Wafer anti-cracking laser cutting machining device

Abstract

The utility model discloses a wafer anti-cracking laser cutting processing device which comprises a pure water basin, a filter screen is arranged in the pure water basin, and a placing table used for placing a wafer is arranged in the middle of the pure water basin. A lifting plate is arranged above the pure water basin, a plurality of positioning vertical plates are arranged on the lifting plate, the positioning vertical plates can move close to or away from the center of the lifting plate, the bottom end of each positioning vertical plate is connected with a positioning block, and the positioning blocks are matched to position and fix a wafer; the bottom of the lifting plate is rotationally connected with a rotating disc, an adjusting rod driven by an air cylinder to stretch out and draw back is arranged at the bottom of the rotating disc, and a laser cutting head is installed on the adjusting rod. According to the utility model, the wafer with the required size can be cut as required, the cutting quality of the wafer is good, and the wafer cannot be broken.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting technical field especially relates to a wafer anti -cracking laser cutting processing device. BACKGROUND

[0002] At present, when cutting wafer, usually utilizes laser cutting head to cut directly, and the heat energy produced is absorbed by wafer, leads to wafer breakage damage, and heat energy also leads to silicon melting or thermal decomposition, produces silicon vapor and condenses, deposits on wafer, thereby produces the chippings at wafer edge, influences product quality, therefore urgently needs a kind of laser cutting processing device, carries out high quality cutting to wafer, and has anti -cracking function. SUMMARY

[0003] The utility model provides a wafer anti -cracking laser cutting processing device, and aims at solving the technical problem that the existing laser cutting device is easy to cause wafer breakage damage and influence product quality in the prior art.

[0004] The technical scheme of the utility model is: a wafer anti -cracking laser cutting processing device, including pure water basin, the filter screen is equipped in the pure water basin, the middle part of the pure water basin is equipped with the placing table for placing wafer, the upper of the pure water basin is equipped with lifting plate, the lifting plate is equipped with multiple positioning vertical boards, the positioning vertical board can move close to or away from the center of the lifting plate, the bottom of each positioning vertical board is connected with positioning block, and each positioning block is positioned and fixed to wafer.

[0005] Further, the filter screen and the pure water basin in the utility model can be detachably installed.

[0006] Further, multiple hollow parts are opened on the placing table in the utility model, the bottom of the placing table is equipped with threaded column, the threaded column passes through the filter screen and is screw-connected with the bottom of the pure water basin.

[0007] Further, the left and right sides of the lifting plate are respectively equipped with lifting frame in the utility model, each lifting frame is equipped with lead screw driven by lifting motor, and the lifting plate is connected with the lead screw on both sides respectively.

[0008] Further, the positioning vertical plate has four pieces, and is distributed at equal angles around the center of the lifting plate, a plurality of sliding grooves corresponding to the positioning vertical plates are formed on the lifting plate, and the positioning vertical plate is slidingly installed in the sliding groove; the top of the lifting plate is provided with a first screw rod with positive and negative thread segments driven by a first motor, and a second screw rod with positive and negative thread segments driven by a second motor, the second screw rod is located above the first screw rod, and the opposite two positioning vertical plates are connected with the positive and negative thread segments of the first screw rod or the second screw rod respectively.

[0009] Further, the first screw rod and the second screw rod are rotatably installed in the support seat at two ends respectively, and the second motor is installed on the heightening seat.

[0010] Further, the inner side surface of the positioning block is an arc surface, and the positioning block is made of an elastic material.

[0011] Further, the top of the lifting plate is provided with a rotary motor, an output shaft of the rotary motor penetrates the lifting plate and is connected with a driving wheel, and the driving wheel is in meshing transmission with the rotating disc.

[0012] Further, the adjusting rod is slidingly connected with the rotating disc.

[0013] Compared with the prior art, the laser cutting device of the utility model can soak the wafer in pure water for cutting, can cool the wafer by pure water, and can prevent the wafer from being damaged due to high temperature after heat absorption; the wafer is positioned and fixed by the positioning block after being placed, movement during cutting is avoided, cutting precision is ensured, the hollow part designed on the placing table can avoid the wafer being sucked by the placing table when moving in water, and a certain protection effect is achieved; during laser cutting, the position of the laser cutting head can be automatically adjusted by the air cylinder, the rotating disc can drive the laser cutting head to rotate, the wafer with a required size can be cut according to requirements, the cutting quality of the wafer is good, and the wafer will not be broken. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view of the utility model;

[0015] Figure 2 It is a perspective view of the utility model (wherein the lifting frame is not drawn);

[0016] Figure 3 It is a specific structure diagram of the pure water basin in the utility model;

[0017] Figure 4 It is a cooperation diagram of the rotating disc and the driving wheel in the utility model.

