Clamping mechanism of semiconductor frame

Abstract

The utility model discloses a clamping mechanism for a semiconductor frame. The clamping mechanism comprises an upper mounting rack, a pair of first swing arms, a guide rod, a lower mounting rack, a pair of second swing arms and a driving mechanism, wherein the pair of first swing arms are arranged on the two sides of the upper mounting frame and hinged to the upper mounting frame; the upper mounting frame is in sliding connection with the guide rod; the lower mounting frame is fixedly connected with the guide rod; the pair of second swing arms are arranged on the two sides of the lower mounting frame and hinged to the lower mounting frame and the pair of first swing arms respectively. Clamping jaws are arranged at the lower ends of the second swing arms; the driving mechanism is fixedly connected with the lower mounting frame, and the output end of the driving mechanism is connected with the upper mounting frame and can drive the upper mounting frame to move up and down along the guide rods. The clamping device can meet the requirement for clamping frames of multiple models, high-speed and high-precision feeding and discharging operation is achieved, the stability in the carrying process is improved, and the production efficiency and the detection accuracy are effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to clamping mechanism technical field, especially a clamping mechanism of semiconductor frame. BACKGROUND

[0002] With the rapid development of semiconductor industry, the performance and reliability of chips are constantly rising. As a key link in chip manufacturing, semiconductor packaging is an important checkpoint to ensure product quality. Traditional manual feeding and discharging is low in efficiency and poor in precision, which is difficult to meet the needs of large-scale production. Especially in the stacking mode of the spring clip type of post-molding material, there is obvious difference from the traditional lead frame feeding and discharging, and a structure capable of meeting the automatic feeding and discharging of this stacking is needed to solve the problem of easy vacuum breakage of the extremely thin and hollow material sheet sucked by the ordinary suction nozzle, so as to realize the stable feeding and discharging function. SUMMARY

[0003] According to the utility model embodiment, a clamping mechanism of semiconductor frame is provided, which comprises:

[0004] an upper mounting frame;

[0005] a pair of first swing arms, which are arranged on both sides of the upper mounting frame and are hinged to the upper mounting frame;

[0006] a guide rod, which is slidingly connected to the upper mounting frame;

[0007] a lower mounting frame, which is fixedly connected to the guide rod;

[0008] a pair of second swing arms, which are arranged on both sides of the lower mounting frame and are hinged to the lower mounting frame and the pair of first swing arms respectively;

[0009] the lower end of the second swing arm is provided with a clamping jaw;

[0010] a driving mechanism, which is fixedly connected to the lower mounting frame and has an output end connected to the upper mounting frame, and can drive the upper mounting frame to move up and down along the guide rod.

[0011] Further, one end of the second swing arm is provided with a pair of first small arms, and the other end is provided with a second small arm; the pair of first small arms are hinged to the first swing arm, and the second small arm is connected to the clamping jaw.

[0012] Further, the utility model also comprises a right-angle adjusting frame and a pair of manual screws, and the right-angle adjusting frame is detachably connected to the second small arm and the clamping jaw through the pair of manual screws.

[0013] Further, a pair of long holes are arranged on the right-angle adjusting frame, a plurality of first adjusting holes are arranged on the second small arm, and a plurality of second adjusting holes are arranged on the clamping jaw; the position of the clamping jaw can be adjusted by adjusting the position between the plurality of first adjusting holes, the plurality of second adjusting holes and the pair of long holes.

[0014] Further, a sliding table is arranged on the right-angle adjusting frame, and a sliding groove is arranged at the lower end of the second arm.

[0015] Further, a guide sleeve is arranged between the upper mounting frame and the guide rod.

[0016] Further, the driving mechanism is a cylinder.

[0017] The clamping mechanism of the semiconductor frame can meet the clamping of multiple models of frames, realizes high-speed and high-precision feeding and discharging operation, improves stability in the conveying process, and effectively improves production efficiency and detection accuracy.

[0018] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology claimed. BRIEF DESCRIPTION OF DRAWINGS

[0019] Fig. 1 is a perspective view according to an embodiment of the present application;

[0020] Fig. 2 is a position diagram of the upper mounting frame, the first swing arm, the second swing arm and the clamping jaw according to an embodiment of the present application;

[0021] Fig. 3 is an exploded view according to an embodiment of the present application. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present application will be described in detail below with reference to the accompanying drawings, and the present application will be further described.

[0023] Firstly, the clamping mechanism of the semiconductor frame according to an embodiment of the present application will be described. Figs. 1-3 The clamping mechanism of the semiconductor frame according to an embodiment of the present application is used for clamping a semiconductor frame, and has a wide application scenario.

[0024] As shown in Figs. 1-3 the clamping mechanism of the semiconductor frame according to an embodiment of the present application comprises:

[0025] an upper mounting frame 1;

[0026] a pair of first swing arms 2, which are arranged on both sides of the upper mounting frame 1 and are hinged to the upper mounting frame 1;

[0027] a guide rod 3, which is slidingly connected to the upper mounting frame 1;

[0028] a lower mounting frame 4, which is fixedly connected to the guide rod 3;

[0029] A pair of second swing arms 5 are arranged on both sides of the lower mounting frame 4 and are respectively hinged with the lower mounting frame 4 and the pair of first swing arms 2;

[0030] The lower end of the second swing arm 5 is provided with a clamping jaw 6, and a hook-shaped part is arranged on the clamping jaw 6, which is used for preventing the semiconductor frame from falling off;

[0031] A driving mechanism 7 is fixedly connected with the lower mounting frame 4, and the output end thereof is connected with the upper mounting frame 1, so as to drive the upper mounting frame 1 to move up and down along the guide rod 3.

