Heat dissipation structure of air-cooled case

Abstract

The utility model discloses a heat dissipation structure of an air cooling case, which comprises a case body and an air guide assembly, a plurality of air inlet holes are formed in one side wall of the case body, and a plurality of air outlet holes are formed in the top of the case body; the air guide assembly comprises an air guide plate, the air guide plate is arranged in the box body so as to divide an air guide space and a containing space from bottom to top in the box body, the air guide space is communicated with the air inlet hole, the containing space is communicated with the air outlet hole, the height of the air guide space is gradually reduced in the air flow direction, and the height of the containing space is gradually reduced in the air flow direction. And a distance is formed between the tail end of the air guide plate and the other side wall of the box body, so that an overflowing opening communicated with the air guide space and the accommodating space is formed. Compared with the prior art, the heat dissipation structure of the air-cooled case has the beneficial effects that the heat dissipation structure of the air-cooled case can concentrate air quantity to blow and dissipate heat of an electronic device, and the air pressure is enhanced, the air speed is increased and the heat dissipation effect of the electronic device is improved by utilizing the structure of the air deflector under the same fan condition.

Description

TECHNICAL FIELD

[0001] The utility model relates to a server case technical field especially relates to a forced air cooling case heat dissipation structure. BACKGROUND

[0002] With the gradual enhancement of the performance and power of electronic devices, electronic devices with various functions are modularly integrated in a case, and the electronic devices generate heat when working, resulting in a large heat flux density inside the case, and the inside of the case needs to be cooled.

[0003] A common cooling method is to use air cooling, and the existing forced air cooling case heat dissipation structure (such as the forced air cooling case disclosed in application No. 201620195225.1) uses a suction fan to suck cold air outside the case into the case, exchanges heat with hot air inside the case, and then uses an exhaust fan to exhaust the heat-exchanged hot air. The structure of the front-in and back-out type is used to cool the electronic devices by air, so that the temperature of the electronic devices is maintained within the normal working range. Since the air inlet and the air outlet are on the same horizontal plane, the airflow trajectory is approximately a plane. On the one hand, it is impossible to concentrate the air volume to blow and cool the electronic devices, and on the other hand, under the same fan condition, the air velocity of the airflow inside the case is small, and the cooling effect on the electronic devices is poor. SUMMARY

[0004] The utility model aims at overcoming the above technical deficiencies, and proposes a forced air cooling case heat dissipation structure to solve the technical problems that in the prior art, the air inlet and the air outlet are on the same horizontal plane, the airflow trajectory is approximately a plane, it is impossible to concentrate the air volume to blow and cool the electronic devices, and under the same fan condition, the air velocity of the airflow inside the case is small, and the cooling effect on the electronic devices is poor.

[0005] To achieve the above technical purposes, the technical scheme of the utility model provides a forced air cooling case heat dissipation structure, which comprises:

[0006] A case body, a plurality of air inlet holes are formed in one side wall of the case body, and a plurality of air outlet holes are formed in the top of the case body;

[0007] An air guide assembly, which comprises an air guide plate, the air guide plate is arranged in the case body to divide the case body into an air guide space and a containing space from bottom to top, the air guide space is communicated with the air inlet holes, the containing space is communicated with the air outlet holes, the height of the air guide space gradually decreases along the airflow direction, and the end of the air guide plate and the other side wall of the case body have a spacing to form a flow passage communicating the air guide space and the containing space, and the containing space directly above the flow passage is used to accommodate electronic devices.

[0008] Further, the air guide space has an air inlet section and an air outlet section which are communicated with each other, the height of the air inlet section gradually decreases along the air flow direction, and the height of the air outlet section is equal to the minimum height of the air inlet section.

[0009] Further, the air guide plate comprises a first air guide plate surface, a second air guide plate surface and a third air guide plate surface which are fixedly connected in sequence, the first air guide plate surface is horizontally arranged, the second air guide plate surface is arranged in an inclined manner, and the third air guide plate surface is horizontally arranged, and the end of the third air guide plate surface and the other side wall of the box form the flow passage.

[0010] Further, the connection portions of the first air guide plate surface, the second air guide plate surface and the third air guide plate surface are all in an arc shape.

[0011] Further, the flow passage is located directly below each air outlet hole.

[0012] Further, the air guide assembly further comprises a plurality of air deflectors, each air deflector is arranged in the box and is arranged at the flow passage in the air guide space in a spaced manner along the air flow direction, and the height of each air deflector gradually decreases along the air flow direction in the air guide space.

[0013] Further, the air deflector comprises a first air deflector surface and a second air deflector surface which are fixedly connected, the first air deflector surface is horizontally arranged, and the second air deflector surface is vertically arranged.

