Heat dissipation structure and edge intelligent terminal

Abstract

The utility model discloses a heat dissipation structure and an edge intelligent terminal, and relates to the technical field of intelligent terminals. The phase change heat dissipation module is arranged in the heat dissipation shell, and the phase change heat dissipation module is connected with the heat dissipation shell and a heating source; the heat conduction assembly is arranged on the inner surface of the heat dissipation shell, and the phase change heat dissipation module is in heat transfer connection with the heat dissipation shell through the heat conduction assembly. According to the technical scheme provided by the utility model, through the cooperative use of the phase change heat dissipation module and the heat conduction assembly, the technical problem that the existing heat dissipation structure cannot effectively meet the requirements of the edge intelligent terminal for different heat dissipation environments is solved.

Description

Technical Field

[0001] This utility model relates to the field of smart terminal technology, and in particular to a heat dissipation structure and an edge smart terminal. Background Technology

[0002] Edge intelligent terminals refer to devices that perform intelligent computing at the network edge. They are typically located near the data source, such as sensors, smartphones, industrial controllers, and smart home devices. These terminal devices have data processing and analysis capabilities, enabling localized data processing and rapid response. With the development of edge computing, edge intelligent terminals are widely used. Edge intelligent terminals generate a significant amount of heat during operation. Traditional heat dissipation methods generally rely on simple air cooling or small heat sinks to cool the internal components of the edge intelligent terminals.

[0003] However, during use, the existing heat dissipation structure cannot effectively meet the needs of edge smart terminals for different heat dissipation environments. Utility Model Content

[0004] The main purpose of this invention is to propose a heat dissipation structure that aims to solve the technical problem that existing heat dissipation structures cannot effectively meet the needs of edge intelligent terminals for different heat dissipation environments.

[0005] For the above purposes, the heat dissipation structure proposed in this utility model includes:

[0006] Heat sink;

[0007] A phase change heat dissipation module, wherein the phase change heat dissipation module is disposed inside the heat dissipation shell, and the phase change heat dissipation module is connected to the heat dissipation shell and the heat source; and

[0008] A heat-conducting component is disposed on the inner surface of the heat sink housing, and the phase change heat dissipation module is heat-transfer connected to the heat sink housing through the heat-conducting component.

[0009] In one embodiment, the heat dissipation structure further includes heat dissipation fins disposed on the side of the heat dissipation shell facing the outside, and the heat dissipation fins are provided on the heat dissipation shell in multiple ways.

[0010] In one embodiment, the heat dissipation fins are trapezoidal in shape.

[0011] In one embodiment, the phase change heat dissipation module includes:

[0012] The main heat sink is in contact with the heat source;

[0013] Auxiliary heat sinks are spaced apart from the main heat sink; and

[0014] A heat pipe having an evaporation section and a condensation section, wherein the evaporation section is connected to the main heat sink and the condensation section is connected to an auxiliary heat sink;

[0015] The heat pipe has an internal cavity containing a flowable phase change working fluid. The phase change working fluid absorbs heat and vaporizes, causing it to flow from the evaporation section to the condensation section, thereby transferring the heat absorbed by the phase change working fluid to the auxiliary heat sink.

[0016] In one embodiment, the thermally conductive component includes a thermally conductive film that connects the heat sink and the auxiliary heat sink.

[0017] In one embodiment, the thermally conductive component further includes a heat-spreading layer disposed between the thermally conductive film and the heat dissipation shell, wherein the thermally conductive film and the heat dissipation shell are connected by heat transfer through the heat-spreading layer.

[0018] In one embodiment, the thermally conductive film is made of graphene; and / or,

[0019] The heat spreader is made of copper.

[0020] In one embodiment, the heat dissipation structure further includes a heat dissipation fan assembly disposed on the outer surface of the heat dissipation shell, wherein the air outlet direction of the heat dissipation fan assembly is toward the heat dissipation fins.

[0021] This utility model also provides an edge intelligent terminal, including:

[0022] Terminal equipment main body; and

[0023] The heat dissipation structure as described in any of the above claims is located on the main body of the terminal device.

[0024] In one embodiment, the edge smart terminal further includes:

[0025] A temperature sensor is used to monitor the internal temperature of the edge smart terminal;

[0026] A control circuit, electrically connected to the temperature sensor, is used to receive the signal fed back by the temperature sensor, and the control circuit is also electrically connected to the cooling fan assembly to adjust the speed of the cooling fan assembly; and

[0027] The power supply, the control circuit, and the temperature sensor are all electrically connected to the power supply.

