Wafer soaking mechanism, turnover device thereof and wafer cleaning equipment
By designing the flipping frame and flipping drive of the wafer immersion mechanism, the problem of mismatched angles when the robot grips the wafer is solved, ensuring that the wafer is adapted to the robot after flipping, avoiding edge damage, and improving cleaning efficiency and safety.
Patent Information
- Application Number
- CN202520114999.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-17
AI Technical Summary
After the wafer is immersed, the robotic arm is prone to damaging the wafer edges when gripping the wafer, and the gripping angle of the robotic arm cannot be matched with that of the wafer gripper.
A wafer immersion mechanism was designed, which includes a flipping frame and a flipping drive. The flipping frame rotates around the hinge point to change the wafer from a vertical state to a horizontal state, ensuring that the wafer is adapted to the gripping angle of the robot arm. Immersion solution is continuously replenished through the replenishment tube to keep the wafer moist.
This technology enables the wafer to be gripped at the same angle as the robotic arm after flipping, avoiding damage to the wafer edges and improving wafer cleaning efficiency and safety.
Smart Images
Figure CN223798642U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment, specifically relating to a wafer immersion mechanism and its flipping device, and a wafer cleaning equipment. Background Technology
[0002] In the wafer manufacturing process, wafer cleaning is usually carried out in batches or on a single wafer. The wafer cleaning process runs through the entire wafer manufacturing process, including pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, resist removal cleaning, pre / post-film deposition cleaning, and post-mechanical polishing cleaning. These processes are crucial for removing particles, chemical residues and contaminants generated during the processing.
[0003] To ensure the effectiveness and efficiency of the wafer cleaning process, the wafers need to be kept moist before cleaning. In some technologies, the wafers are soaked before cleaning to keep them moist. However, the storage posture of the wafers in the soaking mechanism cannot be matched with the gripping angle of the robotic arm that picks up the wafers, which makes it easy to damage the wafer edges when picking up the wafers.
[0004] Therefore, how to prevent the robotic arm from damaging the wafer edges during the gripping process after wafer immersion is a technical problem that urgently needs to be solved by those skilled in the art.
[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content
[0006] This disclosure provides at least one wafer immersion mechanism and its flipping device, and a wafer cleaning device.
[0007] In a first aspect, embodiments of this disclosure provide a wafer immersion mechanism, comprising:
[0008] A tank, inside which a flipping frame is provided, and a wafer box is provided on the flipping frame;
[0009] The tilting shaft is connected to both the tilting frame and the tilting drive.
[0010] A side plate is provided on one side of the tank, and a pair of brackets are provided on the side plate;
[0011] The tilting frame is hinged to the support, and,
[0012] The flipping drive is adapted to drive the flipping frame to rotate around the hinge point as the axis, so that the wafer in the wafer box changes from a vertical state to a horizontal state.
[0013] In one alternative embodiment, the tilting drive is mounted on a side plate and the side plate is connected to a motor drive via a track.
[0014] In one alternative embodiment, the lower part of the tank is connected to a replenishment pipe, and the other end of the replenishment pipe is connected to a storage tank.
[0015] In one alternative embodiment, the tank is further provided with an overflow port and a baffle plate, the baffle plate being inclinedly disposed on one side of the tank.
[0016] In one optional embodiment, the wafer cassette is provided with a 6-inch wafer fixture and an 8-inch wafer fixture, which are assembled in the wafer cassette by fixture fasteners.
[0017] In one alternative embodiment, the flipping frame is further provided with a wafer cassette stop post.
[0018] In one alternative embodiment, the wafers in the wafer cassette are horizontal and parallel to the robotic gripper.
[0019] On the other hand, embodiments of this disclosure also provide a wafer flipping device, which is hinged to a support on one side of the tank;
[0020] The wafer flipping device includes:
[0021] A flip rack, on which wafer boxes are mounted;
[0022] The tilting shaft is connected to both the tilting frame and the tilting drive.
[0023] The flipping drive is adapted to drive the flipping frame to rotate 90° around the hinge point as the axis, so that the wafer in the wafer box changes from a vertical state to a horizontal state.
[0024] In one optional embodiment, the wafer cassette is provided with a 6-inch wafer fixture and an 8-inch wafer fixture, which are assembled in the wafer cassette by fixture fasteners.
[0025] Thirdly, embodiments of this disclosure also provide a wafer cleaning apparatus, comprising:
[0026] The wafer immersion mechanism as described in any one of claims 1-7; and,
[0027] A robotic arm suitable for holding wafers in a horizontal position.
[0028] The beneficial effects of this utility model are: when the flipping frame of this wafer immersion mechanism is not flipped, the wafers in the wafer box are always kept moist in the immersion mechanism; after the flipping frame is flipped, the wafers in the wafer box change from a vertical state to a horizontal state, which makes it easier for the robotic arm gripper to pick up the wafers.
