Water cooling plate heat dissipation device

Abstract

The utility model provides a water cooling plate heat dissipation device. The water cooling plate heat dissipation device comprises a water tank, a water cooling plate, a branch pipe, a water suction pump and a heat exchanger. The water cooling plate body is in contact with a heating element, cooling liquid in the water cooling plate body is used for dissipating heat of the heating element, the cooling liquid inlet is communicated with the water cooling plate water outlet, and the water cooling plate is arranged higher than the water tank. The branch pipe comprises a main pipeline and a branch pipeline, the main pipeline is communicated with the circulating waterway water outlet, and the branch pipeline is communicated with the cooling liquid water outlet. Cooling liquid returns to the water tank from the water tank through the main pipeline, the water suction pump and the heat exchanger to form a continuous circulating waterway, and negative pressure is generated in the branch pipeline when the continuous circulating waterway flows through the main pipeline, so that the cooling liquid flows into the water cooling plate body from the water tank, dissipates heat and enters the main pipeline from the branch pipeline to form a water cooling plate negative pressure loop.

Description

Technical Field

[0001] This application relates to a water-cooled plate heat dissipation device, and more particularly to a water-cooled plate heat dissipation device that uses a manifold to create negative pressure water inlet to prevent coolant leakage from damaging the heat-generating components. Background Technology

[0002] With the development of technologies such as the internet and artificial intelligence, the demand for servers and cloud computing devices is constantly increasing. As computing power continues to improve, the heat generated by the processing units or computing units of these devices also increases. How to effectively dissipate heat from these devices has become an important issue. In addition to installing air conditioning in the installation space, more effective heat dissipation devices must be installed for these specific heat-generating components, such as processing units or computing units, to prevent these electronic components from burning out due to high temperatures or affecting computing performance.

[0003] Among various heat dissipation options, water-cooled systems offer superior cooling performance and are frequently chosen for servers and computer equipment. Most existing water-cooled systems use a pump to inject coolant into a water-cooled plate. The coolant exchanges heat with the heat-generating components, carrying the heat away to achieve cooling. However, if gaps or cracks appear in the joints or surfaces of the components in these water-cooled systems, the positive pressure from the pump can cause coolant to leak out. If this leaks into electronic components, it can lead to short circuits and burnout, affecting the operation of the system.

[0004] In summary, existing water-cooled heat dissipation devices still have significant design flaws, making it difficult to prevent coolant leakage when gaps or holes appear in components, which can easily lead to damage to heat-generating elements. To address this, the inventors of this application have conceived and designed a water-cooled plate heat dissipation device to improve upon the shortcomings of existing technologies, thereby enhancing its industrial application. Utility Model Content

[0005] In view of the problems in the prior art, the purpose of this application is to provide a water-cooled plate heat dissipation device to solve the problem of coolant leakage damaging the heat-generating element in the prior art water-cooled heat dissipation device.

[0006] According to the aforementioned objectives of this application, a water-cooled plate heat dissipation device is proposed, comprising a water tank, a water-cooled plate, a branch pipe, a water pump, and a heat exchanger. The water tank includes a water tank inlet, a water tank body, a water-cooled plate outlet, and a circulating water outlet. The water-cooled plate includes a coolant inlet, a water-cooled plate body, and a coolant outlet. The water-cooled plate body contacts the heat-generating element, and the coolant within the water-cooled plate body dissipates heat from the heat-generating element. The coolant inlet is connected to the water-cooled plate outlet, and the water-cooled plate is positioned higher than the water tank. The branch pipe includes a main pipe and branch pipes. The main pipe is connected to the circulating water outlet, and the branch pipes are connected to the coolant outlet. The water pump is connected to the main pipe. The heat exchanger includes a hot water inlet, a heat exchange chamber, and a cold water outlet. The hot water inlet is connected to the water pump, and the cold water outlet is connected to the water tank inlet. Coolant flows from the water tank body through the circulating water outlet to the main pipe. After being pumped out by the water pump, it is sent to the hot water inlet, then flows out through the cold water outlet, and returns to the water tank through the water tank inlet, forming a continuous circulating water path. When the continuous circulating water path flows through the main pipe, it generates negative pressure in the branch pipe, causing the coolant to flow out from the water-cooled plate outlet, flow into the water-cooled plate body through the coolant inlet, and then flow out from the coolant outlet again, entering the main pipe through the branch pipe, forming a negative pressure loop for the water-cooled plate.

