Display panel and display device

Abstract

The utility model discloses a display panel and a display device. The display panel comprises a substrate, a retaining wall structure and an organic packaging layer, the retaining wall structure is located in the non-display area and comprises a first film layer and a second film layer, the first film layer is arranged on the substrate, and the second film layer is arranged on the substrate and continuously covers the first film layer; at least part of the organic encapsulation layer is located in the display area and is arranged on the substrate; the retaining wall structure comprises a first sub-part and a second sub-part which are connected, the thickness of the first sub-part is smaller than that of the second sub-part, the first sub-part comprises one part of a first film layer and one part of a second film layer, and the second sub-part comprises the other part of the first film layer and the other part of the second film layer. The orthographic projection of the second sub-part on the substrate is located on the outer side of the orthographic projection of the organic packaging layer on the substrate, and the first sub-part is located on the side, close to the display area, of the second sub-part. The frame size of the display panel can be reduced, and the narrow frame design of the display panel is realized.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and a display device. Background Technology

[0002] In traditional display panels, a first and second barrier are typically required to prevent organic ink from overflowing from the encapsulation layer. The first and second barriers are spaced apart; the first barrier is located on the inner side to initially block the organic ink from overflowing from the encapsulation layer. The second barrier is located on the outer side to prevent ink that has overflowed from the first barrier from further overflowing.

[0003] However, in actual production of display panels, the spacing between the first and second baffles increases the bezel size of the display panel, making it impossible to design a display panel with a narrow bezel.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this application is to provide a display panel and a display device to reduce the bezel size of the display panel and achieve a narrow bezel design.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, this application proposes a display panel, including a display area and a non-display area located on at least one side of the display area, the display panel comprising:

[0008] substrate;

[0009] A barrier structure, located in the non-display area, includes a first film layer and a second film layer. The first film layer is disposed on the substrate, and the second film layer is disposed on the substrate and continuously covers the first film layer.

[0010] An organic encapsulation layer, at least a portion of which is located in the display area and disposed on the substrate;

[0011] The barrier structure includes a first sub-part and a second sub-part connected to each other. The thickness of the first sub-part is less than the thickness of the second sub-part. The first sub-part includes a portion of the first film layer and a portion of the second film layer. The second sub-part includes another portion of the first film layer and another portion of the second film layer. The orthographic projection of the second sub-part on the substrate is located outside the orthographic projection of the organic encapsulation layer on the substrate. The first sub-part is located on the side of the second sub-part closer to the display area.

[0012] In one embodiment of this application, the first film layer includes a first sub-block and a second sub-block spaced apart, the first sub-block being located on the side of the second sub-block closer to the display area, and the second film layer continuously covering the first sub-block and the second sub-block;

[0013] The first sub-block and the portion of the second film layer disposed on the first sub-block form the first sub-part, and the second sub-block and the portion of the second film layer disposed on the first sub-block form the second sub-part.

[0014] In one embodiment of this application, the thickness of the first sub-block is less than the thickness of the second sub-block.

[0015] In one embodiment of this application, the thickness of the first sub-block is equal to the thickness of the second sub-block;

[0016] The second film layer includes:

[0017] A first sublayer is disposed on the substrate and continuously covers the first sub-block and the second sub-block; and

[0018] The second sub-layer is located on top of the first sub-layer;

[0019] The orthographic projection of the second sub-block on the substrate is located within the range of the orthographic projection of the second sub-layer on the substrate, and the orthographic projection of the first sub-block on the substrate is located outside the orthographic projection of the second sub-layer on the substrate;

[0020] The first sub-block and the portion of the first sub-layer disposed on the first sub-block form the first sub-part, and the second sub-block, the portion of the first sub-layer disposed on the second sub-block, and the second sub-layer form the second sub-part.

[0021] In one embodiment of this application, a first portion of the first sub-layer is disposed on the side of the first sub-block near the second sub-block, a second portion of the first sub-layer is disposed on the substrate and located between the first sub-block and the second sub-block, and a third portion of the first sub-layer is disposed on the side of the second sub-block near the first sub-block.

[0022] Wherein, the first part of the first sub-layer, the second part of the first sub-layer and the third part of the first sub-layer are connected to form a recessed portion, and the first sub-part and the second sub-part are connected through the recessed portion;

[0023] The recessed portion connects the portion of the first sub-layer disposed on the first sub-block and the portion of the first sub-layer disposed on the second sub-block.

[0024] In one embodiment of this application, the distance between the first sub-block and the second sub-block is in the range of 20 micrometers to 40 micrometers;

[0025] The cross-sectional width of the first sub-block is in the range of 10 micrometers to 30 micrometers;

[0026] The cross-sectional width of the second sub-block is in the range of 10 micrometers to 30 micrometers.

