Grinding pad trimming device

Abstract

The utility model belongs to the technical field of semiconductor machine manufacturing, and particularly relates to a grinding pad trimming device. The grinding pad dressing device comprises a dresser, the dresser comprises a dresser body and a plurality of dressing protrusions, the surface, facing a grinding pad, of the dresser body is a dressing face, the dressing face is provided with a first dressing layer, the surface of each dressing protrusion is provided with a second dressing layer, the first dressing layer is used for dressing the grinding face, and the second dressing layer is used for dressing the grinding face. And the plurality of second finishing layers are in one-to-one correspondence with the grooves. When the grinding pad is trimmed, the first trimming layer trims the grinding surface, and the second trimming layer trims the groove, so that foreign matters on the grinding surface and in the groove can be effectively removed at the same time, and a good trimming effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor machinery manufacturing, concretely relates to a polishing pad dressing device. BACKGROUND

[0002] Chemical mechanical polishing (CMP) is a process by which chemical reaction and mechanical polishing process jointly act. In the polishing process, the polishing head exerts certain pressure on the back of the wafer, so that the front of the wafer is tightly attached to the polishing pad. At the same time, the polishing head drives the wafer and the polishing pad to rotate in the same direction, so that the front of the wafer produces mechanical friction with the polishing pad. In the polishing process, a thin film on the surface of the wafer is removed through a series of complex mechanical and chemical actions, so as to achieve the purpose of wafer planarization.

[0003] In order to increase the friction between the wafer and the polishing pad and make the polishing liquid uniformly distributed, a groove in the form of concentric circle is usually arranged on the surface of the polishing pad. This results in that the tiny polishing particles of the polishing liquid will fill the groove in the polishing process. With the progress of the process, the polishing liquid and the polishing by-product will gradually accumulate, and these foreign matters are the main factors causing scratches on the polishing pad. In addition, the accumulation of foreign matters makes the surface of the polishing pad become smoother, which is not conducive to the friction between the wafer and the polishing pad, and at the same time, affects the uniform distribution of the polishing liquid. Therefore, it is necessary to use a polishing dresser to repair the polishing pad and maintain the roughness of the surface of the polishing pad.

[0004] The dresser in the prior art can only repair the surface of the polishing pad and cannot effectively clean the groove. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving at least the problem that the existing dresser cannot clean the groove on the polishing pad. The purpose is realized by the following technical scheme:

[0006] The first aspect of the utility model provides a polishing pad dressing device, the polishing pad comprises a polishing surface and a plurality of annular grooves, the groove is located on the polishing surface and a plurality of the groove is concentrically distributed, and the polishing pad dressing device comprises:

[0007] The dresser comprises a dresser body and a plurality of dressing protrusions, the surface of the dresser body towards the surface of the polishing pad is a dressing surface, the dressing surface is provided with a first dressing layer, the surface of each dressing protrusion is provided with a second dressing layer, the first dressing layer is used for dressing the polishing surface, and a plurality of the second dressing layer and the groove are one-to-one corresponding.

[0008] The grinding pad trimming device in the technical scheme can effectively remove foreign matters on the grinding surface and in the groove and has good trimming effect.

[0009] In addition, the grinding pad trimming device can have the following additional technical features.

[0010] In some embodiments of the utility model, the first trimming layer and the second trimming layer are both diamond particle layers, and the particle size of the diamond particles in the first trimming layer is larger than the particle size of the diamond particles in the second trimming layer.

[0011] In some embodiments of the utility model, the width of the trimming protrusion is 1 / 3 of the width of the groove.

[0012] In some embodiments of the utility model, the second trimming layer is provided with at least one metal layer on the outside.

[0013] In some embodiments of the utility model, the trimming surface is rectangular.

[0014] In some embodiments of the utility model, the length of the trimming surface is equal to the radius of the grinding surface, and the axis of the length direction of the trimming surface coincides with the radial direction of the grinding surface.

[0015] In some embodiments of the utility model, the grinding pad trimming device further comprises a support, one side of the trimmer body away from the trimming surface is connected with the support, and the support is connected with a workbench.

[0016] In some embodiments of the utility model, the trimmer is provided with a pressure detection unit, and the pressure detection unit is used for detecting the pressure applied by the trimming surface to the grinding surface.