[0029] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description, claims, and drawings.
[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0031] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0032] Figure 1 This is a three-dimensional schematic diagram of a wafer immersion mechanism before flipping, provided in an embodiment of the present disclosure.
[0033] Figure 2 This is a three-dimensional schematic diagram of a wafer immersion mechanism after being flipped according to an embodiment of the present disclosure;
[0034] Figure 3 This is a structural diagram of a wafer cassette fixture within a wafer immersion mechanism provided in an embodiment of the present disclosure;
[0035] Figure 4 This is a three-dimensional schematic diagram of a wafer immersion mechanism adapted to a robotic arm, provided as an embodiment of the present disclosure.
[0036] In the picture:
[0037] 100. Tank body; 110. Overflow port; 120. Baffle plate; 200. Tilting frame; 210. Wafer box; 211. Wafer; 212. 8-inch wafer fixture; 213. 6-inch wafer fixture; 214. Fixture fastener; 220. Wafer box stop post; 300. Tilting shaft; 400. Tilting drive; 500. Side plate; 510. Bracket; 511. Hinge point; 600. Track; 700. Liquid replenishment pipe; 800. Robotic arm fixture; 900. Motor. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0039] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of a feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof.
[0040] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.
[0041] Research has revealed a drawback in existing technologies: to ensure the effectiveness and efficiency of the wafer cleaning process, the wafer needs to be kept moist before cleaning. Some technologies employ pre-cleaning immersion to keep the wafer moist; however, the wafer's orientation within the immersion mechanism cannot be matched to the gripping angle of the robotic arm, making it easy to damage the wafer edges during handling.
[0042] Therefore, in order to solve the above-mentioned technical problems, this disclosure provides a wafer immersion mechanism.
[0043] The shortcomings of the above solutions are the result of the utility model inventor's practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as contributions made by the utility model inventor to this disclosure.
[0044] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.
[0045] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0046] Please see Figure 1 This disclosure provides a wafer immersion mechanism, comprising: a tank 100, in which a flipping frame 200 is disposed, and a wafer cassette 210 is disposed on the flipping frame 200, the wafer cassette 210 being adapted to hold a wafer 211 to be immersed; a flipping shaft 300, connected to the flipping frame 200 and a flipping drive 400 respectively; a side plate 500 disposed on one side of the tank 100, and a pair of supports 510 disposed on the side plate 500; the flipping frame 200 is hinged to the supports 510, and after the wafer 211 is immersed, the flipping drive 400 is adapted to drive the flipping frame 200 to rotate about the hinge point 511 as the axis, so that the wafer 211 in the wafer cassette 210 changes from a vertical state to a horizontal state. The horizontal state of the wafer 211 is adapted to the gripping angle of the robotic arm gripper 800 for grasping the wafer 211, thereby avoiding damage to the edge of the wafer 211 during the gripping process.
[0047] See also Figure 1 In some embodiments, the tilting drive 400 is mounted on the side plate 500 and the side plate 500 is connected to the motor 900 via the track 600. The motor 900 is activated to drive the side plate 500 to move downward.
[0048] Specifically, the flipping frame 200 is hinged to the bracket 510, and the bracket 510 is connected to the side plate 500. When the motor 900 drives the side plate 500 to move up and down, it is suitable for adjusting the height of the flipping frame 200 to further improve the compatibility between the flipped wafer 211 and the gripping angle of the robotic arm gripper 800.
[0049] See also Figure 1 In some embodiments, the lower part of the tank 100 is connected to the replenishment pipe 700, and the other end of the replenishment pipe 700 is connected to the storage tank.
[0050] Specifically, by continuously replenishing the soaking solution through the replenishment tube 700, the wafer 211 can be overflowed and soaked, thus improving the cleaning efficiency of the wafer 211.
[0051] Furthermore, the tank 100 is also provided with an overflow port 110, from which the dirt floating on the soaking liquid after the wafer 211 overflows and is soaked is suitable to flow out.
[0052] See also Figure 1 In some embodiments, a baffle plate 120 is inclinedly provided on one side of the tank 100. The baffle plate 120 is adapted to block the soaking liquid thrown out when the wafer 211 is flipped. Furthermore, the thrown-out soaking liquid is adapted to flow back into the tank 100 along the slope of the baffle plate 120.
[0053] See Figure 3 In some embodiments, a 6-inch wafer clamp 213 and an 8-inch wafer clamp 212 are provided inside the wafer box 210, and the 6-inch wafer clamp 213 and the 8-inch wafer clamp 212 are assembled inside the wafer box 210 by clamp fasteners 214.