[0007] Preferably, the water tank can be located at the bottom of the water-cooled plate heat dissipation device.

[0008] Preferably, the heat exchanger can be positioned higher than the water tank.

[0009] Preferably, the water tank inlet can be located on the top surface of the water tank body, and the water cooling plate outlet and the circulating water outlet can be located on the side surface of the water tank body.

[0010] Preferably, the coolant inlet and coolant outlet can be respectively located on two opposite side surfaces of the water-cooled plate body.

[0011] Preferably, the coolant inlet and coolant outlet can be respectively located at both ends of the top surface of the water-cooled plate body.

[0012] Preferably, the branch pipe may include a first branch pipe and a second branch pipe, and the first branch pipe and the second branch pipe are respectively connected to different water-cooled plates.

[0013] Preferably, the heat exchange cavity can be connected to a heat sink or heat sink fins.

[0014] Preferably, a fan may be installed in the heat exchange chamber.

[0015] Preferably, the heating element may include the central processing unit or image processor of the motherboard.

[0016] In summary, the water-cooled plate heat dissipation device of this application may have one or more of the following advantages:

[0017] (1) The water-cooled plate heat dissipation device can be set up through a branch pipe to form a negative pressure suction in the main pipeline circulation water circuit, thereby forming a negative pressure loop of the water-cooled plate, so that the water-cooled plate device does not need to establish a vacuum environment, reducing the device installation cost and reducing the complexity of water-cooled plate heat dissipation device assembly.

[0018] (2) The water-cooled plate heat dissipation device can be designed so that when the water-cooled plate cracks, the coolant can fall back to the water tank by gravity, preventing the coolant from leaking and directly contacting the heat-generating components, thus avoiding the problem of short circuit and burnout of the components.

[0019] (3) The water-cooled plate heat dissipation device can simultaneously install multiple water-cooled plates through multiple branch pipes of the manifold, which increases the heat dissipation efficiency, increases the flexibility of the entire electronic device design, and enhances the diversity of operation. Attached Figure Description

[0020] To make the technical features, content, advantages, and effects of this application more apparent, the application is now described in detail below with reference to the accompanying drawings and embodiments:

[0021] Figure 1 This is a frame diagram of the water-cooled plate heat dissipation device according to an embodiment of this application.

[0022] Figure 2 This is a schematic diagram of a water-cooled plate heat dissipation device according to an embodiment of this application.

[0023] Figure 3 This is a schematic diagram of a water-cooled plate according to an embodiment of this application.

[0024] Figure 4 This is a schematic diagram of a water-cooled plate according to another embodiment of this application.

[0025] The markings in the diagram are as follows: 10, 20: Water-cooled plate heat dissipation device; 11, 21: Water tank; 12, 22, 32, 42: Water-cooled plate; 13, 23: Branch pipe; 14, 24: Water pump; 15, 25: Heat exchanger; 16: Continuous circulating water circuit; 17: Water-cooled plate negative pressure circuit; 50: Coolant; 90: Heating element; 111, 211: Water tank inlet; 112, 213: Water-cooled plate outlet; 113, 214: Circulating water. Water outlet; 121, 221, 321, 421: Coolant inlet; 122, 223, 323, 423: Coolant outlet; 131, 231: Main pipe; 132, 232: Branch pipe; 212: Water tank body; 222, 322, 422: Water-cooled plate body; 232A: First branch pipe; 232B: Second branch pipe; 251: Hot water inlet; 252: Heat exchange chamber; 253: Cold water outlet. Detailed Implementation

[0026] To facilitate understanding of the technical features, content, advantages, and effects of this application, the application is hereby described in detail with reference to the accompanying drawings and in the form of embodiments. The drawings used are for illustrative purposes only and to assist in the description. They may not represent the actual proportions and precise configurations of the application after implementation. Therefore, the proportions and configurations of the accompanying drawings should not be used to interpret or limit the scope of the application in actual implementation. This is explained in advance.