[0028] The technical solution provided by this utility model protects the internal electronic components of the edge smart terminal by providing a heat dissipation shell, reducing damage to these components from external factors. It also provides support, ensuring the stability and durability of the device under various operating conditions. The phase change heat dissipation module is a crucial component of the heat dissipation structure. Connecting the heat dissipation shell and the heat source, the module utilizes the heat absorption and release properties of phase change materials at specific temperatures to effectively control the temperature of the edge smart terminal. Furthermore, the included heat-conducting components effectively transfer heat from the phase change heat dissipation module to the heat dissipation shell, which then dissipates it into the environment, improving heat conduction efficiency and ensuring rapid heat transfer from the heat source to the heat dissipation shell. The technical solution proposed in this utility model can more effectively manage and dissipate heat, maintaining the edge smart terminal device at a suitable temperature and effectively meeting the needs of edge smart terminals for different heat dissipation environments. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 A three-dimensional structural diagram of an embodiment of the heat dissipation structure provided by this utility model;

[0031] Figure 2 A cross-sectional structural schematic diagram of an embodiment of the heat dissipation structure provided by this utility model;

[0032] Figure 3 A three-dimensional structural schematic diagram of an embodiment of the phase change heat dissipation module provided by this utility model;

[0033] Figure 4 A three-dimensional structural schematic diagram of an embodiment of the heat-conducting component provided by this utility model.

[0034] Explanation of icon numbers:

[0035] 10. Heat sink; 11. Heat sink fins; 20. Phase change heat dissipation module; 21. Main heat sink; 22. Auxiliary heat sink; 23. Heat pipe; 30. Thermal conductive components; 31. Thermal conductive film; 32. Heat dissipation layer; 40. Cooling fan assembly; 50. Terminal device host.

[0036] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0038] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0039] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0040] For edge intelligent terminals, firstly, the interaction requirements between the virtual power plant and user-side energy-consuming equipment are analyzed to determine the functional and performance indicators that the system must meet. This includes a detailed study of operational requirements such as activation / unloading, pipelined parallel processing, and expert parallel processing. A multi-layered cyber-physical system architecture is designed, including a physical layer, network layer, software layer, and algorithm layer. Each layer conforms to unified technical specifications, and system interaction interfaces, such as marketing business interfaces, scheduling interfaces, and information collection system interfaces, need to be optimized to ensure smooth data and command interaction. Secondly, at the software layer, a comprehensive management platform integrating data storage, analysis, processing, and optimization decision-making is developed. A user-friendly APP and system management platform are implemented, including the storage and processing of historical equipment status information and control decision commands, as well as human-computer interaction functions on the web front end. Simultaneously, at the communication layer, information transmission methods and efficiency requirements are set according to application scenarios and hierarchical requirements. A flexible communication network is designed, including local and wide-area multi-channel sharing, end-to-end, GPRS communication, etc., to ensure the security and efficiency of information in local networking and remote communication. Finally, an algorithm layer is developed to implement the intelligent functions of the edge computing module, using a model constrained by the lightweight intelligent terminal's memory resources to extract data features. Lightweight container service technology is utilized to reduce the memory and operational overhead of the edge terminal, allocating more resources to the terminal computing module and enhancing the intelligent terminal's computing and communication capabilities. The system adopts a serverless architecture, adjusting the interaction strategy with the cloud based on the load requirements of different terminals, providing more service response to terminal devices during peak load periods, and using the serverless architecture to provide technical support to intelligent terminals, while an elastic scaling strategy ensures stable system operation.

[0041] Edge intelligent terminals generate a lot of heat during operation. Since they are often in relatively complex working environments, existing heat dissipation structures cannot effectively meet the needs of edge intelligent terminals for different heat dissipation environments. In some compact installation spaces, heat dissipation space is limited; in high-temperature environments, the efficiency of traditional heat dissipation drops sharply. These problems can easily lead to performance degradation, shortened lifespan, or even failure of edge intelligent terminals due to overheating.

[0042] In view of this, the present invention provides a heat dissipation structure that can meet heat dissipation requirements in different installation environments. The phase change heat dissipation module connects the heat sink and the heat source, utilizing the characteristic of phase change materials to absorb and release heat at specific temperatures to effectively control the temperature of the edge smart terminal. Furthermore, through the combined use of the phase change heat dissipation module and the heat-conducting components, the heat generated by the edge smart terminal can be effectively conducted and dissipated, improving heat dissipation efficiency and thus meeting the needs of different heat dissipation environments.