[0014] Further, the connection portion of the first air deflector surface and the second air deflector surface is in an arc shape.

[0015] Further, the air guide assembly further comprises a bottom plate, the bottom plate is arranged in the box and is arranged below the air guide plate and each air deflector, and the bottom plate and the air guide plate form the air guide space.

[0016] Further, the air cooling machine box heat dissipation structure further comprises a fan, and the outlet end of the fan is communicated with each air inlet hole to blow air into each air inlet hole.

[0017] Compared with the prior art, the beneficial effects of the air-cooled machine case heat dissipation structure include: in use, external air enters into the air guide space through the air inlets, the cross-sectional area of the first end in the air guide space is set as a, the cross-sectional area of the last end in the air guide space is set as b, a and b have a proportional relationship n, that is, a / b=n, since the height of the air guide space gradually decreases along the airflow direction, that is, a>b, n>1, the inflow speed of the airflow in the air guide space is set as v0, the outflow speed of the airflow in the air guide space is set as v1, according to the fluid mass conservation law, v1=n v0, since n>1, the outflow speed of the airflow in the air guide space is greater than the inflow speed of the airflow in the air guide space, the airflow reaches the flow-through port, the wind speed is significantly increased, and the airflow flows upwards along the flow-through port to blow and radiate heat for the electronic device, the air-cooled machine case heat dissipation structure can concentrate the air volume to blow and radiate heat for the electronic device, and under the same fan condition, the structure of the air guide plate is utilized to enhance the air pressure, improve the wind speed, improve the heat dissipation effect on the electronic device, and save the operation space of the machine case, so that the machine case is miniaturized. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structural schematic view of an air-cooled machine case heat dissipation structure provided by the utility model;

[0019] Figure 2 is a structural schematic view of the relationship between the cross-sectional area of the air guide space and the wind speed of the air-cooled machine case heat dissipation structure provided by the utility model;

[0020] Figure 3 is a structural schematic view of the height relationship of the air guide plates of the air-cooled machine case heat dissipation structure provided by the utility model;

[0021] Figure 4 is a three-dimensional structural schematic view of the air-cooled machine case heat dissipation structure provided by the utility model;

[0022] Figure 5 is a diagram of the airflow loss coefficient of the air-cooled machine case heat dissipation structure provided by the utility model;

[0023] In the drawing: 100 - case body, 110 - air inlet, 120 - air outlet, 130 - air guide space, 131 - air inlet section, 132 - air outlet section, 140 - containing space, 141 - first region, 142 - second region, 150 - flow-through port, 160 - case body, 170 - sealing plate, 200 - air guide assembly, 210 - air guide plate, 211 - first air guide plate surface, 212 - second air guide plate surface, 213 - third air guide plate surface, 214 - flow-through hole, 220 - air guide plate, 221 - first air guide plate surface, 222 - second air guide plate surface, 230 - bottom plate, 300 - back plate, 400 - fan. DETAILED DESCRIPTION

[0024] In order to make the utility model's purpose, technical scheme and advantage more clearly, the following will be further detailed with the utility model combining with the drawings and examples.

[0025] The utility model provides a kind of air cooling machine case heat dissipation structure, its structure as Figure 1 The utility model provides a kind of air cooling machine case heat dissipation structure, its structure as Figure 3 The utility model provides a kind of air cooling machine case heat dissipation structure, its structure as

[0026] In use, external air enters the air guide space 130 along each air inlet hole 110, the cross-sectional area of the first end in the air guide space 130 is set as a, the cross-sectional area of the end in the air guide space 130 is set as b, a and b have a proportional relationship n, i.e. a / b=n, since the height of the air guide space 130 gradually decreases along the airflow direction, i.e. a>b, n>1, the inflow wind speed of the airflow in the air guide space 130 is set as v0, the outflow wind speed of the airflow in the air guide space 130 is set as v1, according to the law of conservation of mass, v1=n v0, since n>1, the outflow wind speed of the airflow in the air guide space 130 is greater than the inflow wind speed of the airflow in the air guide space 130, the airflow reaches the overflow port 150, the wind speed significantly increases, and flows upward along the overflow port 150, the electronic device is blown and cooled by concentrated airflow, the air cooling machine case heat dissipation structure can concentrate airflow to blow and cool the electronic device, and under the same fan condition, the structure of the air guide plate 210 is used to enhance the air pressure, improve the wind speed, improve the heat dissipation effect on the electronic device, and save the operation space of the case, so as to miniaturize.

[0027] As a preferred embodiment, please refer to Figure 1 and Figure 2The air guide space 130 has an air inlet section 131 and an air outlet section 132 which are in communication with each other, the height of the air inlet section 131 gradually decreases along the air flow direction, and the height of the air outlet section 132 is equal to the minimum height of the air inlet section 131. When the cabinet is working, the structure of the air guide space 130 can make the air flow out of the air guide space 130 have a higher pressure drop compared to the air flow into the air guide space 130, so as to accelerate the air flow out of the air guide space 130 to flow to the electronic device.

