Double-bonding-head double-station multi-mode feeding and discharging die bonding equipment

Abstract

The utility model discloses a double-bonding-head double-station multi-mode feeding and discharging die bonding device which is provided with a die bonding device body, and the front side of the outer surface of the die bonding device body is provided with a feeding mechanism. Comprising a material stacking and feeding set which is slidably connected to the upper middle side of the inner surface of a feeding mechanism, PCBs are evenly placed on the upper surface of the material stacking and feeding set, a jacking frame is slidably connected to the inner surface of the feeding mechanism in a penetrating mode, and meanwhile a magnetic plate is telescopically connected to the upper surface of the feeding mechanism. According to the double-bonding-head double-station multi-mode feeding and discharging die bonding equipment, the feeding mechanism convenient to assemble is arranged and matched with the material stacking and feeding set, stable conveying is formed for PCBs, the requirements that in the COB subdivision field, LED products are larger in size compatibility, high in productivity and capable of being compatible with multiple feeding and discharging modes are met, and the production efficiency is improved. And meanwhile, the feeding platform mode meets the requirement that a professional jig is not required to be replaced when most products are switched, and only the track width, the pressing block and the like need to be adjusted.

Description

Technical Field

[0001] This utility model relates to the technical field of loading and unloading die bonding equipment, specifically a dual-head, dual-station, multi-mode loading and unloading die bonding equipment. Background Technology

[0002] With the mature development of LED flip chip packaging technology, its subdivided COB process has an increasingly larger market share and more product types. The market has placed higher demands on product size compatibility, production capacity, and the time required for product and line changes. In addition, the corresponding feeding processes are different for high-end, mid-range, and low-end products, which puts higher demands on the die bonding equipment in the chip mounting section. During use, its working output is low, the compatible size is limited, and it is not convenient to be compatible with flip chip equipment with multiple feeding and unloading modes.

[0003] To overcome the aforementioned shortcomings, the existing technology (Chinese patent application number CN202011367089.7, application date 2020-11-29) provides an LED high-speed die bonding equipment and its automatic loading and unloading device. This device uses a primary motor to drive a corresponding lead screw and slider pair, which works in conjunction with a primary electric push rod to move the injection unit, thus completing the dispensing process. Then, another primary motor drives a corresponding lead screw and slider pair, which works in conjunction with a secondary electric push rod to move the injection unit, thus completing the chip placement process. This allows the invention to simultaneously fix multiple chips, achieving the effect of simultaneous die bonding and improving LED die bonding efficiency, thereby increasing LED production efficiency. While the existing technology can achieve automatic loading and unloading, it has limitations in terms of product size compatibility and only one loading / unloading mode: stacked loading and box receiving, or box loading and box receiving. For larger compatible sizes, only single-head machines are currently available, resulting in lower capacity and a relatively simple loading / unloading mode. Furthermore, different fixtures are required to switch between different product sizes.

[0004] To address the aforementioned issues, there is an urgent need for innovative design based on the existing material handling and die bonding equipment. Utility Model Content

[0005] The purpose of this utility model is to provide a dual-head, dual-station, multi-mode loading and unloading die bonding equipment to solve the problems mentioned in the background art, such as the small product size compatibility during operation, the single feeding and unloading mode, stacked feeding and box receiving, or box feeding and box receiving. If the compatible size is larger, there is only a single-head machine, but the capacity is low and the loading and unloading mode is relatively simple. In addition, for products of different sizes, corresponding fixtures are required to switch operations.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a dual-head, dual-station, multi-mode die bonding equipment, comprising a die bonding equipment body, and a feeding mechanism on the front side of the outer surface of the die bonding equipment body; including: a stacked feeding group, slidably connected to the upper side of the inner surface of the feeding mechanism, with PCB boards evenly placed on the upper surface of the stacked feeding group, and a lifting frame slidably connected through the inner surface of the feeding mechanism, while a magnetic plate is telescopically connected to the upper surface of the feeding mechanism, and a control valve is installed on the outer surface of the magnetic plate, and an adsorption head is connected to the lower surface of the magnetic plate; a feeding platform, installed in the middle section of the inner surface of the die bonding equipment body, with a longitudinal moving plate slidably connected to the upper surface of the feeding platform, and a transverse moving plate slidably connected to the upper surface of the longitudinal moving plate, while a feeding fixture track is installed on the left side of the upper surface of the transverse moving plate, and a feeding fixture track is connected to the right side of the upper surface of the transverse moving plate, and a rotating shaft is rotatably connected to the inner surface of the longitudinal moving plate, and the rotating shaft slides through the right feeding fixture track.

