Lamp bead with long service life and low attenuation

Abstract

The utility model discloses a long life low attenuation lamp bead relates to LED lamp bead technical field, including base plate body and chip body, the surface of base plate body is fixedly equipped with at least two radiating fin in symmetry arrangement, the surface of base plate body is equipped with at least two diversion hole in equidistant arrangement, the surface of chip body is equipped with at least two radiating fin, the surface of chip body is equipped with at least two radiating fin, and the surface of chip body is equipped with at least two radiating fin. A metal sintering layer for connecting and supporting the chip body is fixedly mounted in the substrate body, heat-conducting gel attached and positioned to the bottom end of the chip body is fixedly mounted at the top end of the metal sintering layer, and a buffering effect can be achieved between the substrate body and the chip body through the characteristics of softness and high resilience of the heat-conducting gel; when equipment is subjected to external force such as vibration, impact or thermal expansion and cold contraction, the heat-conducting gel can absorb and disperse the stress, so that mechanical damage caused by relative displacement or deformation between the substrate body and the chip body is reduced, and the reliability and stability of connection between the chip and the substrate are improved.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to a high-lifetime, low-attenuation lamp bead. Background Technology

[0002] LED chips are products that have been packaged into light-emitting diode (LED) chips. An LED chip is a semiconductor device whose light-emitting principle is based on the recombination of electrons and holes in a semiconductor material. In practical applications, LED chips typically require the following technologies:

[0003] 1. Chip, the core component of the LED chip, used to emit light;

[0004] 2. Packaging materials, used to protect the chip and connect external circuits;

[0005] 3. Electrodes, the metal parts used to connect the chip to external circuitry;

[0006] Currently, existing LED beads (such as patent publication number: CN221780547U) disclose an LED bead with a snap-fit ​​device that greatly simplifies the installation process of LED beads through the coordinated work of a snap-fit ​​groove, an elastic plate, a fixing base, an unlocking mechanism, and a fixing sleeve. Users can easily install the LED beads onto the base without any professional tools.

[0007] When LED chips are working, they generate heat, which accumulates inside the chip and causes the junction temperature to rise rapidly. In addition, the chip uses packaging technology, which allows heat to accumulate inside the chip, causing the chip temperature to rise. Excessive temperature will accelerate chip aging, reduce luminous efficiency, and even damage the chip. Utility Model Content

[0008] To address the shortcomings of existing technologies, this utility model provides a high-lifetime, low-attenuation LED bead, solving the technical problem that LED beads generate heat during operation. If heat dissipation is poor, heat will accumulate inside the LED bead, causing the chip temperature to rise. Excessive temperature will accelerate chip aging, reduce luminous efficiency, and even damage the chip.

[0009] To achieve the above objectives, this utility model provides the following technical solution:

[0010] A high-lifetime, low-attenuation LED bead includes a substrate body and a chip body. At least two symmetrically arranged heat dissipation fins are fixedly mounted on the surface of the substrate body. At least two equidistantly arranged flow guiding holes are opened on the surface of the substrate body. A metal sintered layer that connects and supports the chip body is fixedly mounted inside the substrate body. A thermally conductive gel that fits and is positioned against the bottom of the chip body is fixedly mounted on the top of the metal sintered layer.

[0011] Preferably, the thermal conductive gel is applied to the surface of the metal sintering layer, and the thermal conductive gel is fixed to the chip body by an adhesive method;

[0012] The metal sintered layer is made of aluminum alloy and is fixed inside the substrate body by sintering.

[0013] Preferably, the end of each heat dissipation fin is directly connected to the substrate body, and each heat dissipation fin is an upwardly convex thin sheet;

[0014] The flow guiding holes are arranged in a matrix, and each flow guiding hole penetrates the interior of the substrate body;

[0015] The substrate body is made of ceramic material, and the top of the substrate body is provided with a slot for docking with the chip body.