[0027] Please see Figure 1 This is a framework diagram of a water-cooled plate heat dissipation device according to an embodiment of this application. As shown in the figure, the water-cooled plate heat dissipation device 10 includes a water tank 11, a water-cooled plate 12, a branch pipe 13, a water pump 14, and a heat exchanger 15. When components in a computer device generate heat during operation, they must be cooled and dissipated through various heat dissipation devices to prevent damage to the components due to high temperatures. Among various heat dissipation devices, water-cooled cooling with coolant has excellent heat dissipation effect and is often chosen for installation in computer devices, such as in various types of servers, to dissipate heat from the heat-generating components 90 on the motherboard. These heat-generating components 90 include electronic components such as central processing units or graphics processors. These electronic components generate a large amount of heat during operation and need to be cooled by the water-cooled plate heat dissipation device 10 to maintain the operating performance of the components and ensure their service life.

[0028] In the water-cooled plate heat dissipation device 10, the water-cooled plate 12 is in contact with the heat-generating element 90 to be cooled. The heat energy of the heat-generating element 90 is carried away by the coolant flowing through the water-cooled plate 12. In order to allow the coolant to flow into and out of the water-cooled plate 12, the prior art mostly uses a water pump to inject the coolant from the inlet, and then uses positive pressure to make the coolant flow through the internal pipes of the water-cooled plate 12 and then out from the outlet. However, the water-cooled plate 12 is in direct contact with the heat-generating element 90. If the pipes or structure of the water-cooled plate 12 are damaged, the coolant may leak under positive pressure and come into contact with the heat-generating element 90, causing short circuits or open circuits in electronic components. In view of this, this application adopts a negative pressure method to allow the coolant to be drawn out from the outlet. Under negative pressure, even if the structure of the water-cooled plate 12 has cracks or gaps, the coolant will not directly leak and come into contact with the heat-generating element 90.

[0029] First, the water tank 11 includes a tank body, which has a water tank inlet 111, a water-cooled plate outlet 112, and a circulating water outlet 113. The water tank inlet 111 receives the coolant cooled by the heat exchanger 15 and stores the coolant in the tank body. The tank body has two outlets: the first is the water-cooled plate outlet 112 connected to the water-cooled plate 12, and the other is the circulating water outlet 113 connected to the branch pipe 13. The circulating water outlet 113 is connected to the main pipe 131 of the branch pipe 13. Since the branch pipe 13 is connected to the water pump 14, when the motor is running, it continuously draws out the coolant from the branch pipe 13 and sends it to the heat exchanger 15 via the water pump 14. After the heat exchanger 15 cools the coolant, it is injected into the water tank through the water tank inlet 111. Coolant flows from the water tank body through the circulating water outlet 113 to the main pipe 131, is pumped out by the water pump 14 and sent to the heat exchanger 15, and after cooling, returns to the water tank 11 through the water inlet 111, forming a continuous circulating water path 16.

[0030] The water-cooled plate outlet 112 is connected to the coolant inlet 121 of the water-cooled plate 12, allowing coolant to be injected into the water-cooled plate 12, enter the flow channel inside the water-cooled plate body, and then flow out from the coolant outlet 122 of the water-cooled plate 12 to the branch pipe 132 of the manifold 13. As mentioned above, the motor of the water pump 14 continuously runs to form a continuous circulation water path 16 for the coolant. At this time, in the main pipe 131 of the manifold 13, the coolant continuously flows from the water tank 11 towards the water pump 14. Through the Venturi effect, the pressure in the branch pipe 132 is reduced, that is, a negative pressure suction force is generated on the branch pipe 132, which draws the coolant in the water-cooled plate 12 into the manifold 13. Coolant flows out from the water-cooled plate outlet 112, flows into the water-cooled plate 12 through the coolant inlet 121, and then flows out from the coolant outlet 122, entering the main pipe 131 of the branch pipe 13 through the branch pipe 132, forming a water-cooled plate negative pressure circuit 17.

