Communication module, vehicle-mounted communication terminal and vehicle

Abstract

The utility model provides a communication module, a vehicle-mounted communication terminal and a vehicle, and relates to the technical field of semiconductors. The communication module comprises a circuit board, a chip, a supporting piece and a shielding piece. The first surface of the chip is connected with the circuit board through a connecting structure. The supporting piece is located between the circuit board and the first surface and is arranged on the circuit board; when the communication module and the mainboard are subsequently connected through a secondary furnace process, the chip is forced to move towards the direction of the circuit board due to factors such as the self weight of the heat conducting layer and easy expansion of the heat conducting layer after being heated, and the supporting piece can counteract the trend that the chip moves towards the direction of the circuit board. The shielding member is connected to the circuit board and covers the outside of the chip. The heat conduction layer is arranged between the side, facing the second surface, of the shielding piece and the second surface, the chip can dissipate heat to the outside through the heat conduction layer, and the good heat dissipation effect is achieved. Therefore, the communication module can remarkably improve the heat dissipation effect of the chip on the basis of meeting the secondary remelting process.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to communication modules, vehicle-mounted communication terminals, and vehicles. Background Technology

[0002] The vehicle's onboard communication terminal includes a communication module and a motherboard. As vehicle communication standards continue to upgrade and the functions carried by vehicles increase, the heat generated by the chips in the communication module also increases.

[0003] Because communication modules and motherboards typically require a secondary reflow process for connection, and this process involves high temperatures, it's difficult to incorporate easily expanding thermally conductive materials within the communication module to achieve rapid chip heat dissipation. Poor heat dissipation leads to the chip's junction temperature easily exceeding its operating requirements, potentially causing malfunctions and damage. Utility Model Content

[0004] The embodiments of this application provide a communication module, an in-vehicle communication terminal, and a vehicle. The communication module can significantly improve the heat dissipation of the chip while meeting the requirements of the secondary reflow process. In addition, the support components on the circuit board are convenient for matching different types of chips. The design difficulty and design cost of the communication module are relatively low.

[0005] Firstly, a communication module is provided, which can be used as a communication module. The communication module includes a circuit board, a chip, a support member, and a shield. The chip includes a first surface and a second surface disposed opposite to each other. The first surface and the circuit board are connected by a connection structure, i.e., the chip and the circuit board can be interconnected through the connection structure; the connection structure can be a ball grid array (BGA) or multiple arrays of copper pillar bumps (CPB). The support member is disposed on the side of the circuit board facing the first surface, and the support member is located between the circuit board and the first surface of the chip; along the thickness direction of the chip, the size of the support member is less than or equal to the size of the connection structure; when the communication module and the motherboard are subsequently connected through a secondary reflow process, due to the weight of the thermal conductive layer itself and the tendency of the thermal conductive layer to expand when heated, the chip will be forced to move towards the circuit board, and the support member can be used to support the chip. The shield is connected to the circuit board and covers the outside of the chip. A thermal conductive layer is disposed between the side of the shield facing the second surface and the second surface, through which the chip can dissipate heat to the outside.

[0006] In the aforementioned heat dissipation module, the chip can dissipate heat through the thermal conductive layer, reducing the thermal resistance along the chip's transmission path and resulting in a high heat dissipation effect. Although the chip may be forced to move towards the circuit board due to the weight of the thermal conductive layer and its tendency to expand when heated during the subsequent reflow process between the communication module and the motherboard, the support component can counteract this tendency. This reduces the probability of excessive diffusion of the connection structure between the chip and the circuit board due to compression, effectively preventing short circuits caused by excessive diffusion between adjacent connection structures. In other words, the communication module provided in this application embodiment can significantly improve the chip's heat dissipation effect while meeting the requirements of the reflow process.

[0007] In addition, by placing the support components on the circuit board, the circuit board with the support components can be matched with different types of chips, eliminating the need for excessive chip design and reducing the design difficulty of the communication module.

[0008] In one possible implementation, the support includes a protrusion structure along the thickness direction of the chip, the protrusion structure having a size of H1, and the connection structure having a size of H2, where H1 is smaller than H2.

[0009] When the communication module and motherboard are subsequently connected via a secondary reflow process, the weight of the heat-conducting layer and its tendency to expand when heated will force the chip to move towards the circuit board. However, the raised structure can partially counteract this tendency, mitigating the risk of the connection structure being squeezed and failing due to excessive chip movement towards the circuit board. Furthermore, by controlling H1 to be less than H2, when the chip and circuit board in the communication module are connected via a single reflow process, the raised structure is less likely to affect the connection between the chip and the circuit board.

[0010] In one possible implementation, the protruding structure is made of an insulating, high-temperature resistant material, and its melting temperature is at least higher than the highest temperature during the single-pass reflow process. This effectively prevents the protruding structure from melting during the single-pass reflow process, improving the reliability of the communication module.

[0011] In one possible implementation, the outer surface of the raised structure is provided with an insulating coating, and the melting temperature of the insulating coating is at least higher than the highest temperature in the single reflow process. In this way, the insulating coating can protect the raised structure, effectively preventing it from melting during the single reflow process, thus improving the reliability of the communication module.

[0012] In one possible implementation, the support includes an insulating adhesive layer that wraps around the connection structure. When the communication module and the motherboard are subsequently connected via a secondary reflow process, the weight of the heat-conducting layer and its tendency to expand when heated will force the chip to move towards the circuit board. However, the insulating adhesive layer can partially counteract this tendency, mitigating the risk of the connection structure being squeezed and failing due to excessive chip movement towards the circuit board.

[0013] In one possible implementation, the material of the insulating adhesive layer may include underfill (UF adhesive).