[0016] Compared with the prior art, the present invention has the following beneficial effects;

[0017] In this invention, the airflow holes allow for better heat exchange between the air and the heat dissipation fins as the air passes through them. The heat dissipation fins increase the contact area between the air and the substrate, while the airflow holes provide a more convenient flow channel for the air. The two work together to significantly improve the heat dissipation effect, increase the lifespan of the LED chips, and prevent the chip's performance from deteriorating and light decay from being accelerated due to high temperatures.

[0018] In this invention, the thermally conductive gel, with its soft and elastic properties, can act as a buffer between the substrate and the chip. When the device is subjected to external forces such as vibration, impact, or thermal expansion and contraction, the thermally conductive gel can absorb and disperse these stresses, reduce mechanical damage caused by relative displacement or deformation between the substrate and the chip, and improve the reliability and stability of the connection between the chip and the substrate. Attached Figure Description

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0020] Figure 1 This is a structural diagram of the entire LED bead of this utility model;

[0021] Figure 2 This is a structural diagram of the thermally conductive gel of this utility model;

[0022] Figure 3 This is a structural diagram of the substrate body of this utility model;

[0023] Figure 4 This is a structural diagram of the heat dissipation fins of this utility model.

[0024] In the figure: 11, substrate body; 12, chip body; 13, heat dissipation fins; 14, flow channel holes; 15, thermal conductive gel; 16, metal sintering layer. Detailed Implementation

[0025] This application provides a high-lifetime, low-attenuation LED chip, effectively solving the problem of heat generation during LED operation. If heat dissipation is poor, heat will accumulate inside the LED chip, causing the chip temperature to rise. Excessive temperature will accelerate chip aging, reduce luminous efficiency, and even damage the chip. The airflow holes allow air to exchange heat better with the heat sink fins as it passes through. The heat sink fins increase the contact area between the air and the substrate, while the airflow holes provide a more convenient flow channel for the air. The two work together to significantly improve heat dissipation, increase the lifespan of the LED chip, and prevent the chip's performance from deteriorating and light decay from high temperatures. Example

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the technical solution in this application embodiment effectively solves the problem that when LED chips generate heat during operation, if heat dissipation is poor, heat will accumulate inside the LED chip, causing the chip temperature to rise. Excessive temperature will accelerate chip aging, reduce luminous efficiency, and even damage the chip. The overall idea is as follows:

[0027] To address the problems existing in the prior art, this utility model provides a high-lifetime, low-attenuation LED bead, comprising a substrate body 11 and a chip body 12. At least two symmetrically arranged heat dissipation fins 13 are fixedly mounted on the surface of the substrate body 11, and at least two equidistantly arranged flow guiding holes 14 are opened on the surface of the substrate body 11. A metal sintered layer 16 that connects and supports the chip body 12 is fixedly mounted inside the substrate body 11. A thermally conductive gel 15 that is attached and positioned to the bottom of the chip body 12 is fixedly mounted on the top of the metal sintered layer 16. The thermally conductive gel 15 can quickly conduct the heat generated by the chip body 12 to the substrate body 11, and then dissipate the heat through the substrate body 11, effectively reducing the operating temperature of the chip body 12 and reducing the overheating of the LED bead. The metal sintered layer 16 has excellent electrical insulation properties, which can effectively avoid short circuit problems between the substrate body 11 and the chip body 12 caused by direct contact or other factors.

[0028] The substrate body 11 is made of ceramic material. The top of the substrate body 11 is provided with a slot for docking with the chip body 12. The thermal conductive gel 15 is applied to the surface of the metal sintering layer 16. The thermal conductive gel 15 is fixed to the chip body 12 by adhesive bonding.

[0029] The metal sintered layer 16 is made of aluminum alloy and is fixed inside the substrate body 11 by sintering. It can maintain good electrical connection performance during long-term use and is not prone to electrical connection failure due to poor contact, oxidation, corrosion and other factors. This improves the reliability and stability of the connection between the substrate body 11 and the chip body 12 and extends the service life of electronic devices.

[0030] The end of each heat dissipation fin 13 is directly connected to the substrate body 11. Each heat dissipation fin 13 is an upwardly protruding thin sheet that can change the direction and speed of airflow, causing turbulence in the air between the heat dissipation fins 13 and enhancing heat exchange.