[0031] By using the continuous circulating water path 16, the Venturi effect of the branch pipe 13 creates a negative pressure state for the branch pipe 132 and the water-cooled plate 12. Even if the structure of the water-cooled plate 12 is damaged, the coolant will still be drawn out through the branch pipe, preventing it from flowing out through cracks in the water-cooled plate 12 and damaging the heating element. In addition, the water-cooled plate 12 is positioned higher than the water tank 11, making the coolant inlet 121 higher than the circulating water path outlet 113 of the water tank 11. When the water-cooled plate is damaged, the coolant inlet 121 will naturally fall back into the water tank 11 due to gravity, preventing the coolant from continuously being injected into the water-cooled plate 12 and avoiding it from flowing out through cracks in the water-cooled plate 12 and damaging the heating element. In this embodiment, the Venturi effect generated between the main pipe 131 and the branch pipe 132 by the manifold 13 is used to form a negative pressure in the branch pipe 132, thereby forming a negative pressure loop 17 in the water-cooled plate 12. This design means that when the water-cooled plate 12 is filled with water under negative pressure, there is no need to use vacuum equipment to form a negative pressure environment, which effectively reduces the cost of the device and the complexity of manufacturing the water-cooled plate heat dissipation device 10.

[0032] Please see Figure 2 This is a schematic diagram of a water-cooled plate heat dissipation device according to an embodiment of this application. As shown in the figure, the water-cooled plate heat dissipation device 20 includes a water tank 21, a water-cooled plate 22, a branch pipe 23, a water pump 24, and a heat exchanger 25. The water tank 21 includes a water tank inlet 211, a water tank body 212, a water-cooled plate outlet 213, and a circulating water outlet 214. The water tank 21 is located at the bottom of the water-cooled plate heat dissipation device 20, so that the water-cooled plate 22 and the heat exchanger 25 are positioned higher than the water tank 21. The water tank body 212 has an internal space to store coolant 50, and its external shape can be adjusted according to the internal space of the heat dissipation device. The water tank inlet 211 is located on the top surface of the water tank body 212, and the water-cooled plate outlet 213 and the circulating water outlet 214 are located on the side surface of the water tank body 212. The water-cooled plate outlet 213 can be set above the circulating water outlet 214. When multiple water-cooled plates 22 are set, multiple water-cooled plate outlets 213 can be set to correspond to each water-cooled plate 22.

[0033] The water-cooled plate 22 includes a coolant inlet 221, a water-cooled plate body 222, and a coolant outlet 223. The water-cooled plate body 222 is in contact with the heat-generating element and includes a pipe space through which the coolant 50 passes. When the coolant 50 flows through the water-cooled plate 22, it can dissipate heat from the heat-generating element. The coolant inlet 221 is connected to the water-cooled plate outlet 213. The water-cooled plate 22 is positioned higher than the water tank 21. When the structure of the water-cooled plate 22 develops a crack or the negative pressure is released, the coolant 50 will naturally fall from the coolant inlet 221 to the water-cooled plate outlet 213 due to gravity and be stored in the water tank body 212, preventing leakage in the pipes and damage to other electronic components.

