Photoresistor supply device and photoresist accommodating device

Abstract

The utility model provides a photoresist supply device and a photoresist accommodating device, and the photoresist supply device comprises a first container used for accommodating a photoresist, and the photoresist flows out of the first container based on the pressure change of the surface of the first container; the second container is used for containing the first container, a gas space is arranged between the second container and the first container, and the pressure of the surface of the first container changes based on the pressure change of the gas space. According to the photoresist supply device and the photoresist accommodating device provided by the utility model, the photoresist supply device comprises the first container for accommodating the photoresist and the second container for accommodating the first container, and the pressure of the surface of the first container is changed by changing the pressure of the gas space between the second container and the first container; thus, the photoresist flows out of the first container, crystals and bubbles are prevented from being generated in the supply process of the photoresist, and the performance and yield of semiconductor products are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a photoresist supply device and a photoresist receiving device. Background Technology

[0002] Photoresist is a chemical material widely used in semiconductor manufacturing. Its main function is to control light transmission in photolithography, used to manufacture microchips and electronic components. During photolithography, photoresist protects specific areas of the chip surface from chemical corrosion or physical damage. Simultaneously, it allows for the formation of specific patterns on the photoresist layer using photolithography, transferring the circuit design of the chip onto the photoresist layer.

[0003] Photoresist is composed of film-forming agents, photosensitizers, solvents, additives, and other auxiliary chemicals. In current photoresist applications, high-viscosity photoresist is prone to crystallization and bubble formation, affecting its quality and consequently impacting the performance and yield of semiconductor products. Utility Model Content

[0004] Therefore, it is necessary to provide a photoresist bottle and photoresist supply device to address the problems mentioned above in the background technology, which can at least prevent the photoresist from crystallizing and forming bubbles, thereby improving the performance and yield of semiconductor products.

[0005] To achieve the above and other related objectives, one aspect of this application provides a photoresist supply device, comprising:

[0006] A first container is used to hold photoresist, and the photoresist flows out of the first container based on the pressure change on the surface of the first container;

[0007] A second container is provided to contain the first container, and a gas space is provided between the second container and the first container. The pressure on the surface of the first container changes based on the pressure change of the gas space.

[0008] In one embodiment, the second container is detachably connected to the first container, the second container having an opening through which the first container is placed into or removed from the second container.

[0009] In one embodiment, the photoresist supply device further includes a conduit connected to the first container, through which the photoresist in the first container flows out.

[0010] In one embodiment, the conduit is provided with a liquid valve, which prevents the photoresist from flowing out of the conduit when closed.

[0011] In one embodiment, the first container, the conduit, and the liquid valve are an integrated structure.

[0012] In one embodiment, the photoresist supply device further includes a pressure regulating device for changing the pressure of the gas space between the second container and the first container.

[0013] In one embodiment, the photoresist supply device further includes a pressure sensor for acquiring the pressure value of the gas space between the second container and the first container.

[0014] In one embodiment, the photoresist supply device further includes a temperature controller for adjusting the temperature of the gas supplied into the gas space between the second container and the first container.

[0015] In one embodiment, the photoresist supply device further includes a supply line connected to the first container and disposed below the first container so that the photoresist is delivered into the supply line under gravity.

[0016] This utility model also provides a photoresist containing device, comprising:

[0017] A deformable container for containing photoresist, which flows out of the deformable container based on pressure changes on its surface.

[0018] The photoresist supply device and photoresist container provided by this utility model include a first container for containing photoresist and a second container for containing the first container. By changing the pressure of the gas space between the second container and the first container, the pressure on the surface of the first container changes, thereby causing the photoresist to flow out of the first container. This avoids crystallization and bubbles during the photoresist supply process, and improves the performance and yield of semiconductor products. Attached Figure Description

[0019] To better describe and illustrate embodiments and / or examples of the applications disclosed herein, reference may be made to one or more accompanying drawings. Additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, the embodiments and / or examples currently described, or the best mode of conduct of these applications as currently understood.