[0043] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0044] like Figure 1 and Figure 2 As shown, a heat dissipation structure proposed in this embodiment of the present invention includes:

[0045] Heat sink 10;

[0046] Phase change heat dissipation module 20, the phase change heat dissipation module 20 is disposed inside the heat dissipation shell 10, and the phase change heat dissipation module 20 connects the heat dissipation shell 10 and the heat source; and

[0047] A heat-conducting component 30 is disposed on the inner surface of the heat sink 10, and the phase change heat dissipation module 20 is connected to the heat sink 10 through the heat-conducting component 30.

[0048] In this embodiment, the heat dissipation shell 10 provides protection for the internal electronic components of the edge smart terminal, reducing damage from external factors and providing support to ensure the stability and durability of the device under various operating conditions. The phase change heat dissipation module 20 is a crucial component of the heat dissipation structure. Connecting the heat dissipation shell 10 to the heat source, the phase change heat dissipation module 20 utilizes the heat absorption and release properties of phase change materials at specific temperatures to effectively control the temperature of the edge smart terminal. Furthermore, the heat-conducting component 30 effectively transfers heat from the phase change heat dissipation module 20 to the heat dissipation shell 10, which then dissipates it into the environment, improving heat conduction efficiency and ensuring rapid heat transfer from the heat source to the heat dissipation shell 10. The technical solution proposed in this embodiment can more effectively manage and dissipate heat, maintaining the edge smart terminal device at a suitable temperature and effectively meeting the needs of edge smart terminals for different heat dissipation environments.

[0049] Specifically, the heat dissipation structure includes a heat sink 10, a phase change heat dissipation module 20, and a heat conduction component 30.

[0050] The heat sink 10 is generally made of a metal material with a high thermal conductivity, such as aluminum alloy. It has good thermal conductivity and can quickly conduct the heat generated by the internal components away, reducing the risk of overheating of the equipment.

[0051] The phase change heat dissipation module 20 connects the heat sink 10 and the heat source. Utilizing the property of phase change materials to absorb and release heat at specific temperatures, it transfers the heat generated by the heat source to the heat sink 10. Understandably, the isothermal or near-isothermal property of phase change materials during phase change allows the temperature of the edge smart terminal to be controlled within a certain range, thereby improving reliability and stability. Simultaneously, the phase change heat dissipation module 20 can adjust based on the phase change point of the phase change material according to different ambient temperatures of the edge smart terminal, adapting to different heat dissipation requirements and ensuring stable operation of the device in various environments.

[0052] The thermally conductive component 30 can effectively transfer heat from the phase change heat dissipation module 20 to the heat sink 10. It is understood that the phase change heat dissipation module 20 is thermally connected to the heat sink 10 through the thermally conductive component 30, thus optimizing the heat conduction path, reducing heat loss, and improving the overall heat dissipation efficiency of the heat dissipation structure. The thermally conductive component 30 can be composed of multiple layers of thermally conductive materials.

[0053] Furthermore, refer to Figure 1 , Figure 2 In one embodiment of the present invention, the heat dissipation structure further includes heat dissipation fins 11, which are disposed on the side of the heat dissipation shell 10 facing the outside. Multiple heat dissipation fins 11 are provided on the heat dissipation shell 10.

[0054] In this embodiment, the surface area of ​​the heat sink 10 is increased by the heat dissipation fins 11, thereby improving heat dissipation efficiency. The heat dissipation fins 11 dissipate heat through conduction and convection. In the convection heat dissipation process, the size of the heat dissipation area directly determines the effectiveness of the heat dissipation. It is understood that a larger surface area results in better heat dissipation, while a smaller surface area results in worse heat dissipation.

[0055] Furthermore, refer to Figure 1 In one embodiment of this utility model, the heat dissipation fins 11 are trapezoidal in shape.

[0056] In this embodiment, the trapezoidal heat dissipation fins 11 are designed to increase the heat dissipation area and facilitate airflow. Through their unique shape, the trapezoidal fins can provide a larger surface area within the same space, thereby enhancing heat dissipation performance. Furthermore, the design of the trapezoidal heat dissipation fins 11 can optimize the thermal performance of the heat sink 10 by reducing wind resistance and allowing cool air to be drawn in through gaps, thus achieving the best heat dissipation effect.

[0057] Furthermore, refer to Figure 2 , Figure 3 In one embodiment of this utility model, the phase change heat dissipation module 20 includes:

[0058] The main heat sink 21 is in contact with the heat source;

[0059] Auxiliary heat sink 22 is spaced apart from main heat sink 21; and

[0060] Heat pipe 23 has an evaporation section and a condensation section. The evaporation section is connected to the main heat sink 21, and the condensation section is connected to the auxiliary heat sink 22.

