Server with data encryption function
By introducing a heat dissipation system consisting of a cooling box, heat conduction plate, and cooling chamber into the server, and utilizing the cooling effect of coolant circulation and semiconductor refrigeration chips, the problem of uneven heat dissipation on the server motherboard is solved, achieving a highly efficient heat dissipation effect and improving the performance of electronic components.
Patent Information
- Application Number
- CN202520067646.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-01-13
AI Technical Summary
Traditional air-cooling systems cannot provide sufficient and uniform airflow for server motherboards with complex encryption modules, resulting in excessively high temperatures in certain areas and affecting the performance of electronic components.
The heat dissipation mechanism consists of a cooling box, heat conduction plate, cooling chamber, heat pipe, connecting pipe, pump, semiconductor refrigeration chip and heat sink fins. It achieves efficient heat dissipation of the motherboard through coolant circulation and the cooling effect of semiconductor refrigeration chip.
It effectively reduces motherboard temperature, improves the performance of electronic components, and ensures stable server operation.
Smart Images
Figure CN223808677U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to server technical field, concretely is a kind of server with data encryption function. BACKGROUND
[0002] In today's digital information rapid development era, data security becomes the most important in all industries. The server with data encryption function emerges as the times require, aims at protecting sensitive information stored in the server of enterprise, organization and personal user from being stolen and tampered.
[0003] Based on the above, the present inventor found that the following problems exist: the server mainboard is the core bearing platform of the whole system, integrates many key electronic components such as CPU, memory controller, chipset, etc. These components will generate a large amount of heat in the process of high-speed and continuous data processing. The traditional air cooling system is limited by the internal space layout of the case, and cannot provide sufficient and uniform cold air flow for the mainboard installed with complex encryption modules, so that the temperature of some areas of the mainboard is too high, which still affects the performance of various electronic components integrated thereon.
[0004] Therefore, in view of the above, the existing structure and defects are improved, and a server with data encryption function is provided to achieve the purpose of having more practical value. CONTENT OF THE UTILITY MODEL
[0005] The utility model aims at providing a kind of server with data encryption function to solve the problems raised in the above background.
[0006] By adopting the above technical scheme, the server mainboard with data encryption function can be cooled, and the performance of various electronic components integrated thereon can be improved.
[0007] In view of the above problems, the technical scheme provided by the utility model is as follows:
[0008] A server with data encryption function includes a main body and a cooling mechanism. The main body includes an encryption server body, an installation slot is formed in the upper end face of the encryption server body, a mainboard is arranged at the bottom end of the installation slot in the encryption server body, the cooling mechanism includes a mounting frame, a cooling box is installed at the bottom end of the mounting frame, the cooling box is inserted into the installation slot, a heat-conducting plate is installed at the bottom end of the cooling box, the bottom end of the heat-conducting plate abuts against one side of the mainboard, a cooling box is installed at the upper end of the mounting frame, a plurality of water guide plates are installed at both sides of the cooling box, the water guide plates are staggered between the two sides, and a semiconductor refrigeration sheet is installed at the upper end of the cooling box.
[0009] Further, the bottom end of the interior of the cooling box is inserted with a plurality of heat pipes, and the bottom end of the plurality of heat pipes is connected with the top end of the heat conduction plate.
[0010] The beneficial effect of the above further scheme is that the heat on the heat conduction plate can be continuously transferred up by the heat pipes, and the heat at the top end of the heat pipes is taken away by the continuously flowing cooling liquid, thereby promoting the heat conduction effect.
[0011] Further, the two sides of the cooling box are respectively inserted with a first connecting pipe and a second connecting pipe, one end of the first connecting pipe and the second connecting pipe extends through the mounting bracket to the interior and is respectively connected with the two sides of the cooling box.
[0012] The beneficial effect of the above further scheme is that by installing the first connecting pipe and the second connecting pipe, one end of which is connected with the two sides of the cooling box, the cooling liquid in the cooling box and the cooling tank can circulate.
[0013] Further, a pump is installed on one side of the interior of the cooling box, and the output end of the pump is connected with one end of the first connecting pipe through a pipeline.
[0014] The beneficial effect of the above further scheme is that by installing the pump, the cooling liquid in the cooling box can be pumped into the cooling tank for cooling when the pump is working.
