Heat dissipation system of power equipment

Abstract

The utility model discloses a heat dissipation system of power equipment. The heat dissipation system comprises a box body, a plurality of circuit boards, a plurality of fans and a heat exchange module, a first air inlet and a first heat dissipation hole are formed in one side of the box body at intervals in the first direction; the plurality of circuit boards are arranged in the box body at intervals along a first direction; a first circulating air channel is formed between the first air inlet and the first heat dissipation hole between at least one pair of adjacent circuit boards through the fan; part of the circuit board corresponding to the position of the first heat dissipation hole forms a second circulating air duct in a plane vertical to the first direction through the fan; the heat exchange module is installed in the first heat dissipation hole and conveys airflow of the first circulating air duct to the second circulating air duct after heat exchange and cooling. The heat dissipation box has the beneficial effects that heat of different areas in the box body can be concentrated to the first heat dissipation holes of the box body through the draught fan, then heat dissipation is conducted through the installed heat exchange module, and the requirement for the installation space of the heat exchange module can be effectively reduced so that the compactness of the structure can be improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system for power devices. Background Technology

[0002] With the continuous development of the photovoltaic industry, the demand for photovoltaic inverter equipment is constantly increasing, and the requirements for inverter protection level, structural size, and operating power are becoming increasingly stringent. Due to the increasing power density of the overall structure, the losses of internal electronic components such as capacitors, IGBTs, fuses, and magnetic components are further increasing, and the heat flux density is also increasing. The temperature rise inside the chassis has a decisive impact on the performance of internal components.

[0003] The common method for heat dissipation inside the inverter chassis is to use heat sinks. However, with the increasing protection levels of inverters, relying solely on heat sinks is insufficient to meet the operating requirements of internal components. Heat exchangers are needed to exchange heat between the internal and external environments to further reduce component temperatures. However, existing heat exchangers are relatively large and installed at the bottom of a sealed chamber. Their layout significantly impacts the inverter's structural dimensions, requiring careful planning in advance to improve structural compactness. This complicates the inverter's structural design. Utility Model Content

[0004] One objective of this application is to provide a heat dissipation system for power devices that can solve at least one of the defects in the aforementioned background art.

[0005] To achieve at least one of the above objectives, the technical solution adopted in this application is as follows: a heat dissipation system for a power device, comprising a housing, multiple circuit boards, multiple fans, and a heat exchange module; a first air inlet and a first heat dissipation hole are spaced apart along a first direction on one side of the housing; multiple circuit boards are spaced apart inside the housing along the first direction; a first circulating air duct is formed between the first air inlet and the first heat dissipation hole by the fans between at least a pair of adjacent circuit boards; a portion of the circuit boards corresponding to the position of the first heat dissipation hole forms a second circulating air duct in a plane perpendicular to the first direction by the fans; the heat exchange module is installed at the first heat dissipation hole and cools the airflow in the first circulating air duct before delivering it to the second circulating air duct.

[0006] Preferably, a set of first air inlets is provided on the side of the housing; or, two sets of first air inlets are provided on the side of the housing, the two sets of first air inlets being located on both sides of the first heat dissipation hole along the first direction; each set has at least one first air inlet, and the plurality of first air inlets in each set are spaced apart on the same side wall of the housing along a second direction perpendicular to the first direction.

[0007] Preferably, the circuit board includes a first circuit board and a second circuit board; the mounting position of the first circuit board corresponds to the first air inlet, and the mounting position of the second circuit board corresponds to the first heat dissipation hole; the first circuit board and the nearest second circuit board cooperate with the fan installed between them to form the first circulating air duct; the second circuit board cooperates with the fan installed thereon to form the second circulating air duct.

[0008] Preferably, the first circuit board is installed close to the first air inlet, and the second circuit board is installed far from the first air inlet; the first circulating air duct is formed between the first circuit board and the nearest second circuit board by a first fan installed at an angle away from the first air inlet.