[0020] Figure 1 This is a schematic diagram of the structure of a photoresist supply device in the prior art;

[0021] Figure 2 This is a schematic diagram of the photoresist supply device provided in one embodiment;

[0022] Figure 3 This is a schematic diagram of the structure of a photoresist accommodating device provided in one embodiment.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100. Photoresist; 101. Photoresist bottle; 102. Conduit; 103. Connector; 104. Supply line; 105. Machine base; 106. Pressure regulating device; 201. First container; 202. Second container; 203. Gas space; 204. Liquid valve; 205. Pressure sensor; 206. Temperature controller; 301. Deformable container. Detailed Implementation

[0025] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0028] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Although the illustrations only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation, the form, quantity and proportion of each component in the actual implementation can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] Photoresist is a high-viscosity solution composed of film-forming agents, photosensitizers, solvents, additives, and other auxiliary chemicals. Currently, photoresist is typically packaged in photoresist bottles. During transportation, the photoresist can slosh around inside the bottle, splashing onto the cap and neck area, easily causing crystallization. These crystals can then fall into the photoresist, causing contamination and consequently affecting the performance and yield of semiconductor products. Furthermore, in the current use of photoresist, such as... Figure 1 As shown, the cap of the photoresist bottle 101 is usually opened, and the conduit 102 is placed below the liquid surface of the photoresist 100 in the photoresist bottle 101. The conduit 102 is connected to the supply line 104 through the connector 103 to supply the photoresist 100 to the machine 105. Since the supply line 104 is usually located above the photoresist bottle 101, in order for the photoresist 100 to enter the conduit 102 and the supply line 104, the gas space above the liquid surface of the photoresist 100 in the photoresist bottle 101 needs to be pressurized by the pressure regulating device 106. As the gas pressure increases, the photoresist 100 in the photoresist bottle 101 is forced into the conduit 102 and the supply line 104 to supply the photoresist 100 to the machine 105.

[0030] However, in the above process, the gas used for pressurization comes into direct contact with the photoresist, which easily causes bubbles to form within the photoresist 100. Uneven coating of the photoresist containing bubbles leads to uneven exposure areas in the photolithography process, reducing photolithography accuracy and consequently lowering the performance and yield of the generated semiconductor products. Furthermore, as the photoresist 100 is used, its liquid level continuously decreases. The photoresist 100 adhering to the mouth and sidewalls of the photoresist bottle 101 gradually loses water and crystallizes. These crystals easily fall into the photoresist below, resulting in uneven coating of the crystallized photoresist. This leads to uneven exposure areas and incomplete ashing in the photolithography process, reducing photolithography accuracy and consequently lowering the performance and yield of the generated semiconductor products.

[0031] To address the above problems, this utility model provides a photoresist supply device, such as... Figure 2 As shown, it includes:

[0032] A first container 201 is used to contain photoresist 100, and the photoresist flows out of the first container based on the pressure change on the surface of the first container;

[0033] The second container 202 is used to contain the first container 201. A gas space 203 is provided between the second container and the first container. The pressure on the surface of the first container changes based on the pressure change of the gas space.

[0034] For example, the photoresist supply device further includes a conduit 102 connected to the first container 201, through which the photoresist 100 in the first container 201 flows out. A liquid valve 204 is provided on the conduit 102, which prevents the photoresist 100 from flowing out when closed. The first container 201, the conduit 102, and the liquid valve 204 are an integral, non-removable structure.

[0035] In one embodiment, the first container 201 for containing the photoresist 100 is filled with the photoresist 100, therefore the first container 201 does not contain a gas space. Furthermore, the conduit 102 is integrally connected to the first container 201, and the first container 201 does not contain any other openings or channels. Therefore, the conduit 102 is the only channel connecting the interior of the first container 201 to the outside. The conduit 102 is only used to discharge the photoresist 100; gas cannot enter the interior of the first container 201 through the conduit 102, thus achieving isolation between the interior of the first container 201 and the outside gas. During storage in the first container 201 and during discharge through the conduit 102, the photoresist 100 is prevented from contacting the outside gas, thereby preventing the formation of bubbles within the photoresist 100 and preventing dehydration and crystallization of the photoresist 100 in the first container 201, ensuring the quality of the photoresist 100.

[0036] In one embodiment, a liquid valve 204 is provided on the conduit 102. When the liquid valve 204 is closed, the photoresist 100 is stored in the first container 201 and the conduit 102, and is not in contact with external gas. When the liquid valve 204 is open, the photoresist 100 in the first container 201 flows out unidirectionally through the conduit 102. As the photoresist 100 flows out, the shape of the first container 201 changes, and the volume of the first container 201 gradually decreases as the photoresist 100 flows out. When the photoresist 100 has completely flowed out, the volume of the first container 201 reaches its minimum, at which point the internal space of the first container 201 is close to zero.