[0015] Further, the upper end of the semiconductor refrigeration sheet is provided with a plurality of heat dissipation fins, and a pair of heat dissipation fans is inserted between the plurality of heat dissipation fins.
[0016] The beneficial effect of the above further scheme is that by installing the heat dissipation fins, the heat dissipation effect of the hot end of the semiconductor refrigeration sheet can be improved, and by installing the heat dissipation fans, the cooling effect of the hot end of the semiconductor refrigeration sheet can be further improved, thereby promoting the cooling effect of the cold end on the cooling liquid.
[0017] Further, the interiors of the cooling box and the cooling tank are filled with cooling liquid.
[0018] The beneficial effect of the above further scheme is that by filling the cooling liquid in the interiors of the cooling box and the cooling tank, the heat in the cooling box can be taken away when the cooling liquid circulates, and cooled in the interior of the cooling tank.
[0019] Further, handles are installed on both ends of one side of the encryption server body, and foot screws are installed on the four corners of the bottom end of the encryption server body.
[0020] The beneficial effect of the above further scheme is that by installing the handles, the encryption server body can be easily pulled out or moved, and by installing the foot screws, the encryption server body can be easily supported.
[0021] The beneficial effects of this utility model are as follows: This utility model provides a server with data encryption function through the above design. This server, with data encryption function, has an installation slot on the upper surface of the encryption server body, and the motherboard of the encryption server body is placed at the bottom of the installation slot. After the cooling box is inserted into the installation slot, the bottom of the heat-conducting plate installed at its bottom is in contact with the back of the motherboard. When the heat generated by the various electronic components on the motherboard is transferred to the motherboard, it is transferred to the interior of the cooling box through the heat-conducting plate, thereby cooling the motherboard and improving the performance of the various electronic components integrated on the motherboard. By installing several staggered water guide plates on both sides of the interior of the cooling box, the coolant flows within the staggered water guide plates after entering the cooling box, which prolongs its flow time and allows for better cooling by the semiconductor cooling chip. This allows the cooling water to exchange between the cooling boxes, transferring the heat from the motherboard. Attached Figure Description
[0022] Figure 1 This is a three-dimensional structural diagram of a server with data encryption function disclosed in an embodiment of the present invention. Figure 1 ;
[0023] Figure 2 This is a three-dimensional structural diagram of a server with data encryption function disclosed in an embodiment of the present invention. Figure 2 ;
[0024] Figure 3 This is a schematic diagram of the unfolded three-dimensional structure of a server with data encryption function disclosed in an embodiment of this utility model.
[0025] Figure 4 This is a three-dimensional structural diagram of the internal structure of the cooling box of a server with data encryption function disclosed in an embodiment of the present utility model.
[0026] Figure 5 This is a side cross-sectional view of the cooling box structure of a server with data encryption function disclosed in an embodiment of this utility model.
[0027] In the diagram: 100, main body; 1001, encryption server body; 1002, handle; 1003, foot; 1004, mounting slot; 200, heat dissipation mechanism; 2001, mounting bracket; 2002, cooling box; 2003, semiconductor refrigeration chip; 2004, cooling fan; 2005, cooling box; 2006, heat conduction plate; 2007, water guide plate; 2008, first connecting pipe; 2009, second connecting pipe; 2010, heat pipe; 2011, pump. Detailed Implementation
[0028] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0029] Please refer to Figure 1 - Figure 5 The utility model provides a technical scheme: a kind of server with data encryption function, including main body 100 and heat dissipation mechanism 200, the main body 100 includes encryption server body 1001, the upper end surface of encryption server body 1001 is equipped with installation slot 1004, the inside of encryption server body 1001 is located the bottom end of installation slot 1004 and is equipped with mainboard, the heat dissipation mechanism 200 includes mounting bracket 2001, cooling tank 2005 is installed in the bottom end of mounting bracket 2001, cooling tank 2005 is inserted with installation slot 1004, cooling tank 2005 is installed with heat conduction plate 2006 in the bottom end, the bottom end of heat conduction plate 2006 is in contact with the side of mainboard, the upper end of mounting bracket 2001 is installed with cooling tank 2002, the inside of cooling tank 2002 is installed with a plurality of water guide plates 2007 in both sides, a plurality of water guide plates 2007 are staggered between both sides, the upper end of cooling tank 2002 is installed with semiconductor refrigeration piece 2003, by being equipped with installation slot 1004 in the upper end surface of encryption server body 1001, and the mainboard of encryption server body 1001 is set in the bottom end of installation slot 1004, after cooling tank 2005 is inserted into the inside of installation slot 1004, the bottom end of heat conduction plate 2006 installed in its bottom end is in contact with the back of mainboard, when the heat generated when various electronic components on mainboard run is transferred to mainboard, by heat conduction plate 2006 is transferred to the inside of cooling tank 2005, to cool and heat radiate mainboard, improve the performance of various electronic components integrated on mainboard, by being installed with a plurality of staggered water guide plates 2007 in both sides of cooling tank 2002 inside, after cooling liquid enters the inside of cooling tank 2002, flow in the staggered water guide plates 2007 inside, can prolong its flow time, is better by semiconductor refrigeration piece 2003 cooling, to make cooling water exchange between cooling tank 2002 and cooling tank 2005, transfer heat on mainboard.