[0027] In one embodiment of this application, the first film layer is continuously disposed on the substrate;

[0028] The second film layer includes:

[0029] A first sublayer, disposed on the substrate and located in the non-display area, continuously covers the first film layer. The first sublayer includes a first connecting portion and a second connecting portion connected to each other. The first connecting portion and the second connecting portion are disposed on the first film layer. The orthographic projection of the first connecting portion on the substrate is located on the side of the orthographic projection of the second connecting portion on the substrate closer to the display area.

[0030] The second sub-layer is disposed on the second connecting part;

[0031] The second sub-layer, the second connecting portion, and the portion of the first film layer covered by the second connecting portion form the second sub-part, and the first connecting portion and the portion of the first film layer covered by the first connecting portion form the first sub-part.

[0032] In one embodiment of this application, the cross-sectional width of the first film layer is in the range of 60 micrometers to 80 micrometers;

[0033] The cross-sectional width of the first sublayer is in the range of 90 to 110 micrometers;

[0034] The cross-sectional width of the second sublayer is in the range of 30 to 50 micrometers.

[0035] In one embodiment of this application, the thickness of the first sub-part is in the range of 2 micrometers to 7 micrometers;

[0036] The thickness of the second sub-part is in the range of 3 micrometers to 8 micrometers.

[0037] In one embodiment of this application, the orthographic projection of the first sub-part on the substrate is located outside the orthographic projection of the organic encapsulation layer on the substrate;

[0038] The thickness of the organic encapsulation layer is less than the thickness of the first sub-part.

[0039] In one embodiment of this application, the display panel further includes:

[0040] A first inorganic encapsulation layer is disposed on the substrate and covers the first sub-part and the second sub-part; the organic encapsulation layer is disposed on the first inorganic encapsulation layer; and

[0041] A second inorganic encapsulation layer is disposed on the first inorganic encapsulation layer and covers the organic encapsulation layer, the first sub-part, and the second sub-part.

[0042] Secondly, this application proposes a display device, including a display panel, the display panel including a display area and a non-display area located on at least one side of the display area, the display panel including a substrate, a barrier structure, and an organic encapsulation layer; the barrier structure is located in the non-display area, the barrier structure including a first film layer and a second film layer, the first film layer being disposed on the substrate, the second film layer being disposed on the substrate, and continuously covering the first film layer; at least a portion of the organic encapsulation layer is located in the display area and is disposed on the substrate; wherein, the barrier structure includes a first sub-part and a second sub-part connected to each other, the thickness of the first sub-part being less than the thickness of the second sub-part, the first sub-part including a portion of the first film layer and a portion of the second film layer, the second sub-part including another portion of the first film layer and another portion of the second film layer, the orthographic projection of the second sub-part on the substrate being located outside the orthographic projection of the organic encapsulation layer on the substrate, and the first sub-part being located on the side of the second sub-part closer to the display area.

[0043] The barrier structure of this application includes a first sub-part and a second sub-part connected to each other, with the thickness of the first sub-part being less than the thickness of the second sub-part. The first sub-part is used to initially block the outward leakage of organic ink from the organic encapsulation layer, and the second sub-part is used to further block the outward leakage of organic ink from the organic encapsulation layer. Because the first sub-part and the second sub-part are connected in this application, compared to the conventional display panel with the first and second barrier walls spaced apart, this application reduces the bezel size of the display panel by eliminating the gap between the first and second barrier walls in the conventional display panel, thereby achieving a narrow bezel design for the display panel. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of a traditional display panel;

[0045] Figure 2 This is a schematic diagram of a first embodiment of the display panel of this application;

[0046] Figure 3 This is a schematic diagram of step S11 in the first method of manufacturing the display panel of this application;

[0047] Figure 4This is a schematic diagram of step S12a in the first method of manufacturing the display panel of this application;

[0048] Figure 5 This is a schematic diagram of step S13 in the first method of manufacturing the display panel of this application;

[0049] Figure 6 This is another schematic diagram of the first embodiment of the display panel of this application;

[0050] Figure 7 This is a schematic diagram of step S12b in the second method of manufacturing the display panel of this application;

[0051] Figure 8 This is another schematic diagram of the first embodiment of the display panel of this application;

[0052] Figure 9 This is a schematic diagram of a second embodiment of the display panel of this application;

[0053] Figure 10 This is a schematic diagram of a third embodiment of the display panel of this application;

[0054] Figure 11 This is a schematic diagram of step S21 in the third manufacturing method of the display panel of this application;

[0055] Figure 12 This is a schematic diagram of step S22a in the third method of manufacturing the display panel of this application;

[0056] Figure 13 This is a schematic diagram of step S23 in the third method of manufacturing the display panel of this application;

[0057] Figure 14 This is another schematic diagram of a third embodiment of the display panel of this application;

[0058] Figure 15 This is a schematic diagram of step S22b in the fourth method of manufacturing the display panel of this application. Detailed Implementation

