Multi-branch phase change heat dissipation device
By setting multiple independent heat dissipation cavities and flow channel cavities in the heat dissipation substrate and heat exchanger, and forming a multi-branch design through gas-liquid pipelines, the downtime problem caused by the single loop in the existing technology is solved, achieving the effects of efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202520330385.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-02-27
AI Technical Summary
Existing phase change heat dissipation devices typically employ a single heat dissipation loop design, which makes it easy for the equipment to shut down when it fails, affecting reliability and service life, and making it inconvenient for inspection and maintenance.
A multi-branch phase change heat dissipation device is adopted. By setting multiple heat dissipation cavities in the heat dissipation substrate and connecting them with the flow channel cavities in the heat exchanger through gas-liquid riser pipes and gas-liquid downcomer pipes, multiple independent heat dissipation circuits are formed. This ensures that other circuits can still work normally when a single circuit fails, while also enhancing heat dissipation efficiency.
It improves heat dissipation efficiency, enhances system reliability and maintainability, avoids system downtime caused by a single heat dissipation loop failure, and extends the service life of the equipment.
Smart Images

Figure CN223798557U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of energy storage battery manufacturing technology, and in particular to a multi-branch phase change heat dissipation device. Background Technology
[0002] To reduce product costs, an increasing number of power supply devices on the market are adopting high-power designs. This increase in power leads to greater heat dissipation demands, placing higher requirements on the heat dissipation performance of radiators. Traditional aluminum profile radiators or aluminum finned radiators, due to limitations in their structure and heat dissipation principles, are no longer sufficient to meet the heat dissipation needs of high-power equipment. Therefore, high-efficiency radiators utilizing the phase change principle have gradually become a focus of market attention. However, existing phase change heat dissipation devices often employ a single heat dissipation loop design; a failure in this design can cause the entire system to shut down, and it is inconvenient for inspection and maintenance, affecting the reliability and lifespan of the equipment. Therefore, how to improve heat dissipation efficiency while ensuring system reliability and maintainability has become an urgent technical problem to be solved. Utility Model Content
[0003] The purpose of this invention is to solve the problem of equipment failure and inability to operate when the equipment malfunctions.
[0004] This utility model provides a multi-branch phase change heat dissipation device, comprising:
[0005] A heat dissipation substrate with multiple heat dissipation cavities inside;
[0006] The heat exchanger has multiple flow channel cavities inside;
[0007] Multiple gas-liquid riser pipes and multiple gas-liquid downcomer pipes;
[0008] The heat dissipation cavity is connected to the flow channel cavity through the gas-liquid riser pipe and the gas-liquid fallr pipe.
[0009] Furthermore, each of the flow channel cavities of the heat exchanger is provided with heat exchange fins.
[0010] Furthermore, the heat dissipation cavity contains a medium.
[0011] Furthermore, the heat exchanger is disposed at one end of the heat dissipation substrate and is disposed perpendicular to the heat dissipation substrate.
[0012] Furthermore, there is a predetermined distance between the heat exchanger and the heat dissipation substrate, and the gas-liquid riser is disposed between the heat exchanger and the heat dissipation substrate.
[0013] Furthermore, one end of the gas-liquid downpipe is connected to the other end of the heat dissipation substrate, extends parallel to the heat dissipation substrate, extends vertically, and is connected to the heat exchanger.
[0014] Furthermore, the heat dissipation substrate, the heat exchanger, the gas-liquid riser pipe, and the gas-liquid fallr pipe are all made of aluminum alloy.
[0015] Furthermore, the diameter of the gas-liquid riser is 1-1.5 times the diameter of the gas-liquid downcomer.
[0016] Furthermore, the gas-liquid riser pipe is vertically arranged.
[0017] Compared with the prior art, the present invention has at least the following beneficial effects: by setting multiple independent heat dissipation cavities in the heat dissipation substrate and connecting them with the corresponding flow channel cavities in the heat exchanger through gas-liquid riser pipes and gas-liquid fallr pipes to form multiple independent heat dissipation circuits, the other heat dissipation circuits can still work normally when a single heat dissipation circuit fails, thereby ensuring that the entire heat dissipation system can continue to operate at reduced load without completely shutting down. At the same time, the use of multiple parallel heat dissipation circuits can also improve the overall heat dissipation efficiency. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained as provided without creative effort.
