White LED light source, backlight module and electronic equipment

Abstract

The utility model relates to the field of LEDs, and provides a white LED light source, a backlight module and electronic equipment, the LED light source comprises a substrate, and a light emitting circuit is arranged on the substrate; the blue light chip is electrically connected with the light emitting circuit; the green light conversion layer comprises a first transparent adhesive layer and green light conversion particles, the green light conversion layer at least covers the light-emitting front face of the blue light chip, and the green light conversion particles comprise at least one of green quantum dot particles and green sulfide fluorescent powder particles; the red light conversion layer comprises a second transparent adhesive layer and red light conversion particles, the red light is mixed with the blue light and the green light to obtain white light, and the red light conversion particles comprise red fluoride fluorescent powder particles; and the packaging layer is used for packaging and covering the red light conversion layer, the green light conversion layer and the blue light chip on the substrate. By using the green light conversion particles and the red light conversion particles with different material characteristics, mutual absorption of light between the two materials is reduced, and the light output efficiency of the white LED light source is improved.

Description

Technical Field

[0001] This application relates to the field of LED technology, and more specifically, to a white LED light source, a backlight module, and an electronic device. Background Technology

[0002] With the rapid development of semiconductor lighting technology, LEDs (light-emitting diodes), as a new generation of high-efficiency and energy-saving light sources, have been widely applied in various fields such as daily lighting, display technology, and automotive lighting. Traditional white LED light sources primarily generate white light by exciting yellow phosphors with blue LED chips. In this configuration, the blue light emitted by the blue chip is absorbed by the yellow phosphors and converted into yellow light, which mixes with the unabsorbed blue light to produce white light close to natural light. However, the white light produced by this method has a fixed color temperature that is difficult to adjust, and due to the limited conversion efficiency of the phosphors, the overall luminous efficacy and color purity of the light source are often not high.

[0003] In recent years, with the development of new fluorescent materials, the use of multilayer phosphor conversion technology—that is, stacking green and red light conversion layers on a blue light chip—allows for more flexible adjustment of the spectral composition of the light source, thereby obtaining higher quality white light output. However, this has led to the phosphors in the green and red light conversion layers influencing each other's luminous efficiency, which in turn affects the overall luminous efficacy and color purity of the light source.

[0004] Therefore, existing technologies still need improvement and development. Utility Model Content

[0005] The purpose of this application is to propose a white LED light source to solve the technical problem of low luminous efficiency of existing white LED light sources.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] In a first aspect, this utility model provides a white LED light source, comprising:

[0008] The substrate is equipped with a light-emitting circuit;

[0009] The blue light chip is electrically connected to the light-emitting circuit.

[0010] The green light conversion layer includes a first transparent adhesive layer and green light conversion particles. The green light conversion layer covers at least the light-emitting front side of the blue light chip. The green light conversion layer is used to convert part of the blue light emitted by the blue light chip into green light. The green light conversion particles include at least one of green quantum dot particles and green sulfide phosphor particles.

[0011] The red light conversion layer includes a second transparent adhesive layer and red light conversion particles. The red light conversion layer covers at least the light-emitting front side of the green light conversion layer and is used to convert part of the blue light emitted by the blue light chip into red light. The red light is mixed with blue light and green light to obtain white light. The red light conversion particles include red fluoride phosphor particles.

[0012] The encapsulation layer is used to encapsulate and cover the red light conversion layer, green light conversion layer, and blue light chip on the substrate.

[0013] In some embodiments, the white LED light source further includes a transparent isolation layer disposed between the green light conversion layer and the red light conversion layer to separate the green light conversion layer and the red light conversion layer.

[0014] Furthermore, the transparent isolation layer has the same refractive index as the first transparent adhesive layer.

[0015] In some embodiments, the refractive index ratio of the first transparent adhesive layer to the second transparent adhesive layer ranges from 0.95 to 1.05.