[0009] Preferably, a second fan is installed on the side of the second circuit board close to the heat exchange module, and a third fan is installed in the middle of the side of the second circuit board away from the heat exchange module; the second fan is installed at the downstream end of the heat exchange module along the airflow direction of the second circulating air duct; the second fan is directly opposite the second circuit board, and the third fan is inclined so that the second fan and the third fan cooperate to form the second circulating air duct.

[0010] Preferably, there are multiple second circuit boards, and at least one pair of adjacent second circuit boards share the same second fan.

[0011] Preferably, the heat exchange module is built into the housing, and the heat exchange module includes a heat exchanger, an air guide plate, and a fourth fan; the air guide plate and the fourth fan are installed at both ends of the same side of the heat exchanger, and the heat exchanger is fitted to the inner wall of the housing through the air guide plate and the fourth fan; the side of the heat exchanger away from the inner wall of the housing is used to absorb the heat carried by the airflow in the first circulating air duct and the second circulating air duct; the side of the heat exchanger close to the inner wall of the housing forms an external heat exchange channel with the outside through the air guide plate and the fourth fan for heat dissipation.

[0012] Preferably, the heat exchange module is partially external to the housing. The heat exchange module includes a heat exchanger, a guide vane, a fourth fan, and a fifth fan. The heat exchanger is installed on the outer wall of the housing, and the guide vane and the fourth fan are installed on the inner wall of the housing to form an inner heat exchange channel, thereby transferring the heat carried by the airflow in the first and second circulating air ducts to the heat exchanger. The fifth fan is installed on one side of the heat exchanger to form an outer heat exchange channel for heat dissipation.

[0013] Preferably, the housing is provided with independent first heat dissipation cavity and second heat dissipation cavity along the first direction; the circuit board is installed in the first heat dissipation cavity, and the opposite side walls of the second heat dissipation cavity are provided with a second air inlet and a second heat dissipation hole, and an inductor module and a heat dissipation module are installed in the second heat dissipation cavity; the heat dissipation module includes an adjacent heat sink and a sixth fan, the inductor module is installed between the sixth fan and the second air inlet, and the heat sink is installed between the sixth fan and the second heat dissipation hole.

[0014] Preferably, the number of air inlets is one group, and the power module is mounted on the back of the second circuit board, which is furthest from the first circuit board; the substrate of the heat sink is close to the power module so that the heat generated by the power module is transferred to the heat sink for heat dissipation.

[0015] Compared with the prior art, the beneficial effects of this application are as follows:

[0016] (1) By using the internal fan, the heat in different areas inside the box can be concentrated to the first heat dissipation hole of the box, and then the heat exchange module installed at the first heat dissipation hole can dissipate heat, which can effectively reduce the installation space requirement of the heat exchange module and improve the compactness of the structure.

[0017] (2) By installing the heat exchange module on the side of the box, the installation difficulty can be reduced, and the heat exchange module can be easily maintained and cleaned. When the equipment fails, the components can be replaced or repaired more quickly, reducing the downtime of the equipment.

[0018] (3) By installing the heat exchange module on the side of the box, it can be far away from the heat source, thereby increasing the heat conduction distance and making the heat distribution more uniform, thus improving the heat dissipation effect of the heat exchange module. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structural layout of this application in the vertical direction.

[0020] Figure 2 This is a schematic diagram of the structural layout of the second circuit board in this application.

[0021] Figure 3 This is a schematic diagram of the external heat exchange module structure of this application. Figure 1 .

[0022] Figure 4 This is a schematic diagram of the external heat exchange module structure of this application. Figure 2 .

[0023] Figure 5 This is a schematic diagram of the structural layout of the heat dissipation module of this application.