[0017] In some embodiments of the utility model, the trimming surface is an inclined surface, and along the radial direction of the grinding surface from the center of the grinding surface to the direction away from the center, the trimming surface is inclined away from the grinding surface.

[0018] In some embodiments of the utility model, the trimming surface is a stepped surface, and along the radial direction of the grinding surface from the center of the grinding surface to the direction away from the center, the pressure applied by the trimmer to the grinding surface is distributed in a stepped manner and gradually decreases. BRIEF DESCRIPTION OF DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments with reference made to the accompanying drawings. The drawings are for purposes of illustration only and are not intended to limit the present inventive subject matter thereto. Like reference numerals are used to denote like elements throughout the accompanying drawings. In the drawings:

[0020] Figure 1 A structural schematic diagram of a polishing pad trimming device according to an embodiment of the present application is schematically shown;

[0021] Figure 2 A structural schematic diagram of a polishing pad trimming device (the trimming surface is an inclined surface) according to an embodiment of the present application is schematically shown;

[0022] Figure 3 A structural schematic diagram of a polishing pad trimming device (the trimming surface is a stepped surface) according to an embodiment of the present application is schematically shown.

[0023] Reference numerals in the drawings represent the following:

[0024] 100, polishing pad; 110, groove;

[0025] 200, trimmer; 210, trimmer body; 211, first trimming layer; 220, trimming protrusion; 221, second trimming layer;

[0026] 300, bracket; 310, horizontal plate; 320, inclined rod. DETAILED DESCRIPTION

[0027] Exemplary embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings. While example embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be embodied in various forms without being limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0028] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0029] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0030] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.

[0031] Figure 1 A schematic diagram of the grinding pad dressing device according to an embodiment of the present invention is shown. Figure 1The utility model provides a kind of grinding pad finishing device, grinding pad 100 includes grinding surface and multiple annular grooves 110, groove 110 is located on grinding surface and multiple grooves 110 concentric distribution, grinding pad finishing device includes trimmer 200, trimmer 200 includes trimmer body 210 and multiple trimming protrusions 220, the surface of trimmer body 210 towards grinding pad 100 is trimming face, trimming face is provided with first trimming layer 211, the surface of each trimming protrusion 220 is provided with second trimming layer 221, first trimming layer 211 is used to trim grinding surface, multiple second trimming layers 221 and groove 110 one to one.

[0032] The grinding pad finishing device in the technical solution can effectively remove foreign matters on the grinding surface and in the grooves 110 simultaneously, and has good trimming effect.

[0033] Optionally, the diamond particles of the first trimming layer 211 and the second trimming layer 221 are formed on the trimmer 200 by electrodepositing or melting process.

[0034] Optionally, the trimming protrusion 220 is cylindrical, and annular grooves are arranged along the circumference of the trimming protrusion 220, the number of the annular grooves is multiple, and the multiple annular grooves are arranged along the height direction of the trimming protrusion 220. By arranging the annular grooves, the diamond particles can be embedded in the annular grooves, so that the diamond particles can be stably fixed on the trimming protrusion 220. The depth and width of the annular grooves can be adjusted according to actual needs, so as to embed diamond particles with appropriate particle size, thereby adapting to the trimming requirements of different grinding pads 100 and ensuring the best trimming effect. Optionally, the trimming protrusion 220 is made of high-hardness material, to ensure wear resistance and durability during trimming. For example, the material of the trimming protrusion 220 can be stainless steel.

[0035] Further, the trimmer body 210 is also made of high-hardness material, to ensure wear resistance and durability during trimming. For example, the material of the trimmer body 210 can be stainless steel. In addition, the surface of the trimmer body 210 can be coated with an anti-corrosion coating to enhance its service life in harsh environments. The anti-corrosion coating material of the trimmer body 210 can be selected from nano ceramic or fluorocarbon, to further improve its chemical corrosion resistance.

[0036] Further, the first trimming layer 211 and the second trimming layer 221 are both diamond particle layers, and the particle size of the diamond particles in the first trimming layer 211 is larger than that of the diamond particles in the second trimming layer 221. It can be understood that the size of the groove 110 is limited, and therefore, the second trimming layer 221 adopts diamond particles with a smaller particle size, which can ensure that the second trimming layer 221 finely trims the inside of the groove 110 and ensures that the cleanliness of the groove 110 and the grinding surface is consistent. At the same time, the first trimming layer 211 adopts diamond particles with a larger particle size, which ensures efficient trimming of the grinding surface. The first trimming layer 211 and the second trimming layer 221 work together to improve the overall trimming effect and prolong the service life of the grinding pad 100.