[0016] Furthermore, the blue light chip is a flip-chip blue light chip.

[0017] In some embodiments, the encapsulation layer includes a diffuser layer covering the front side of the red light conversion layer, and the diffuser layer contains scattering particles.

[0018] Furthermore, the encapsulation layer also includes a reflective layer containing scattering particles, the number of which is greater than ...

[0019] Furthermore, the density of scattering particles within the reflective layer decreases from the center outwards.

[0020] Secondly, this utility model provides a backlight module, including the light source described in the above embodiments.

[0021] Thirdly, this utility model provides an electronic device, including the backlight module in the above embodiments.

[0022] The beneficial effects of the white LED light source provided in this application are at least as follows: a substrate on which a light-emitting circuit is provided; a blue light chip electrically connected to the light-emitting circuit; a green light conversion layer comprising a first transparent adhesive layer and green light conversion particles, the green light conversion layer covering at least the front side of the blue light chip, the green light conversion layer being used to convert part of the blue light emitted by the blue light chip into green light, the green light conversion particles comprising at least one of green quantum dot particles and green sulfide phosphor particles; a red light conversion layer comprising a second transparent adhesive layer and red light conversion particles, used to convert part of the blue light emitted by the blue light chip into red light, which is then mixed with blue and green light to obtain white light, the red light conversion particles comprising red fluoride phosphor particles; and an encapsulation layer for encapsulating and covering the red light conversion layer, green light conversion layer, and blue light chip on the substrate. This application, through the use of green light conversion particles and red light conversion particles with different characteristics, can reduce the mutual absorption between the two types of light conversion particles, meaning that more blue light can be effectively converted into green and red light, improving the overall luminous efficiency and light output. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a white LED light source provided in an embodiment of this application;

[0025] Figure 2 Another structural schematic diagram of a white LED light source provided in the embodiments of this application;

[0026] Figure 3 A schematic diagram of the structure of a white LED light source provided in this application embodiment;

[0027] Figure 4 This is another structural schematic diagram of a white LED light source provided in an embodiment of this application;

[0028] The following are the labeling elements in the figure:

[0029] 101. Substrate;

[0030] 102. Blu-ray chip;

[0031] 103. Green light conversion layer;

[0032] 104. Red light conversion layer;

[0033] 105. Transparent isolation layer;

[0034] 106. Diffusion layer;

[0035] 107. Reflective layer. Detailed Implementation

[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0037] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0038] The white LED light source of this application embodiment is described below with reference to the accompanying drawings.

[0039] Please see Figure 1 , Figure 1 This application discloses a white LED light source, comprising: a substrate 101, a blue LED chip 102, a green light conversion layer 103, a red light conversion layer 104, and an encapsulation layer. The substrate 101 has a light-emitting circuit. The blue LED chip 102 is electrically connected to the light-emitting circuit. The green light conversion layer 103 includes a first transparent adhesive layer and green light conversion particles. The green light conversion layer 103 covers at least the front surface of the blue LED chip 102, and is used to convert a portion of the blue light emitted by the blue LED chip 102 into green light. The green light particles include a green content... The red light conversion layer 104 includes a second transparent adhesive layer and red light conversion particles. The red light conversion layer 104 covers at least the light-emitting front side of the green light conversion layer 103 and is used to convert part of the blue light emitted by the blue light chip 102 into red light, which is then mixed with blue and green light to obtain white light. The red light conversion particles include red fluoride phosphor particles. An encapsulation layer is used to encapsulate and cover the red light conversion layer 104, the green light conversion layer 103 and the blue light chip 102 on the substrate 101.