[0032] Further, as shown in the drawings, Figs. 1-2 in the embodiment, one end of the second swing arm 5 is provided with a pair of first small arms 51, and the other end is provided with a second small arm 52; the pair of first small arms 51 are hinged with the first swing arm 2, and the second small arm 52 is connected with the clamping jaw 6.

[0033] Further, as shown in the drawings, Figs. 1-3 in the embodiment, a right-angle adjusting frame 8 and a pair of manual screws are further included, and the right-angle adjusting frame 8 is detachably connected with the second small arm 52 and the clamping jaw 6 through the pair of manual screws.

[0034] Further, as shown in the drawings, Figs. 1-3 in the embodiment, a pair of long holes 81 are arranged on the right-angle adjusting frame 8, a plurality of first adjusting holes 521 are arranged on the second small arm 52, and a plurality of second adjusting holes 61 are arranged on the clamping jaw 6; the position of the clamping jaw 6 can be adjusted by adjusting the position between the plurality of first adjusting holes 521, the plurality of second adjusting holes 61 and the pair of long holes 81, so as to adapt to different models of semiconductor frames.

[0035] Further, as shown in the drawings, Figs. 1-2 in the embodiment, a sliding table 82 is arranged on the right-angle adjusting frame 8, and a sliding groove 522 is arranged at the lower end of the second small arm 52; the sliding table 82 is slidingly arranged in the sliding groove 522, so as to facilitate the adjustment of the position of the right-angle adjusting frame 8 on the second small arm 52.

[0036] Further, as shown in the drawings, Fig. 3 in the embodiment, a guide sliding sleeve 10 is arranged between the upper mounting frame 1 and the guide rod 3, which is used for reducing the friction between the upper mounting frame 1 and the guide rod 3.

[0037] Further, as shown in the drawings, Fig. 3 in the embodiment, the driving mechanism 7 is a gas cylinder.

[0038] Working principle: first, according to the semiconductor frame type to adjust the position of the jaw 6 on the second arm 52; then, the manipulator moves the jaw 6 to the designated position, the driving mechanism 7 drives the upper mounting frame 1 to move upward, the upper mounting frame 1 drives the first swing arm 2 and the second swing arm 5 to move, the second swing arm 5 drives the jaw 6 to clamp the semiconductor frame; then the manipulator drives the semiconductor frame to move to the designated position, the driving mechanism 7 drives the jaw 6 to open, and the semiconductor frame is put down.

[0039] The above, with reference to Figs. 1-3 The clamping mechanism of the semiconductor frame according to the embodiments of the utility model is described, which can meet the clamping of multiple type frames, realizes high-speed and high-precision feeding and discharging operation, improves stability in the conveying process, and effectively improves production efficiency and detection accuracy.

[0040] It should be noted that in the present specification, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or equipment. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0041] Although the content of the utility model has been introduced in detail by the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and alternatives of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the appended claims.

Claims

1. A clamping mechanism of a semiconductor frame, characterized by, The utility model relates to a kind of automatic feeding device for seedling transplanting, including: Upper mounting frame; A pair of first swing arms, a pair of the first swing arms are arranged on both sides of the upper mounting frame, and are hinged with the upper mounting frame; Guide rod, the upper mounting frame is slidably connected with the guide rod; Lower mounting frame, the lower mounting frame is fixedly connected with the guide rod; A pair of second swing arms, the pair of second swing arms are arranged on both sides of the lower mounting frame, and are respectively hinged with the lower mounting frame, a pair of the first swing arms; The second swing arm lower end is provided with clamping jaw; Driving mechanism, the driving mechanism is fixedly connected with the lower mounting frame, and its output end is connected with the upper mounting frame, and the upper mounting frame can be driven to move up and down along the guide rod.

2. The clamping mechanism of a semiconductor frame according to claim 1, wherein The second swing arm one end is provided with a pair of first small arms, and the other end is provided with second small arm;A pair of the first small arms are hinged with the first swing arm, and the second small arm is connected with the clamping jaw.

3. The clamping mechanism of claim 2, wherein the clamping mechanism is configured to clamp the semiconductor frame between the first and second clamping members. Also include: right-angle adjusting frame and a pair of hand screws, the right-angle adjusting frame is detachably connected with the second small arm, the clamping jaw respectively through a pair of the hand screws.

4. The clamping mechanism of claim 3, wherein The right-angle adjusting frame is provided with a pair of long holes, the second small arm is provided with a plurality of first adjusting holes, and the clamping jaw is provided with a plurality of second adjusting holes;The position of the clamping jaw can be adjusted by adjusting the position between a plurality of the first adjusting holes, a plurality of the second adjusting holes and a pair of the long holes.

5. The clamping mechanism of claim 3, wherein The right-angle adjusting frame is provided with slide table, and the second small arm lower end is provided with sliding slot, and the slide table is slidably arranged in the sliding slot.

6. The clamping mechanism of claim 1, wherein, The upper mounting frame is provided with guide sleeve between the guide rod.

7. The clamping mechanism of claim 1, wherein, The driving mechanism is air cylinder.

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