[0030] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0031] Please refer to Figure 1 - Figure 5 The bottom end of the cooling box 2005 is inserted with a plurality of heat pipes 2010, the bottom end of the plurality of heat pipes 2010 is connected with the top end of the heat conduction plate 2006, the two sides of the cooling box 2002 are respectively inserted with a first connecting pipe 2008 and a second connecting pipe 2009, one end of the first connecting pipe 2008 and the second connecting pipe 2009 extends to the inside through the mounting frame 2001 and is connected with the two sides of the cooling box 2005 respectively, a pump 2011 is installed on one side of the inside of the cooling box 2005, the output end of the pump 2011 is connected with one end of the first connecting pipe 2008 through a pipeline, the upper end of the semiconductor refrigeration sheet 2003 is provided with a plurality of heat dissipation fins, and a pair of heat dissipation fans 2004 is inserted between the plurality of heat dissipation fins, the inside of the cooling box 2005 and the cooling box 2002 is filled with cooling liquid, the bottom end of the cooling box 2005 is inserted with a plurality of heat pipes 2010, the bottom end of the cooling box 2005 is connected with the top end of the heat conduction plate 2006, the heat on the heat conduction plate 2006 can be continuously transmitted to the heat pipes 2010, the heat at the top end of the heat pipes 2010 is taken away by the continuously flowing cooling liquid, so as to promote the heat conduction effect, the first connecting pipe 2008 and the second connecting pipe 2009 are installed, one end of the first connecting pipe 2008 and the second connecting pipe 2009 is connected with the two sides of the cooling box 2005, so that the cooling liquid in the cooling box 2005 and the cooling box 2002 can circulate, the pump 2011 is installed, when the pump 2011 works, the cooling liquid in the cooling box 2005 can be pumped into the cooling box 2002 to cool, the heat dissipation fins are installed, the heat dissipation effect of the hot end of the semiconductor refrigeration sheet 2003 can be improved, the heat dissipation fan 2004 is installed, the cooling effect of the hot end of the semiconductor refrigeration sheet 2003 can be further improved, the cooling effect of the cooling liquid by the cold end is promoted, the cooling liquid is filled in the cooling box 2005 and the cooling box 2002, when the cooling liquid circulates, the heat in the cooling box 2005 can be taken away and cooled in the cooling box 2002.
[0032] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0033] Please refer to Figure 1 - Figure 5 One side of the encryption server body 1001 is provided with a handle 1002 at both ends, and the bottom corners of the encryption server body 1001 are provided with foot screws 1003. By installing the handle 1002, the encryption server body 1001 can be conveniently pulled out or moved. By installing the foot screw 1003, the encryption server body 1001 can be conveniently supported.