[0059] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0060] Please see Figure 1A conventional display panel 200 includes a substrate 210 and a first barrier 220 and a second barrier 230 spaced apart on the substrate 210. The conventional display panel 200 includes a display area AA and a non-display area NA located on at least one side of the display area AA. Both the first barrier 220 and the second barrier 230 are located in the non-display area NA. The first barrier 220 is located on the inner side to initially prevent organic ink in the organic encapsulation layer 240 from overflowing outwards. The second barrier 230 is located on the outer side to prevent ink overflowing from the first barrier 220 from further overflowing outwards. Due to the spaced arrangement, a gap d exists between the first barrier 220 and the second barrier 230. In the conventional display panel 200, this gap d is typically greater than 40 micrometers. The presence of this gap d prevents the size of the non-display area NA from being reduced, thus limiting the bezel size of the conventional display panel 200 and hindering the implementation of a narrow bezel design. Generally, the cross-sectional width of the first barrier 220 of a conventional display panel 200 is 40 micrometers, and the cross-sectional width of the second barrier 230 is 60 micrometers. The total width of the first barrier 220, the gap d, and the second barrier of the conventional display panel 200 is greater than 140 micrometers.

[0061] This application discloses a display device, which may be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display panel 100.

[0062] This application discloses a display panel 100. The display panel 100 of this application is an organic light-emitting diode (OLED) display panel 100.

[0063] Please see Figure 2 The display panel 100 includes a display area and a non-display area located on at least one side of the display area.

[0064] The display panel 100 includes a substrate 10, a barrier structure 20, and an organic encapsulation layer 32. The barrier structure 20 is located in the non-display area. The barrier structure 20 includes a first film layer 21 and a second film layer 22. The first film layer 21 is disposed on the substrate 10. The second film layer 22 is disposed on the substrate 10 and continuously covers the first film layer 21. At least a portion of the organic encapsulation layer 32 is located in the display area and is disposed on the substrate 10.

[0065] The barrier structure 20 includes a first sub-part 20a and a second sub-part 20b connected to each other. The thickness of the first sub-part 20a is less than the thickness of the second sub-part 20b. The first sub-part 20a includes a portion of the first film layer 21 and a portion of the second film layer 22. The second sub-part 20b includes another portion of the first film layer 21 and another portion of the second film layer 22. The orthographic projection of the second sub-part 20b on the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 on the substrate 10. The first sub-part 20a is located on the side of the second sub-part 20b closer to the display area.

[0066] The barrier structure 20 in this embodiment includes a first sub-part 20a and a second sub-part 20b connected to each other. The thickness of the first sub-part 20a is less than the thickness of the second sub-part 20b. The first sub-part 20a is used to initially block the organic ink in the organic encapsulation layer 32 from overflowing outwards, and the second sub-part 20b is used to further block the organic ink in the organic encapsulation layer 32 from overflowing outwards. Since the first sub-part 20a and the second sub-part 20b are connected in this application, compared with the conventional display panel 200 which has a first barrier 220 and a second barrier 230 spaced apart, this application reduces the bezel size of the display panel 100 by eliminating the gap d between the first barrier 220 and the second barrier 230 in the conventional display panel 200, thereby achieving a narrow bezel design for the display panel 100.

[0067] Optionally, the display panel 100 further includes a first inorganic encapsulation layer 31 and a second inorganic encapsulation layer 33. The first inorganic encapsulation layer 31 is disposed on the substrate 10 and covers the first sub-part 20a and the second sub-part 20b. An organic encapsulation layer 32 is disposed on the first inorganic encapsulation layer 31. The second inorganic encapsulation layer 33 is disposed on the first inorganic encapsulation layer 31 and covers the organic encapsulation layer 32, the first sub-part 20a, and the second sub-part 20b.

[0068] In this embodiment, the encapsulation layer of the display panel 100 has a three-layer structure, comprising a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 stacked together. The first inorganic encapsulation layer 31 is made of inorganic material and is formed on the substrate 10 using chemical vapor deposition (CVD), covering the first sub-part 20a and the second sub-part 20b. The first inorganic encapsulation layer 31 can prevent external water and oxygen from intruding into the display panel 100. The organic encapsulation layer 32 is made of organic material and is formed on the first inorganic encapsulation layer 31 using inkjet printing (IJP), and is blocked by the first sub-part 20a and the second sub-part 20b to prevent ink overflow from the organic encapsulation layer 32. The organic encapsulation layer 32 can improve the overall flexibility and bending performance of the encapsulation layer. The second inorganic encapsulation layer 33 is made of inorganic materials and is formed on the first inorganic encapsulation layer 31 by chemical vapor deposition, covering the organic encapsulation layer 32, the first sub-part 20a, and the second sub-part 20b. The second inorganic encapsulation layer 33 can further prevent external water and oxygen from intruding into the interior of the display panel 100.

[0069] Optionally, the thickness of the first sub-section 20a is in the range of 2 micrometers to 7 micrometers.