[0037] Further, the width of the trimming protrusion 220 is 1 / 3 of the width of the groove 110, so as to ensure that the trimming protrusion 220 can extend into the groove 110 for effective trimming. It can be understood that the height of the trimming protrusion 220 is set according to the depth of the groove 110 to avoid trimming blind area and improve trimming accuracy. The shape and size of the trimming protrusion 220 can be flexibly adjusted according to actual needs to adapt to different types of grinding pads 100 and ensure that the trimming effect is optimized.

[0038] Further, the outer side of the second trimming layer 221 is provided with at least one metal layer. By providing a metal layer on the outer side of the second trimming layer 221, the corrosion resistance and wear resistance of the second trimming layer 221 can be increased, and the diamond particles can be effectively prevented from falling off. Preferably, the number of metal layers is three, which can effectively prevent the diamond particles from falling off and avoid overly complex processes. Alternatively, the metal layer can be a gold plating layer. The gold plating layer is formed on the surface of the second trimming layer 221 by electrodeposition.

[0039] Further, in the present embodiment, the shape of the trimming surface is rectangular.

[0040] When performing trimming work, the grinding pad 100 is in a rotating state, and the trimmer 200 is in a stationary state. Through the rotation of the grinding pad 100, the trimming surface and the entire grinding surface can be contacted. Alternatively, the side of the trimming protrusion 220 facing the groove 110 can be arc-shaped, so as to be more consistent with the shape of the groove 110.

[0041] Further, the length of the trimming surface is equal to the radius of the grinding surface, and the axis of the length direction of the trimming surface coincides with the radial direction of the grinding surface. That is, the trimmer body 210 is placed along the radial direction of the grinding surface, and the midpoint of one end of the trimmer body 210 is aligned with the center of the grinding surface, so that the grinding pad 100 rotates one round, and the trimmer 200 can just trim the entire grinding surface once.

[0042] Further, the polishing pad conditioning device further comprises a bracket 300 connected to the side of the conditioner body 210 away from the conditioning surface and connected to the workbench. The bracket 300 can increase the stability of the conditioner 200, prevent the conditioning protrusion 220 from disengaging from the groove 110, and ensure the accuracy of conditioning. The bracket 300 is made of high-strength material to ensure that it does not deform during high-speed rotation, further improving the stability and safety of the conditioning process. The design of the bracket 300 also needs to consider the anti-vibration performance to cope with the vibration generated by high-speed rotation, further ensuring the smoothness of the conditioning process. Illustratively, the bracket 300 includes a horizontal plate 310 and a plurality of inclined rods 320, one end of the inclined rod 320 is connected to the horizontal plate 310, and the other end is fixed to the conditioner body 210, forming a stable triangular support structure, effectively dispersing vibration, and ensuring conditioning accuracy. By optimizing the structure of the bracket 300, the durability and reliability of the overall device are improved, ensuring long-term stable operation. Alternatively, the bracket 310 can be fixed to the workbench through the rack, and firmly connected to the workbench through bolts or other fasteners to ensure that the bracket 300 does not displace during conditioning.

[0043] Further, the conditioner 200 is provided with a pressure detection unit for detecting the pressure applied by the conditioning surface to the polishing surface. Alternatively, the degree of conditioning can be adjusted by adjusting the pressure applied by the conditioning surface to the polishing surface, and the size of the pressure can be adjusted by adjusting the height of the conditioner 200. Alternatively, the side of the bracket 300 away from the conditioner 200 is connected to the lifting mechanism, and the height of the conditioner 200 can be adjusted by adjusting the lifting mechanism. Alternatively, the lifting mechanism includes a pneumatic cylinder, and the bracket 300 is connected to the output end of the pneumatic cylinder, and the height of the bracket 300 is adjusted by the upward or downward movement of the output end. By accurately controlling the pressure and height, the conditioning process is ensured to be efficient and uniform, prolonging the service life of the polishing pad 100. In addition, the pressure detection unit provides real-time feedback data, which facilitates the operator to adjust in time, optimizes the conditioning effect, and improves the overall work efficiency. Alternatively, the pressure detection unit can be a pressure sensor, which is connected to the control unit through a data transmission system to monitor and adjust the conditioning pressure in real time, ensuring the conditioning accuracy.