[0014] In one possible implementation, a recess is provided on the side of the shield facing the second surface, and a heat-conducting layer is provided between the bottom wall of the recess and the second surface.

[0015] Compared to placing a thermally conductive layer directly between the shielding component and the second surface of the chip, placing a thermally conductive layer between the bottom wall of the recessed portion of the shielding component and the second surface of the chip reduces the thickness of the thermally conductive layer in the communication module, thus reducing its weight. With a reduced thickness, the expansion force generated by the thermally conductive layer's expansion is also reduced, assuming a constant thermal expansion temperature. Therefore, the reduced weight and expansion force of the thermally conductive layer minimize the amount of chip movement towards the circuit board during subsequent connection of the communication module and the motherboard via a secondary reflow process. This mitigates the risk of connection failure due to excessive chip movement towards the circuit board and subsequent compression of the connection structure.

[0016] In one possible implementation, the ratio of H1 to H2 is less than or equal to 90%. By controlling the ratio of H1 to H2 within the aforementioned range, a moderate ratio of H1 to H2 can mitigate the potential problem of poor connection between the chip and the circuit board caused by an excessively large protrusion structure.

[0017] In one possible implementation, the communication module includes multiple protrusions; along the thickness direction of the chip, these protrusions overlap with different edge positions of the chip. That is, the orthographic projections of the multiple protrusions onto the chip overlap with different edge positions of the chip.

[0018] When the communication module and the motherboard are connected through a secondary reflow process, the chip will be forced to move toward the circuit board due to the weight of the heat-conducting layer and the fact that the heat-conducting layer is prone to expansion when heated. Multiple protrusions can support the edge of the chip, and the protrusions provide relatively uniform support to the chip, which can effectively prevent the local connection structure from being excessively squeezed.

[0019] In one possible implementation, the protrusion structure is small in size. The connection between the circuit board and the protrusion structure is achieved by integrally molding the circuit board and the protrusion structure, which can reduce the connection difficulty between the circuit board and the protrusion structure, thereby reducing the manufacturing difficulty and manufacturing cost of the communication module.

[0020] Secondly, another communication module is provided, which can be used as a communication module. This communication module includes a circuit board, a chip, and a shielding component. The chip includes a first surface and a second surface disposed opposite to each other, and the first surface and the circuit board are connected by a connection structure. The shielding component is connected to the circuit board and covers the outside of the chip. A recess is provided on the side of the shielding component facing the second surface, and a heat-conducting layer is provided between the bottom wall of the recess and the second surface. In other words, the communication module provided in this application embodiment may not require a support component.

[0021] A thermally conductive layer is provided between the bottom wall of the recessed part of the shielding component and the second surface of the chip. This can reduce the thickness of the thermally conductive layer in the communication module, reduce the weight of the thermally conductive layer, and reduce the expansion force generated by the expansion of the thermally conductive layer. When the communication module and the motherboard are subsequently connected through a secondary reflow process, the amount of movement of the chip toward the circuit board can be reduced. This can alleviate the risk of the connection structure being squeezed and disconnected due to excessive movement of the chip toward the circuit board.

[0022] Thirdly, a vehicle-mounted communication terminal is provided. The vehicle-mounted communication terminal includes a motherboard and a communication module as described in any possible implementation of the first aspect and the second aspect; the side of the circuit board in the communication module facing away from the chip in the communication module is connected to the motherboard, which enables interconnection between the circuit board and the motherboard.

[0023] In the aforementioned vehicle-mounted communication terminal, when the communication module and the motherboard are connected via a secondary reflow process, the connection structure within the communication module is less prone to deformation, thus ensuring the vehicle-mounted communication terminal exhibits excellent reliability. Furthermore, because the chips within the communication module have excellent heat dissipation capabilities, the diversity of chip design can be increased while maintaining the normal operating temperature of the vehicle-mounted communication terminal, which is beneficial for achieving diverse performance characteristics.

[0024] In one possible implementation, the vehicle-mounted communication terminal further includes a heat sink housing, with the motherboard and communication module disposed inside the heat sink housing. The heat sink housing includes a third surface and a fourth surface disposed opposite to each other; the side of the motherboard facing away from the circuit board contacts the third surface, and the chip can be cooled sequentially through the motherboard and the circuit board to the third surface of the heat sink housing; the side of the shield facing away from the first surface contacts the fourth surface, and the chip can be cooled sequentially through the shield to the fourth surface of the heat sink housing.

[0025] In one possible implementation, the side of the motherboard facing away from the circuit board and the third surface of the heat sink are in contact through a first thermal interface layer. The chip can dissipate heat sequentially through the motherboard, the circuit board, the first thermal interface layer, and the third surface of the heat sink. The first thermal interface layer has better thermal conductivity, which can improve the chip's heat dissipation effect. The side of the shield facing away from the first surface and the fourth surface are in contact through a second thermal interface layer. The chip can dissipate heat sequentially through the shield, the second thermal interface layer, and the fourth surface of the heat sink. The fourth thermal interface material has better thermal conductivity, which can improve the chip's heat dissipation effect.

[0026] Typically, a secondary reflow process can be used to connect the communication module and the motherboard, and then the motherboard and communication module are placed inside the heat sink housing. This means that the first and second thermal interface layers do not need to be present in the secondary reflow process. Therefore, the first and second thermal interface layers do not affect the secondary reflow process, resulting in superior reliability for the vehicle-mounted communication terminal.

[0027] Fourthly, a vehicle is provided that includes an in-vehicle communication terminal comprising any possible implementation of the third aspect. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 Here are some structural diagrams of vehicle-mounted communication terminals;

[0030] Figure 2 Here are some flowcharts for preparing vehicle-mounted communication terminals;

[0031] Figure 3 This application provides schematic diagrams of the structures of some communication modules in its embodiments.