[0019] Figure 1 This is an isometric view of a phase change heat dissipation device according to an embodiment of the present invention;
[0020] Figure 2 This is a front view of a phase change heat dissipation device according to an embodiment of the present invention;
[0021] Figure 3 This is a top view of a phase change heat dissipation device according to an embodiment of the present invention;
[0022] Figure 4 This is a left view of a phase change heat dissipation device in one embodiment of the present invention;
[0023] Figure 5 This is a cross-sectional view of the phase change heat dissipation device along the AA direction in one embodiment of the present invention;
[0024] Figure 6 This is a cross-sectional view of the phase change heat dissipation device along the BB direction in one embodiment of the present invention;
[0025] Among them, 1-heat dissipation substrate; 2-heat exchanger; 3-gas-liquid riser pipe; 4-gas-liquid faller pipe. Detailed Implementation
[0026] The present invention will now be described in more detail with reference to the accompanying drawings, which illustrate preferred embodiments of the present invention. It should be understood that those skilled in the art can modify the present invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being broadly known to those skilled in the art and is not intended to limit the present invention.
[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0028] The present invention will be described in more detail below by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer as will be explained below. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.
[0029] This utility model provides a multi-branch phase change heat dissipation device. Please refer to [reference needed]. Figures 1-4 ,include:
[0030] The heat dissipation substrate 1 has multiple heat dissipation cavities inside it;
[0031] Heat exchanger 2 has multiple flow channel cavities inside;
[0032] Multiple gas-liquid riser pipes 3 and multiple gas-liquid downcomer pipes 4;
[0033] The heat dissipation cavity is connected to the flow channel cavity through the gas-liquid riser pipe 3 and the gas-liquid fallr pipe 4.
[0034] The heat dissipation cavity within the heat dissipation substrate 1 is used to contain the phase change medium, while the flow channel cavity within the heat exchanger 2 is used to achieve heat exchange. Each heat dissipation cavity and a flow channel cavity form a closed-loop heat dissipation circuit via a gas-liquid riser pipe 3 and a gas-liquid downcomer pipe 4. The gas-liquid riser pipe 3 allows the phase change material to change from a liquid to a gaseous state and rise after absorbing heat, while the gas-liquid downcomer pipe 4 allows the gaseous phase change material to condense into a liquid state and descend back into the heat dissipation cavity after releasing heat, thus forming a continuous heat dissipation cycle.
[0035] The multi-branch design improves heat dissipation efficiency while enhancing system reliability and maintainability. Compared to traditional single-circuit heat dissipation designs, the multi-branch design ensures that if one branch fails, the others can continue to operate normally, thus preventing system-wide downtime. Furthermore, the multi-branch design facilitates inspection and maintenance, helping to extend equipment lifespan. Optimized pipe interface settings and media flow paths further enhance heat dissipation performance, meeting the cooling requirements of high-power equipment.
[0036] Furthermore, each of the flow channel cavities of the heat exchanger 2 is provided with heat exchange fins.
[0037] Heat exchange fins can increase the surface area of heat exchanger 2, thereby improving heat exchange efficiency. Specifically, heat exchange fins can be fixed to the outer wall of the flow channel cavity by welding, riveting, or integral molding. As a preferred embodiment, the heat exchange fins can be made of aluminum alloy to enhance their thermal conductivity. In addition, the shape of the heat exchange fins can be straight, corrugated, or serrated to adapt to different heat exchange requirements.
[0038] By incorporating heat exchange fins, the heat dissipation efficiency of heat exchanger 2 can be significantly improved, thereby better meeting the heat dissipation requirements of high-power equipment. This not only enhances heat dissipation performance but also strengthens system reliability and maintainability through a multi-branch design, avoiding system downtime caused by a single heat dissipation loop failure.
[0039] Furthermore, the heat dissipation cavity contains a medium.
[0040] This medium achieves efficient heat transfer through the principle of phase change during the heat dissipation process. Specifically, after absorbing heat within the heat dissipation substrate 1, the medium vaporizes. The vaporized medium then flows to the heat exchanger 2 through the gas-liquid riser pipe 3. In the heat exchanger 2, it condenses back into a liquid state and returns to the heat dissipation substrate 1 through the gas-liquid downcomer pipe 4, forming a circulating heat dissipation process. The medium can be water, ethanol, or other liquids with high latent heat of phase change to achieve efficient heat transfer.
[0041] As a preferred embodiment, the choice of medium can be adjusted according to the specific application requirements. For example, in high-temperature environments, a medium with a higher boiling point can be selected to ensure the stability of the heat dissipation system; while in low-temperature environments, a medium with a lower boiling point can be selected to improve heat dissipation efficiency. In addition, the filling amount of the medium can also be optimized according to the dimensions of the heat dissipation substrate 1 and the heat exchanger 2 to ensure that the medium can flow sufficiently during the vaporization and condensation process, avoiding the impact on heat dissipation effect due to insufficient or excessive medium.