[0070] The first sub-section 20a serves to initially prevent the organic ink in the organic encapsulation layer 32 from overflowing. The thickness of the first sub-section 20a is 2.0 μm, 2.1 μm, 2.2 μm, 2.3 μm, 2.4 μm, 2.5 μm, 2.6 μm, 2.7 μm, 2.8 μm, 2.9 μm, 3.0 μm, 3.1 μm, 3.2 μm, 3.3 μm, 3.4 μm, 3.5 μm, 3.6 μm, 3.7 μm, 3.8 μm, 3.9 μm, 4.0 μm, 4.1 μm, 4.2 μm, 4.3 μm, and 4.4 μm. The value is one of the following: 4.5 micrometers, 4.6 micrometers, 4.7 micrometers, 4.8 micrometers, 4.9 micrometers, 5.0 micrometers, 5.1 micrometers, 5.2 micrometers, 5.3 micrometers, 5.4 micrometers, 5.5 micrometers, 5.6 micrometers, 5.7 micrometers, 5.8 micrometers, 5.9 micrometers, 6.0 micrometers, 6.1 micrometers, 6.2 micrometers, 6.3 micrometers, 6.4 micrometers, 6.5 micrometers, 6.6 micrometers, 6.7 micrometers, 6.8 micrometers, 6.9 micrometers, or 7.0 micrometers.

[0071] Optionally, the thickness of the second sub-section 20b is in the range of 3 micrometers to 8 micrometers.

[0072] The second sub-section 20b is used to further prevent the organic ink in the organic encapsulation layer 32 from overflowing. The thickness of the second sub-section 20b is 3.0 μm, 3.1 μm, 3.2 μm, 3.3 μm, 3.4 μm, 3.5 μm, 3.6 μm, 3.7 μm, 3.8 μm, 3.9 μm, 4.0 μm, 4.1 μm, 4.2 μm, 4.3 μm, 4.4 μm, 4.5 μm, 4.6 μm, 4.7 μm, 4.8 μm, 4.9 μm, 5.0 μm, 5.1 μm, 5.2 μm, 5.3 μm, and 5.4 μm. The value is one of the following: 5.5 micrometers, 5.6 micrometers, 5.7 micrometers, 5.8 micrometers, 5.9 micrometers, 6.0 micrometers, 6.1 micrometers, 6.2 micrometers, 6.3 micrometers, 6.4 micrometers, 6.5 micrometers, 6.6 micrometers, 6.7 micrometers, 6.8 micrometers, 6.9 micrometers, 7.0 micrometers, 7.1 micrometers, 7.2 micrometers, 7.3 micrometers, 7.4 micrometers, 7.5 micrometers, 7.6 micrometers, 7.7 micrometers, 7.8 micrometers, 7.9 micrometers, or 8.0 micrometers.

[0073] In the first embodiment of this application:

[0074] Please see Figure 2 The first film layer 21 includes a first sub-block 211 and a second sub-block 212 spaced apart. The first sub-block 211 is located on the side of the second sub-block 212 closer to the display area. The second film layer 22 continuously covers the first sub-block 211 and the second sub-block 212.

[0075] The portion of the first sub-block 211 and the portion of the second film layer 22 disposed on the first sub-block 211 forms the first sub-section 20a. The portion of the second sub-block 212 and the portion of the second film layer 22 disposed on the first sub-block 211 forms the second sub-section 20b.

[0076] The thickness of the first sub-block 211 is equal to the thickness of the second sub-block 212.

[0077] The second film layer 22 includes a first sublayer 221 and a second sublayer 222. The first sublayer 221 is disposed on the substrate 10 and continuously covers the first subblock 211 and the second subblock 212. The second sublayer 222 is disposed on the first sublayer 221.

[0078] The orthographic projection of the second sub-block 212 on the substrate 10 is within the range of the orthographic projection of the second sub-layer 222 on the substrate 10. The orthographic projection of the first sub-block 211 on the substrate 10 is outside the orthographic projection of the second sub-layer 222 on the substrate 10.

[0079] The portion of the first sub-block 211 and the portion of the first sub-layer 221 disposed on the first sub-block 211 forms the first sub-section 20a. The portion of the second sub-block 212, the portion of the first sub-layer 221 disposed on the second sub-block 212, and the second sub-layer 222 form the second sub-section 20b.

[0080] In this embodiment, the material of the first film layer 21 includes an organic material. The material of the first film layer 21 is the same as the material of the planarization layer of the display panel 100. The second film layer 22 includes a first sub-layer 221 and a second sub-layer 222. The material of the first sub-layer 221 includes an organic material, and the material of the first sub-layer 221 is the same as the material of the planarization layer of the display panel 100. The material of the first sub-layer 221 can be the same as the material of the first film layer 21. The material of the second sub-layer 222 includes an organic material. The material of the second sub-layer 222 is the same as the material of the pixel defining layer of the display panel 100. The thickness of the second sub-layer 222 can be adjusted by exposure and development, thereby adjusting the thickness of the second sub-section 20b. When the exposure and development time is longer, the thickness of the second sub-layer 222 is thinner, thereby making the thickness of the second sub-section 20b thinner, thus reducing the thickness of the display panel 100, but this will reduce the ability of the second sub-section 20b to block the overflow of the organic encapsulation layer 32. When the exposure and development time is short, the second sub-layer 222 is thicker, which in turn makes the second sub-part 20b thicker. Although this increases the thickness of the display panel 100, it can improve the ability of the second sub-part 20b to block the overflow of the organic encapsulation layer 32.