[0061] The heat pipe 23 has a cavity inside, and a flowable phase change working fluid is placed inside the cavity. The phase change working fluid absorbs heat and vaporizes, causing it to flow from the evaporation section to the condensation section, so as to transfer the heat absorbed by the phase change working fluid to the auxiliary heat sink 22.

[0062] In this embodiment, the phase change heat dissipation module 20 may further include a main heat sink 21, an auxiliary heat sink 22, and a heat pipe 23. The main heat sink 21 is in direct contact with the heat source and is the first contact point for heat transfer. It can absorb the heat generated by the heat source, facilitating subsequent heat dissipation. The auxiliary heat sink 22 is spaced apart from the main heat sink 21 to help disperse the heat absorbed by the main heat sink 21, thereby improving the efficiency of the entire heat dissipation module, reducing the heat load of a single heat sink, and minimizing the risk of local overheating. The heat pipe 23 utilizes the phase change process of the phase change working fluid to achieve rapid heat conduction. The heat pipe 23 has a relative evaporation section and a condensation section. It can be understood that when the evaporation section of the heat pipe 23 is heated, the phase change working fluid absorbs heat and evaporates into gas. The gas then flows to the condensation section, where it releases heat and condenses back into a liquid state. The liquid phase change working fluid then returns to the evaporation section, forming a continuous cycle. In this embodiment, the evaporation section of the heat pipe 23 is connected to the main heat sink 21. The phase change working fluid absorbs the heat transferred by the main heat sink 21 and vaporizes into steam. Then the steam flows to the condensation section of the heat pipe 23 and releases heat to the auxiliary heat sink 22, thereby completing the heat transfer. This arrangement can efficiently transfer heat while maintaining a uniform temperature, thus improving the performance and efficiency of the entire heat dissipation structure.

[0063] Furthermore, refer to Figure 2 In one embodiment of the present invention, the heat-conducting component 30 includes a heat-conducting film 31, which connects the heat dissipation shell 10 and the auxiliary heat dissipation fins 22.

[0064] In this embodiment, the heat-conducting component 30 may include a heat-conducting film 31. The heat-conducting film 31 can fill the micro-gaps and uneven pores between the heat sink 10 and the auxiliary heat sink 22, reducing thermal resistance and improving heat dissipation performance. Through the heat-conducting film 31, the heat from the auxiliary heat sink 22 can be quickly conducted to the heat sink 10.

[0065] Furthermore, refer to Figure 2 , Figure 4 In one embodiment of the present invention, the heat-conducting component 30 further includes a heat-spreading layer 32 disposed between the heat-conducting film 31 and the heat dissipation shell 10, and the heat-conducting film and the heat dissipation shell 10 are connected by heat transfer through the heat-spreading layer 32.

[0066] In this embodiment, the heat-conducting component 30 may further include a heat-spreading layer 32. The heat-spreading layer 32 can further uniformly distribute heat and reduce the risk of local overheating. The heat-spreading layer 32 plays a key role in uniform temperature distribution and efficient heat conduction in the heat-conducting component 30, and can increase the contact area with the heat sink 10, significantly improving the heat dissipation effect of the entire heat dissipation structure.

[0067] Furthermore, in one embodiment of this utility model, the thermal conductive film 31 is made of graphene; and / or,

[0068] The heat spreader 32 is made of copper.

[0069] In this embodiment, the thermally conductive film 31 is made of graphene, a hexagonal two-dimensional honeycomb carbon nanomaterial composed of carbon atoms. Graphene possesses excellent thermal conductivity, and due to its high thermal conductivity, flexibility, and low density, the graphene thermally conductive film 31 can better transfer heat. The heat dissipation layer 32 is made of copper, which has good thermal conductivity and can effectively conduct heat, achieving rapid heat conduction and expansion. In the heat dissipation structure, it can play a role in uniform heat distribution, reducing the risk of localized overheating.

[0070] Furthermore, refer to Figure 1 In one embodiment of the present invention, the heat dissipation structure further includes a heat dissipation fan assembly 40, which is disposed on the outer surface of the heat dissipation shell 10, and the air outlet direction of the heat dissipation fan assembly 40 is towards the heat dissipation fins 11.