[0032] Figure 4 These are schematic diagrams illustrating the structures of some communication modules in embodiments of this application;

[0033] Figure 5 These are schematic diagrams illustrating the structures of some other communication modules as shown in the embodiments of this application;

[0034] Figure 6 Schematic diagrams of other communication modules provided in the embodiments of this application;

[0035] Figure 7 Schematic diagrams of the structures of some communication modules provided in the embodiments of this application;

[0036] Figure 8 This application provides a diagram showing the positional relationship of support components in some communication modules.

[0037] Figure 9 Schematic diagrams of the structures of some communication modules provided in the embodiments of this application;

[0038] Figure 10 This application provides structural schematic diagrams of some vehicle-mounted communication terminals as shown in the embodiments.

[0039] Figure 11 This application provides structural schematic diagrams of some vehicle-mounted communication terminals as shown in the embodiments.

[0040] Figure 12 The following are schematic diagrams illustrating the structures of some other vehicle-mounted communication terminals as shown in the embodiments of this application.

[0041] Figure label:

[0042] 1-Vehicle communication terminal; 10-Communication module; 20-Main board; 30-Heat dissipation housing; 41-First thermal interface layer; 42-Second thermal interface layer.

[0043] 100 - Circuit board; 200 - Chip; 310 - Raised structure; 320 - Insulating adhesive layer; 400 - Shielding component; 410 - Recessed part; 500 - Thermal conductive layer. Detailed Implementation

[0044] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0045] In the following, the terms "first," "second," etc., are used only for descriptive purposes to distinguish identical or similar items that have substantially the same function and effect, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the embodiments of this application, the term "connection" should be interpreted broadly; unless otherwise explicitly specified and limited, "connection" can be a direct connection or an indirect connection through an intermediate medium.

[0046] This application provides a vehicle that includes at least an in-vehicle communication terminal. The in-vehicle communication terminal (telematics box, abbreviated as T-BOX), as an electronic device installed in a vehicle, can be used to realize data communication, information processing, and control functions between the vehicle and external systems. Therefore, it is widely used in logistics transportation, public transportation, special vehicles, and other fields. For example, the in-vehicle communication terminal can realize communication between people and vehicles, and between vehicles and the outside world (vehicle-to-vehicle, vehicle-to-server), thereby realizing numerous functions such as vehicle navigation, in-vehicle entertainment, external communication, and driving assistance, which can significantly increase the vehicle's intelligence, safety, and comfort.

[0047] Figure 1 This is a schematic diagram of the structure of some vehicle-mounted communication terminals. (Reference) Figure 1 The vehicle-mounted communication terminal may include a communication module 10 and a motherboard 20. The communication module 10 and the motherboard 20 are connected via a connection structure C1. In some examples, this connection structure C1, also referred to as a chip pad, may include an array of solder balls or multiple arrays of bumps. For example, the material of the solder ball array may be tin.

[0048] The communication module 10 is used to realize communication functions between the vehicle and the outside world, including wireless communication and data transmission. The communication module 10 can connect to external systems using wireless local area networks (WLAN), Bluetooth (BT), Global Navigation Satellite System (GNSS), Frequency Modulation (FM), Near Field Communication (NFC), or Infrared (IR) technologies. For example, the communication module 10 can connect to the vehicle gateway via WLAN to obtain various vehicle data, such as vehicle speed, remaining range, fuel level, and door / window status, and upload this information to the cloud or receive instructions from the cloud. As another example, the communication module 10 can transmit vehicle fault data to a cloud server via WLAN to provide services such as vehicle status monitoring, fault diagnosis, and remote upgrades.

[0049] The motherboard 20, also known as the mainboard, is an important component of the vehicle-mounted communication terminal. The motherboard 20 serves to support the communication module 10.

[0050] The vehicle communication terminal may also include a data logger, a temperature control module, a vehicle diagnostic interface, etc., to realize its corresponding functions. Figure 1The architecture of the vehicle communication terminal shown does not constitute a limitation on the vehicle communication terminal, which may include, for example... Figure 1 The components shown may have more or fewer components, or may be combined as follows: Figure 1 Some of the components shown, or those that can be used with, for example Figure 1 The component arrangements shown are different.

[0051] Figure 2 This is a flowchart of some processes for preparing vehicle-mounted communication terminals.

[0052] refer to Figure 1 and Figure 2 The communication module 10 in the vehicle-mounted communication terminal includes a chip and a circuit board. The chip and circuit board are usually connected using a one-time reflow process (also known as one-time reflow assembly).

[0053] A single-pass reflow process can sequentially include an installation stage, a preheating stage, a soldering stage, a cooling stage, and a quality inspection stage. The installation stage may include: placing the chip onto the circuit board. The preheating stage may include: preheating the circuit board to ensure uniform heat dissipation. The soldering stage may include: evaporating and melting solder paste at controlled temperatures to complete the soldering of the chip and the circuit board. The cooling stage may include: controlling the cooling rate to prevent cold deformation of the circuit board due to excessively rapid cooling. The quality inspection stage may include: performing electrical tests on the communication module 10 after the cooling stage to ensure the chip functions correctly. Of course, a single-pass reflow process may also include other stages, or include other steps within the aforementioned five stages. For example, other electronic components may be placed onto the circuit board during the installation stage.

[0054] refer to Figure 1 and Figure 2 After the communication module 10 is obtained through a single reflow process, a second reflow process (also known as a second reflow assembly) is usually required to connect the communication module 10 and the motherboard 20.