[0031] The airflow holes 14 are arranged in a matrix, and each airflow hole 14 penetrates the interior of the substrate body 11. This allows the air to exchange heat with the heat dissipation fins 13 better as it passes through the airflow holes 14. The heat dissipation fins 13 can increase the contact area between the air and the substrate, while the airflow holes 14 can provide a more convenient flow channel for the air. The two work together to significantly improve the heat dissipation effect.

[0032] Working principle:

[0033] The first step involves moving the chip body 12 to align its bottom end with the top end of the substrate body 11. The substrate body 11 and chip body 12 are then connected via press-fitting. Simultaneously, the end of the chip body 12 is attached to the top end of the thermal conductive gel 15. To directly solder the LED onto the circuit board, the circuit board must be prepared first, ensuring correct wiring connections. The chip body 12 is then connected to a power source. The thermal conductive gel 15 quickly conducts the heat generated by the chip body 12 to the substrate body 11, which then dissipates the heat, effectively reducing the operating temperature of the chip body 12 and minimizing overheating of the LED. The metal sintered layer 16 has excellent electrical insulation properties, effectively preventing short circuits between the substrate body 11 and chip body 12 caused by direct contact or other factors.

[0034] The thermal conductive gel 15, with its soft and elastic properties, can act as a buffer between the substrate body 11 and the chip body 12. When the device is subjected to external forces such as vibration, impact or thermal expansion and contraction, the thermal conductive gel 15 can absorb and disperse these stresses, reduce mechanical damage caused by relative displacement or deformation between the substrate body 11 and the chip body 12, and improve the reliability and stability of the connection between the chip and the substrate.

[0035] In the second step, the metal sintered layer 16 is fixed inside the substrate body 11 by sintering, which can maintain good electrical connection performance during long-term use and is not prone to electrical connection failure due to poor contact, oxidation, corrosion and other factors. This improves the reliability and stability of the connection between the substrate body 11 and the chip body 12 and extends the service life of electronic devices. The airflow holes 14 can better exchange heat with the heat dissipation fins 13 when the air passes through the airflow holes 14. The heat dissipation fins 13 can increase the contact area between the air and the substrate, while the airflow holes 14 can provide a more convenient flow channel for the air. The two work together to significantly improve the heat dissipation effect.

[0036] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A long-life low-decay lamp bead comprising a substrate body (11) and a chip body (12), characterized in that, The surface of the substrate body (11) is fixedly installed with at least two symmetrically arranged heat dissipation fins (13), the surface of the substrate body (11) is provided with at least two equidistantly arranged flow guide holes (14), the inside of the substrate body (11) is fixedly installed with a metal sintering layer (16) serving to connect and support the chip body (12), and the top end of the metal sintering layer (16) is fixedly installed with heat-conducting gel (15) abutting and positioning the bottom end of the chip body (12).

2. The long-life low-decay light-emitting diode according to claim 1, wherein the phosphor layer is formed on the light-emitting diode chip. The heat-conducting gel (15) is coated on the surface of the metal sintering layer (16), and the heat-conducting gel (15) and the chip body (12) are fixed by adhesion.

3. The long-life low-decay light-emitting diode according to claim 1, wherein the phosphor layer is formed on the light-emitting diode chip. The metal sintering layer (16) is made of an aluminum alloy and is fixed in the substrate body (11) by sintering.

4. The long-life low-decay light-emitting diode of claim 1, wherein the phosphor layer is formed on the surface of the light-emitting diode chip. The end of each heat dissipation fin (13) is directly connected to the substrate body (11), and each heat dissipation fin (13) is an upwardly protruding sheet.

5. The long-life low-decay light-emitting diode of claim 1, wherein the phosphor layer is formed on the surface of the light-emitting diode chip. The flow guide holes (14) are arranged in a matrix, and each flow guide hole (14) penetrates the inside of the substrate body (11).

6. The long-life low-decay light-emitting diode of claim 1, wherein the light-emitting diode is a light-emitting diode chip. The substrate body (11) is made of ceramic, and the top end of the substrate body (11) is provided with a clamping groove abutting the chip body (12).

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