[0081] In this embodiment, by setting a continuous first sub-layer 221, the first sub-part 20a and the second sub-part 20b are connected. Compared with the first barrier 220 and the second barrier 230 of the conventional display panel 200, there is no gap between the first sub-part 20a and the second sub-part 20b of this application, thereby reducing the bezel size of the display panel 100 and realizing the narrow bezel design of the display panel 100.

[0082] The first method for manufacturing the display panel 100 of this application includes the following steps:

[0083] Step S11: Please refer to Figure 3A barrier structure 20 and a first inorganic encapsulation layer 31 covering the barrier structure 20 are formed on a substrate 10. The barrier structure 20 is located in a non-display area. The barrier structure 20 includes a first film layer 21 and a second film layer 22. The first film layer 21 is disposed on the substrate 10. The second film layer 22 is disposed on the substrate 10 and continuously covers the first film layer 21. The barrier structure 20 includes a first sub-part 20a and a second sub-part 20b connected to each other. The thickness of the first sub-part 20a is less than the thickness of the second sub-part 20b. The first sub-part 20a is located on the side of the second sub-part 20b closer to the display area. The first film layer 21 includes a first sub-block 211 and a second sub-block 212 spaced apart. The first sub-block 211 is located on the side of the second sub-block 212 closer to the display area. The second film layer 22 continuously covers the first sub-block 211 and the second sub-block 212. The thickness of the first sub-block 211 is equal to the thickness of the second sub-block 212. The second film layer 22 includes a first sub-layer 221 and a second sub-layer 222. A first sublayer 221 is disposed on the substrate 10 and continuously covers the first sub-block 211 and the second sub-block 212. A second sublayer 222 is disposed on the first sublayer 221. The orthographic projection of the second sub-block 212 on the substrate 10 is within the range of the orthographic projection of the second sublayer 222 on the substrate 10. The orthographic projection of the first sub-block 211 on the substrate 10 is outside the orthographic projection of the second sublayer 222 on the substrate 10. The portion of the first sub-block 211 and the first sublayer 221 disposed on the first sub-block 211 forms a first sub-part 20a. The portion of the second sub-block 212, the portion of the first sublayer 221 disposed on the second sub-block 212, and the second sublayer 222 form a second sub-part 20b.

[0084] Step S12a: Please refer to Figure 4 A large amount of organic ink is printed on the first inorganic encapsulation layer 31 to form an organic encapsulation layer 32. The orthographic projection of the second sub-part 20b on the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 on the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the second sub-part 20b.

[0085] Step S13: Please refer to Figure 5 A second inorganic encapsulation layer 33 is formed on the first inorganic encapsulation layer 31. The second inorganic encapsulation layer 33 covers the organic encapsulation layer 32, the first sub-part 20a, and the second sub-part 20b.

[0086] Optional, please refer to Figure 6 The orthographic projection of the first sub-part 20a onto the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 onto the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the first sub-part 20a.

[0087] In this embodiment, the organic encapsulation layer 32 is relatively thin, and the first sub-part 20a is sufficient to prevent ink overflow from the organic encapsulation layer 32. The second sub-part 20b is used to prevent further outward overflow of the organic encapsulation layer 32.

[0088] The display panel 100 of this application also includes a second manufacturing method, the difference between the second manufacturing method and the first manufacturing method being step S12a.

[0089] The second method of manufacturing the display panel 100 of this application includes:

[0090] Step 12b: Please refer to Figure 7 An appropriate amount of organic ink is printed on the first inorganic encapsulation layer 31 to form an organic encapsulation layer 32. The orthographic projection of the second sub-part 20b on the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 on the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the second sub-part 20b.

[0091] In the second manufacturing method of the display panel 100, the addition of only a suitable amount of organic ink makes it less prone to overflow of the organic encapsulation layer 32, thereby improving the encapsulation effect of the display panel 100. In the first manufacturing method of the display panel 100, the addition of a large amount of organic ink can improve the overall flexibility and bending performance of the encapsulation layer of the display panel 100.

[0092] Optional, please refer to Figure 8 The distance L1 between the first sub-block 211 and the second sub-block 212 is in the range of 20 micrometers to 40 micrometers.

[0093] The distance L1 between the first sub-block 211 and the second sub-block 212 can be one of the following values: 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers, or 40 micrometers.

[0094] Optional, please refer to Figure 8 The cross-sectional width L2 of the first sub-block 211 is in the range of 10 micrometers to 30 micrometers.

[0095] The cross-sectional width L2 of the first sub-block 211 takes the value of one of the following: 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, or 30 micrometers. The cross-sectional direction of the first sub-block 211 is the direction in which the non-display area is away from the display area.