[0040] The substrate 101 serves as the basic platform for mounting the light-emitting chip and circuitry, providing not only physical support for electronic components but also enabling electrical connections. The substrate 101 includes, but is not limited to, printed circuit boards (PCBs). The circuit board comprises a PCB, a ceramic substrate 101, a metal substrate 101, and a flexible substrate 101. The PCB is an insulating substrate 101 with pre-set circuit patterns for assembling and connecting electronic components. Through carefully arranged copper traces, pads, and vias, the PCB achieves electrical connections and signal transmission between electronic components. The ceramic substrate 101 is made of highly thermally conductive materials such as alumina and aluminum nitride. These materials, due to their excellent thermal conductivity, high insulation, low coefficient of thermal expansion, and good chemical stability, are suitable for applications requiring high power, high frequency, and good thermal management. The metal substrate 101 is a metal circuit board material, belonging to general electronic components. It consists of a thermally conductive insulating layer, a metal plate, and metal foil, and features special magnetic permeability, excellent heat dissipation, high mechanical strength, and good processing performance. The flexible substrate 101 is a highly reliable and extremely flexible printed circuit board made with polyimide or polyester film as the substrate, featuring high wiring density, light weight, thinness, and good bending properties. The light-emitting circuit, which drives the blue light chip 102, is mainly designed to provide the blue light chip 102 with the required current and voltage to ensure that the blue light chip 102 can emit light stably and efficiently.

[0041] The substrate 101 can be rectangular, circular, or polygonal in shape. The shape and size of the substrate 101 are determined according to different devices and installation space, and this application embodiment does not impose any limitations on this. For example, when the white LED light source of this embodiment is used as the backlight source of the display, if a side-emitting method is adopted, the substrate 101 can be designed as a long rectangular strip to adapt to the narrow space at the edge or side of the display. During installation, the long rectangular substrate 101 can be arranged along the top, bottom, or sides of the display, with the LED elements closely arranged on the substrate 101. The light is guided to the entire display area through a light guide plate or diffuser film to form uniform background illumination. If it is used as the backlight source of the display and a direct-lit backlight method is adopted, the substrate 101 of this application embodiment can be designed as a large-area rectangular substrate 101 that matches the size of the display panel. The above embodiments of the substrate 101 are all examples. Those skilled in the art can determine the shape and size of the substrate 101 according to the actual situation, and this application does not limit the substrate 101.

[0042] Blue LED chip 102 is a semiconductor device whose light-emitting principle is based on the direct electroluminescence effect of a semiconductor PN junction. Specifically, when holes in a p-type semiconductor and electrons in an n-type semiconductor meet at the PN junction, recombination occurs, releasing energy in the process. This energy is ultimately released in the form of photons, forming blue light. Blue LED chip 102 typically uses gallium nitride or gallium nitride alloys as its core semiconductor material. These materials, due to their wide bandgap characteristics, can efficiently emit blue light in the wavelength range of 450-490 nanometers. In the construction of blue LED chip 102, electrons are injected from the n-region into the p-region and recombine with holes near the PN junction. The energy released in this process is sufficient to excite photons, which then escape from the semiconductor material, forming visible blue light.

[0043] The blue light chip 102 can be directly adopted from existing blue light chips 102 technologies, such as InGaN / GaN multi-quantum-well blue light chips 102, and the blue light chip 102 can be installed through flip-chip process, wire bonding, direct chip mounting, etc. Among them, flip-chip bonding refers to a mounting method in which the active side of the chip is placed directly on the substrate 101 or the package carrier with the active side facing down. The bumps on the chip are aligned with the pads on the substrate 101, and an electrical connection is formed by reflow soldering or thermocompression bonding. Wire bonding is one of the traditional chip mounting methods, which uses metal wires to connect the pads on the chip to the pads on the substrate 101 or the lead frame. Tape and reel automatic bonding uses a flexible metal foil or polyimide tape with a pre-formed conductive path to connect the chip to the substrate 101 or the package. Direct chip mounting is a method similar to flip-chip bonding, used in situations where additional packaging is not required. In addition, the methods of mounting the blue light chip 102 onto the substrate 101 also include microsphere mounting and thermocompression bonding. The specific method of mounting the chip onto the substrate 101 can be determined according to the actual situation, and this embodiment does not impose any restrictions on this.