[0018] Wherein: 1, pure water basin; 2, filter screen; 3, placing table; 3a, hollow part; 4, threaded column; 5, lifting plate; 5a, sliding slot; 6, lifting frame; 7, lifting motor; 8, positioning vertical plate; 9, positioning block; 10, first motor; 11, first screw; 12, second motor; 13, second screw; 14, support seat; 15, heightening seat; 16, rotating disc; 17, rotating motor; 18, driving wheel; 19, air cylinder; 20, adjusting rod; 21, laser cutting head; A, wafer. DETAILED DESCRIPTION

[0019] The specific embodiments of the wafer anti-cracking laser cutting processing device of the utility model are described below in combination with the drawings.

[0020] Embodiment:

[0021] The specific embodiments of the wafer anti-cracking laser cutting processing device of the utility model are described below in combination with the drawings. Figure 1 、 Figure 2 、 Figure 3 , which mainly comprises a pure water basin 1, the pure water basin 1 is provided with a filter screen 2, the filter screen 2 is detachably installed with the pure water basin 1, the middle part of the pure water basin 1 is provided with a placing table 3 for placing a wafer A, the placing table 3 is located above the filter screen 2, a plurality of hollow parts 3a are formed on the placing table 3, the bottom of the placing table 3 is provided with a threaded column 4, the threaded column 4 penetrates through the filter screen 2 and is threadedly connected with the bottom of the pure water basin 1. The wafer A is placed on the placing table 3 and immersed in the pure water in the pure water basin 1, and the debris after laser cutting is filtered by the filter screen 2. The placing table 3 can be screwed off first, then the filter screen 2 is removed to clean the debris.

[0022] The upper side of the pure water basin 1 is provided with a lifting plate 5, the left and right sides of the lifting plate 5 are respectively provided with lifting frames 6, each lifting frame 6 is provided with a lead screw driven by a lifting motor 7, the lifting plate 5 is connected with the lead screws on both sides, and the lifting motor 7 can drive the lead screws to drive the lifting plate 5 to move up and down.

[0023] Four positioning vertical plates 8 are arranged on the lifting plate 5, the four positioning vertical plates 8 are distributed at equal angles around the center of the lifting plate 5, four sliding slots 5a corresponding to the positioning vertical plates 8 are formed on the lifting plate 5, the positioning vertical plates 8 are slidingly installed in the sliding slots 5a, and the upper ends of the positioning vertical plates 8 penetrate out of the sliding slots 5a. The top of the lifting plate 5 is provided with a first screw 11 with positive and negative thread segments driven by a first motor 10 and a second screw 13 with positive and negative thread segments driven by a second motor 12, the second screw 13 is located above the first screw 11, and the opposite two positioning vertical plates 8 are connected with the positive and negative thread segments of the first screw 11 or the second screw 13, and the four positioning vertical plates 8 can move towards the center of the lifting plate 5 or away from the center of the lifting plate 5. The two ends of the first screw 11 and the second screw 13 are rotatably installed in the support seat 14, and the second motor 12 is installed on the heightening seat 15.

[0024] The bottom end of each positioning vertical plate 8 is connected with a positioning block 9, the inner side surface of the positioning block 9 is an arc surface, and the positioning block 9 is made of elastic material, so that the fitting degree of the positioning block 9 with the wafer A is better, and the wafer A is not damaged, and four positioning blocks 9 are used for positioning and fixing the wafer A, so as to prevent movement during cutting and affect the cutting precision.

[0025] With reference to Figure 1 , Figure 2 , Figure 4 , the bottom of the center of the lifting plate 5 is rotationally connected with a rotating disc 16, the top of the lifting plate 5 is provided with a rotating motor 17, the output shaft of the rotating motor 17 penetrates through the lifting plate 5 and is connected with a driving wheel 18, and the driving wheel 18 is in meshing transmission with the rotating disc 16. The rotating motor 17 can drive the driving wheel 18 to rotate, and then drive the rotating disc 16 to rotate.

[0026] The bottom of the rotating disc 16 is provided with an adjusting rod 20 driven to stretch and retract by a gas cylinder 19, the adjusting rod 20 is slidingly connected with the rotating disc 16, the moving precision can be improved, and a laser cutting head 21 is installed on the adjusting rod 20, the adjusting rod 20 can be driven to stretch and retract by the stretching and retraction of the gas cylinder 19, and then the laser cutting head 21 is adjusted to a required position.

