Rotary transformer signal processing module

Abstract

A signal processing module of a rotary transformer relates to electronic technology and comprises a circuit structure mounted on a ceramic substrate, and the circuit structure is composed of an MCU bare chip, an R / D converter bare chip, a memory bare chip, an operational amplifier bare chip, a chip resistor and a chip capacitor. The ceramic substrate and the circuit structure thereof are packaged in an integrated ceramic tube shell, and the circuit structure is connected with pins of the ceramic substrate. The mechanical properties such as reliability and impact resistance of the control system are improved, and the product cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the electronic technology field, in particular to resolver driving control and signal acquisition, and more particularly to a resolver signal processing module. BACKGROUND

[0002] The resolver is an electromagnetic sensor, also known as a synchronous resolver. It is a small AC motor used to measure the angular displacement and angular velocity of a rotating object, which is composed of a stator and a rotor. The stator winding serves as the primary side of the transformer and receives the excitation voltage, and the rotor winding serves as the secondary side of the transformer and obtains the induced voltage through electromagnetic coupling. The resolver is a precision angle, position, and speed detection device, suitable for almost all applications using rotary encoders, and is widely used in motor control, such as position acquisition and speed control.

[0003] Most control systems with resolver signal processing functions currently use low-power operational amplifiers with totem pole push-pull excitation output to achieve the functions of excitation signal amplification and driving capability enhancement. The control function unit is implemented using digital circuits such as DSP (Digital Signal Processor), CPLD (Complex Programmable Logic Device), and FPGA (Field Programmable Gate Array). However, such a solution is usually presented in a conventional PCB (Printed Circuit Board) level circuit, and is mainly used in industrial control, medical equipment, consumer electronics, and other fields. In small-scale applications, factors such as operating voltage, operating current, environmental temperature, size, cost control, and motor type must be considered. Moreover, the circuit power output efficiency is low, the driving signal amplitude is difficult to accurately control, the heat dissipation power is large, and it is difficult to meet the heat dissipation requirements under normal circuit working conditions.

[0004] The existing technology integrates the circuit device of motor position acquisition and control function, which is either large in size or incomplete in function, resulting in system dispersion and large space occupation. SUMMARY

[0005] The main purpose of the present application is to provide a resolver signal processing module, which is integrated using the SIP (System In a Package) packaging process, solving the technical problems of system structure dispersion, low efficiency, high power consumption, and large size in the prior art.

[0006] In order to achieve the above-mentioned purpose, according to an aspect of the embodiment of the present application, a resolver signal processing module is provided, characterized in that it comprises a circuit structure mounted on a ceramic substrate, the circuit structure being composed of an MCU bare chip, an R / D converter bare chip, a storage bare chip, an operational amplifier bare chip, and a patch resistor and a patch capacitor, the ceramic substrate and its circuit structure being packaged in an integrated ceramic tube shell, and the circuit structure being connected with the pins of the ceramic substrate.

[0007] In some embodiments, the ceramic substrate adopts a standardized ceramic substrate with a 15x15 pad array.

[0008] In some embodiments, the ceramic substrate has a size of 20.00x20.00x4.15mm.

[0009] In some embodiments, the ceramic tube shell has a hollow structure.

[0010] In some embodiments, the hollow structure is arranged on the inner side of the ceramic tube shell.

[0011] In some embodiments, the hollow structure has a honeycomb shape.

[0012] In some embodiments, the hollow structure has symmetry.

[0013] In some embodiments, the operational amplifier bare chip includes a power operational amplifier bare chip and a precision operational amplifier bare chip.

[0014] In some embodiments, the power operational amplifier has a model of HYX2546, and the precision operational amplifier has a model of HYX2340.

[0015] In some embodiments, the MCU bare chip has a model of HYS2210, the R / D converter bare chip has a model of HYX2S1210, and the storage bare chip has a model of HR25Q128.

[0016] In some embodiments, the MCU bare chip adopts a RISC-V architecture.