[0042] By incorporating a medium and utilizing the principle of phase change, highly efficient heat transfer is achieved, solving the problem of insufficient heat dissipation efficiency of traditional radiators in high-power equipment. This not only improves heat dissipation efficiency but also enhances system reliability and maintainability through a multi-branch design, avoiding system downtime caused by a single heat dissipation loop failure. Specifically, by placing a medium within the heat dissipation cavity and combining it with the circulation design of the gas-liquid riser pipe 3 and gas-liquid downcomer pipe 4, rapid and uniform heat transfer is ensured, effectively reducing the equipment's operating temperature and extending its service life.
[0043] Furthermore, The heat exchanger is disposed at one end of the heat dissipation substrate and is perpendicular to the heat dissipation substrate.
[0044] The predetermined distance between the heat exchanger and the heat dissipation base plate can be adjusted according to actual heat dissipation requirements to ensure optimal heat dissipation. The location and direction of the gas-liquid riser pipe can be designed according to specific application scenarios. For example, in situations with limited space, the gas-liquid riser pipe can be arranged in a curved or inclined manner to adapt to different installation environments. The connection method of the gas-liquid downcomer can also be adjusted as needed, for example, a detachable connection method can be used to facilitate maintenance and repair.
[0045] By aligning the heat exchanger perpendicular to the heat dissipation substrate and incorporating a gas-liquid riser between them, highly efficient heat exchange between the heat dissipation substrate and the heat exchanger is achieved. The gas-liquid downcomer further optimizes the heat conduction path, allowing the heat dissipation medium to be more evenly distributed between the heat dissipation substrate and the heat exchanger, thereby improving heat dissipation efficiency. This improved efficiency also enhances the system's reliability and maintainability, resolving the common failure issues inherent in existing phase change heat dissipation devices with a single heat dissipation loop design.
[0046] Furthermore, there is a predetermined distance between the heat exchanger and the heat dissipation substrate, and the gas-liquid riser is disposed between the heat exchanger and the heat dissipation substrate.
[0047] Specifically, the predetermined distance between the heat exchanger and the heat sink base plate can be adjusted according to actual heat dissipation requirements to ensure optimal heat dissipation. The gas-liquid riser pipe is positioned between the heat exchanger and the heat sink base plate; this design helps improve heat exchange efficiency while facilitating maintenance and repair. The connection method of the gas-liquid downcomer ensures that the cooling medium can effectively flow from the heat sink base plate to the heat exchanger, further enhancing the stability and reliability of the heat dissipation system.
[0048] In a preferred embodiment, the gas-liquid riser pipe can be designed with an adjustable length to accommodate heat dissipation substrates and heat exchangers of different sizes. Furthermore, the vertical extension of the gas-liquid downcomer pipe can be provided with multiple branches to increase the flow path of the cooling medium, thereby improving heat dissipation efficiency.
[0049] By optimizing the distance between the heat exchanger and the heat dissipation base plate, as well as the layout of the gas-liquid riser and downcomer pipes, the heat dissipation efficiency was significantly improved, while the reliability and maintainability of the system were enhanced.
[0050] Furthermore, one end of the gas-liquid downpipe is connected to the other end of the heat dissipation substrate, extends parallel to the heat dissipation substrate, extends vertically, and is connected to the heat exchanger.
[0051] This design enables the gas-liquid downpipe to effectively transfer heat from the heat dissipation substrate to the heat exchanger, thus achieving efficient heat dissipation. The portion of the downpipe extending parallel to the heat dissipation substrate ensures that heat is not lost due to pipe bends during transfer, while the vertically extending portion directly transfers heat to the heat exchanger, avoiding secondary heat transfer losses.
[0052] As a preferred embodiment, the gas-liquid downcomer can be made of aluminum alloy, which has good thermal conductivity and mechanical strength, ensuring that the gas-liquid downcomer maintains stable performance under high-temperature environments. Furthermore, the diameter of the gas-liquid downcomer can be adjusted according to actual heat dissipation requirements to maximize heat dissipation efficiency.
[0053] Therefore, the technical solution of this application achieves efficient heat transfer between the heat dissipation substrate and the heat exchanger by optimizing the structural design of the gas-liquid downcomer. This improves heat dissipation efficiency, simplifies the structure of the heat dissipation device, and reduces manufacturing costs and maintenance difficulty. Specifically, by extending the gas-liquid downcomer parallel to the heat dissipation substrate and then perpendicularly to the heat exchanger, heat loss caused by pipe bending in traditional designs is avoided, thereby improving overall heat dissipation performance. In addition, this design facilitates the inspection and maintenance of the heat dissipation device, improving the reliability and service life of the equipment.