[0055] The secondary reflow process may include: First, using a fixture to fix the soldered surface of the circuit board, i.e. the soldered surface formed by the soldering of the circuit board and the chip, to reduce the risk of the chip falling off during the secondary reflow process; Second, soldering the circuit board and the motherboard 20. The specific soldering process can refer to the preheating stage, soldering stage, cooling stage and quality inspection stage in the primary reflow process. However, the melting point of the solder paste used in the secondary reflow process is usually lower than that of the solder paste used in the primary reflow process, which can reduce the risk of the solder joints of the chip and the circuit board melting during the secondary reflow process.

[0056] As vehicle communication standards continue to upgrade and vehicle carrying functions increase, the heat generated by the chips in the communication module 10 increases accordingly, leading to a corresponding increase in the overall power consumption of the communication module 10. However, since the communication module 10 and the motherboard 20 typically require a secondary reflow process for connection, and this process involves high temperatures, it is difficult to incorporate easily expandable thermally conductive materials within the communication module 10 to achieve rapid heat dissipation for the chips. Poor heat dissipation results in the chips easily exceeding their junction temperature range, potentially causing malfunctions and damage.

[0057] In view of this, embodiments of this application propose a communication module, an in-vehicle communication terminal, and a vehicle. This communication module can significantly improve the heat dissipation effect of the chip while meeting the requirements of the secondary reflow process. In addition, by setting up support components on the circuit board, it is not necessary to do too much design on the chip, and the design difficulty and design cost of the communication module are low.

[0058] Figure 3 The diagram shows the structure of some communication modules provided in the embodiments of this application.

[0059] This application provides a communication module 10, which can be used as a vehicle-mounted communication module. (See reference...) Figure 3 The communication module 10 includes a circuit board 100, a chip 200, a support component, and a shielding component 400.

[0060] Circuit board 100 serves to support chip 200 and shielding component 400, and also enables signal interconnection between different chips 200. Furthermore, circuit board 100 can also facilitate connection and signal transmission between chip 200 and other electronic components. In some examples, circuit board 100 can be a printed circuit board (PCB).

[0061] Chip 200 includes a first surface and a second surface disposed opposite to each other. The first surface and circuit board 100 are connected by a connection structure C1. Chip 200 and circuit board 100 can be interconnected by the connection structure C1. In some examples, the number of chips 200 in communication module 10 can be one or more, and this application embodiment does not constitute a limitation.

[0062] Support components (can be) Figure 3 The protruding structure 310 in the middle can also be Figure 6 The insulating adhesive layer 320 in the chip 200 is provided on the side of the circuit board 100 facing the first surface and located between the first surface and the circuit board 100; along the thickness direction of the chip 200, the size of the support is less than or equal to the size of the connection structure C1.

[0063] A shielding component 400 is connected to the circuit board 100 and covers the outside of the chip 200. The shielding component 400 serves to shield the chip from external interference or radiation, as well as from external interference or radiation to the chip 200, ensuring good performance stability and reliability of the chip 200. Specifically, the shielding component 400 functions to: effectively prevent external electromagnetic interference to the internal circuitry of the chip 200, maintaining the stability of the chip 200; reduce the probability of the chip 200 being interfered with by external interference signals, reducing the error rate of the chip 200; and reduce electromagnetic radiation and stray radiation from the chip 200, preventing interference with other electronic devices.

[0064] A thermally conductive layer 500 is disposed between the shielding member 400 and the second surface on the side facing the second surface. In some examples, the material of the thermally conductive layer 500 may include at least one of thermally conductive putty, thermally conductive gel, thermally conductive double-sided tape, thermally conductive silicone grease, thermally conductive potting compound, or thermally conductive adhesive.

[0065] In the embodiments of this application, the shielding component 400 and the chip 200 are provided with a thermally conductive layer 500. The chip 200 can dissipate heat sequentially through the shielding component 400 and the thermally conductive layer 500. Since the thermal resistance of the thermally conductive layer 500 is small, the total thermal resistance on the transmission path of the chip 200 can be reduced, resulting in a higher heat dissipation effect for the chip 200. The chip 200 is less likely to exceed the required operating temperature range due to junction temperature, which can improve the functional stability of the chip 200 and reduce the probability of chip 200 damage. When the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the chip 200 will be forced to move towards the circuit board 100 due to the weight of the thermally conductive layer 500 itself and the fact that the thermally conductive layer 500 is prone to expansion when heated. Because a support is provided between the circuit board 100 and the chip 200, the support can counteract the tendency of the chip 200 to move towards the circuit board 100, effectively reducing the probability of the connection structure C1 between the chip 200 and the circuit board 100 spreading excessively in all directions due to compression. This effectively prevents adjacent connection structures C1 from connecting and causing a short circuit in the chip 200. In other words, the communication module 10 provided in this embodiment can significantly improve the heat dissipation effect of the chip 200 while meeting the requirements of the secondary reflow process.

[0066] Furthermore, by mounting the support on the circuit board 100, the circuit board 100 with the support can be matched with different types of chips 200, eliminating the need for extensive design work on the chips 200 and reducing the design difficulty of the communication module 10. If the support is mounted on the second surface of the chip 200, support would be required for each type of chip 200, significantly increasing the design difficulty of the communication module 10.

[0067] In the embodiments of this application, A and B being arranged opposite to each other can mean that A and B are arranged back to back. For example, when the first surface and the second surface are arranged opposite to each other, the first surface and the second surface overlap in at least a partial area along a certain direction.

[0068] In the embodiments of this application, A and B being arranged opposite each other can mean that A and B are arranged face to face. For example, when the third surface and the fourth surface are arranged opposite each other, the third surface and the fourth surface overlap in at least a portion of their area along a certain direction.