[0044] The arrangement and number of blue LED chips 102 on the substrate 101 can be set according to actual conditions. For example, when the white LED light source of this application is used as an omnidirectional lighting source, the substrate 101 of the lighting source is circular, and the arrangement of the blue LED chips 102 can be arranged in a ring or spiral pattern. The number is set according to the size of the substrate 101 to ensure the lighting brightness of the white LED light source. The arrangement distance of the blue LED chips 102 is set according to the heat dissipation of the chips. When the white LED light source of this application is used as a backlight source for a display, it is necessary to provide a uniform and high-brightness planar light source to ensure the display quality of the display. Therefore, the arrangement of the blue LED chips 102 on the substrate 101 can be linear, and the light emitted by the white LED light source is evenly distributed across the entire screen through the light guide plate. When the backlight source of the display adopts a direct-lit backlight method, the substrate 101 of this embodiment can be designed as a large-area rectangular substrate 101 that matches the size of the display panel. The arrangement of the blue LED chips 102 on the substrate 101 can be a regular array arrangement, such as a square or hexagonal arrangement, to maximize the uniformity and efficiency of light output.

[0045] The green light conversion layer 103 and the red light conversion layer 104 serve as structural layers in optoelectronic devices that alter the characteristics of the incident spectrum. These layers contain light-converting particles that absorb blue light emitted by the blue light chip 102 and then emit green and red light, thus converting blue light into green light. When high-energy, short-wavelength blue light irradiates the surface containing the light-converting particles, the particles absorb the energy of the blue light photons. This absorbed energy causes electrons in the particles to transition from a lower energy level to a higher energy level excited state. In this high-energy state, the electrons undergo non-radiative decay, during which they lose energy through interaction with their surroundings and release it as heat. The electrons then descend to a slightly lower excited state. After reaching a stable state, they return to the ground state via radiative transition and emit photons. Because the total energy of the electrons decreases during the non-radiative decay phase, the energy of the released photons also decreases accordingly. This results in emitted photons with longer wavelengths than the original blue light, manifesting as red, green, or other longer wavelengths of light.

[0046] Phosphor particles with different material properties may have different luminescent centers, matrices, and dopant ions. These differences lead to variations in the wavelengths, intensities, and spectral distributions of absorbed and emitted light. Therefore, under the excitation of the blue LED chip 102, different phosphor particles can independently convert light. Light-converting particles with different material properties have different emission and excitation spectra. For example, green sulfide phosphor particles mainly absorb blue light and convert it to green light, while red fluoride phosphor particles have a narrower emission spectrum and an excitation spectrum with almost no absorption in the green light band. This difference in spectral characteristics allows the two light-converting particles to more effectively avoid light overlap and mutual absorption during the light conversion process. Furthermore, due to the different material properties of the two light-converting particles, the energy absorbed by one particle is difficult to directly transfer to the other, leading to mutual absorption. Therefore, under the excitation of the blue LED chip 102, various light-converting particles can complete the light conversion process relatively independently, reducing mutual interference between light rays and thus improving the luminous efficiency of the white LED light source.

[0047] The green light conversion layer 103 includes a first transparent adhesive layer with high light transmittance, reducing the loss of blue light emitted by the blue light chip 102 and further reducing blue light loss in the green light conversion layer 103, thereby improving the overall light extraction efficiency. The material of the first transparent adhesive layer includes, but is not limited to, highly transparent resin or silicone materials. The first transparent adhesive layer is mixed with green light conversion particles to obtain the green light conversion layer 103. After mixing, the first transparent adhesive layer forms a physical protective layer that isolates the green light conversion particles from the water and oxygen environment of the air, preventing the degradation of the green light conversion particles by moisture and oxygen, and avoiding a decrease in the light conversion efficiency of the green light conversion particles. When the first transparent adhesive layer is a highly transparent resin material, after mixing the resin material with the green light conversion particles, it is adhered to the front emitting surface of the blue light chip 102, and then bonded to the blue light chip 102 through photocuring to form a whole. This not only ensures good contact between the green light conversion layer 103 and the blue light chip 102, but also further enhances the structural stability of the entire light source assembly, ensuring the reliability and durability of the light source under various environmental conditions.