[0007] Preferably, the stacking and feeding group and the feeding mechanism form a limiting sliding structure, and the feeding mechanism and the lifting structure form a lifting structure. Furthermore, the feeding mechanism and the adsorption head form an adsorption structure through a magnetic plate and a control valve.

[0008] The above structure allows for stable control of the position of the stacked material group during use, and can be used in conjunction with the adsorption head.

[0009] Preferably, a support platform is slidably connected to the upper section of the upper surface of the feeding mechanism, and a movable component is slidably connected to the side of the outer surface of the feeding mechanism. A push rod is installed on the outer surface of the movable component. At the same time, a material box feeding group is provided on the outer surface of the feeding mechanism, and a lifting mechanism is connected to the middle section of the inner surface of the feeding mechanism. The feeding mechanism and the support platform form a translation structure, and the feeding mechanism forms a pushing structure through the movable component and the push rod. The feeding mechanism and the material box feeding group form a nested structure, and the material box feeding group and the lifting mechanism form a lifting structure.

[0010] With the above structure, the lifting mechanism can be effectively controlled during use, and the push rod of the moving parts assembly can be driven to adjust the PCB board conveying position, thereby improving the stability of use.

[0011] Preferably, the die bonding equipment body forms a multi-axis sliding structure through a feeding platform and a longitudinal moving plate and a transverse moving plate, and the transverse moving plate forms an integrated structure with the left feeding fixture track, and the right feeding fixture track forms a sliding structure with the transverse moving plate. At the same time, the right feeding fixture track forms a through-limiting rotation structure with a synchronous wheel and a rotating shaft.

[0012] The above structure facilitates stable multi-axis adjustment during use, and, in conjunction with the right and left feeding fixture tracks, controls the stability of the PCB board.

[0013] Preferably, the inner surface of the feeding fixture track is connected to a rotating shaft, and the outer surface of the rotating shaft is rotatably connected to a synchronous belt. A pressure block is installed on the upper surface of the feeding fixture track, and a cylinder is installed on the upper surface of the longitudinal moving plate. A lifting plate is telescopically connected to the upper surface of the cylinder, and a top bar is installed on the upper surface of the lifting plate. The feeding fixture track and the rotating shaft form a limiting rotation structure, and the rotating shaft forms a conveying structure via a synchronous wheel and a synchronous belt. The feeding fixture track and the pressure block form a sliding limiting structure, and the longitudinal moving plate forms a lifting structure via a cylinder, the lifting plate, and the top bar. The lifting plate and the right-side feeding fixture track form a sliding structure.

[0014] With the above structure, the synchronous belt and pressure block are effectively controlled during use to form an effective adjustable conveyor for the PCB board, and the lifting plate is used to adjust the height of the PCB board.

[0015] Preferably, a left wafer assembly and a right wafer assembly are respectively assembled on the left and right sides of the upper surface of the die bonding equipment body, and a double dispensing assembly is provided on the rear side of the outer surface of the left wafer assembly, and a pin assembly is connected to the rear side of the double dispensing assembly. At the same time, a receiving platform unloading assembly is connected to the rear side of the outer surface of the die bonding equipment body. The die bonding equipment body, the left wafer assembly, and the right wafer assembly form a symmetrical feeding arrangement, and the left wafer assembly and the right wafer assembly respectively form a dispensing structure with the double dispensing assembly. The die bonding equipment body and the receiving platform unloading assembly form a discharging structure.

[0016] The above structure effectively improves the stability of the device during use. It works in conjunction with the left and right wafer groups and the dual dispensing group to transfer and dispense PCB boards, and to receive and discharge materials through the connecting platform unloading group.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. This dual-head, dual-station, multi-mode loading and unloading die bonding equipment is equipped with an easy-to-assemble loading mechanism and, together with the stacked loading group, forms a stable conveying of PCB boards. It also meets the requirements of LED products in the COB sub-field with greater product size compatibility, high capacity, and compatibility with multiple loading and unloading modes. At the same time, the feeding platform mode meets the requirement that most product switching does not require the replacement of professional fixtures, only the adjustment of track width and pressure blocks, etc.