[0054] Specifically, by disassembling and assembling the fixture fastener 214, the 6-inch wafer fixture 213 and the 8-inch wafer fixture 212 can be flexibly replaced, facilitating maintenance.
[0055] See Figure 2 In some embodiments, the wafer cassette 210 is installed in conjunction with the flip frame 200 in a movable assembly manner. The flip frame 200 is also provided with a wafer cassette stop post 220. When the flip frame 200 is flipped, the wafer cassette stop post 220 can further reinforce the wafer cassette 210 and prevent it from falling off the flip frame 200.
[0056] See Figure 4 In some embodiments, the horizontally positioned wafer 211 inside the wafer cassette 210 is parallel to the robotic gripper 800. The robotic gripper 800 only needs to adjust its height to fit the wafer 211, further reducing the difficulty for the robotic gripper 800 to grip the wafer 211.
[0057] See Figure 1 In some embodiments, a wafer flipping device is also provided, which is hinged to a support 510 on one side of the tank 100; the wafer flipping device includes: a flipping frame 200 on which a wafer box 210 is disposed; a flipping shaft 300 connected to the flipping frame 200 and a flipping drive 400 respectively; the flipping drive 400 is adapted to drive the flipping frame 200 to rotate 90° around the hinge point 511 as the axis, so that the wafer 211 in the wafer box 210 changes from a vertical state to a horizontal state.
[0058] In some embodiments, a wafer cleaning apparatus is also provided, including the one used in the above embodiments.
[0059] A wafer immersion mechanism; and a robotic arm suitable for holding a horizontally positioned wafer 211.
[0060] In summary, when the flipping frame 200 of this wafer immersion mechanism is not flipped, the wafer 211 inside the wafer cassette 210 remains moist within the immersion mechanism. After the flipping frame 200 flips, the wafer 211 inside the wafer cassette 210 changes from a vertical to a horizontal position. The horizontal position of the wafer 211 is adapted to the gripping angle of the robotic arm chuck 800 that holds the wafer 211, thereby preventing damage to the edges of the wafer 211 during the gripping process.
[0061] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0062] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0063] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.
[0064] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A wafer immersion mechanism, characterized in that, include: A tank (100) is provided inside which a flipping frame (200) is provided, and a wafer box (210) is provided on the flipping frame (200). The flipping shaft (300) is connected to the flipping frame (200) and the flipping drive (400) respectively; A side plate (500) is provided on one side of the tank (100), and a pair of brackets (510) are provided on the side plate (500). The flipping frame (200) is hinged to the support (510), and, The flip drive (400) is adapted to drive the flip frame (200) to rotate around the hinge point (511) as the axis, so that the wafer (211) in the wafer box (210) changes from a vertical state to a horizontal state.
2. The wafer immersion mechanism as described in claim 1, characterized in that, The tilting drive (400) is mounted on the side plate (500), and the side plate (500) is connected to the motor (900) via the track (600).
3. The wafer immersion mechanism as described in claim 2, characterized in that, The lower part of the tank (100) is connected to the replenishment pipe (700), and the other end of the replenishment pipe (700) is connected to the storage tank.
4. The wafer immersion mechanism as described in claim 3, characterized in that, The tank (100) is also provided with an overflow port (110) and a baffle plate (120), the baffle plate (120) being inclinedly disposed on one side of the tank (100).
5. The wafer immersion mechanism as described in claim 1, characterized in that, The wafer box (210) is provided with a 6-inch wafer fixture (213) and an 8-inch wafer fixture (212), which are assembled in the wafer box (210) by a fixture fastener (214).
6. The wafer immersion mechanism as described in claim 1, characterized in that, The flipping frame (200) is also provided with a wafer box stop post (220).
7. The wafer immersion mechanism as described in claim 1, characterized in that, The wafer (211) in the horizontal state inside the wafer box (210) is parallel to the robotic gripper (800).
8. A wafer flipping device, characterized in that, It is hinged to a bracket (510) on one side of the tank (100); The wafer flipping device includes: A flipping frame (200) on which a wafer box (210) is mounted. The flipping shaft (300) is connected to the flipping frame (200) and the flipping drive (400) respectively; The flip drive (400) is adapted to drive the flip frame (200) to rotate 90° around the hinge point (511) as the axis, so that the wafer (211) in the wafer box (210) changes from a vertical state to a horizontal state.
9. The wafer flipping apparatus as described in claim 8, characterized in that, The wafer box (210) is provided with a 6-inch wafer fixture (213) and an 8-inch wafer fixture (212), which are assembled in the wafer box (210) by a fixture fastener (214).
10. A wafer cleaning device, characterized in that, include: The wafer immersion mechanism as described in any one of claims 1-7; as well as, A robotic arm suitable for holding wafers in a horizontal position.