[0048] Quantum dot particles are semiconductor microcrystals with diameters ranging from 1 to 10 nanometers, exhibiting a three-dimensional quantum size effect in their electronic structure. Because the size of quantum dot particles is similar to the trajectory radius of excited-state electrons, carrier movement is restricted, leading to the transformation of continuous energy bands in the same material into quasi-discrete molecular energy levels at larger scales. Therefore, based on the unique light absorption properties of quantum dot particles, they can generate fluorescence of specific wavelengths after excitation. Green light conversion particles utilize green quantum dot particles, achieving efficient conversion from blue to green light through the quantum confinement effect. When light emitted from the blue light chip 102 interacts with the green quantum dot particles, the quantum dot particle size, between that of atoms and macroscopic crystals, results in energy level quantization, i.e., the quantum confinement effect. This effect allows electrons and holes to efficiently absorb blue light and re-radiate green light during energy transitions, while maintaining the narrow-band characteristics of the emission spectrum, thus ensuring the purity and brightness of the light color. The red light conversion particles use red fluoride phosphor particles. The luminescence mechanism of red fluoride phosphor particles is different from that of quantum dots. After absorbing blue light, the red fluoride phosphor particles undergo an energy transition between the excited state and the ground state, thereby releasing red light. Since the emission spectrum of the phosphor particles is significantly separated from that of green quantum dots, and the luminescence principle and response wavelength range of the two are different, the mutual absorption phenomenon of light between the two light sources is reduced.

[0049] Green sulfide phosphor particles are inorganic materials used for light conversion, including but not limited to zinc sulfide:copper and zinc sulfide:gallium. When excited by blue light, green sulfide phosphor particles produce narrow-band green fluorescence. The different material properties between green sulfide phosphor particles and red fluoride phosphor particles reduce mutual absorption of light between the two types of phosphor particles when used simultaneously. This ensures that each phosphor particle can work independently and efficiently, avoiding ineffective energy cycling between particles of different colors, thereby improving the overall luminous efficiency.

[0050] The red light conversion layer 104 includes a second transparent adhesive layer. The material of the second transparent adhesive layer includes, but is not limited to, resin or silicone. The second transparent adhesive layer has high light transmittance, reducing the loss of blue light emitted by the blue light chip 102. The high light transmittance reduces light loss in the green light conversion layer 103 and the red light conversion layer 104, thereby improving the overall light extraction efficiency. The red light conversion layer 104 can be disposed on the light-emitting front side of the green light conversion layer 103, directly receiving the blue light that has passed through the green light conversion layer 103 and partially converting it into red light. Then, the red light mixes with the green light previously generated by the green light conversion layer 103 and the unconverted blue light, and is emitted to form mixed white light.

[0051] The function of the encapsulation layer is to protect the internal components from the influence of the external environment, such as moisture and dust. It can be a transparent adhesive layer, specifically by dispensing or coating to complete the encapsulation of the blue-green light-emitting chip and the red light conversion layer. This can be achieved through chip-scale package (CSP) packaging. CSP packaging means that the size of the packaged chip is close to the size of the bare chip, reducing the volume of the packaged chip.