[0069] In the embodiments of this application, the side of A facing B can refer to the side of A that is closer to B, and the side of A facing away from B can refer to the side of A that is farther away from B.

[0070] Figure 4 and Figure 5 The diagram illustrates the structure of some communication modules in the embodiments of this application.

[0071] In other embodiments, reference is made to... Figure 4 The communication module 10 includes a circuit board 100, a chip 200, and a shielding component 400. The chip 200 includes a first surface and a second surface disposed opposite to each other. The first surface is connected to the circuit board 100 via a connection structure C1. The shielding component 400 is connected to the circuit board 100 and covers the outside of the chip 200. In other words, the communication module 10 provided in this embodiment does not have a heat-conducting layer or a support component.

[0072] The communication module 10 lacks a heat-conducting layer, forcing the chip 200 to rely solely on air for heat dissipation due to its high thermal resistance. This increases the total thermal resistance along the chip 200's transmission path, resulting in poor heat dissipation efficiency. Consequently, the chip 200's junction temperature is prone to exceeding its operating range, potentially leading to malfunctions or damage. Furthermore, the absence of a heat-conducting layer prevents the expansion of the heat-conducting layer from forcing the chip 200 towards the circuit board 100 during subsequent reflow processes when the communication module 10 and motherboard 20 are connected. In other words, while the communication module 10 can withstand reflow processes, the chip 200 suffers from poor heat dissipation.

[0073] In other embodiments, reference is made to... Figure 5 The communication module 10 includes a circuit board 100, a chip 200, and a shielding member 400. The chip 200 includes a first surface and a second surface disposed opposite to each other. The first surface and the circuit board 100 are connected via a connection structure C1. The shielding member 400 is connected to the circuit board 100 and covers the outside of the chip 200. A heat-conducting layer 500 is disposed between the side of the shielding member 400 facing the second surface and the second surface. In other words, the communication module 10 provided in this embodiment does not have a support member.

[0074] The communication module 10 is equipped with a heat-conducting layer 500, so the chip 200 can dissipate heat through the heat-conducting layer 500 with low thermal resistance, resulting in better heat dissipation efficiency. However, the communication module 10 does not have a support structure. When the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the weight of the heat-conducting layer 500 and its tendency to expand when heated will force the chip 200 to move towards the circuit board 100. The connection structure C1 between the chip 200 and the circuit board 100 will be squeezed and excessively diffused in all directions. Adjacent connection structures C1 are prone to connection due to diffusion, which may cause a short circuit in the chip 200.

[0075] Taking the connection structure C1 as a solder ball array as an example, when the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, due to the weight of the heat-conducting layer 500 itself and the fact that the heat-conducting layer 500 is prone to expansion when heated, the chip 200 will be forced to move toward the circuit board 100. The solder balls will be squeezed and spread in a direction perpendicular to the thickness of the chip 200. Adjacent solder balls are prone to connect, thus causing the chip 200 to short-circuit.

[0076] In some embodiments, reference Figure 3 The support includes a protrusion structure 310 along the thickness direction of the chip 200. The size of the protrusion structure 310 is H1, and the size of the connecting structure C1 is H2. H1 is smaller than H2.

[0077] When the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the chip 200 will be forced to move toward the circuit board 100 due to the weight of the heat-conducting layer 500 and the fact that the heat-conducting layer 500 is prone to expansion when heated. The protrusion structure 310 located near the connection structure C1 can support the chip 200, alleviate the risk of the connection structure C1 being squeezed and connected due to the chip 200 moving too far toward the circuit board 100, thereby reducing the risk of short circuit of the chip 200 and improving the reliability of the communication module 10.

[0078] Furthermore, by controlling H1 to be less than H2, the impact of the protrusion structure 310 on the connection between the chip 200 and the circuit board 100 in the communication module 10 can be reduced when they are connected through a single reflow process. If H1 is too large, for example, H1 is greater than H2, it may make it difficult for the chip 200 and the circuit board 100 to achieve an effective connection, thereby affecting the interconnection effect between the chip 200 and the circuit board 100.

[0079] For example, the ratio of H1 to H2 is less than or equal to 90%. For instance, the ratio of H1 to H2 can be 30%, 40%, 50%, 60%, 70%, 80%, or 90%. By controlling the ratio of H1 to H2 within the aforementioned range, a moderate ratio of H1 to H2 can mitigate the potential problem of poor connection between the chip 200 and the circuit board 100 caused by an excessively large size of the protrusion structure 310.

[0080] The ratio of H1 to H2 is mainly affected by factors such as the size of the connecting structure C1 itself, the spacing between adjacent connecting structures C1, and the thermal expansion coefficient of the heat-conducting layer 500.

[0081] For example, if the thermal expansion coefficient of the heat-conducting layer 500 remains constant, the larger the ratio of the size of the connecting structure C1 itself to the spacing between adjacent connecting structures C1, that is, the denser the connecting structures C1, the easier it is for the connecting structures C1 to connect. Therefore, it is necessary to control the ratio of H1 to H2 to be larger to alleviate the risk of the connecting structures C1 connecting. Conversely, the more dispersed the connecting structures C1 are, the less likely they are to connect, and the ratio of H1 to H2 is smaller.