[0034] Specifically, the working principle of the server with data encryption function: in use, first, the server with data encryption function is placed in a suitable working environment, and is stably supported through the foot 1003 at the bottom of the four corners of the encryption server body 1001; when the encryption server body 1001 starts, the CPU, chip set and other electronic elements on the mainboard begin to run at high speed, generating a large amount of heat; the heat is conducted to the heat conduction plate 2006 through the mainboard, the heat conduction plate 2006 transmits the heat to the inside of the cooling box 2005, at the same time, the several heat pipes 2010 inserted at the bottom end of the cooling box 2005, with the bottom end connected with the top end of the heat conduction plate 2006, further transmit the heat on the heat conduction plate 2006 upwards, so that the heat is quickly dispersed to the cooling liquid in the cooling box 2005; the pump 2011 in the cooling box 2005 is started, and the cooling liquid is pumped to the first connecting pipe 2008 through the pipeline; since one end of the first connecting pipe 2008 penetrates the mounting frame 2001 and is connected with one side of the cooling box 2002, the cooling liquid flows into the cooling box 2002; in the cooling box 2002, the cooling liquid slowly flows between the staggered water guide plates 2007, prolonging the residence time of the cooling liquid in the low-temperature environment; at this time, the semiconductor refrigeration piece 2003 installed at the upper end of the cooling box 2002 works, its cold end refrigerates and cools the cooling liquid, and its hot end is cooled through the heat dissipation fins and the heat dissipation fan 2004, ensuring the refrigeration effect of the semiconductor refrigeration piece 2003; the cooling liquid cooled by the semiconductor refrigeration piece 2003 is cooled in temperature, flows back to the cooling box 2005 through the second connecting pipe 2009, and exchanges heat with the high-temperature cooling liquid in the cooling box 2005; in this way, the cooling liquid is circulated between the cooling box 2005 and the cooling box 2002, continuously taking out and dissipating the heat generated by the mainboard, maintaining the mainboard in a suitable temperature range, and ensuring the stable operation of the mainboard of the encryption server body 1001; when it is necessary to maintain or move the server, the server can be conveniently pulled out or moved through the handles 1002 at the two ends of one side of the encryption server body 1001.
Claims
1. A server having a data encryption function, characterized by comprising: The utility model relates to a kind of encryption server cooling device, including main body (100) and heat dissipation mechanism (200), the main body (100) includes encryption server body (1001), the upper end surface of encryption server body (1001) is equipped with installation slot (1004), the inside of encryption server body (1001) is located the bottom end of installation slot (1004) and is equipped with mainboard, the heat dissipation mechanism (200) includes mounting bracket (2001), the bottom end of mounting bracket (2001) is equipped with cooling box (2005), cooling box (2005) is inserted with installation slot (1004), the bottom end of cooling box (2005) is equipped with heat conduction plate (2006), the bottom end of heat conduction plate (2006) is located with the side of mainboard, the upper end of mounting bracket (2001) is equipped with cooling tank (2002), the inside of cooling tank (2002) both sides is equipped with a plurality of water guide plate (2007), a plurality of water guide plate (2007) between both sides are staggered, the upper end of cooling tank (2002) is equipped with semiconductor refrigeration sheet (2003).
2. The server with data encryption function according to claim 1, characterized in that, The inside bottom end of cooling box (2005) is equipped with a plurality of heat pipes (2010), and the bottom end of a plurality of heat pipes (2010) is connected with the top end of heat conduction plate (2006).
3. The server with data encryption function according to claim 1, characterized in that, The both sides of cooling tank (2002) are respectively inserted with first connecting pipe (2008) and second connecting pipe (2009), and one end of first connecting pipe (2008) and second connecting pipe (2009) is extended to the inside through mounting bracket (2001) and is connected with the both sides of cooling box (2005) respectively.
4. The server with data encryption function according to claim 3, characterized in that, The inside one side of cooling box (2005) is equipped with pump (2011), and the output end of pump (2011) is connected with one end of first connecting pipe (2008) through pipeline.
5. The server with data encryption function according to claim 1, characterized in that, The upper end of semiconductor refrigeration sheet (2003) is equipped with a plurality of heat dissipation fins, and a pair of heat dissipation fans (2004) is inserted between a plurality of heat dissipation fins.
6. The server with data encryption function according to claim 1, characterized in that, The inside of cooling box (2005) and cooling tank (2002) is filled with cooling liquid.
7. The server with data encryption function according to claim 1, characterized in that, The both ends of one side of encryption server body (1001) are equipped with handle (1002), and the bottom end of encryption server body (1001) is equipped with footing (1003) in four corners.