[0017] In some embodiments, the MCU bare chip, the R / D converter bare chip, the storage bare chip, the operational amplifier bare chip, and the patch resistor and the patch capacitor are all domestic components.

[0018] According to the technical solution of the present application and the further improved technical solution in some exemplary embodiments, the present application has the following beneficial effects:

[0019] The SIP advanced packaging technology is adopted, the substrate is integrated with the ceramic tube shell packaging, and the advantages of high reliability, miniaturization and easy installation are achieved. The reliability and mechanical properties such as impact resistance of the control system are improved, and the product cost is also reduced. Whether in the field of industrial control or in the field of military products, the product can work normally under various working conditions. The technical scheme of the application enhances the universality of the product, is more conducive to the standardized management of the product, and adopts all domestic MCU+peripheral circuit as the control core, and the structure is simple.

[0020] The application will be further described below in conjunction with the drawings and specific embodiments. The additional aspects and advantages of the application will be partially given in the following description, partially become obvious from the following description, or be known by the practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application, and the specific embodiments, illustrative examples and their descriptions of the present application are used to explain the present application, and do not constitute improper limitations on the present application. In the drawings:

[0022] Figure 1 It is a schematic diagram of the main device layout structure according to the specific embodiment of the application;

[0023] Figure 2 It is a schematic diagram of the module structure according to the specific embodiment of the application, wherein Figure 2 a is a front view, Figure 2 b is a left view, Figure 2 c is a top view;

[0024] Figure 3 It is a schematic diagram of the ceramic tube shell structure according to the specific embodiment of the application, wherein Figure 3 a is a tube shell front view, Figure 3 b is Figure 3 a A-A sectional view, Figure 3 c is a tube shell rear view.

[0025] Figure 4 It is a schematic diagram of the circuit structure according to the specific embodiment of the application. DETAILED DESCRIPTION

[0026] It should be noted that the specific embodiments, exemplary embodiments and features in the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the following contents.

[0027] In order to make the person skilled in the art better understand the scheme of the present application, the technical scheme in the specific embodiments and exemplary embodiments of the present application will be described clearly and completely in the following combined with the drawings in the specific embodiments and exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the specific embodiments and exemplary embodiments in the present application, all the other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application.

[0028] The bare chip in the present application mainly refers to an integrated circuit bare chip, which is an integrated circuit product before packaging.

[0029] Embodiment

[0030] As shown in Figure 1 and Figure 2 , the rotary transformer signal processing module in the example includes a circuit structure mounted on a ceramic substrate 100. The circuit structure is composed of an MCU bare chip 11, an R / D converter bare chip 12, a storage bare chip 13, a precision operational amplifier bare chip 141, a power operational amplifier bare chip 142, and a patch resistor (not shown in the figure) and a patch capacitor (not shown in the figure). The ceramic substrate 100 and its circuit structure are packaged in an integrated ceramic tube shell, and the circuit structure is connected to the pins 10 on the back of the ceramic substrate 100.

[0031] The module in the example adopts a post-film integrated circuit process, an integrated ceramic tube shell as a substrate, and parallel seam welding to cover, which meets the high quality level requirements of GJB (national military standard). The module processed by thick film technology has the advantages of high reliability, miniaturization, and easy installation, which can improve the reliability and mechanical properties such as impact resistance of the control system.

[0032] The rotary transformer signal processing module in the example adopts SIP (System In a Package) packaging technology, and the module size is 20×20×4.15mm in length, width and height. The pins are BGA packaging (Ball Grid Array Package) with a pitch of 1.27, and there are a total of 15×15=225 pins (pads). The shape of the module is as shown in Figure 2 , and the specific dimensions in the figure are shown in Table 1.

[0033] Table 1

[0034]

[0035] In order to reduce the weight of the module, the ceramic tube shell in the rotary transformer signal processing module in the example is specially processed, and a carving process is adopted to form a non-porous hollow structure on the inner side of the ceramic tube shell, as shown in Figure 3 a andFigure 3 The hollow structure can adopt a honeycomb (hexagonal) hollow structure, a square hollow structure, or other shapes with symmetry, and the hollow pattern distribution on the tube shell also has symmetry, facilitating processing and mass production.