[0037] In one embodiment, the first container 201 is a deformable container, typically made of a flexible material, including but not limited to flexible materials with extensibility and flexible materials without extensibility. Flexible materials with extensibility include, but are not limited to, rubber and plastics, while flexible materials without extensibility include, but are not limited to, plastic films and paper materials. For example, when the first container 201 is made of rubber, the first container 201 itself can deform. The deformed rubber has an inward contraction force, so the photoresist can flow out of the first container without pressurizing the gas space 203. When the rubber regains its extensibility, pressure needs to be applied to the surface of the rubber, such as squeezing or folding the rubber, to allow the photoresist to flow out of the first container. When the first container 201 is made of plastic film, it is usually made in a bag shape. Since the plastic film itself is not extensible, external pressure needs to be applied to the surface of the plastic film, such as squeezing or folding the plastic film, to change the shape of the first container and allow the photoresist to flow out.

[0038] In one embodiment, since the first container 201 is in direct contact with the photoresist, which is a solution composed of various chemicals, the first container 201 must be made of a material that will not react with the photoresist. Furthermore, due to the complex environment of semiconductor processes, involving various reaction temperatures and gases, the first container 201 is typically made of a high-temperature resistant and corrosion-resistant material.

[0039] In one embodiment, the second container 202 is typically made of a rigid material. Rigid materials lack ductility, so when the pressure inside the second container 202 changes, it will not deform due to its own ductility, such as swelling or bulging. Furthermore, the material used to make the second container 202 should have a certain degree of pressure resistance to prevent damage due to changes in internal pressure, such as bursting or rupture. Additionally, to facilitate visual observation of the photoresist application in the first container 201, the second container 202 is typically made of a transparent material. Specifically, the materials used to make the second container 202 include, but are not limited to, glass and rigid plastics.

[0040] In one embodiment, the volume of the second container 202 (i.e., the outer container) used to contain the first container 201 (i.e., the inner bottle) is larger than the volume of the first container 201, so as to form a gap between the second container 202 and the first container 201. The gap between the second container 202 and the first container 201 can be filled with gas or liquid. Taking the gap between the second container 202 and the first container 201 as a gas space 203 as an example, the pressure on the surface of the first container 201 can be changed by changing the gas volume of the gas space 203. For example, gas can be introduced to increase the pressure on the surface of the first container 201, so that the photoresist in the first container 201 is discharged. When the gas volume in the gas space 203 remains unchanged or decreases, the pressure on the surface of the first container 201 decreases, and at this time the photoresist in the first container 201 stops being discharged.

[0041] In one embodiment, due to the complex environment of semiconductor processes, which involves various reaction temperatures and reaction gases, the gas introduced into the gas space 203 is usually a chemically stable gas, such as nitrogen or argon, to avoid the gas from exploding at high temperatures or reacting with the gas in the production environment.

[0042] For example, the second container 202 is detachably connected to the first container 201. The second container 202 has an opening through which the first container 201 is placed or removed. Furthermore, the second container 202 also includes a stopper to seal the opening, thereby creating a sealed space 203 between the second container 202 and the first container 201.

[0043] In one embodiment, refer to Figure 2 As shown, the second container 202 can be a fixed device, while the first container 201 containing the photoresist 100 is a movable device. Specifically, a first container 201 containing the photoresist 100 is inserted into the second container 202 through an opening on the second container 202. The second container 202 and the first container 201 are detachably connected. Then, the opening of the second container 202 is sealed with a stopper to form a sealed gas space 203 between the second container 202 and the first container 201. The conduit 102 connected to the first container 201 passes through the stopper and is tightly connected to the stopper, ensuring that the gas space 203 between the second container 202 and the first container 201 is a sealed space and that there is no leakage between the stopper and the second container 202, or between the stopper and the conduit 102. When the photoresist 100 in the first container 201 is used up, the stopper is opened, the first container 201 is removed from the second container 202 and taken out of the opening, and then a new first container is placed into the second container 202 and detachably connected to the second container 202. In this way, the second container 202 can be reused, reducing costs.

[0044] For example, the photoresist supply device further includes a supply line 104 connected to the first container 201 and disposed below the first container 201 so that the photoresist 100 is delivered into the supply line 104 under the action of gravity.