[0071] In this embodiment, the heat dissipation structure may further include a cooling fan assembly 40. The fan in the cooling fan assembly 40 is a centrifugal fan with high air pressure, which increases the airflow speed around the heat dissipation fins 11, thereby improving convective heat dissipation efficiency and effectively blowing air across the heat dissipation fins 11 to accelerate heat dissipation. It is understood that the fan speed in the cooling fan assembly 40 can be intelligently adjusted according to the internal temperature of the edge smart terminal. When the internal temperature is low, the fan operates at a low speed to reduce noise and energy consumption; when the internal temperature rises to a certain threshold, the fan speed increases to enhance the heat dissipation effect.

[0072] This utility model also provides an edge intelligent terminal, which includes the heat dissipation structure of the above embodiments. The specific structure of the heat dissipation structure is as described in the above embodiments. Since this edge intelligent terminal adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0073] Furthermore, in one embodiment of this utility model, the edge intelligent terminal further includes:

[0074] Temperature sensors are used to monitor the internal temperature of edge smart terminals;

[0075] The control circuit is electrically connected to the temperature sensor to receive the signal fed back from the temperature sensor, and is also electrically connected to the cooling fan assembly 40 to adjust the speed of the cooling fan assembly 40; and

[0076] The power supply, control circuit, and temperature sensor are all electrically connected to the power supply.

[0077] In this embodiment, the edge intelligent terminal may further include a temperature sensor, a control circuit, and a power supply. The temperature sensor is used to monitor the temperature of the edge intelligent terminal device in real time. The control circuit manages and coordinates the operation of the edge intelligent terminal, transmitting the temperature data fed back by the temperature sensor to the cooling fan assembly 40 and precisely adjusting the airflow of the cooling fan assembly 40. The power supply provides the necessary power to the edge intelligent terminal to support the normal operation of the temperature sensor and the control circuit.

[0078] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: Heat sink; A phase change heat dissipation module, wherein the phase change heat dissipation module is disposed inside the heat dissipation shell, and the phase change heat dissipation module is connected to the heat dissipation shell and the heat source; and A heat-conducting component is disposed on the inner surface of the heat sink housing, and the phase change heat dissipation module is heat-transfer connected to the heat sink housing through the heat-conducting component.

2. The heat dissipation structure as described in claim 1, characterized in that, The heat dissipation structure also includes heat dissipation fins, which are disposed on the side of the heat dissipation shell facing the outside. Multiple heat dissipation fins are provided on the heat dissipation shell.

3. The heat dissipation structure as described in claim 2, characterized in that, The heat dissipation fins are trapezoidal in shape.

4. The heat dissipation structure as described in claim 1, characterized in that, The phase change heat dissipation module includes: The main heat sink is in contact with the heat source; Auxiliary heat sinks are spaced apart from the main heat sink; and A heat pipe having an evaporation section and a condensation section, wherein the evaporation section is connected to the main heat sink and the condensation section is connected to an auxiliary heat sink; The heat pipe has an internal cavity containing a flowable phase change working fluid. The phase change working fluid absorbs heat and vaporizes, causing it to flow from the evaporation section to the condensation section, thereby transferring the heat absorbed by the phase change working fluid to the auxiliary heat sink.

5. The heat dissipation structure as described in claim 4, characterized in that, The thermally conductive component includes a thermally conductive film, which connects the heat sink and the auxiliary heat sink.

6. The heat dissipation structure as described in claim 5, characterized in that, The thermally conductive component further includes a heat-spreading layer disposed between the thermally conductive film and the heat dissipation shell, and the thermally conductive film and the heat dissipation shell are connected by heat transfer through the heat-spreading layer.

7. The heat dissipation structure as described in claim 6, characterized in that, The thermally conductive film is made of graphene; and / or, The heat spreader is made of copper.

8. The heat dissipation structure as described in claim 2, characterized in that, The heat dissipation structure also includes a cooling fan assembly disposed on the outer surface of the heat dissipation shell, with the air outlet direction of the cooling fan assembly facing the heat dissipation fins.

9. An edge intelligent terminal, characterized in that, include: Terminal equipment main body; as well as The heat dissipation structure as described in any one of claims 1-8 is disposed on the main body of the terminal device.

10. The edge intelligent terminal as described in claim 9, characterized in that, The edge intelligent terminal also includes: A temperature sensor is used to monitor the internal temperature of the edge smart terminal; A control circuit, electrically connected to the temperature sensor, is used to receive the signal fed back by the temperature sensor, and the control circuit is also electrically connected to the cooling fan assembly to adjust the speed of the cooling fan assembly; and The power supply, the control circuit, and the temperature sensor are all electrically connected to the power supply.

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