[0082] For example, when the ratio of the size of the connection structure C1 to the spacing between adjacent connection structures C1 remains constant, a larger coefficient of thermal expansion of the heat-conducting layer 500 results in greater expansion of the heat-conducting layer 500, forcing the chip 200 to move towards the circuit board 100, making connection structures C1 more prone to connection. Therefore, it is necessary to control the ratio of H1 to H2 to be larger to mitigate the risk of connection structure C1 connecting. Conversely, a smaller coefficient of thermal expansion of the heat-conducting layer 500 makes connection structure C1 less likely to connect, resulting in a smaller ratio of H1 to H2. Of course, the ratio of H1 to H2 may also be affected by other factors, but the approach to setting the ratio of H1 to H2 can refer to the aforementioned analysis.

[0083] In some examples, the protrusion structure 310 can be sheet-like or other shapes that provide good support. The shape and position of the protrusion structure 310 can be set according to the actual layout of the connecting structure C1, and this embodiment does not limit this.

[0084] In some examples, the circuit board 100 and the raised structure 310 are integrally formed.

[0085] Since the protrusion structure 310 is typically small, if the circuit board 100 and the protrusion structure 310 are fabricated separately and then connected, it is difficult to connect the small protrusion structure 310 to the circuit board 100, and it is not suitable to connect them using common methods such as soldering. However, by using an integral molding process to connect the circuit board 100 and the protrusion structure 310, the connection difficulty between the circuit board 100 and the protrusion structure 310 can be reduced, thereby reducing the fabrication difficulty and cost of the communication module 10.

[0086] In some examples, the outer surface of the protrusion 310 is provided with an insulating coating, and the melting temperature of the insulating coating is at least higher than the highest temperature in the single-pass reflow process. If the melting temperature of the insulating coating is too low, the protrusion 310 may melt during the single-pass reflow process, which could affect the reliability of the communication module 10. For example, the material of the insulating coating may include glass, ceramic, or liquid crystal polymer.

[0087] In some examples, the material of the protrusion 310 is an insulating, high-temperature resistant material, and the melting temperature of the protrusion 310 is at least higher than the highest temperature in the first reflow process. If the melting temperature of the protrusion 310 is too low, the protrusion 310 may melt during the first reflow process, which would affect the reliability of the communication module 10. If the material of the protrusion 310 is a conductive material, it may cause a short circuit in the chip 200 when the protrusion 310 contacts the chip 200.

[0088] For example, the material of the protrusion structure 310 may include glass, ceramic, liquid crystal polymer, or the same material as the circuit board 100. This results in a lower cost for the protrusion structure 310, which is beneficial for the commercial application of the communication module 10.

[0089] Figure 6 The diagram shows the structure of some other communication modules provided in the embodiments of this application.

[0090] In some embodiments, reference Figure 6 The support includes an insulating adhesive layer 320, which wraps around the connecting structure C1.

[0091] By wrapping the connection structure C1 with the insulating adhesive layer 320, when the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the chip 200 will be forced to move towards the circuit board 100 due to the weight of the heat-conducting layer 500 and the fact that the heat-conducting layer 500 is prone to expansion when heated. The insulating adhesive layer 320 can support the chip 200, effectively offsetting the stress generated by the expansion of the heat-conducting layer 500, alleviating the risk of the connection structure C1 being squeezed and disconnected due to excessive movement of the chip 200 towards the circuit board 100, thereby reducing the risk of short circuit of the chip 200 and improving the reliability of the communication module 10.

[0092] In some examples, the material of the insulating adhesive layer 320 may include an underfill adhesive. The underfill adhesive provides superior insulation, which helps reduce the risk of short circuits in the chip 200.

[0093] Figure 7 This is a schematic diagram of the structure of some other communication modules provided in the embodiments of this application.

[0094] In some embodiments, reference Figure 7 The support includes a raised structure 310 and an insulating adhesive layer 320. The raised structure 310 is close to the connecting structure C1, and the insulating adhesive layer 320 covers the connecting structure C1. In this way, by setting the raised structure 310 and the insulating adhesive layer 320, the effect of supporting the chip 200 is improved.

[0095] Figure 8 This is a diagram showing the positional relationship of support components in some communication modules provided in the embodiments of this application. Figure 8 The chip projection surface is the orthographic projection of chip 200 onto circuit board 100, through... Figure 8 The relative positions of chip 200, protrusion structure 310, insulating adhesive layer 320, connection structure C1 and circuit board 100 can be seen.

[0096] In some embodiments, the communication module 10 includes a plurality of protrusions 310; along the thickness direction of the chip 200, the plurality of protrusions 310 overlap with different edge positions of the chip 200. That is, the orthographic projection of the plurality of protrusions 310 on the chip 200 overlaps with different edge positions of the chip 200.

[0097] When the communication module 10 and the motherboard are subsequently connected through a secondary reflow process, due to the weight of the heat-conducting layer 500 and the fact that the heat-conducting layer 500 is prone to expansion when heated, the chip 200 will be forced to move toward the circuit board 100. Multiple protrusions 310 can support the edge of the chip 200. The support effect of the protrusions 310 on the chip 200 is relatively uniform, which can effectively prevent the local connection structure C1 from being excessively squeezed.

[0098] Example, reference Figure 8 The protrusions 310 can be positioned to correspond to the four corners of the chip 200. By supporting the four corners of the chip 200, the protrusions 310 provide relatively uniform support to the chip 200, effectively preventing excessive compression of the local connection structure C1. Alternatively, the protrusions 310 can be positioned to correspond to the middle positions of the four sides of the chip 200. By supporting the middle positions of the four sides of the chip 200, the protrusions 310 also provide relatively uniform support, effectively preventing excessive compression of the local connection structure C1. The specific position and number of the protrusions 310 are not limited in this embodiment. Figure 8 As shown, the insulating adhesive layer 320 can partially fill the area between the chip 200 and the circuit board 100, or it can completely fill the area between the chip 200 and the circuit board 100.