[0052] According to the technical solution provided in the embodiments of this application, the white LED light source includes a substrate 101, a blue light chip 102, a green light conversion layer 103, a red light conversion layer 104, and an encapsulation layer. The substrate 101 is provided with a light-emitting circuit. The blue light chip 102 is electrically connected to the light-emitting circuit. The green light conversion layer 103 includes a first transparent adhesive layer and green light conversion particles. The green light conversion layer 103 covers at least the front surface of the blue light chip 102. The green light conversion layer 103 is used to convert part of the blue light emitted by the blue light chip 102 into green light. The green light conversion particles include at least one of green quantum dot particles and green sulfide phosphor particles. The red light conversion layer 104 includes a second transparent adhesive layer and red light conversion particles. The red light conversion particles include red fluoride phosphor particles. The blue LED chip 102 is powered by the light-emitting circuit of the substrate 101 and emits blue light. Then, some of the blue light is converted into green light by green light conversion particles through the green light conversion layer 103. After the blue and green light enter the red light conversion layer 104, another portion of the blue light is converted into red light by red light conversion particles with different characteristics. The converted red and green light, along with the blue light emitted by the blue LED chip 102, mix to produce white light. Finally, the mixed white light is emitted through the encapsulation layer. Because the green light conversion particles use at least one of green quantum dot particles and green sulfide phosphor particles, while the red light conversion particles use red fluoride phosphor particles, the mutual influence between these two types of conversion particles is reduced due to their different characteristics. This reduces the mutual absorption of light, improves the conversion efficiency of the green and red light conversion particles for blue light, and thus enhances the overall luminous efficiency of the white LED light source.

[0053] Furthermore, the red light conversion particles include KSF phosphor particles.

[0054] Specifically, KSF phosphor particles are structural particles that can effectively absorb blue light and emit red light, thereby converting blue light into red light with a wavelength in the range of 610-640 nanometers. The spectral purity is high, reducing the spectral overlap between the converted red and green light. Red and green light can be generated independently and efficiently, and mixed with the remaining blue light to form high-quality white light without energy loss due to mutual absorption of light, thus significantly improving the luminous efficiency of white LED light sources.

[0055] Furthermore, Figure 2This is a schematic diagram of another white LED light source provided in the embodiments of this application, such as... Figure 2 As shown, the red light conversion layer 104 of the white LED light source serves as an encapsulation layer, covering the green light conversion layer 103 and the blue light chip 102. The material of the red light conversion layer 104 can be a silicone layer produced by dispensing. By encapsulating the chip through the red light conversion layer 104, not only can the red light conversion particles be protected, but the water and oxygen environment of the blue light chip 102 is also isolated, reducing the corrosive effect of moisture and oxygen in the air on the blue light chip 102, improving the service life of the blue light chip 102, and enhancing the long-term stability and reliability of the white LED light source.

[0056] In some embodiments, such as Figure 3 The white LED light source shown also includes a transparent isolation layer 105, which is disposed between the green light conversion layer 103 and the red light conversion layer 104 to separate the green light conversion layer 103 and the red light conversion layer 104.

[0057] Specifically, the transparent isolation layer 105 includes, but is not limited to, transparent inorganic materials or polymer materials with good light transmittance. The transparent inorganic materials can be silicon dioxide, alumina, or certain transparent ceramic materials, which have good chemical stability and heat resistance, and can provide stable physical isolation and light transmission channels.

[0058] According to the technical solution provided in this application, the white LED light source also includes a transparent isolation layer 105, disposed between the green light conversion layer 103 and the red light conversion layer 104. The light-emitting circuit first excites the blue light chip 102 to generate blue light. Subsequently, the blue light passes sequentially through the green light conversion layer 103, the transparent isolation layer 105, and the red light conversion layer 104. During this process, some of the blue light is converted into green and red light, which are eventually mixed to form white light. Since the transparent isolation layer 105 physically separates the green light conversion layer 103 and the red light conversion layer 104, it ensures that the green light conversion layer 103 and the red light conversion layer 104 work independently, avoiding mutual absorption and scattering of light between the green light conversion layer 103 and the red light conversion layer 104, thereby improving luminous efficiency and light color quality.