[0019] 2. This dual-head, dual-station, multi-mode die bonding equipment is equipped with push rods for easy loading at different positions. It can simultaneously load both the stack loading group and the box loading group. Through the assembled lifting mechanism, it controls the loading or unloading of the box loading groups at different heights. It also forms a transfer system through the feeding platform and transports the materials to the left and right wafer groups. After controlling the double dispensing group and the ejector pin group to work together, it forms an unloading system through the docking station. In use, it can improve the expandability of the die bonding equipment. Different groups of loading, transfer, and unloading components can be set according to customer requirements. It can be used as a standalone machine, or it can control the movement of the PCB board in a forward-forward and forward-outward mode. It can also be used continuously, with a forward-forward and backward-outward mode to control different working states. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the die bonding device body of this utility model;

[0021] Figure 2 This is a schematic diagram of the internal three-dimensional structure of the die bonding device body of this utility model;

[0022] Figure 3 This is a three-dimensional structural diagram of the die bonding equipment body of this utility model.

[0023] Figure 4 This is a three-dimensional structural diagram of the feeding mechanism of this utility model;

[0024] Figure 5 This is a three-dimensional structural diagram of the feeding platform of this utility model.

[0025] In the diagram: 1. Die bonding equipment body; 2. Feeding mechanism; 3. Stacking feeding group; 4. PCB board; 5. Lifting frame; 6. Magnetic plate; 7. Control valve; 8. Adsorption head; 9. Support platform; 10. Moving parts; 11. Push rod; 12. Material box feeding group; 13. Lifting mechanism; 14. Feeding platform; 15. Longitudinal moving plate; 16. Lateral moving plate; 17. Feeding fixture track; 18. Rotary shaft; 19. Synchronous belt; 20. Pressure block; 21. Cylinder; 22. Lifting plate; 23. Top bar; 24. Left wafer group; 25. Right wafer group; 26. Double dispensing group; 27. Ejector pin group; 28. Connecting table unloading group. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-5 This utility model provides a technical solution: a dual-head, dual-station, multi-mode die bonding equipment, comprising a die bonding equipment body 1, and a feeding mechanism 2 on the front side of the outer surface of the die bonding equipment body 1; including: a stacked feeding group 3, slidably connected to the upper side of the inner surface of the feeding mechanism 2, with PCB boards 4 evenly placed on the upper surface of the stacked feeding group 3, and a lifting frame 5 slidably connected through the inner surface of the feeding mechanism 2; a magnetic plate 6 is telescopically connected to the upper surface of the feeding mechanism 2, and a control valve 7 is installed on the outer surface of the magnetic plate 6; and an adsorption head 8 is connected to the lower surface of the magnetic plate 6; the stacked feeding group 3 and the feeding mechanism 2 form a limiting sliding structure, and the feeding mechanism 2 and the lifting frame 5 form a lifting mechanism. The feeding mechanism 2 has a lowering structure, and the feeding mechanism 2 forms an adsorption structure with the adsorption head 8 through the magnetic plate 6 and the control valve 7; the upper section of the upper surface of the feeding mechanism 2 is slidably connected to the support platform 9, and the outer side of the feeding mechanism 2 is slidably connected to the moving part 10, and the outer surface of the moving part 10 is equipped with the push rod 11. At the same time, the outer surface of the feeding mechanism 2 is provided with the material box feeding group 12, and the middle section of the inner surface of the feeding mechanism 2 is connected to the lifting mechanism 13; the feeding mechanism 2 and the support platform 9 form a translation structure, and the feeding mechanism 2 forms a pushing structure through the moving part 10 and the push rod 11, and the feeding mechanism 2 and the material box feeding group 12 form a nested structure, and the material box feeding group 12 and the lifting mechanism 13 form a lifting structure.

[0028] In use, the feeding mechanism 2 is stably assembled on the outer surface of the die bonding equipment body 1. The stacked feeding group 3 assembled by the feeding mechanism 2 supports the PCB board 4 and replenishes the PCB board 4. The lifting frame 5, which is slidably controlled in conjunction with the feeding mechanism 2, can control the lifting height of the lifting frame 5 according to the conveying speed to move the PCB board 4 upward. During the upward movement, the magnetic plate 6, which is assembled in conjunction with the magnetic plate, is stably attracted by the adsorption head 8 installed by the control valve 7. The spacing between the support platforms 9 is then controlled to place the PCB board 4 stably on the support platform 9. After placement, the push rod 11 is driven by the moving part 10 to push the PCB board 4 on the support platform 9. The push rod 11 also pushes the PCB board 4 in the material box feeding group 12 simultaneously. The height of the material box feeding group 12 can be controlled by the lifting mechanism 13 according to the different heights of the material box feeding group 12, thereby forming a stable conveying of the PCB board 4.