[0024] In the diagram: housing 100, first heat dissipation cavity 110, second heat dissipation cavity 120, side plate 130, first air inlet 131, first heat dissipation hole 132, second air inlet 141, second heat dissipation hole 142, first circuit board 210, second circuit board 220, power module 240, inductor module 250, first fan 310, second fan 320, third fan 330, heat exchange module 400, heat exchanger 410, air guide plate 420, fourth fan 430, fifth fan 440, heat dissipation module 500, radiator 510, sixth fan 520. Detailed Implementation

[0025] The present application will now be further described in conjunction with specific embodiments. It should be noted that, in the description of this specification, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0026] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0027] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0031] One preferred embodiment of this application, such as Figure 1As shown, a heat dissipation system for a power device includes a housing 100, multiple circuit boards, multiple fans, and a heat exchange module 400. One side plate 130 of the housing 100 is provided with a first air inlet 131 and a first heat dissipation hole 132 spaced apart along a first direction. The first air inlet 131 allows cool air from the outside to flow into the housing 100 for heat dissipation of the power devices, while the first heat dissipation hole 132 facilitates heat exchange with the outside environment, thereby transferring heat from inside the housing 100 to the outside. Multiple circuit boards are spaced apart inside the housing 100 along the first direction. At least one pair of adjacent circuit boards are connected by fans to form a first circulating air duct between the first air inlet 131 and the first heat dissipation hole 132. This allows the airflow formed by the cool air entering the housing 100 through the first air inlet 131 to flow along the first circulating air duct towards the first heat dissipation hole 132, thereby cooling the circuit boards that pass through. A portion of the circuit board corresponding to the first heat dissipation hole 132 forms a second circulating air duct through the first heat dissipation hole 132 in a plane perpendicular to the first direction through a fan. The heat exchange module 400 is installed in the first heat dissipation hole 132 and delivers the airflow of the first circulating air duct to the second circulating air duct after heat exchange and cooling, thereby cooling the circuit board through which the second circulating air duct passes.

[0032] It should be understood that in this embodiment, a first circulating airflow channel is formed inside the housing 100 using a fan to dissipate heat from different circuit boards. Simultaneously, a second circulating airflow channel is formed within the device mounting space of some circuit boards. Both the first and second circulating airflow channels can be connected at the first heat dissipation hole 132. This allows heat from different areas inside the housing 100 to be concentrated at the first heat dissipation hole 132, and finally dissipated through the heat exchange module 400 installed at the first heat dissipation hole 132. Compared to traditional methods, this embodiment allows for precise determination of the installation position of the heat exchange module 400 to rationally utilize the structural space of the housing 100. It also reduces the number of heat exchange modules 400 installed, thereby reducing the installation space requirements and leaving more central space for the installation of other important components, thus improving the compactness of the internal structure of the housing 100.

[0033] Meanwhile, in this embodiment, by installing the heat exchange module 400 away from the circuit board that generates the heat source, sufficient heat conduction distance can be provided, allowing for a more uniform distribution of heat generated on the circuit board when it is transferred to the heat exchange module 400, thereby improving the heat dissipation effect of the heat exchange module 400. Furthermore, by installing the heat exchange module 400 on the side of the housing 100, the installation difficulty of the heat exchange module 400 can be reduced, facilitating subsequent maintenance and cleaning.

[0034] It is understandable that, depending on the installation method of the power device, the first direction can be either vertical or horizontal. Generally speaking, power devices have relatively strict requirements for installation space in the thickness direction. Therefore, in this embodiment, the first direction is preferably vertical, which also facilitates airflow. That is, the circuit boards are vertically spaced, so for each circuit board, its installation direction is horizontal. Then, some adjacent circuit boards can form a first circulating air duct in the vertical direction through a fan, and some circuit boards can form a second circulating air duct in their own horizontally mounted plane of power devices through a fan.

[0035] In this embodiment, as Figure 1 As shown, a set of first heat dissipation holes 132 is provided. Each set of first heat dissipation holes 132 can contain one or more holes; that is, the first heat dissipation holes 132 can be elongated or arranged in a multi-opening pattern along the horizontal width of the side plate 130. There are two main structures for the first air inlet 131, which will be described in detail below. The first structure of the first air inlet 131 is as follows... Figure 1 As shown, a set of first air inlets 131 is provided. This set of first air inlets 131 can be located above or below the first heat dissipation hole 132. A second structure of the first air inlets 131 is that two sets of first air inlets 131 are provided on the side of the housing 100, with the two sets of first air inlets 131 located vertically on both sides of the first heat dissipation hole 132. Each set has at least one first air inlet 131; that is, the first air inlet 131 can be elongated or arranged in a multi-opening pattern along the horizontal width of the side panel 130.

