Welding pad conduction structure of circuit board

Abstract

The utility model belongs to the technical field of circuit boards, particularly relates to a welding pad conduction structure of a circuit board, and aims to solve the problems of short circuit and pseudo soldering caused by non-plugging of conduction holes and difficulty in connection caused by disconnection of conductive columns and pins in the prior art, the welding pad conduction structure of the circuit board comprises a circuit board main body, and the conduction holes are arranged in the circuit board main body. And the via holes comprise a through hole, a blind hole and a buried hole. According to the utility model, some conduction holes which are not used for conduction can be filled by the copper plugs and the epoxy resin plugs, the hole plugging can prevent liquid tin from penetrating through the conduction holes and penetrating through the element surface to cause short circuit, and in addition, the hole plugging can prevent solder paste on the surface of a close-range bonding pad from flowing into the holes to cause pseudo soldering to influence later element surface mounting, so that the product quality is improved. The copper ring and the extension head are arranged on the conductive column, the copper ring is used for connecting one end of the conductive column, and the extension head can extend to one end of the broken pin wire, so that the welding difficulty is reduced, and the operation time is saved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a solder pad conductive structure for a circuit board. Background Technology

[0002] A printed circuit board (PCB) is formed by stacking many layers of copper foil. Because an insulating layer is laid between each layer of copper foil, the connecting copper foil layers cannot communicate with each other. Therefore, these copper foil layers need to be connected by solder pads to establish signal links.

[0003] Printed circuit boards have many vias used to conduct or connect copper foil traces in the circuit board layers. The vias mainly include through holes, blind holes, and buried holes. When some vias are not used for circuit connection, there is a risk of short circuit and poor soldering. In addition, once the conductive pillars inside the vias are disconnected from the pins, it is not easy to reconnect them with solder. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a conductive pad structure for a circuit board, which overcomes the deficiencies of existing technologies and effectively solves the problems of short circuits and poor soldering caused by unsealed vias, and the difficulty in reconnecting conductive posts to pins when they are disconnected.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A conductive pad structure for a circuit board includes a circuit board body. The circuit board body has a through hole inside, which includes a through hole, a blind hole, and a buried hole. Copper plugs are provided at both ends of the through hole, and an epoxy resin plug is provided between the two copper plugs. A conductive post is provided inside the through hole, and a copper ring is provided on the outer wall of the conductive post. An extension head is fixedly connected to one side of the outer wall of the copper ring.

[0007] Preferably, a copper pad is provided inside the through hole on the outer wall of the conductive post.

[0008] Preferably, the outer wall of the circuit board body is provided with pin lines, and the extension head is soldered to the outer wall of the pin lines.

[0009] Preferably, solder is soldered to one end of the conductive pillar on the top outer wall of the circuit board body.

[0010] Preferably, the circuit board body has copper foil layers and insulating layers that are evenly distributed inside, and the copper foil layers and insulating layers are alternately distributed.

[0011] Preferably, the inner walls of the through holes, blind holes, and buried holes are provided with a copper plating layer.

[0012] The beneficial effects of this utility model are as follows:

[0013] 1. In the conductive structure of the solder pads of the circuit board in this design, some through holes that are not used for conduction can be filled with copper plugs and epoxy resin plugs. This method of plugging holes can prevent liquid solder from passing through the through holes and penetrating the component surface, causing a short circuit. In addition, plugging holes can prevent solder paste from flowing into the holes from the surface of the nearby solder pads, causing poor soldering and affecting the subsequent component placement.

[0014] 2. The circuit board of this design has a conductive pad structure with a copper ring and an extension head placed on the conductive post. The copper ring is used to connect one end of the conductive post, and the extension head can extend to one end of the disconnected pin line, thereby reducing the difficulty of soldering and saving operation time. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the solder pad conductive structure of a circuit board proposed in this utility model.

[0016] Figure 2 This is a partial cross-sectional view of the solder pad conduction structure of a circuit board according to the present invention.

[0017] Figure 3 This is a schematic diagram of the main connection structure of a circuit board with a solder pad conductive structure according to the present invention.

[0018] Figure 4 This is a schematic diagram of the main body of a circuit board with a solder pad conductive structure proposed in this utility model.