[0029] A feeding platform 14 is installed in the middle section of the inner surface of the die bonding equipment body 1. A longitudinal moving plate 15 is slidably connected to the upper surface of the feeding platform 14, and a transverse moving plate 16 is slidably connected to the upper surface of the longitudinal moving plate 15. A feeding fixture track 17 is installed on the left side of the upper surface of the transverse moving plate 16, and a feeding fixture track 17 is connected to the right side of the upper surface of the transverse moving plate 16. A rotating shaft 18 is rotatably connected to the inner surface of the longitudinal moving plate 15, and the rotating shaft 18 slides through the right-side feeding fixture track 17. The die bonding equipment body 1 is connected to the feeding platform 14. The longitudinal moving plate 15 and the transverse moving plate 16 form a multi-axis sliding structure. The transverse moving plate 16 and the left feeding fixture track 17 form an integrated structure, and the right feeding fixture track 17 and the transverse moving plate 16 form a sliding structure. The right feeding fixture track 17 and the rotating shaft 18 form a through-type limiting rotation structure via a synchronous wheel. The inner surface of the feeding fixture track 17 is connected to the rotating shaft 18, and the outer surface of the rotating shaft 18 is rotatably connected to a synchronous belt 19. A pressure block 20 is installed on the upper surface of the feeding fixture track 17, and a pressure block 20 is installed on the upper surface of the longitudinal moving plate 15. A cylinder 21 is provided, and a lifting plate 22 is telescopically connected to the upper surface of the cylinder 21. A top bar 23 is installed on the upper surface of the lifting plate 22. The feeding fixture track 17 and the rotating shaft 18 form a limiting rotation structure. The rotating shaft 18 forms a conveying structure with the synchronous pulley and the synchronous belt 19. The feeding fixture track 17 and the pressure block 20 form a sliding limiting structure. At the same time, the longitudinal moving plate 15 forms a lifting structure with the lifting plate 22 and the top bar 23 through the cylinder 21. The lifting plate 22 and the right-side feeding fixture track 17 form a sliding structure. The upper surface of the die bonding equipment body 1 is respectively assembled with the left and right sides. The device comprises a left wafer group 24 and a right wafer group 25. A double dispensing assembly 26 is provided on the rear side of the outer surface of the left wafer group 24, and a pin assembly 27 is connected to the rear side of the double dispensing assembly 26. At the same time, a receiving platform unloading assembly 28 is connected to the rear side of the outer surface of the die bonding equipment body 1. The die bonding equipment body 1, the left wafer group 24, and the right wafer group 25 form a symmetrical feeding arrangement. The left wafer group 24 and the right wafer group 25 respectively form a dispensing structure with the double dispensing assembly 26, and the die bonding equipment body 1 and the receiving platform unloading assembly 28 form a discharging structure.

[0030] When the PCB board 4 is pushed, the positions of the longitudinal moving plate 15 and the transverse moving plate 16 are controlled in advance by the feeding platform 14. The left side of the transverse moving plate 16 is assembled with the feeding fixture track 17 to form a positioning, and the right side of the feeding fixture track 17 slides and matches the width of the PCB board 4. The distance between the left and right feeding fixture tracks 17 is controlled to support the PCB board 4. Simultaneously, the rotating shaft 18 assembled on the transverse moving plate 16 controls the rotation of the timing belt 19, and the pressure block 20 cooperates to press down and limit the PCB board 4. The cylinder 21 assembled on the side of the transverse moving plate 16 controls the height of the top bar 23 installed on the lifting plate 22, and simultaneously forms a stable conveying of the PCB board 4. It is then conveyed to the left wafer group 24 and the right wafer group 25, where it works with the double dispensing group 26 and the ejector pin group 27 to assemble chips. Finally, it is conveyed to the unloading group 28 of the docking station for unloading and discharge.