[0044] In actual conditioning process, the vibration of the polishing pad 100 often causes severe wear of the outer ring, which in turn affects the uniformity of the wafer thickness after polishing. In order to solve this problem, in some embodiments, the conditioning surface is an inclined surface, which is inclined away from the polishing surface along the radial direction of the polishing surface from the center of the polishing surface to the direction away from the center. That is, the pressure applied by the conditioner 200 to the polishing surface gradually decreases. By using this method, the problem of severe wear of the outer ring caused by vibration of the polishing pad 100 can be improved, the uniformity of the wafer thickness after polishing is ensured, and the surface quality and processing precision of the wafer are improved.

[0045] In some other embodiments, the dressing surface is a stepped surface, and the pressure applied by the dresser 200 to the polishing surface is distributed in a stepped manner and gradually decreases along the radial direction of the polishing surface from the center of the polishing surface to the direction away from the center. For example, the dressing surface is divided into three parts along the radial direction of the polishing surface from the center of the polishing surface to the direction away from the center, and the three parts are gradually away from the polishing surface, so that the pressure applied by the dressing surface to the polishing surface gradually decreases in stages, ensuring that the wear degree of each area of the polishing surface is consistent, thereby improving the overall polishing quality of the wafer. By adopting this structure, the dresser 200 can achieve uniform wear in different areas, effectively prolong the service life of the polishing pad 100, and at the same time improve the flatness and smoothness of the wafer surface, thereby ensuring the quality and performance of the final product. Of course, the dressing surface can also be divided into four, five or six parts, etc., and the specific setting can be made according to the use needs.

[0046] The above merely describes the preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A polishing pad conditioning apparatus, the polishing pad (100) comprising a polishing surface and a plurality of annular grooves (110), the grooves (110) being located on the polishing surface and a plurality of the grooves (110) being concentrically distributed, characterized in that, The polishing pad trimming device comprises: The trimmer (200) comprises a trimmer body (210) and a plurality of trimming protrusions (220), the surface of the trimmer body (210) towards the surface of the polishing pad (100) is a trimming surface, the trimming surface is provided with a first trimming layer (211), and the surface of each trimming protrusion (220) is provided with a second trimming layer (221), the first trimming layer (211) is used for trimming the polishing surface, and a plurality of second trimming layers (221) and the grooves (110) are in one-to-one correspondence.

2. The polishing pad conditioning apparatus of claim 1, wherein, The first trimming layer (211) and the second trimming layer (221) are both diamond particle layers, and the particle size of the diamond particles in the first trimming layer (211) is greater than the particle size of the diamond particles in the second trimming layer (221).

3. The polishing pad conditioning apparatus of claim 1, wherein, The width of the trimming protrusion (220) is 1 / 3 of the width of the groove (110).

4. The polishing pad conditioning apparatus of claim 1, wherein, The outer side of the second trimming layer (221) is provided with at least one metal layer.

5. The polishing pad conditioning apparatus of claim 1, wherein, The shape of the trimming surface is rectangular.

6. The polishing pad conditioning apparatus of claim 1, wherein, The length of the trimming surface is equal to the radius of the polishing surface, and the axis of the length direction of the trimming surface coincides with the radial direction of the polishing surface.

7. The polishing pad conditioning device of claim 1, wherein, The polishing pad trimming device further comprises a support (300), one side of the trimmer body (210) away from the trimming surface is connected with the support (300), and the support (300) is connected with a workbench.

8. The polishing pad conditioning apparatus of claim 1, wherein, A pressure detection unit is arranged on the trimmer (200), and the pressure detection unit is used for detecting the pressure applied by the trimming surface to the polishing surface.

9. The polishing pad conditioning apparatus of claim 1, wherein, The trimming surface is an inclined surface, and along the radial direction of the polishing surface from the center of the polishing surface to the direction away from the center, the trimming surface is inclined away from the polishing surface.

10. The polishing pad conditioning device of any of claims 1-9, wherein, The trimming surface is a stepped surface, and along the radial direction of the polishing surface from the center of the polishing surface to the direction away from the center, the pressure applied by the trimmer (200) to the polishing surface is distributed in a stepped manner and gradually decreases.

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