[0034] The manifold 23 includes a main pipe 231 and a branch pipe 232. The pipe area of ​​the main pipe 231 is larger than that of the branch pipe 232. The main pipe 231 is connected to the outlet 214 of the circulating water circuit and is connected to the water pump 24. The motor of the water pump 24 draws the coolant 50 from the outlet 214 of the circulating water circuit, enters the water pump 24 through the main pipe, and is then discharged from the outlet of the water pump 24, flowing to the hot water inlet of the heat exchanger 25. When the motor of the water pump 24 continues to run, causing the coolant 50 to continuously flow through the main pipe 231, the branch pipe 232 of the manifold 23 will generate a negative pressure suction due to the Venturi effect. This causes the coolant 50 in the water tank 21 to also flow out from the outlet 213 of the water-cooled plate, flow into the water-cooled plate body 222 through the coolant inlet 221, and then flow out from the outlet 223, entering the main pipe 231 of the manifold 23 through the branch pipe 232. The negative pressure state of the branch pipe 232 and the water-cooled plate 22 is formed by the Venturi effect of the manifold 23. When the structure of the water-cooled plate 22 is damaged, the coolant 50 will still be drawn out through the branch pipe 232 and will not flow out through the crack of the water-cooled plate 22 and damage the heating element.

[0035] In this embodiment, the branch pipe 23 further includes a first branch pipe 232A and a second branch pipe 232B, which are arranged in parallel with the branch pipe 232. The first branch pipe 232A and the second branch pipe 232B are respectively connected to different water-cooled plates. Similarly, the fluid in the main pipe 231 of the branch pipe 23 creates negative pressure suction in each branch, allowing the coolant 50 to dissipate heat through other water-cooled plates. The number of branch pipes in this application is not limited to the number in the embodiment. In other embodiments, the number of branch pipes and their corresponding number of water-cooled plates can be adjusted according to the type and number of heat-generating elements.

[0036] The water-cooled plate 22 cools and dissipates heat from the heat-generating components using coolant 50. After passing through the water-cooled plate 22, the coolant 50 flowing out has a high temperature. Although it mixes with the coolant 50 output from the water tank after entering the main pipe 231 for initial cooling, the coolant 50 still has a high temperature when passing through the water pump 24. It needs to be further cooled by the heat exchanger 25 to restore the coolant 50 to a lower operating temperature. The coolant 50 pumped out by the water pump 24 enters the heat exchange chamber 252 of the heat exchanger 25 through the hot water inlet 251. The heat exchange chamber 252 may contain an internal space or internal pipes. The heat exchange chamber 252 is connected to a heat sink or heat sink fins, or a fan is installed in the heat exchange chamber 252 to cool the coolant 50 inside the heat exchange chamber 252. Then it flows out through the cold water outlet 253 and returns to the water tank 212 through the water tank inlet 211. The heat exchanger 25 is positioned higher than the water tank 21. The cooled coolant 50 can be directly injected into the water tank inlet 211 from the cold water outlet 253 and stored inside the water tank body 212. The coolant 50 flows from the water tank body 212 through the circulating water outlet 214 to the main pipe 231, is pumped out by the water pump 24 and sent to the hot water inlet 251, then flows out from the cold water outlet 253 and back to the water tank 211 through the water tank inlet 211, forming a continuous circulating water path. When the continuous circulating water path flows through the main pipe 231, a negative pressure is generated in the branch pipe 232, causing the coolant 50 to flow out from the water-cooled plate outlet 213, into the water-cooled plate body 222 through the coolant inlet 221, and then out from the coolant outlet 223, entering the main pipe 231 through the branch pipe 232, forming a negative pressure loop for the water-cooled plate.

[0037] When cracks or damage occur in the structure of the water-cooled plate 22, the coolant 50 flows out from both sides of the coolant inlet 221 and coolant outlet 223. The height difference causes the coolant 50 to fall back into the water tank 21 due to gravity, and the negative pressure through the branch pipe 232 draws the coolant 50 out, preventing it from flowing out through the cracks in the water-cooled plate 22 and damaging the heating elements. The design of the branch pipe 23 not only accommodates the number of water-cooled plates 22 installed but also simplifies the device complexity by eliminating the need for vacuum equipment to create a negative pressure environment, effectively reducing device costs.