[0036] The ceramic tube shell with the hollow structure can reduce the weight of the module, with a weight reduction effect of more than 30%, and can ensure the structural strength of the tube shell without damaging the sealing performance of the tube shell, which is very suitable for some military application scenarios that are sensitive to weight.

[0037] In the module circuit structure, a MCU bare chip adopting a domestic RISC-V architecture (an open-source instruction set architecture based on the principle of a reduced instruction set) is used as a control core for data processing, a R / D converter bare chip is used to output a resolver excitation signal and collect a resolver signal, an AD interface of the MCU bare chip is used to collect a voltage signal, an operational amplifier of the MCU bare chip or an external integrated operational amplifier is used to realize analog signal conditioning, an interface of the MCU bare chip is used to communicate with external circuits, and a corresponding memory bare chip is configured as a data information storage unit. The information of main components is shown in Table 2.

[0038] Table 2

[0039] Name Model Function Description Quantity Remark MCU bare chip HYS2210 Circuit processing core 1 Domestic component R / D converter bare chip HYX2S1210 Rotary transformer digital conversion 1 Domestic component Power operational amplifier bare chip HYX2546 Rotary transformer drive 1 Domestic component Precise operational amplifier bare chip HYX2340 Signal conditioning filter 4 Domestic component Storage bare chip HR25Q128 Data storage 1 Domestic component Chip resistor --- Peripheral circuit configuration 8 Domestic component Chip capacitor --- Peripheral circuit configuration 23 Domestic component

[0040] The MCU bare chip in the resolver signal processing module is HYS2210, and the main characteristics are as follows:

[0041] 32-bit RISC-V architecture, maximum working frequency 72MHz; integrated single-precision floating-point processing unit, digital signal processing supporting single-instruction multiple-data flow instructions. 5-stage sequential execution pipeline, 8KB instruction cache, 8KB data cache; memory is 256KB (2x128KB) on-chip FLASH, supports double operation, 96KB (64KB+16KB+16KB) SRAM, supports physical memory protection, 4KB on-chip EEPROM; system power voltage range 2.7V-5.5V, has multiple clock sources such as external high-speed crystal oscillator (HSE), external low-speed crystal oscillator (LSE), internal high-speed clock (HSI), internal low-speed clock (LSI), phase-locked loop (PLL) clock, has power-on / power-down reset (POR / PDR), low-voltage detection (LVDH / LVDL), port reset; built-in gear-adjustable accurate voltage reference (VREF) can be used for ADC, DAC reference; has 2 units of 12-bit SAR-ADC with a maximum sampling rate of 2Msps, 2 units of 12-bit DAC with a maximum conversion rate of 500Ksps, and 4 units of 4.5MHz rail-to-rail high-speed operational amplifier; has multiple timers, communication interfaces, debugging interfaces, and other peripheral auxiliary functions.

[0042] The R / D converter model in the resolver signal processing module of the example is HYX2S1210, and the main features are as follows:

[0043] The resolver digital converter with 10-bit to 16-bit resolution integrates a programmable sine wave oscillator on chip to provide sine wave excitation for the resolver; the excitation single-ended output has a typical value of 3.6V and a peak-to-peak value of 7.2V, and the output frequency is 2kHz to 20kHz; the sine and cosine allow input peak-to-peak values of 2.3V to 4V; a Type II servo loop is provided for tracking the input signal and converting the information at the sine and cosine inputs into digital quantities corresponding to the input angle and speed, and the maximum tracking rate is 3125rps.

[0044] The principle block diagram of the module circuit structure 101 of the example is shown in Figure 4 The module mainly completes the conditioning of analog signals, driving of the resolver, signal data acquisition and data storage, and the digital IO interface (including PWM, SPI, IIC, UART, CAN) of the MCU bare chip is led out, and all signals are low-frequency and low-voltage signals. The circuit signals in the module include digital signals and analog signals, among which the clock signal and the PWM (pulse width modulation) signal flip quickly and easily interfere with other signals. Therefore, the ceramic substrate layout is divided according to the analog and data areas, the wiring is as short as possible, and the layout principle of focusing on the protection of the PWM signal is followed to design the layout.