[0099] In some embodiments, reference Figure 7The shielding component 400 has a recess 410 on the side facing the second surface, and a heat-conducting layer 500 is disposed between the bottom wall of the recess 410 and the second surface. When the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the chip 200 will be forced to move toward the circuit board 100 due to the weight of the heat-conducting layer 500 itself and the expansion of the heat-conducting layer 500 due to heat.

[0100] Compared to directly placing the heat-conducting layer 500 between the shielding component 400 and the second surface of the chip 200, placing the heat-conducting layer 500 between the bottom wall of the recess 410 of the shielding component 400 and the second surface of the chip 200 can reduce the thickness of the heat-conducting layer 500 in the communication module 10, thus reducing the weight of the heat-conducting layer 500 itself. With a reduced thickness, the expansion force generated by the expansion of the heat-conducting layer 500 is reduced while maintaining a constant thermal expansion temperature. Therefore, the reduced weight and expansion force of the heat-conducting layer 500, when the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, can reduce the amount of movement of the chip 200 towards the circuit board 100, mitigating the risk of the connection structure C1 being squeezed and disconnected due to excessive movement of the chip 200 towards the circuit board 100.

[0101] In some examples, reference Figure 7 The recess 410 may be provided corresponding to the second surface of the chip 200. For example, along the thickness direction of the chip 200, the side of the recess 410 facing the chip 200 and the second surface of the chip 200 overlap at least partially.

[0102] The specific shape and depth of the recess 410 are affected by factors such as the thickness of the chip 200, the expansion properties of the thermal conductive layer 500 material, and the compressive strength of the connecting structure C1. For example, if the thickness of the chip 200 and the compressive strength of the connecting structure C1 remain constant, the greater the expansion force generated by the material of the thermal conductive layer 500, the smaller the thickness of the thermal conductive layer 500 needs to be, which allows for a larger recess depth in the recess 410. Conversely, if the thickness of the chip 200 and the expansion properties of the thermal conductive layer 500 material remain constant, the weaker the compressive strength of the connecting structure C1, the smaller the thickness of the thermal conductive layer 500 typically needs to be, which also allows for a larger recess depth in the recess 410.

[0103] In some embodiments, the shielding member 400 may be shaped as a cover (i.e., a shielding shield) and may cover the outside of the chip 200. In some embodiments, the material of the shielding member 400 may include metal. For example, the material of the shielding member 400 may be copper, aluminum, steel, etc. In some embodiments, when the material of the shielding member 400 is metal, the connection method between the shielding member 400 and the circuit board 100 may be soldering.

[0104] Figure 9 This is a schematic diagram of the structure of some other communication modules provided in the embodiments of this application.

[0105] This application provides another communication module 10, which is used as a vehicle-mounted communication module. (See reference...) Figure 9 The communication module 10 includes a circuit board 100, a chip 200, and a shielding member 400. The chip 200 includes a first surface and a second surface disposed opposite to each other. The first surface and the circuit board 100 are connected via a connection structure C1. The shielding member 400 is connected to the circuit board 100 and covers the outside of the chip 200. A recess 410 is provided on the side of the shielding member facing the second surface, and a heat-conducting layer 500 is provided between the bottom wall of the recess 410 and the second surface. In other words, the communication module 10 provided in this embodiment may not require a support member.

[0106] A heat-conducting layer 500 is provided between the bottom wall of the recess 410 of the shielding component 400 and the second surface of the chip 200. This reduces the thickness of the heat-conducting layer 500 in the communication module 10, decreases its weight, and reduces the expansion force generated by its expansion. When the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the amount of movement of the chip 200 toward the circuit board 100 can be reduced. This mitigates the risk of the connection structure C1 being squeezed and disconnected due to excessive movement of the chip 200 toward the circuit board 100. Therefore, without providing a support between the circuit board 100 and the chip 200, the communication module 10 can be guaranteed to meet the secondary reflow process.

[0107] Figure 10 and Figure 11 The diagram shows the structure of some vehicle-mounted communication terminals provided in the embodiments of this application. Figure 10 for Figure 7 The communication module shown corresponds to the vehicle-mounted communication terminal. Figure 11 for Figure 9 The vehicle-mounted communication terminal corresponding to the communication module shown is not shown in the embodiments of this application. Figure 3 and Figure 6 The vehicle-mounted communication terminal corresponding to the communication module shown is configured in the same way as... Figure 10 , Figure 11 similar.

[0108] This application provides a vehicle-mounted communication terminal 1. (See reference...) Figure 10 and Figure 11 The vehicle-mounted communication terminal 1 includes a motherboard 20 and a communication module 10 as described in the previous embodiment. The circuit board 100 in the communication module 10 is connected to the motherboard 20 on the side facing away from the chip 200 in the communication module 10, which can realize the interconnection between the circuit board 100 and the motherboard 20, and thus realize the interconnection between the chip 200 and the motherboard 20.

[0109] In the aforementioned vehicle-mounted communication terminal 1, when the communication module 10 and the motherboard 20 are subsequently connected through a secondary reflow process, the connection structure C1 in the communication module 10 is not easily deformed, thus the vehicle-mounted communication terminal 1 has good reliability. Furthermore, since the chip 200 in the communication module 10 has good heat dissipation, the design diversity of the chip 200 can be increased while ensuring the normal operating temperature of the vehicle-mounted communication terminal 1, which is beneficial for achieving diverse performance characteristics of the vehicle-mounted communication terminal 1.

[0110] In some embodiments, the circuit board 100 and the motherboard 20 can be connected via a connection structure C2. In some examples, the connection structure C2 may include an array of solder balls or multiple arrays of bumps. In some examples, the motherboard 20 may be a printed circuit board.