[0054] Please refer to Figures 5-6 Each heat dissipation cavity is connected to the flow channel cavity via an independent gas-liquid riser pipe 3 and a gas-liquid downcomer pipe 4. This design allows each heat dissipation cavity and flow channel cavity to form an independent heat dissipation circuit. For example, the diameters of the gas-liquid riser pipe 3 and the gas-liquid downcomer pipe 4 can be adjusted according to actual heat dissipation requirements to ensure the flow efficiency and heat dissipation effect of the medium in the pipeline.
[0055] By connecting each heat dissipation cavity to the flow channel cavity through independent gas-liquid riser pipes 3 and gas-liquid downcomer pipes 4, a multi-branch independent heat dissipation design is achieved. This not only improves heat dissipation efficiency but also enhances system reliability and maintainability. Specifically, when one branch fails, the others can still operate normally, avoiding the risk of a complete system downtime. Furthermore, the independent branch design facilitates inspection and maintenance, reduces equipment downtime, and extends equipment lifespan.
[0056] Specifically, the thermally vaporized medium flows to the heat exchanger 2 through the gas-liquid riser 3. The heat exchanger 2 is used to condense the thermally vaporized medium into a liquid state and transfer it to the heat dissipation substrate 1 through the gas-liquid downcomer 4.
[0057] Specifically, the function of the gas-liquid riser pipe 3 is to transport the heated and vaporized medium in the heat dissipation base plate 1 to the heat exchanger 2. The heat exchanger 2, through its internal flow channel cavity and externally arranged heat exchange fins, condenses the heated and vaporized medium into a liquid state. The condensed liquid medium then flows back to the heat dissipation base plate 1 through the gas-liquid downcomer pipe 4, completing one cycle. Through the synergistic effect of the gas-liquid riser pipe 3 and the heat exchanger 2, efficient circulation and heat dissipation of the medium are achieved. This not only solves the system downtime problem caused by a single heat dissipation loop design but also improves the system's reliability and maintainability through a multi-branch design, thus effectively meeting the heat dissipation requirements of high-power equipment.
[0058] Furthermore, the heat dissipation substrate 1, the heat exchanger 2, the gas-liquid riser pipe 3, and the gas-liquid downcomer pipe 4 are all made of aluminum alloy.
[0059] The choice of aluminum alloy material offers advantages such as lightweight, high thermal conductivity, and excellent corrosion resistance, effectively improving the heat dissipation efficiency and service life of the heat dissipation device. Specifically, the high thermal conductivity of aluminum alloy allows for rapid heat transfer from the heat dissipation base plate 1 to the heat exchanger 2, and the heat is circulated and transferred through the gas-liquid riser pipe 3 and the gas-liquid downcomer pipe 4. Furthermore, the corrosion resistance of aluminum alloy ensures that the heat dissipation device is not easily affected by environmental factors during long-term use, thus maintaining stable heat dissipation performance.
[0060] As a preferred embodiment, the aluminum alloy material can be 6061 or 6063 series aluminum alloys, both of which are widely used in industrial applications and possess good mechanical and processing properties. Furthermore, the aluminum alloy surface can be anodized to enhance its corrosion resistance and wear resistance, thereby further improving the reliability of the heat dissipation device. By using aluminum alloy material, not only is the heat dissipation efficiency of the heat dissipation device improved, but its durability and reliability are also enhanced. Compared with traditional single-circuit heat dissipation designs, multi-branch phase-change heat dissipation devices made of aluminum alloy can reduce the risk of system failure while ensuring efficient heat dissipation, facilitating inspection and maintenance, thus solving the technical problems in the heat dissipation requirements of high-power equipment.
[0061] Furthermore, the diameter of the gas-liquid riser 3 is 1-1.5 times the diameter of the gas-liquid downcomer 4.
[0062] Specifically, the diameter of the gas-liquid riser pipe 3 is designed to be 1-1.5 times that of the gas-liquid downcomer pipe 4. This design effectively improves the flow capacity of the gas-liquid riser pipe 3, thereby accelerating the flow of the heated vaporized medium to the heat exchanger 2. As a preferred embodiment, the diameter of the gas-liquid riser pipe 3 can be adjusted according to actual heat dissipation requirements. For example, when the heat dissipation requirement is large, the diameter of the gas-liquid riser pipe 3 can be appropriately increased to further improve heat dissipation efficiency. In addition, the diameter design of the gas-liquid riser pipe 3 can also be achieved by optimizing the pipe wall thickness and material selection to ensure its stability and durability under high temperature and high pressure environments.