[0031] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-head double-station multi-mode feeding and die bonding equipment, comprising a die bonding equipment body (1), and a feeding mechanism (2) arranged on the front surface of the die bonding equipment body (1); the feeding mechanism (2) comprises a stacking feeding group (3) slidably connected to the inner surface of the feeding mechanism (2) at the upper middle side, and a plurality of PCB boards (4) are evenly arranged on the upper surface of the stacking feeding group (3); the inner surface of the feeding mechanism (2) is slidably connected with a jacking frame (5); the upper surface of the feeding mechanism (2) is telescopically connected with a magnetic plate (6); the outer surface of the magnetic plate (6) is provided with a control valve (7); and the lower surface of the magnetic plate (6) is connected with a suction head (8). characterized in that A feeding platform (14) is arranged on the inner surface of the die bonding equipment body (1) at the middle section, and the upper surface of the feeding platform (14) is slidably connected with a longitudinal moving plate (15); the upper surface of the longitudinal moving plate (15) is slidably connected with a transverse moving plate (16); the upper surface of the transverse moving plate (16) is provided with a feeding jig track (17) on the left side; the upper surface of the transverse moving plate (16) is connected with a feeding jig track (17) on the right side; the inner surface of the longitudinal moving plate (15) is rotatably connected with a rotating shaft (18); and the rotating shaft (18) penetrates through the right feeding jig track (17) in a sliding manner. The stacking feeding group (3) and the feeding mechanism (2) form a limiting sliding structure; the feeding mechanism (2) and the jacking frame (5) form a lifting structure; and the feeding mechanism (2), the magnetic plate (6), the control valve (7) and the suction head (8) form a suction structure. The upper surface of the feeding mechanism (2) is slidably connected with a supporting platform (9) at the upper middle section; the outer surface of the feeding mechanism (2) is slidably connected with a moving piece (10) at the side surface; the outer surface of the moving piece (10) is provided with a push rod (11); the outer surface of the feeding mechanism (2) is provided with a box feeding group (12); the inner surface of the feeding mechanism (2) is connected with a lifting mechanism (13) at the middle section; the feeding mechanism (2) and the supporting platform (9) form a translation structure; the feeding mechanism (2), the moving piece (10) and the push rod (11) form a pushing structure; the feeding mechanism (2) and the box feeding group (12) form a nesting structure; and the box feeding group (12) and the lifting mechanism (13) form a lifting structure.

2. The dual-head dual-station multi-mode material loading and unloading die bonding apparatus according to claim 1, wherein: The die bonding equipment body (1), the feeding platform (14), the longitudinal moving plate (15) and the transverse moving plate (16) form a multi-axis sliding structure; the transverse moving plate (16) and the left feeding jig track (17) form an integrated structure; the right feeding jig track (17) and the transverse moving plate (16) form a sliding structure; and the right feeding jig track (17), the synchronous wheel and the rotating shaft (18) form a penetrating limiting rotating structure.

3. The dual-head dual-station multi-mode material loading and unloading die bonding apparatus according to claim 1, wherein: ​ 4. The dual-head dual-station multi-mode material loading and unloading die bonding apparatus according to claim 1, wherein: ​ 5. The dual-head dual-station multi-mode material loading and unloading die bonding apparatus according to claim 1, wherein: The inner surface of the feeding jig track (17) is connected with a rotating shaft (18), the outer surface of the rotating shaft (18) is rotationally connected with a synchronous belt (19), the upper surface of the feeding jig track (17) is installed with a pressing block (20), the upper surface of the longitudinal moving plate (15) is installed with a pneumatic cylinder (21), the upper surface of the pneumatic cylinder (21) is telescopically connected with a jacking plate (22), and the upper surface of the jacking plate (22) is installed with a jacking strip (23); the feeding jig track (17) and the rotating shaft (18) constitute a limiting rotation structure, the rotating shaft (18) and the synchronous belt (19) constitute a conveying structure through a synchronous wheel, the feeding jig track (17) and the pressing block (20) constitute a sliding limiting structure, the longitudinal moving plate (15), the jacking plate (22) and the jacking strip (23) constitute a lifting structure through the pneumatic cylinder (21), and the jacking plate (22) and the right feeding jig track (17) constitute a sliding structure.

6. The dual-head dual-station multi-mode material loading and unloading die bonding apparatus according to claim 1, wherein: The upper surface of the solid crystal device body (1) is respectively assembled with a left wafer group (24) and a right wafer group (25) on the left side and the right side, the rear side of the outer surface of the left wafer group (24) is provided with a double dispensing group (26), the rear side of the double dispensing group (26) is connected with a thimble group (27), and the rear side of the outer surface of the solid crystal device body (1) is connected with a docking table discharging group (28); the solid crystal device body (1), the left wafer group (24) and the right wafer group (25) constitute a symmetrical feeding arrangement, the left wafer group (24) and the right wafer group (25) respectively constitute a dispensing structure with the double dispensing group (26), and the solid crystal device body (1) and the docking table discharging group (28) constitute a discharging structure.

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