecting leads 2, or the pre-drilled hole on the connecting leads 2 does not need to be a complete circle. The pre-drilled hole can be used as a positioning for the back drilling process to avoid displacement during drilling. This utility model provides a circuit board gold finger with a lead to be removed. The connecting lead 2 is located in the upper region of the gold finger 3, that is, near the area where the gold finger 3 connects to the circuit board body 1. Since all the areas where the gold fingers 3 connect to the circuit board body 1 are on the same straight line, it is also applicable to gold fingers 3 of different lengths. This utility model is a semi-finished product. That is, after the connecting lead 2 is plated on the circuit board body 1, the connecting lead 2 between two adjacent gold fingers 3 can be removed by drilling to form a finished product. The operation steps are simple, which greatly shortens the production cycle, saves a lot of manpower and material resources, and solves the technical problem that the process of using reverse etching to process circuit boards in the prior art is relatively complicated.
[0025] As an optional implementation, the connecting lead 2 includes a segment to be removed 21 and a retained segment 22. There are multiple segments to be removed 21 and multiple retained segments 22. The number of retained segments 22 is the same as the number of gold fingers 3. The number of segments to be removed 21 is one less than the number of retained segments 22. All segments to be removed 21 and all retained segments 22 are alternately connected. The retained segments 22 are located on the gold fingers 3, and the segments to be removed 21 are located between two adjacent gold fingers 3. The segment to be removed 21 is the part that needs to be removed, and can be specifically back-drilled using CCD optical alignment.
[0026] As an optional implementation, the pre-drilled hole is located in the central region of the segment 21 to be removed, which is also to make the pre-drilled hole located between two adjacent gold fingers 3, so that the segment 21 to be removed can be removed as much as possible, and the amount of remaining gold fingers 3 is relatively small.
[0027] As an optional implementation, an arc-shaped marking line is provided on the segment 21 to be removed. The center of the arc of the marking line coincides with the center of the pre-drilled hole. The arc-shaped marking line is used to remind the worker of the radius of the back-drilled hole. The radius of the arc-shaped marking line can be 0.20 mm, and the distance between two adjacent gold fingers 3 is 0.40 mm. The radius of the pre-drilled hole is 0.05 mm to 0.075 mm smaller than the radius of the arc-shaped marking line. After the connecting lead 2 is gold-plated onto the circuit board body 1, a pre-drilled hole is first drilled on the segment 21 to be removed using a CCD back-drilling process. Finally, a back-drilled hole is drilled on the basis of the pre-drilled hole using a CCD back-drilling process. The radius of the back-drilled hole is the same as the radius of the arc-shaped marking line, and the two coincide. At this time, the segment 21 to be removed is removed, forming a finished product.
[0028] As an optional implementation, the segment 21 to be removed includes a first end 211, a middle region 212, and a second end 213. The first end 211, the middle region 212, and the second end 213 are fixedly connected in sequence. The first end 211 is close to one gold finger 3, and the second end 213 is close to another gold finger 3. The width of the middle region 212 is greater than the width of the first end 211, and the width of the middle region 212 is greater than the width of the second end 213. This structural feature of the segment 21 to be removed, after drilling using a CCD back-drilling process, results in a relatively small or almost non-existent amount of residual material on the first end 211 and the second end 213, thus minimizing or eliminating the amount of residual burrs on the gold fingers 3.
[0029] As an optional implementation, the length of the retention segment 22 is 0.40 mm, the length of the first end 211 can be 0.05 mm to 0.10 mm, the length of the second end 213 can be 0.05 mm to 0.10 mm, the width of the first end 211 can be 0.10 mm to 0.12 mm, the width of the second end 213 can be 0.10 mm to 0.12 mm, and the width of the middle region 212 can be 0.15 mm.
[0030] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A gold finger of a circuit board with leads to be removed, characterized in that, Including the circuit board body (1), wherein, The circuit board body (1) is plated with connecting leads (2), which are connected in series with all the gold fingers (3) on the circuit board body (1). The connecting leads (2) are located in the upper region of the gold fingers (3), and pre-made holes are provided between two adjacent gold fingers (3). The pre-made holes are located on the connecting leads (2).
2. The gold finger of a circuit board with leads to be removed according to claim 1, characterized in that, The connecting lead (2) includes a segment to be removed (21) and a retained segment (22). There are multiple segments to be removed (21) and multiple retained segments (22). All segments to be removed (21) and all segments to be retained (22) are arranged alternately and connected. The retained segment (22) is located on the gold finger (3), and the segment to be removed (21) is located between two adjacent gold fingers (3).
3. The gold finger of a circuit board with leads to be removed according to claim 2, characterized in that, The pre-drilled hole is located in the central region of the section to be removed (21).
4. The gold finger of a circuit board with leads to be removed according to claim 3, characterized in that, An arc-shaped marking line is provided on the section to be removed (21), and the center of the arc of the marking line coincides with the center of the pre-made hole.
5. The gold finger of a circuit board with leads to be removed according to claim 4, characterized in that, The radius of the arc-shaped marking line is 0.20 mm, and the radius of the pre-drilled hole is 0.05 mm to 0.075 mm smaller than the radius of the arc-shaped marking line.
6. The gold finger of a circuit board with leads to be removed according to claim 2, characterized in that, The segment to be removed (21) includes a first end (211), a middle region (212), and a second end (213). The first end (211), the middle region (212), and the second end (213) are fixedly connected in sequence. The first end (211) is close to one of the gold fingers (3), and the second end (213) is close to another gold finger (3). The width of the middle region (212) is greater than the width of the first end (211), and the width of the middle region (212) is greater than the width of the second end (213).
7. The gold finger of a circuit board with leads to be removed according to claim 6, characterized in that, The length of the retention section (22) is 0.40 mm, the length of the first end (211) is 0.05 mm to 0.10 mm, and the length of the second end (213) is 0.05 mm to 0.10 mm.
8. The gold finger of a circuit board with leads to be removed according to claim 6, characterized in that, The width of the first end (211) is 0.10mm to 0.12mm, and the width of the second end (213) is 0.10mm to 0.12mm.