[0045] exist Figure 1 In the prior art shown, the supply pipe 104 is positioned above the photoresist bottle 101, and the photoresist 100 flows upward into the supply pipe 104. Therefore, photoresist 100 residue is easily generated inside the photoresist bottle 101, resulting in waste. In the embodiments of this application, such as... Figure 2 As shown, the supply line 104 is located below the first container 201. Therefore, even without pressurizing the gas space 203 between the second container 202 and the first container 201, the photoresist 100 can be delivered into the supply line 104 under gravity to supply the machine 105. By inverting the first container 201 and the second container 202, and positioning the supply line 104 below the first container 201, the photoresist in the first container 201 can be fully utilized, avoiding residue and waste. Furthermore, a connector 103 is provided at the end of the supply line 104. The conduit 102 of the first container 201 is connected to the connector 103 at the end of the supply line 104, which avoids direct contact between the connector 103 and the photoresist 100, thereby preventing crystal formation at the connector 103 and contamination of the photoresist 100.

[0046] For example, the photoresist supply device further includes a pressure regulating device 106 for changing the pressure of the gas space 203 between the second container 202 and the first container 201. Furthermore, the photoresist supply device also includes a pressure sensor 205 for acquiring the pressure value of the gas space 203 between the second container 202 and the first container 201.

[0047] In one embodiment, the pressure regulating device 106 employs a gas pressurizing device to introduce gas into the gas space 203 between the second container 202 and the first container 201. After the second container 202 is detachably connected to the first container 201 and the opening of the second container 202 is sealed with a stopper, the pressure regulating device 106 is turned on, and nitrogen gas is introduced into the gas space 203 between the second container 202 and the first container 201. As the amount of nitrogen increases, the gas pressure in the gas space 203 increases. The shape of the second container 202 remains unchanged, while the shape of the first container 201 changes under pressure. The photoresist 100 in the first container 201 is squeezed and flows out through the conduit 102 below the first container 201, and is sent into the supply line 104 below the first container 201 to supply photoresist 100 to the machine 105. Furthermore, the flow rate of the photoresist 100 flowing out of the first container 201 can be controlled by controlling the flow rate of the gas introduced into the gas space 203. For example, when a large amount of photoresist 100 needs to be supplied to the machine 105, the pressure regulating device 106 can quickly introduce nitrogen gas to rapidly pressurize the surface of the first container 201.

[0048] In one embodiment, by installing a pressure sensor 205 in the gas space 203, pressure changes in the gas space 203 can be accurately monitored. The pressure sensor 205 can be a wind speed pressure sensor. Furthermore, by linking the pressure sensor 205 with a pressure regulating device 106, pressure control of the gas space 203 can be achieved. For example, when the pressure value acquired by the pressure sensor 205 decreases, the pressure regulating device 106 increases the gas flow rate; when the pressure value acquired by the pressure sensor 205 increases, the pressure regulating device 106 decreases the gas flow rate. By controlling the pressure of the gas space 203 within a certain range, a uniform supply of photoresist 100 can be achieved.

[0049] For example, the photoresist supply device further includes a temperature controller 206 for regulating the temperature of the gas supplied into the gas space 203 between the second container 202 and the first container 201. By maintaining the temperature of the gas supplied into the gas space 203 within a certain range, the influence of the semiconductor process ambient temperature is avoided, thereby ensuring the quality of the photoresist 100. The temperature range of nitrogen gas includes 20°C to 25°C, for example, 20°C, 23°C, and 25°C, wherein the quality of the photoresist 100 is better when the temperature range of nitrogen gas is controlled at approximately 23°C.

[0050] The photoresist supply device provided by this utility model includes a first container for containing photoresist and a second container for containing the first container. By changing the pressure of the gas space between the second container and the first container, the pressure on the surface of the first container changes, thereby causing the photoresist to flow out of the first container. This avoids crystallization and bubbles during the photoresist supply process, and improves the performance and yield of semiconductor products.

[0051] This utility model also provides a light resist containing device, such as Figure 3 As shown, it includes:

[0052] A deformable container 301 is used to contain photoresist 100, which flows out of the deformable container based on pressure changes on the surface of the deformable container.

[0053] Exemplarily, the photoresist supply device also includes a conduit 102 connected to the deformable container 301, through which the photoresist 100 contained in the deformable container 301 flows out. A liquid valve 204 is provided on the conduit 102, which prevents the photoresist 100 from flowing out of the conduit 102 when closed. The deformable container 301, the conduit 102, and the liquid valve 204 are a non-detachable integrated structure.