[0059] Furthermore, the transparent isolation layer 105 has the same refractive index as the first transparent adhesive layer.

[0060] Specifically, when the refractive indices of the two media are similar or equal, light reflection at the interface is greatly reduced, and transmittance increases, a phenomenon known as refractive index matching. The transparent insulating layer 105 has the same refractive index as the first transparent adhesive layer, which reduces interfacial light reflection. Specifically, the insulating layer 105 can use the same main material as the green light conversion layer 103. Using the same material as part of both the insulating layer 105 and the green light conversion layer 103 ensures high optical compatibility between them. This means that light does not encounter significant refractive index changes when passing through these two layers, avoiding additional light scattering and energy loss, thereby improving the luminous efficiency of the light source.

[0061] In some embodiments, the refractive index ratio of the first transparent adhesive layer to the second transparent adhesive layer ranges from 0.95 to 1.05.

[0062] Specifically, the refractive index ratio of the first transparent adhesive layer to the second transparent adhesive layer ranges from 0.95 to 1.05, following Snell's law. A significant difference in refractive index between the two media leads to substantial light reflection loss at the interface. Therefore, a refractive index ratio of 0.95 to 1.05, close to 1:1, reduces light emission at the interface, allowing more light to penetrate. Furthermore, when light propagates through a medium, encountering uneven density or impurities causes light scattering. When the refractive indices of the two layers are very close, the unevenness at the interface decreases, thereby reducing the probability of light scattering, ensuring the integrity of the light beam, improving light utilization efficiency, and ultimately significantly improving the luminous efficiency of the light source.

[0063] In some embodiments, the Blu-ray chip 102 is a flip-chip Blu-ray chip 102.

[0064] Specifically, in flip-chip technology, the active side of the chip faces downwards, directly towards the packaging substrate 101 or heat sink. The electrodes of the chip are soldered to the corresponding electrodes on the substrate 101 via bumps or metal pillars. This connection method is called flip-chip bonding or flip-chip soldering. The blue light chip 102 is a flip-chip blue light chip 102. The electrical connection of the chip is made from the bottom, reducing top obstruction and allowing more light to directly reach the red light conversion layer 104 and the green light conversion layer 103. This reduces additional scattering and absorption of light between conversion particles, thereby improving the luminous efficiency of the light source.

[0065] In some embodiments, such as Figure 4 As shown, the encapsulation layer includes a diffusion layer 106 covering the front side of the red light conversion layer 104, and scattering particles are provided in the diffusion layer 106.

[0066] Specifically, the scattering particles are high-refractive-index material particles, such as silicon dioxide, titanium dioxide, or other types of inorganic or organic particles. When light passes through the diffusion layer containing scattering particles, these scattering particles randomly scatter the light, resulting in a more uniform distribution of light in all directions, which in turn increases the surrounding outgoing light and increases the light diffusion angle of the LED light source.

[0067] The reflective layer can partially reflect light back, increasing the number of reflections of light inside the LED light source. The reflective particles are material particles that have a reflective effect on light, including but not limited to titanium dioxide particles, which are set at the center of the reflective layer to reflect part of the generated white light back to the diffusion layer, reducing the central light intensity. By increasing the number of light reflections, some of the light that might have been emitted directly forward is redirected to the side, thus increasing the amount of light emitted from the side and further expanding the light diffusion angle.

[0068] Furthermore, such as Figure 4 As shown, the encapsulation layer also includes a reflective layer 107, which covers the light-emitting front side of the diffusion layer. The reflective layer 107 contains scattering particles, and the number of scattering particles in the reflective layer is greater than the number of scattering particles in the diffusion layer.