[0096] Optional, please refer to Figure 8 The cross-sectional width L3 of the second sub-block 212 is in the range of 10 micrometers to 30 micrometers.

[0097] The cross-sectional width L3 of the second sub-block 212 takes the value of one of the following: 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, or 30 micrometers. The cross-sectional direction of the second sub-block 212 is the direction in which the non-display area is furthest from the display area.

[0098] In this embodiment, when the distance L1 between the first sub-block 211 and the second sub-block 212 is 20 micrometers, the cross-sectional width L2 of the first sub-block 211 is 10 micrometers, and the cross-sectional width L3 of the second sub-block 212 is 10 micrometers, the overall width of the retaining wall structure 20 is relatively small, which can better reduce the bezel size of the display panel 100 and realize the narrow bezel design of the display panel 100.

[0099] When the distance L1 between the first sub-block 211 and the second sub-block 212 is 30 micrometers, the cross-sectional width L2 of the first sub-block 211 is 20 micrometers, and the cross-sectional width L3 of the second sub-block 212 is 20 micrometers, the overall width of the barrier structure 20 is relatively moderate. This can improve the barrier structure 20's ability to block the overflow of the organic encapsulation layer 32 while taking into account the reduction of the bezel size of the display panel 100.

[0100] Optional, please refer to Figure 8 A first portion of the first sublayer 221 is disposed on the side of the first subblock 211 near the second subblock 212. A second portion of the first sublayer 221 is disposed on the substrate 10 and located between the first subblock 211 and the second subblock 212. A third portion of the first sublayer 221 is disposed on the side of the second subblock 212 near the first subblock 211.

[0101] The first portion, the second portion, and the third portion of the first sublayer 221 are connected to form a recess 20c. The first sub-part 20a and the second sub-part 20b are connected through the recess 20c. The recess 20c connects the portion of the first sublayer 221 disposed on the first sub-block 211 and the portion of the first sublayer 221 disposed on the second sub-block 212.

[0102] In this embodiment, the recessed portion 20c is designed to buffer organic ink that overflows to the first sub-portion 20a, thereby improving the display panel 100's ability to block organic ink overflow.

[0103] In the second embodiment of this application:

[0104] To avoid redundancy, the second embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0105] The second embodiment of this application differs from the first embodiment in that:

[0106] In the second embodiment, the second film layer 22 is a single-layer structure.

[0107] Optional, please refer to Figure 9 The thickness of the first sub-block 211 is less than the thickness of the second sub-block 212.

[0108] In this embodiment, by setting the thickness of the first sub-block 211 to be less than the thickness of the second sub-block 212, the thickness of the second sub-part 20b is greater than the thickness of the first sub-part 20a without the need to set the second sub-layer 222. Compared with the first embodiment of this application, the second embodiment reduces one process, improves production efficiency, and reduces production costs.

[0109] In the third embodiment of this application:

[0110] To avoid redundancy, the third embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0111] The third embodiment of this application differs from the first embodiment in that:

[0112] Optional, please refer to Figure 10 The first film layer 21 is continuously disposed on the substrate 10.

[0113] Optionally, the second film layer 22 includes a first sublayer 221 and a second sublayer 222. The first sublayer 221 is disposed on the substrate 10 and located in the non-display area. The first sublayer 221 continuously covers the first film layer 21. The first sublayer 221 includes a first connecting portion and a second connecting portion connected to each other. The first connecting portion and the second connecting portion are disposed on the first film layer 21. The orthographic projection of the first connecting portion on the substrate 10 is located on the side of the orthographic projection of the second connecting portion on the substrate 10 closer to the display area. The second sublayer 222 is disposed on the second connecting portion.

[0114] The second sub-layer 222, the second connecting portion, and the portion of the first film layer 21 covered by the second connecting portion form the second sub-part 20b. The first connecting portion and the portion of the first film layer 21 covered by the first connecting portion form the first sub-part 20a.

[0115] In this embodiment, the first film layer 21 is continuously disposed on the substrate 10. Compared with the first embodiment, the first film layer 21 in the third embodiment does not require patterning of the first sub-block 211 and the second sub-block 212, saving a patterning process, improving production efficiency, and reducing production costs. At the same time, since the first film layer 21 is continuously disposed, the spacing between the first sub-part 20a and the second sub-part 20b can be further reduced compared with the first embodiment, thereby further reducing the bezel size of the display panel 100 and realizing a narrow bezel design of the display panel 100.

[0116] Optionally, the cross-sectional width L4 of the first membrane layer 21 is in the range of 60 micrometers to 80 micrometers.

[0117] The cross-sectional width L4 of the first film layer 21 takes the value of one of 60 micrometers, 65 micrometers, 70 micrometers, 75 micrometers, or 80 micrometers. The cross-sectional direction of the first film layer 21 is the direction away from the display area from the non-display area.

[0118] Optionally, the cross-sectional width of the first sublayer 221 is in the range of 90 to 110 micrometers.