[0054] In one embodiment, the deformable container 301 for containing the photoresist 100 is filled with the photoresist 100, therefore the deformable container 301 does not contain a gas space. Furthermore, the conduit 102 is connected to the deformable container 301, and the deformable container 301 does not contain any other openings or channels. Therefore, the conduit 102 is the only channel connecting the interior of the deformable container 301 to the outside. The conduit 102 is only used to discharge the photoresist 100, so gas cannot enter the interior of the deformable container 301 through the conduit 102, achieving isolation between the interior of the deformable container 301 and the outside gas. During storage in the deformable container 301 and during discharge through the conduit 102, the photoresist 100 is prevented from contacting the gas, thereby preventing the formation of bubbles within the photoresist 100 and preventing dehydration and crystallization of the photoresist 100, thus ensuring the quality of the photoresist 100.

[0055] In one embodiment, a liquid valve 204 is provided on the conduit 102. When the liquid valve 204 is closed, the photoresist 100 is stored in the deformable container 301 and the conduit 102, and does not come into contact with the gas. When the liquid valve 204 is open, the photoresist 100 in the deformable container 301 flows out unidirectionally through the conduit 102. As the photoresist 100 flows out, the shape of the deformable container 301 changes, and the volume of the deformable container 301 gradually decreases as the photoresist 100 flows out. When the photoresist 100 has completely flowed out, the volume of the deformable container 301 reaches its minimum, at which point the internal space of the deformable container 301 is close to zero.

[0056] In one embodiment, the deformable container 301 is typically made of a flexible material, including but not limited to flexible materials with extensibility and flexible materials without extensibility. Flexible materials with extensibility include, but are not limited to, rubber and plastics, while flexible materials without extensibility include, but are not limited to, plastic films and paper materials. For example, when the deformable container 301 is made of rubber or plastic film, it can be made into a bottle or bag shape. When external pressure is applied to the surface of the deformable container 301, such as by squeezing or folding it, the shape of the deformable container 301 changes, allowing photoresist to flow out from it.

[0057] In one embodiment, since the deformable container 301 is in direct contact with the photoresist, which is a solution composed of various chemicals, the deformable container 301 should be made of a material that will not react with the photoresist. Furthermore, due to the complex environment of semiconductor processes, involving various reaction temperatures and gases, the deformable container 301 should be made of a high-temperature resistant and corrosion-resistant material.

[0058] The photoresist containing device provided by this utility model includes a deformable container for containing photoresist. By changing the pressure on the surface of the deformable container, the shape of the deformable container changes, and the photoresist flows out from the deformable container, avoiding crystallization and bubbles during the photoresist supply process, thereby improving the performance and yield of semiconductor products.

[0059] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on this application.

[0060] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A photoresist supply device, characterized in that, include: A first container is used to hold photoresist, and the photoresist flows out of the first container based on the pressure change on the surface of the first container; A second container is provided to contain the first container, and a gas space is provided between the second container and the first container. The pressure on the surface of the first container changes based on the pressure change of the gas space.

2. The photoresist supply device according to claim 1, characterized in that, The second container is detachably connected to the first container, and the second container is provided with an opening through which the first container is placed into or removed from the second container.

3. The photoresist supply device according to claim 1, characterized in that, It also includes a conduit connected to the first container, through which the photoresist in the first container flows out.

4. The photoresist supply device according to claim 3, characterized in that, The conduit is equipped with a liquid valve, which prevents the photoresist from flowing out of the conduit when the liquid valve is closed.

5. The photoresist supply device according to claim 4, characterized in that, The first container, the conduit, and the liquid valve are an integrated structure.

6. The photoresist supply device according to claim 1, characterized in that, Also includes: A pressure regulating device is used to change the pressure of the gas space between the second container and the first container.

7. The photoresist supply device according to claim 6, characterized in that, Also includes: A pressure sensor is used to acquire the pressure value of the gas space between the second container and the first container.

8. The photoresist supply device according to claim 7, characterized in that, Also includes: A temperature controller is used to regulate the temperature of the gas fed into the gas space between the second container and the first container.

9. The photoresist supply device according to claim 7, characterized in that, Also includes: A supply line is connected to the first container and is positioned below the first container so that the photoresist is delivered into the supply line under the influence of gravity.

10. A photoresist containing device, characterized in that, include: A deformable container for containing photoresist, which flows out of the deformable container based on pressure changes on its surface.

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