[0019] In the diagram: 1. Circuit board body; 2. Through hole; 3. Blind hole; 4. Buried hole; 5. Epoxy resin plug; 6. Copper plug; 7. Conductive post; 8. Copper pad; 9. Copper ring; 10. Extension head; 11. Lead wire; 12. Solder; 13. Copper foil layer; 14. Insulating layer; 15. Copper plating layer. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example 1, refer to Figure 1-2 A conductive structure for a circuit board includes a circuit board body 1, with a through hole inside the circuit board body 1. The through hole includes a through hole 2, a blind hole 3, and a buried hole 4. Copper plugs 6 are provided at both ends of the through hole 2, and an epoxy resin plug 5 is provided between the two copper plugs 6.

[0022] In this embodiment, some vias that are not used for electrical conduction can be filled with copper plugs 6 and epoxy resin plugs 5. This method of plugging vias can prevent liquid solder from passing through the vias and penetrating the component surface, causing a short circuit. In addition, plugging vias can prevent solder paste from flowing into the vias from the surface of the nearby pads, causing poor soldering and affecting the subsequent component placement.

[0023] Example 2, refer to Figure 4 A conductive structure for a circuit board has a conductive post 7 inside a through hole, and a copper ring 9 on the outer wall of the conductive post 7. An extension head 10 is fixedly connected to one side of the outer wall of the copper ring 9.

[0024] In this embodiment, a copper ring 9 and an extension head 10 are placed on the conductive post 7. The copper ring 9 is used to connect one end of the conductive post 7, and the extension head 10 can extend to one end of the disconnected pin line 11, thereby reducing the difficulty of soldering and saving operation time.

[0025] Reference Figure 4 A copper pad 8 is provided inside the through hole on the outer wall of the conductive post 7.

[0026] Reference Figure 3-4 The outer wall of the circuit board body 1 is provided with pin lines 11, and the extension head 10 is soldered to the outer wall of the pin lines 11.

[0027] Reference Figure 4 Solder 12 is soldered to one end of the conductive post 7 on the top outer wall of the circuit board body 1.

[0028] Reference Figure 2 The circuit board body 1 has copper foil layers 13 and insulating layers 14 that are evenly distributed inside, and the copper foil layers 13 and insulating layers 14 are alternately distributed.

[0029] Reference Figure 2 A copper plating layer 15 is provided on the inner wall of the through hole 2, blind hole 3 and buried hole 4.

[0030] Working principle: The circuit board body 1 is divided into multiple alternating copper foil layers 13 and insulating layers 14. There are through holes distributed inside the circuit board body 1. The through holes mainly include through holes 2 that penetrate the circuit board body 1, blind holes 3 that connect the inner and outer layer circuits, and buried holes 4 hidden inside the circuit board body 1. Some through holes that are not used for conduction can be filled with copper plugs 6 and epoxy resin plugs 5. The holes are plugged in this way. A copper ring 9 and an extension head 10 are placed on the conductive post 7. The copper ring 9 is used to connect one end of the conductive post 7, and the extension head 10 can extend to one end of the disconnected pin line 11 and be soldered to the pin line 11.

[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A via structure of a circuit board, comprising a circuit board body (1), characterized in that, The circuit board body (1) is internally provided with a through hole, and the through hole comprises a through hole (2), a blind hole (3) and a buried hole (4), both ends of the through hole (2) are provided with copper plugs (6), and an epoxy resin plug (5) is arranged between the two copper plugs (6), the through hole is internally provided with a conductive column (7), and the outer wall of the conductive column (7) is provided with a copper ring (9), one side of the outer wall of the copper ring (9) is fixedly connected with an extension head (10).

2. The solder pad via structure of claim 1, wherein: The outer wall of the conductive column (7) is provided with a copper pad (8) inside the through hole.

3. The solder pad access structure of claim 1, wherein: The outer wall of the extension head (10) is welded on the outer wall of the pin wire (11).

4. The solder pad access structure of claim 1, wherein: The outer wall of the circuit board body (1) is welded with a solder (12) at one end of the conductive column (7).

5. The solder pad access structure of claim 1, wherein: The circuit board body (1) is internally provided with copper foil layers (13) and insulating layers (14) distributed at equal distances, and the copper foil layers (13) and the insulating layers (14) are alternately distributed.

6. The solder pad access structure of claim 1, wherein: The inner wall of the through hole (2), the blind hole (3) and the buried hole (4) is provided with a copper plating layer (15).

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