[0111] In some embodiments, the vehicle-mounted communication terminal 1 further includes a heat sink 30, with the motherboard 20 and communication module 10 disposed inside the heat sink 30. The heat sink 30 includes a third surface and a fourth surface disposed opposite to each other; the side of the motherboard 20 facing away from the circuit board 100 contacts the third surface, and the chip 200 can dissipate heat sequentially through the motherboard 20, the circuit board 100 to the third surface of the heat sink 30; the shielding member 400 contacts the fourth surface facing away from the first surface, and the chip 200 can dissipate heat through the shielding member 400 to the fourth surface of the heat sink 30.

[0112] In addition, the heat sink 30 can also protect components such as the motherboard 20 and the communication module 10, so as to ensure that the components inside the heat sink 30 maintain good stability and reliability in various environments.

[0113] In some examples, the side of the motherboard 20 facing away from the circuit board 100 and its third surface are in contact through a first thermal interface layer 41. The chip 200 can dissipate heat sequentially through the motherboard 20, the circuit board 100, the first thermal interface layer 41, and the third surface of the heat sink 30. The first thermal interface layer 41 has better thermal conductivity, which can improve the heat dissipation effect of the chip 200. The side of the shielding member 400 facing away from the first surface and its fourth surface are in contact through a second thermal interface layer 42. The chip 200 can dissipate heat sequentially through the shielding member 400, the second thermal interface layer 42, and the fourth surface of the heat sink 30. The second thermal interface layer 42 has better thermal conductivity, which can improve the heat dissipation effect of the chip 200.

[0114] Typically, a secondary reflow process can be used to connect the communication module 10 and the motherboard 20, and then the motherboard 20 and the communication module 10 can be placed inside the heat sink housing 30. Therefore, neither the first thermal interface layer 41 nor the second thermal interface layer 42 will affect the secondary reflow process, and the vehicle-mounted communication terminal 1 has superior reliability.

[0115] In some examples, the material of the first thermal interface layer 41 is a thermal interface material (TIM), which may specifically include at least one of thermally conductive putty, thermally conductive gel, thermally conductive double-sided tape, thermally conductive silicone grease, thermally conductive potting compound, or thermally conductive adhesive. In some examples, the material of the second thermal interface layer 42 is a thermal interface material, which may specifically include at least one of thermally conductive putty, thermally conductive gel, thermally conductive double-sided tape, thermally conductive silicone grease, thermally conductive potting compound, or thermally conductive adhesive. The material of the first thermal interface layer 41 may be the same as or different from the material of the second thermal interface layer 42.

[0116] In some examples, the heat dissipation housing 30 may include cooling pipes, a coolant tank, and a pump, with the coolant tank and cooling pipes connected via the pump. The coolant tank stores coolant, the cooling pipes dissipate heat from the chip 200, and the pump powers the flow of coolant in the cooling pipes. Of course, the heat dissipation housing 30 may also include other components, which are not limited in this embodiment.

[0117] Figure 12 The diagram illustrates the structure of some vehicle-mounted communication terminals as shown in the embodiments of this application.

[0118] In other embodiments, reference is made to... Figure 12The vehicle-mounted communication terminal 1 includes a motherboard 20, a circuit board 100, a chip 200, and a shielding component 400. The chip 200 includes a first surface and a second surface disposed opposite to each other. The first surface is connected to the circuit board 100 via a connection structure C1. The shielding component 400 is connected to the circuit board 100 and covers the outside of the chip 200. The side of the circuit board 100 facing away from the chip 200 contacts the motherboard 20. In other words, the vehicle-mounted communication terminal 1 provided in this embodiment does not have a heat-conducting layer 500 or a supporting component.

[0119] The vehicle-mounted communication terminal 1 lacks a heat-conducting layer 500, resulting in poor heat dissipation of the chip 200. To improve the heat dissipation of the chip 200, a fan is typically used to cool the third and fourth surfaces of the heat sink 30. However, the chip 200 of the vehicle-mounted communication terminal 1 provided in this embodiment has superior heat dissipation, thus eliminating the need for a fan for air cooling. This increases the effective usable area of ​​the vehicle-mounted communication terminal 1 and reduces its manufacturing cost.

[0120] This application provides a vehicle that includes the vehicle-mounted communication terminal 1 described in the foregoing embodiments. Because the vehicle-mounted communication terminal 1 has high reliability and heat dissipation, it is beneficial for upgrading the vehicle's communication standard and increasing the vehicle's carrying capacity.

[0121] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications of this application fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and modifications.

Claims

1. A communication module, characterized in that, The application relates to a communication module. The application relates to a communication module. The application relates to a communication module. The application relates to a communication module. The application relates to a communication module.

2. The communication module of claim 1, wherein, The application relates to a communication module. The application relates to a communication module.

3. The communication module according to claim 1 or 2, characterized in that, The application relates to a communication module.

4. The communication module according to any one of claims 1 to 3, characterized in that, The application relates to a communication module.

5. The communication module of claim 2, wherein, The application relates to a communication module.

6. The communication module of claim 2 or 5, wherein, The application relates to a communication module.

7. The communication module of any of claims 2, 5 or 6, wherein, The application relates to a communication module.

8. A communication module, characterized in that The application relates to a communication module. The application relates to a communication module. The application relates to a communication module. The application relates to a communication module.

9. A vehicle-mounted communication terminal, characterized by comprising: The application relates to a communication module. The application relates to a communication module. The application relates to a communication module.

10. The in-vehicle communication terminal according to claim 9, characterized by The application relates to a communication module. The application relates to a communication module.

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