[0036] It is understood that both structural forms of the first air inlet 131 described above can meet the requirements of this application. The first structural form is suitable for situations with a small number of circuit boards, while the second structural form is suitable for situations with a large number of circuit boards. The specific choice can be made according to the actual needs of those skilled in the art. For the convenience of the following description, the following description will take the example of a set of first air inlets 131 installed on the upper side of the first heat dissipation hole 132.

[0037] In this embodiment, as Figure 1As shown, the circuit board includes a first circuit board 210 and a second circuit board 220. The mounting position of the first circuit board 210 corresponds to the first air inlet 131, and the mounting position of the second circuit board 220 corresponds to the first heat dissipation hole 132. The first circuit board 210 and the nearest second circuit board 220 cooperate with a fan installed between them to form a first circulating air duct. When the fan used to form the first circulating air duct is working, it can draw cold air from the outside from the first air inlet 131 into the interior of the housing 100, and then flow through the first circuit board 210 and the second circuit board 220 closest to the first circuit board 210 before flowing to the heat exchange module 400. Thus, during the flow of cold air, the first circuit board 210 and the corresponding second circuit board 220 can be cooled down sequentially. At the same time, the second circuit board 220 cooperates with the fan installed in its mounting plane to form a second circulating air duct. Thus, the airflow carrying heat in the first circulating air duct, after being cooled down by the heat exchange module 400, can cool down the corresponding second circuit board 220 along the second circulating air duct.

[0038] Understandably, the cold air entering the housing 100 from the first air inlet 131 has a good cooling effect. Therefore, no additional heat dissipation or heat exchange method is needed for the first circuit board 210; air cooling is sufficient. Since the heat generated on a single circuit board is not very high, the cold air entering the housing 100 from the first air inlet 131 still has a certain cooling capacity after cooling the first circuit board 210. This can be circulated to the second circuit board 220 by a fan for further cooling. Because the cold air entering from the first air inlet 131 has already cooled the first circuit board 210, its ability to cool the second circuit board 220 is relatively weak and may not meet the expected cooling requirements. Therefore, a heat exchange module 400 can be installed to cool the airflow to enhance its cooling capacity before it re-circulates along the second air duct to cool the second circuit board 220 to meet the expected requirements.

[0039] It should be understood that the specific number of the first circuit board 210 and the second circuit board 220 can be set according to the actual needs of those skilled in the art. The number of the first circuit board 210 can be one or more; the number of the second circuit board 210 can also be one or more; for example... Figure 1 As shown, there is one first circuit board 210 and two second circuit boards 220. For ease of description in the following sections, the following explanation will use one first circuit board 210 and two second circuit boards 220 as an example.

[0040] In this embodiment, there are various specific arrangement structures that can form the first circulating air duct. For ease of understanding, one specific structure will be described in detail below. For example... Figure 1 As shown, the first circuit board 210 is mounted horizontally close to the first air inlet 131, and the second circuit board 220 is mounted horizontally away from the first air inlet 131. A first circulating air duct is formed between the first circuit board 210 and the nearest second circuit board 220 by a first fan 310 mounted at an angle away from the first air inlet 131.

[0041] Specifically, such as Figure 1 As shown, the side plate 130 for housing the first air inlet 131 and the first heat dissipation hole 132 can be located on the right side of the housing 100. The first circuit board 210 is horizontally mounted on the right side of the housing 100, and the second circuit board 220 is horizontally mounted on the left side of the housing 100. The first fan 310 is also horizontally mounted on the left side of the housing 100, tilted upwards and to the left. The specific tilt angle can be set according to actual needs, such as 30°, 45°, or 60°. When the first fan 310 is working, it can draw cold air from the right side of the housing 100 into the interior of the housing 100. After passing through the first circuit board 210, the cold air flows downwards and to the left through the first fan 310 to the second circuit board 220. Since the left side of the housing 100 is a sealed structure, the airflow can flow to the right along the second circuit board 220 to the heat exchange module 400. It should be noted that... Figure 1 The direction indicated by the dashed arrow in the middle is the airflow direction of the first circulation duct.