[0027] In the working process of the laser cutting machining device, the wafer A is first placed on the placing table 3 and immersed in the pure water in the pure water basin 1, then the lifting motor 7 drives the lifting plate 5 to descend, and drives the positioning block 9 to descend to the height of the wafer A, then the first motor 10 and the second motor 12 work synchronously, drive the four positioning vertical plates 8 to move towards the center of the lifting plate 5 at the same time, drive the four positioning blocks 9 to move towards the center synchronously, position and fix the wafer A, and after positioning, the wafer A is located at the center position of the placing table 3, when the wafer A moves on the placing table 3, the hollow part 3a on the placing table 3 can avoid the wafer A from being sucked by the placing table 3 when moving in the water, and plays a certain protection role. Then laser cutting is carried out, the adjusting rod 20 is first driven to stretch and retract by the gas cylinder 19, the laser cutting head 21 is adjusted to a required position, then the rotating motor 17 works, drives the driving wheel 18 to rotate, and then drives the rotating disc 16 to rotate, and the rotating disc 16 drives the laser cutting head 21 to rotate, so that the wafer A of a required size can be cut according to requirements.

[0028] Of course, the above embodiment is only for describing the technical concept and characteristics of the utility model, the purpose is to enable the person skilled in the art to understand the content of the utility model and to implement it, and cannot limit the protection scope of the utility model. Any modification made according to the spirit and essence of the main technical scheme of the utility model should be covered in the protection scope of the utility model.

Claims

1. A wafer anti-crack laser cutting processing device, characterized in that: The utility model provides pure water basin (1) including, the filter screen (2) is equipped in pure water basin (1), the middle part of pure water basin (1) is equipped with the placement platform (3) for placing wafer (A), the top of pure water basin (1) is equipped with lifting plate (5), lifting plate (5) is equipped with multiple positioning vertical board (8) on, positioning vertical board (8) can be close to or far from the center of lifting plate (5) movement, the bottom of each positioning vertical board (8) is connected with positioning block (9), and each positioning block (9) is fixed with wafer (A) and is positioned, the bottom rotationally connected with carousel (16) of lifting plate (5), the bottom of carousel (16) is equipped with the adjusting rod (20) of telescopic drive by pneumatic cylinder (19), and laser cutting head (21) is installed on adjusting rod (20).

2. The wafer anti-cracking laser cutting device according to claim 1, wherein: The filter screen (2) is detachably installed on the pure water basin (1).

3. The wafer anti-cracking laser cutting device according to claim 1, wherein: A plurality of hollow parts (3a) are formed in the placement platform (3), and a threaded column (4) is arranged at the bottom of the placement platform (3). The threaded column (4) penetrates through the filter screen (2) and is threadedly connected with the bottom of the pure water basin (1).

4. The wafer anti-cracking laser cutting device according to claim 1, wherein: Lifting frames (6) are arranged at the left and right sides of the lifting plate (5), respectively. A lead screw driven by a lifting motor (7) is arranged in each lifting frame (6). The lifting plate (5) is connected with the lead screws at the left and right sides, respectively.

5. The wafer anti-cracking laser cutting device according to claim 1, wherein: The positioning vertical boards (8) are four pieces and are equiangularly distributed around the center of the lifting plate (5). A plurality of sliding grooves (5a) corresponding to the positioning vertical boards (8) are formed in the lifting plate (5). The positioning vertical boards (8) are slidingly installed in the sliding grooves (5a). A first screw rod (11) having positive and negative thread segments driven by a first motor (10) and a second screw rod (13) having positive and negative thread segments driven by a second motor (12) are arranged at the top of the lifting plate (5). The second screw rod (13) is located above the first screw rod (11). Opposite positioning vertical boards (8) are connected with the positive and negative thread segments of the first screw rod (11) or the second screw rod (13), respectively.

6. The wafer anti-cracking laser cutting device according to claim 5, wherein: The first screw rod (11) and the second screw rod (13) are rotatably installed in bearing seats (14) at both ends, respectively. The second motor (12) is installed on a heightening seat (15).

7. The wafer anti-cracking laser cutting device according to claim 1, wherein: The inner side surface of the positioning block (9) is an arc surface. The positioning block (9) is made of an elastic material.

8. The wafer anti-cracking laser cutting device according to claim 1, wherein: A rotary motor (17) is arranged at the top of the lifting plate (5). An output shaft of the rotary motor (17) penetrates through the lifting plate (5) and is connected with a driving wheel (18). The driving wheel (18) is in meshing transmission with the carousel (16).

9. The wafer anti-cracking laser cutting device according to claim 1, wherein: The adjusting rod (20) is slidingly connected with the carousel (16).

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