[0069] Specifically, the reflective layer can partially reflect light back, increasing the number of reflections of light within the LED light source. The number of scattering particles in the reflective layer is greater than that in the diffuser layer. In the reflective layer, the scattering particles increase the number of refractions of light, gradually changing the light path that should have exited the reflective layer, and reflecting some light back to the diffuser layer. By increasing the number of light reflections, some of the light that might have been emitted directly forward is redirected to the side, thus increasing the amount of light emitted from the side and further expanding the light diffusion angle.

[0070] The density of scattering particles in the reflective layer is greater than that in the diffuser layer. Because the density of scattering particles in the diffuser layer is relatively high and the distance between the scattering particles is small, the light originally concentrated there is refracted multiple times, gradually redirecting the light path back to the diffuser layer. This increases the number of refractions and reflections of light within the LED light source, achieving a more uniform light distribution and improving luminous efficiency.

[0071] Furthermore, the density of scattering particles decreases from the center outwards within the reflective layer.

[0072] Specifically, the density of scattering particles is higher in the central region of the reflective layer. Since the light intensity and concentration are typically highest in the central region, the high density of scattering particles can more effectively scatter and redirect this light, preventing excessively bright spots from forming in the central area. Further away from the center, the light intensity and concentration naturally decrease, and the lower density of scattering particles reduces unnecessary scattering events while ensuring that light in the peripheral areas is still properly scattered, maintaining the uniformity of the overall light distribution. By decreasing the density of scattering particles from the center outwards within the reflective layer, unnecessary light scattering and energy loss are reduced, thereby improving the overall luminous efficiency.

[0073] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A white LED light source, comprising: a substrate, wherein a light emitting circuit is arranged on the substrate; a blue light chip, wherein the blue light chip is electrically connected to the light emitting circuit; a green light conversion layer, wherein the green light conversion layer comprises a first transparent adhesive layer and green light conversion particles, the green light conversion layer covers at least a light emitting surface of the blue light chip, the green light conversion layer is configured to convert part of blue light emitted by the blue light chip into green light, and the green light conversion particles comprise at least one of green quantum dot particles and green sulfide phosphor particles; a red light conversion layer, wherein the red light conversion layer comprises a second transparent adhesive layer and red light conversion particles, the red light conversion layer covers at least a light emitting surface of the green light conversion layer, the red light conversion layer is configured to convert part of blue light emitted by the blue light chip into red light, and the red light is mixed with the blue light and the green light to obtain white light, and the red light conversion particles comprise red fluoride phosphor particles; an encapsulation layer, wherein the encapsulation layer encapsulates and covers the red light conversion layer, the green light conversion layer and the blue light chip on the substrate.

2. The white LED light source according to claim 1, characterized in that The white LED light source further comprises a transparent isolation layer, wherein the transparent isolation layer is arranged between the green light conversion layer and the red light conversion layer, and the transparent isolation layer is configured to separate the green light conversion layer and the red light conversion layer.

3. The white LED light source according to claim 2, characterized in that The transparent isolation layer has the same refractive index as the first transparent adhesive layer.

4. The white LED light source according to claim 1, characterized in that, The refractive index ratio of the first transparent adhesive layer to the second transparent adhesive layer ranges from 0.95 to 1.

05.

5. The white LED light source according to claim 1, characterized in that, The blue light chip is a flip-chip blue light chip.

6. The white LED light source according to claim 1, characterized in that, The encapsulation layer comprises a diffusion layer covering a light emitting surface of the red light conversion layer, and the diffusion layer is provided with scattering particles.

7. The white LED light source according to claim 6, characterized in that The encapsulation layer further comprises a reflective layer covering a light emitting surface of the diffusion layer, and the reflective layer is provided with scattering particles, and the number of scattering particles in the reflective layer is greater than the number of scattering particles in the diffusion layer.

8. The white LED light source according to claim 7, characterized in that In a direction from the center to the periphery of the reflective layer, the density of the scattering particles in the reflective layer decreases.

9. A backlight module, characterized in that, The white LED light source according to any one of claims 1-8.

10. An electronic device, comprising: The backlight module according to claim 9.

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