[0042] In this embodiment, there are various specific arrangement structures that can form the first circulating air duct. For ease of understanding, one specific structure will be described in detail below. For example... Figures 2 to 4 As shown, a second fan 320 is mounted on the side of the second circuit board 220 closest to the heat exchange module 400, and a third fan 330 is mounted in the middle of the side of the second circuit board 220 furthest from the heat exchange module 400. The second fan 320 is located downstream of the heat exchange module 400 along the airflow direction of the second circulating air duct; the second fan 320 faces the second circuit board 220 directly, and the third fan 330 is tilted so that the second fan 320 and the third fan 330 cooperate to form the second circulating air duct.

[0043] Understandably, in the horizontal direction, the airflow direction of the second circulation duct can be either clockwise or counterclockwise, for example... Figures 2 to 4As shown, the airflow direction of the second circulating air duct is clockwise. Assuming that the second fan 320 is installed horizontally at the front of the interior of the housing 100, the second fan 320 can blow the cooled airflow from the heat exchange module 400 towards the front of the second circuit board 220. After the airflow passes the front of the second circuit board 220, it is drawn to the rear of the second circuit board 220 by the third fan 330 at the left side, until the airflow returns to the position of the heat exchange module 400 after passing the rear of the second circuit board 220, thus completing the entire circulation process and achieving cooling and heat dissipation for the entire area of ​​the second circuit board 220.

[0044] Specifically, as can be seen from the foregoing, there are multiple second circuit boards 220. Each second circuit board 220 may be equipped with an independent second fan 320 and a third fan 330. Of course, if the distance between two adjacent second circuit boards 220 is relatively small, two or more adjacent second circuit boards 220 may share the same second fan 320 and / or third fan 330.

[0045] Understandably, considering the small installation gap of the second circuit board 220 on the side away from the heat exchange module 400, or its direct connection to the side wall of the housing 100, it is inconvenient to share the installation of the third fan 330 on the side of the second circuit board 220 away from the heat exchange module 400. However, a certain installation gap between the second circuit board 220 and the heat exchange module 400 facilitates the installation of the second fan 320, allowing the same second fan 320 to guide airflow to multiple second circuit boards 220. Therefore, as... Figure 1 As shown, under suitable conditions, in this embodiment, it is preferable to install an independent third fan 330 on the left side of the second circuit board 220, while a shared second fan 320 can be installed on the right side of the second circuit board 220.

[0046] In this embodiment, the heat exchange module 400 can be installed in two ways: internal installation and external installation. Internally installed heat exchange module 400 has a larger contact area with the interior of housing 100, which improves the heat exchange efficiency inside housing 100, but it occupies some installation space inside housing 100. Externally installed heat exchange module 400 can effectively reduce the space occupied inside housing 100, but it reduces the heat exchange efficiency inside housing 100 to some extent. Therefore, those skilled in the art can choose the installation method of heat exchange module 400 according to actual needs.

[0047] It is understandable that the specific structural layout of the heat exchange module 400 differs depending on the installation method. For ease of understanding, the specific structure of the heat exchange module 400 for the two installation methods will be explained in detail below.

[0048] Installation Method 1: (e.g.) Figure 2 As shown, the heat exchange module 400 is built into the housing 100. The heat exchange module 400 includes a heat exchanger 410, an air guide plate 420, and a fourth fan 430. The air guide plate 420 and the fourth fan 430 are installed at both ends of the same side of the heat exchanger 410. The heat exchanger 410 is fitted to the inner wall of the housing 100 through the air guide plate 420 and the fourth fan 430. The side of the heat exchanger 410 away from the inner wall of the housing 100 is used to absorb the heat carried by the airflow in the first and second circulating air ducts and transfer it to the side closer to the inner wall of the housing 100. The side of the heat exchanger 410 close to the inner wall of the housing 100 forms an external heat exchange channel with the outside through the air guide plate 420 and the fourth fan 430, thereby realizing heat dissipation and cooling of the heat exchanger 410.