[0119] The cross-sectional width L5 of the first sub-layer 221 takes the value of one of 90 micrometers, 95 micrometers, 100 micrometers, 105 micrometers, or 110 micrometers. The cross-sectional direction of the first sub-layer 221 is the direction in which the non-display area is away from the display area.

[0120] Optionally, the cross-sectional width L6 of the second sublayer 222 is in the range of 30 to 50 micrometers.

[0121] The cross-sectional width L6 of the second sub-layer 222 takes the value of 30 micrometers, 35 micrometers, 40 micrometers, 45 micrometers, or 50 micrometers. The cross-sectional direction of the second sub-layer 222 is the direction in which the non-display area is furthest from the display area.

[0122] In this embodiment, when the cross-sectional width L4 of the first film layer 21 is 60 micrometers and the cross-sectional width L5 of the first sub-layer 221 is 90 micrometers, the overall width of the barrier structure 20 is relatively small, which can better reduce the bezel size of the display panel 100 and realize the narrow bezel design of the display panel 100.

[0123] When the cross-sectional width L4 of the first film layer 21 is 70 micrometers and the cross-sectional width L5 of the first sub-layer 221 is 100 micrometers, the overall width of the barrier structure 20 is relatively moderate, which can improve the ability of the barrier structure 20 to block the overflow of the organic encapsulation layer 32 while taking into account the reduction of the bezel size of the display panel 100.

[0124] The first method for manufacturing the display panel 100 of this application includes the following steps:

[0125] Step S21: Please refer to Figure 11A barrier structure 20 and a first inorganic encapsulation layer 31 covering the barrier structure 20 are formed on a substrate 10. The barrier structure 20 is located in a non-display area. The barrier structure 20 includes a first film layer 21 and a second film layer 22. The first film layer 21 is continuously disposed on the substrate 10. The second film layer 22 is disposed on the substrate 10 and continuously covers the first film layer 21. The barrier structure 20 includes a first sub-part 20a and a second sub-part 20b connected to each other. The thickness of the first sub-part 20a is less than the thickness of the second sub-part 20b. The first sub-part 20a is located on the side of the second sub-part 20b closer to the display area. The second film layer 22 includes a first sub-layer 221 and a second sub-layer 222. The first sub-layer 221 is disposed on the substrate 10 and located in the non-display area. The first sub-layer 221 continuously covers the first film layer 21 and includes a first connecting portion and a second connecting portion connected to each other. The first connecting portion and the second connecting portion are disposed on the first film layer 21. The orthographic projection of the first connecting portion on the substrate 10 is located on the side of the orthographic projection of the second connecting portion on the substrate 10 closer to the display area. A second sub-layer 222 is disposed on the second connecting portion. The second sub-layer 222, the second connecting portion, and the portion of the first film layer 21 covered by the second connecting portion form the second sub-part 20b, and the first connecting portion and the portion of the first film layer 21 covered by the first connecting portion form the first sub-part 20a.

[0126] Step S22a: Please refer to Figure 12 A large amount of organic ink is printed on the first inorganic encapsulation layer 31 to form an organic encapsulation layer 32. The orthographic projection of the second sub-part 20b on the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 on the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the second sub-part 20b.

[0127] Step S23: Please refer to Figure 13 A second inorganic encapsulation layer 33 is formed on the first inorganic encapsulation layer 31. The second inorganic encapsulation layer 33 covers the organic encapsulation layer 32, the first sub-part 20a, and the second sub-part 20b.

[0128] Optional, please refer to Figure 14 The orthographic projection of the first sub-part 20a onto the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 onto the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the first sub-part 20a.

[0129] In this embodiment, the organic encapsulation layer 32 is relatively thin, and the first sub-part 20a is sufficient to prevent ink overflow from the organic encapsulation layer 32. The second sub-part 20b is used to prevent further outward overflow of the organic encapsulation layer 32.

[0130] The display panel 100 of this application also includes a fourth manufacturing method, the difference between the fourth manufacturing method and the third manufacturing method being step S22a.

[0131] The fourth method of manufacturing the display panel 100 in this application includes:

[0132] Step 22b: Please refer to Figure 15 An appropriate amount of organic ink is printed on the first inorganic encapsulation layer 31 to form an organic encapsulation layer 32. The orthographic projection of the second sub-part 20b on the substrate 10 is located outside the orthographic projection of the organic encapsulation layer 32 on the substrate 10. The thickness of the organic encapsulation layer 32 is less than the thickness of the second sub-part 20b.

[0133] In the fourth manufacturing method of the display panel 100, the addition of only a suitable amount of organic ink makes it difficult for the organic encapsulation layer 32 to overflow, thereby improving the encapsulation effect of the display panel 100. In the third manufacturing method of the display panel 100, the addition of a large amount of organic ink can improve the overall flexibility and bending performance of the encapsulation layer of the display panel 100.