[0063] This significantly improves the heat dissipation efficiency of the heat dissipation device. Specifically, the increased diameter of the gas-liquid riser pipe 3 reduces the flow resistance of the medium during its ascent, thereby accelerating the heat exchange rate. This design not only effectively solves the problem of insufficient heat dissipation efficiency in traditional heat dissipation devices but also improves the reliability and maintainability of the heat dissipation device, ensuring the stability of the equipment during long-term operation.
[0064] Furthermore, the gas-liquid riser pipe 3 is vertically arranged.
[0065] Specifically, the vertical arrangement of the gas-liquid riser pipe 3 facilitates the natural rise of the medium during the phase change process, promoting medium flow through gravity and thus improving heat dissipation efficiency. As a preferred embodiment, the gas-liquid riser pipe 3 can be perpendicular to the connection surface between the heat dissipation substrate 1 and the heat exchanger 2, ensuring that the medium's ascent is unobstructed. Furthermore, the vertical arrangement of the gas-liquid riser pipe 3 simplifies the piping layout, reduces the use of bends and other connectors, and lowers system complexity and manufacturing costs.
[0066] Therefore, the vertical arrangement of the gas-liquid riser pipe 3 not only optimizes the flow path of the medium but also improves the reliability and ease of maintenance of the system. Through this design, the medium can flow more efficiently from the heat dissipation base plate 1 to the heat exchanger 2 during the phase change process, and return to the heat dissipation base plate 1 through the gas-liquid downcomer pipe 4 after condensation, forming a stable cycle. This significantly improves heat dissipation efficiency while reducing system failure rate and maintenance difficulty, solving a key problem in the heat dissipation requirements of high-power equipment.
[0067] In summary, by setting N independent heat dissipation cavities and flow channel cavities in the heat dissipation base plate and heat exchanger respectively, and forming multiple independent heat dissipation circuits through gas-liquid riser pipes and gas-liquid downcomer pipes, parallel heat dissipation of multiple branches is achieved, improving the overall heat dissipation efficiency. Simultaneously, the multi-branch design ensures that other circuits can continue to operate normally even if a single heat dissipation circuit fails, allowing for continued reduced-load operation without complete shutdown. The 2N pipe interfaces on the heat dissipation base plate and heat exchanger facilitate the installation and connection of each heat dissipation circuit, and the surface fixing holes facilitate the fixed installation of the heat dissipation base plate. The heat exchange fins on the heat exchanger further enhance the heat dissipation effect. All components are made of aluminum alloy, which has good thermal conductivity and processing performance. The larger diameter of the gas-liquid riser pipe compared to the downcomer pipe effectively reduces the expansion pressure on the pipe wall during the phase change process of the liquid medium. The independent design of each heat dissipation circuit also facilitates inspection and maintenance, improving the maintainability of the device.
[0068] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.
Claims
1. A multi-branch phase change heat dissipation device, characterized in that, include: A heat dissipation substrate with multiple heat dissipation cavities inside; The heat exchanger has multiple flow channel cavities inside; Multiple gas-liquid riser pipes and multiple gas-liquid downcomer pipes; The heat dissipation cavity is connected to the flow channel cavity through the gas-liquid riser pipe and the gas-liquid fallr pipe.
2. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, Each of the flow channel cavities of the heat exchanger is provided with heat exchange fins.
3. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, The heat dissipation cavity contains a medium.
4. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, The heat exchanger is disposed at one end of the heat dissipation substrate and is perpendicular to the heat dissipation substrate.
5. The multi-branch phase change heat dissipation device as described in claim 4, characterized in that, The heat exchanger and the heat dissipation substrate are at a predetermined distance, and the gas-liquid riser is disposed between the heat exchanger and the heat dissipation substrate.
6. The multi-branch phase change heat dissipation device as described in claim 5, characterized in that, One end of the gas-liquid downpipe is connected to the other end of the heat dissipation substrate, extends parallel to the heat dissipation substrate, then extends vertically and connects to the heat exchanger.
7. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, The heat dissipation substrate, the heat exchanger, the gas-liquid riser pipe, and the gas-liquid fallr pipe are all made of aluminum alloy.
8. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, The diameter of the gas-liquid riser pipe is 1 to 1.5 times the diameter of the gas-liquid downcomer pipe.
9. The multi-branch phase change heat dissipation device as described in claim 1, characterized in that, The gas-liquid riser pipe is set vertically.