[0049] It should be understood that staggered air ducts can be formed on both sides of the heat exchanger 410. The internal air duct carries hot air from the first and second circulating air ducts, while the external air duct carries ambient air driven by the fourth fan 430. This allows for the circulating cooling of the hot air inside the housing 100, thereby maximizing the cooling of the internal heat-generating components of the power equipment. The specific structure and working principle of the heat exchanger 410 are well-known to those skilled in the art and will not be described in detail here. The air guide plate 420 can be installed on the housing 100 by bolt fastening or welding. The heat exchanger 410 and the fourth fan 430 are generally installed on the housing 100 by bolt fastening.

[0050] Installation Method Two: (e.g.) Figure 3 and Figure 4 As shown, the heat exchange module 400 is partially externally mounted on the housing 100. The heat exchange module 400 includes a heat exchanger 410, an air guide plate 420, a fourth fan 430, and a fifth fan 440. The heat exchanger 410 is installed on the outer wall of the housing 100, and the air guide plate 420 and the fourth fan 430 are installed on the inner wall of the housing 100 to form an inner heat exchange channel, thereby transferring the heat carried by the airflow in the first and second circulating air channels to the heat exchanger 410. The fifth fan 440 is installed on one side of the heat exchanger 410 to form an outer heat exchange channel for heat dissipation.

[0051] Specifically, the fourth fan 430 and the air guide plate 420 work together to form an internal heat exchange channel. At this time, the heat from the first and second circulating air ducts can be absorbed by the fins of the heat exchanger 410 through the internal heat exchange channel. The heat exchanger 410 can be air-cooled through direct contact with the external environment. However, considering that the efficiency of natural air cooling is relatively low, a fifth fan 440 is provided in this embodiment. The fifth fan 440 can accelerate the air flow near the fins in the heat exchanger 410, thereby achieving air cooling of the heat exchanger 410 and improving the heat exchange efficiency.

[0052] Understandably, to facilitate better heat absorption of the first and second circulating air ducts by the internal heat exchange channel formed by the fourth fan 430 and the air guide plate 420, the fourth fan 430 and the air guide plate 420 can be arranged along the airflow direction of the second circulating air duct. Therefore, there are two specific arrangement methods for the fourth fan 430 and the air guide plate 420. One arrangement method is as follows... Figure 3 As shown, along the airflow direction of the second circulating air duct, the air guide plate 420 is positioned upstream of the fourth fan 430; another arrangement is as follows... Figure 4 As shown, along the airflow direction of the second circulating air duct, the air guide plate 420 is positioned downstream of the fourth fan 430.

[0053] Preferably, the housing 100 has independent first heat dissipation cavity 110 and second heat dissipation cavity 120 respectively arranged along the first direction; the circuit board is installed in the first heat dissipation cavity 110, and the opposite side walls of the second heat dissipation cavity 120 are respectively provided with a second air inlet 141 and a second heat dissipation hole 142. The second heat dissipation cavity 120 is equipped with an inductor module 250 and a heat dissipation module 500; the heat dissipation module 500 includes a heat sink 510 and a sixth fan 520 arranged adjacently, the inductor module 250 is installed between the sixth fan 520 and the second air inlet 141, and the heat sink 510 is installed between the sixth fan 520 and the second heat dissipation hole 142.

[0054] Preferably, the number of air inlets is one group, and the power module 240 is mounted on the back of the second circuit board 220, which is furthest from the first circuit board 210; the substrate of the heat sink 510 is close to the power module 240 so that the heat generated by the power module 240 is transferred to the heat sink 510 for heat dissipation.

[0055] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation system for a power device, characterized in that, include: The enclosure; a first air inlet and a first heat dissipation hole are provided at intervals along a first direction on one side of the enclosure; Multiple circuit boards; Multiple circuit boards are spaced apart and installed inside the housing along a first direction; Multiple fans; At least one pair of adjacent circuit boards form a first circulating air duct between the first air inlet and the first heat dissipation hole through the fan; the portion of the circuit board corresponding to the position of the first heat dissipation hole forms a second circulating air duct in a plane perpendicular to the first direction through the fan; as well as A heat exchange module; the heat exchange module is installed in the first heat dissipation hole and cools the airflow in the first circulating air duct before delivering it to the second circulating air duct.