[0134] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area located on at least one side of the display area. substrate; A barrier structure, located in the non-display area, includes a first film layer and a second film layer. The first film layer is disposed on the substrate, and the second film layer is disposed on the substrate and continuously covers the first film layer. An organic encapsulation layer, at least a portion of which is located in the display area and disposed on the substrate; The barrier structure includes a first sub-part and a second sub-part connected to each other. The thickness of the first sub-part is less than the thickness of the second sub-part. The first sub-part includes a portion of the first film layer and a portion of the second film layer. The second sub-part includes another portion of the first film layer and another portion of the second film layer. The orthographic projection of the second sub-part on the substrate is located outside the orthographic projection of the organic encapsulation layer on the substrate. The first sub-part is located on the side of the second sub-part closer to the display area.

2. The display panel as described in claim 1, characterized in that, The first film layer includes a first sub-block and a second sub-block that are spaced apart. The first sub-block is located on the side of the second sub-block that is closer to the display area. The second film layer continuously covers the first sub-block and the second sub-block. The first sub-block and the portion of the second film layer disposed on the first sub-block form the first sub-part, and the second sub-block and the portion of the second film layer disposed on the first sub-block form the second sub-part.

3. The display panel as described in claim 2, characterized in that, The thickness of the first sub-block is less than the thickness of the second sub-block.

4. The display panel as described in claim 2, characterized in that, The thickness of the first sub-block is equal to the thickness of the second sub-block; The second film layer includes: A first sublayer is disposed on the substrate and continuously covers the first sub-block and the second sub-block; and The second sub-layer is located on top of the first sub-layer; The orthographic projection of the second sub-block on the substrate is located within the range of the orthographic projection of the second sub-layer on the substrate, and the orthographic projection of the first sub-block on the substrate is located outside the orthographic projection of the second sub-layer on the substrate; The first sub-block and the portion of the first sub-layer disposed on the first sub-block form the first sub-part, and the second sub-block, the portion of the first sub-layer disposed on the second sub-block, and the second sub-layer form the second sub-part.

5. The display panel as described in claim 4, characterized in that, The first portion of the first sub-layer is disposed on the side of the first sub-block near the second sub-block, the second portion of the first sub-layer is disposed on the substrate and located between the first sub-block and the second sub-block, and the third portion of the first sub-layer is disposed on the side of the second sub-block near the first sub-block. Wherein, the first part of the first sub-layer, the second part of the first sub-layer and the third part of the first sub-layer are connected to form a recessed portion, and the first sub-part and the second sub-part are connected through the recessed portion; The recessed portion connects the portion of the first sub-layer disposed on the first sub-block and the portion of the first sub-layer disposed on the second sub-block.

6. The display panel as described in claim 2, characterized in that, The distance between the first sub-block and the second sub-block is in the range of 20 micrometers to 40 micrometers; The cross-sectional width of the first sub-block is in the range of 10 micrometers to 30 micrometers; The cross-sectional width of the second sub-block is in the range of 10 micrometers to 30 micrometers.

7. The display panel as described in claim 1, characterized in that, The first film layer is continuously disposed on the substrate; The second film layer includes: A first sublayer, disposed on the substrate and located in the non-display area, continuously covers the first film layer. The first sublayer includes a first connecting portion and a second connecting portion connected to each other. The first connecting portion and the second connecting portion are disposed on the first film layer. The orthographic projection of the first connecting portion on the substrate is located on the side of the orthographic projection of the second connecting portion on the substrate closer to the display area. The second sub-layer is disposed on the second connecting part; The second sub-layer, the second connecting portion, and the portion of the first film layer covered by the second connecting portion form the second sub-part, and the first connecting portion and the portion of the first film layer covered by the first connecting portion form the first sub-part.

8. The display panel as described in claim 7, characterized in that, The cross-sectional width of the first membrane layer is in the range of 60 micrometers to 80 micrometers; The cross-sectional width of the first sublayer is in the range of 90 to 110 micrometers; The cross-sectional width of the second sublayer is in the range of 30 to 50 micrometers.

9. The display panel as described in any one of claims 1-8, characterized in that, The thickness of the first sub-part is in the range of 2 micrometers to 7 micrometers; The thickness of the second sub-part is in the range of 3 micrometers to 8 micrometers.

10. The display panel as claimed in any one of claims 1-8, characterized in that, The orthographic projection of the first sub-part on the substrate is located outside the orthographic projection of the organic encapsulation layer on the substrate; The thickness of the organic encapsulation layer is less than the thickness of the first sub-part.

11. The display panel as claimed in any one of claims 1-8, characterized in that, The display panel also includes: A first inorganic encapsulation layer is disposed on the substrate and covers the first sub-part and the second sub-part; the organic encapsulation layer is disposed on the first inorganic encapsulation layer; and A second inorganic encapsulation layer is disposed on the first inorganic encapsulation layer and covers the organic encapsulation layer, the first sub-part, and the second sub-part.

12. A display device, characterized in that, The display device includes a display panel as claimed in any one of claims 1-11.

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