[0045] In the example, the MCU bare chip and the R / D converter bare chip are analog-digital hybrid chips, the operational amplifier is a full analog chip, and the storage bare chip is a full digital chip. Figure 1 In the example, the MCU bare chip and the R / D converter bare chip are analog-digital hybrid chips, the operational amplifier is a full analog chip, and the storage bare chip is a full digital chip. Figure 1 The upper left of the ceramic substrate 100 is the MCU bare chip 11, the lower left is the four precision operational amplifier bare chips 141, the upper right is the storage bare chip 13, the right middle is the R / D converter bare chip 12, and the lower right is the power operational amplifier 142. The upper part of the entire ceramic substrate 100 is the digital area, and the lower part is the analog area. At the same time, in the digital-analog segmented part, the PWM signal is routed to the upper digital area through the via to the inner layer. The analog signals in the digital area are routed to the analog area through the via to the inner layer, realizing the digital-analog area segmentation of the module, as shown in Figure 1

[0046] The resolver signal processing module of the example, the military device is tested under the test conditions required by the corresponding quality level of GJB (such as applying 29400m / s 2Constant acceleration test of the structure is carried out by applying external load to the structure in the Y1 direction (the direction in which the element tends to be detached from the base) and maintaining for 1 min, ensuring that the mechanical performance of the module meets the application requirements. At the same time, the module is designed for electromagnetic compatibility and appropriate signal ground isolation measures are taken to isolate and attenuate the electromagnetic radiation of the three signals of the stronger 8MHz clock signal and 8.192MHz clock signal and 1MHz PWM signal in the module, avoiding affecting other circuits. The module working voltage range: 3.3V, continuous working current: not more than 1A, working temperature range: -55℃-125℃.

[0047] The resolver signal processing module of the application adopts SIP first use packaging, which is a motor position acquisition control module with higher integration, wider application range and higher universality. It can be applied to brush motor, brushless motor speed control system and various types of speed sensor, including Hall sensor, magnetic encoder, optical encoder or sensorless control, can match various motor pole pairs and motor speed, can perform online program update, can perform health status self-checking and upload, compared with traditional PCB motor control module, saves 70% of the module occupied area, its application range is more extensive, and the motor signal acquisition and control module is more universal.

Claims

1. A resolver signal processing module, characterized by, The application relates to a circuit structure mounted on a ceramic substrate, which is composed of an MCU bare chip, an R / D converter bare chip, a memory bare chip, an operational amplifier bare chip and patch resistors and patch capacitors, the ceramic substrate and the circuit structure are packaged in an integrated ceramic tube shell, and the circuit structure is connected with the pins of the ceramic substrate.

2. A resolver signal processing module according to claim 1, characterized in that, The ceramic substrate adopts a standardized ceramic substrate with a 15*15 pad array.

3. A resolver signal processing module according to claim 2, wherein, The module size is 20.00*20.00*4.15 mm.

4. The resolver signal processing module of claim 1, wherein, The ceramic tube shell has a hollow structure.

5. A resolver signal processing module according to claim 4, wherein, The hollow structure is arranged on the inner side of the ceramic tube shell.

6. A resolver signal processing module according to claim 4, wherein, The hollow structure is in the shape of a honeycomb.

7. A resolver signal processing module according to claim 4, wherein, The hollow structure has symmetry.

8. The resolver signal processing module of claim 1, wherein, The operational amplifier bare chip comprises a power operational amplifier bare chip and a precision operational amplifier bare chip.

9. A resolver signal processing module according to claim 8, wherein, The power operational amplifier is of the HYX2546 type, and the precision operational amplifier is of the HYX2340 type.

10. The resolver signal processing module of claim 1, wherein, The MCU bare chip is of the HYS2210 type, the R / D converter bare chip is of the HYX2S1210 type, and the memory bare chip is of the HR25Q128 type.

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