2. The heat dissipation system for power equipment as described in claim 1, characterized in that, A set of the first air inlets is provided on the side of the housing; Alternatively, the side of the housing is provided with two sets of the first air inlets, and the two sets of the first air inlets are located on both sides of the first heat dissipation hole along the first direction. The number of first air inlets in each group is at least one, and the multiple first air inlets in each group are spaced apart on the same side wall of the housing along a second direction perpendicular to the first direction.

3. The heat dissipation system for power equipment as described in claim 2, characterized in that, The circuit board includes a first circuit board and a second circuit board; the mounting position of the first circuit board corresponds to the first air inlet, and the mounting position of the second circuit board corresponds to the first heat dissipation hole. The first circuit board and the nearest second circuit board cooperate with the fan installed between them to form the first circulating air duct; The second circuit board, in conjunction with the installed fan, forms the second circulating air duct.

4. The heat dissipation system for the power device as described in claim 3, characterized in that, The first circuit board is mounted close to the first air inlet, and the second circuit board is mounted far from the first air inlet. The first circulating air duct is formed between the first circuit board and the nearest second circuit board by a first fan that is installed at an angle away from the first air inlet.

5. The heat dissipation system for power equipment as described in claim 3, characterized in that, A second fan is installed on the side of the second circuit board closer to the heat exchange module, and a third fan is installed in the middle of the side of the second circuit board away from the heat exchange module. The second fan is installed at the downstream end of the heat exchange module along the airflow direction of the second circulating air duct; The second fan is directly opposite the second circuit board, and the third fan is tilted so that the second fan and the third fan cooperate to form the second circulating air duct.

6. The heat dissipation system for the power device as described in claim 5, characterized in that, There are multiple second circuit boards, and at least one pair of adjacent second circuit boards share the same second fan.

7. The heat dissipation system for the power device as described in any one of claims 1-6, characterized in that, The heat exchange module is built into the housing, and the heat exchange module includes a heat exchanger, an air guide plate, and a fourth fan; The air guide plate and the fourth fan are installed at both ends on the same side of the heat exchanger, and the heat exchanger is fitted to the inner wall of the housing through the air guide plate and the fourth fan; The side of the heat exchanger away from the inner wall of the box is used to absorb the heat carried by the airflow in the first and second circulating air ducts; the side of the heat exchanger near the inner wall of the box forms an external heat exchange channel with the outside through the air guide plate and the fourth fan to dissipate heat.

8. The heat dissipation system for the power device as described in any one of claims 1-6, characterized in that, The heat exchange module is partially external to the housing, and the heat exchange module includes a heat exchanger, an air guide plate, a fourth fan, and a fifth fan; The heat exchanger is installed on the outer wall of the housing, and the air guide plate and the fourth fan are installed on the inner wall of the housing to form an inner heat exchange channel, thereby transferring the heat carried by the airflow in the first and second circulating air channels to the heat exchanger; the fifth fan is installed on one side of the heat exchanger to form an outer heat exchange channel for heat dissipation.

9. The heat dissipation system for the power device as described in claim 3, characterized in that, The box body is provided with an independent first heat dissipation cavity and a second heat dissipation cavity along the first direction; The circuit board is mounted in the first heat dissipation cavity, and the opposite side walls of the second heat dissipation cavity are respectively provided with a second air inlet and a second heat dissipation hole. An inductor module and a heat dissipation module are installed in the second heat dissipation cavity. The heat dissipation module includes a radiator and a sixth fan arranged adjacent to each other. The inductor module is installed between the sixth fan and the second air inlet, and the radiator is installed between the sixth fan and the second heat dissipation hole.

10. The heat dissipation system for the power device as described in claim 9, characterized in that, The number of air inlets is one group, and the power module is installed on the back of the second circuit board, which is furthest from the first circuit board. The substrate of the heat sink is close to the power module so that the heat generated by the power module is transferred to the heat sink for heat dissipation.

Images