[0038] Please see Figure 3This is a schematic diagram of a water-cooled plate according to an embodiment of this application. As shown in the figure, the water-cooled plate 32 includes a coolant inlet 321, a water-cooled plate body 322, and a coolant outlet 323. The water-cooled plate body 322 can be a metal plate or sheet structure, which is in contact with the heat-generating element and dissipates heat from the heat-generating element through the coolant inside the water-cooled plate body 322. The coolant inlet 321 and the coolant outlet 323 can be respectively disposed at both ends of the top surface of the water-cooled plate body 322. Referring to the foregoing embodiment, the coolant inlet 321 is connected to the water-cooled plate outlet to receive coolant from the water tank, and the coolant outlet 323 is connected to a branch pipe to send the discharged coolant to the manifold.

[0039] Please see Figure 4 This is a schematic diagram of a water-cooled plate according to another embodiment of this application. As shown in the figure, the water-cooled plate 42 includes a coolant inlet 421, a water-cooled plate body 422, and a coolant outlet 423. The water-cooled plate body 422 can be a metal plate or sheet structure, which is in contact with the heat-generating element and dissipates heat from the heat-generating element through the coolant inside the water-cooled plate body 422. The coolant inlet 421 and the coolant outlet 423 can be respectively disposed on two opposite side surfaces of the water-cooled plate body 422. Referring to the foregoing embodiment, the coolant inlet 421 is connected to the water-cooled plate outlet to receive coolant from the water tank, and the coolant outlet 423 is connected to a branch pipe to send the discharged coolant to the manifold.

[0040] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this application should be included within the scope of the claims.

Claims

1. A water-cooled plate heat dissipation device, characterized in that, Include: The water tank includes a water tank inlet, a water tank body, a water-cooled plate outlet, and a circulating water outlet. A water-cooled plate includes a coolant inlet, a water-cooled plate body, and a coolant outlet. The water-cooled plate body is in contact with a heat-generating element, and the heat-generating element is dissipated through the coolant inside the water-cooled plate body. The coolant inlet is connected to the water-cooled plate outlet, and the water-cooled plate is positioned higher than the water tank. A branch pipe includes a main pipe and branch pipes, wherein the main pipe is connected to the outlet of the circulating water circuit and the branch pipes are connected to the outlet of the coolant. A water pump is connected to the main pipeline; as well as A heat exchanger includes a hot water inlet, a heat exchange chamber, and a cold water outlet. The hot water inlet is connected to the water pump, and the cold water outlet is connected to the water tank inlet. The coolant flows from the water tank body through the outlet of the circulating water path to the main pipe, is pumped out by the water pump and sent to the hot water inlet, then flows out through the cold water outlet and returns to the water tank through the water tank inlet, forming a continuous circulating water path. When the continuous circulating water path flows through the main pipe, a negative pressure is generated in the branch pipe, causing the coolant to flow out from the outlet of the water-cooled plate, flow into the water-cooled plate body through the coolant inlet, and then flow out from the coolant outlet again, entering the main pipe through the branch pipe, forming a negative pressure loop for the water-cooled plate.

2. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The water tank is located at the bottom of the water-cooled plate heat dissipation device.

3. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The heat exchanger is positioned higher than the water tank.

4. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The water tank inlet is located on the top surface of the water tank body, and the water cooling plate outlet and the circulating water outlet are located on the side surface of the water tank body.

5. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The coolant inlet and the coolant outlet are respectively located on two opposite side surfaces of the water-cooled plate body.

6. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The coolant inlet and the coolant outlet are respectively located at both ends of the top surface of the water-cooled plate body.

7. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The branch pipe includes a first branch pipe and a second branch pipe, and the first branch pipe and the second branch pipe are respectively connected to different water-cooled plates.

8. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The heat exchange cavity is connected to a heat sink or heat sink fins.

9. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The heat exchange chamber is equipped with a fan.

10. The water-cooled plate heat dissipation device according to claim 1, characterized in that, The heating element mentioned above includes a central processing unit or a graphics processor on the motherboard.

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