[0028] As a preferred embodiment, please refer to Figure 2 The air guide plate 210 includes a first air guide plate surface 211, a second air guide plate surface 212 and a third air guide plate surface 213 which are fixedly connected in sequence. The first air guide plate surface 211 is horizontally arranged, the second air guide plate surface 212 is arranged obliquely, and the third air guide plate surface 213 is horizontally arranged. The end of the third air guide plate surface 213 and the other side wall of the cabinet 100 form the flow port 150, so that the height of the air inlet section 131 gradually decreases along the air flow direction, and the height of the air outlet section 132 is equal to the minimum height of the air inlet section 131.

[0029] As a preferred embodiment, please refer to Figure 2 The connecting portions of the first air guide plate surface 211, the second air guide plate surface 212 and the third air guide plate surface 213 are all arc-shaped structures, and the connecting portions of the first air guide plate surface 211, the second air guide plate surface 212 and the third air guide plate surface 213 are rounded. This not only can reduce air flow loss, but also can reduce noise. According to the air flow loss coefficient diagram formula, when it is rounded, the loss coefficient is the smallest, which is K L =0.05.

[0030] As a preferred embodiment, please refer to Figure 2 The flow port 150 is located directly below each air outlet hole 120. The air flow blowing to the electronic device can be directly discharged along each air outlet hole 120 after blowing and heat dissipation to the electronic device, so as to form vertical movement of the air flow.

[0031] As a preferred embodiment, please refer to Figure 2 and Figure 3The air guide assembly 200 further comprises a plurality of air deflecting plates 220, each of which is arranged in the cabinet 100 and is arranged at the flow port 150 along the airflow direction in the air guide space 130, the height of each of the air deflecting plates 220 gradually decreases along the airflow direction in the air guide space 130, and the height of each of the air deflecting plates 220 is sequentially h1, h2, and h3 along the airflow direction in the air guide space 130. Each of the air deflecting plates 220 receives the airflow flowing from the air guide space 130, and the airflow is divided by the stepped height h1>h2>h3, so that the air volume of the front end and the rear end of the electronic device is uniform. Due to the conventional air cooling cabinet heat dissipation structure, the air volume cannot uniformly blow to each position of the electronic device. The air cooling cabinet heat dissipation structure can divide the airflow by using each of the air deflecting plates 220, so that the air volume can uniformly blow to each position of the electronic device, solves the problem of uneven air volume in the cabinet, and makes the temperature of the electronic device lowest and the working performance of the electronic device maximized.

[0032] As a preferred embodiment, please refer to Figure 2 and Figure 3 The air deflecting plate 220 comprises a first air deflecting plate surface 221 and a second air deflecting plate surface 222 which are fixedly connected, the first air deflecting plate surface 221 is horizontally arranged, and the second air deflecting plate surface 222 is vertically arranged, so that each of the air deflecting plates 220 can receive the airflow flowing from the air guide space 130, and the airflow is divided by the stepped height of each of the first air deflecting plate surfaces 221.

[0033] As a preferred embodiment, please refer to Figure 5 The connection between the first air deflecting plate surface 221 and the second air deflecting plate surface 222 is in an arc structure, and the connection between the first air deflecting plate surface 221 and the second air deflecting plate surface 222 is rounded. Not only can the air loss be reduced, but also the noise can be reduced. According to the airflow loss coefficient diagram formula, when it is rounded, the loss coefficient is minimum, that is, K L =0.05.

[0034] As a preferred embodiment, please refer to Figure 2 and Figure 3 The air guide assembly 200 further comprises a bottom plate 230, the bottom plate 230 is arranged in the cabinet 100 and is arranged below the air guide plate 210 and each of the air deflecting plates 220, the bottom plate 230 and the air guide plate 210 form the air guide space 130, the bottom plate 230 is used for airflow shaping, and high-pressure gas is generated as soon as possible. The use of the bottom plate 230 can also separate the air guide plate 210, each of the air deflecting plates 220, and the bottom of the cabinet 100, so as to facilitate the maintenance of the air guide plate 210 and each of the air deflecting plates 220 later.

[0035] As a preferred embodiment, refer to Figure 2 and Figure 3 , the air-cooled machine case heat dissipation structure further comprises a back plate 300, the back plate 300 is arranged in the box body 100 and is arranged in the accommodating space 140, so as to divide the first area 141 and the second area 142 which are not communicated with each other in the accommodating space 140, the first area 141 is located directly above the air deflector 210, the second area 142 is located directly above each air deflector 220, the second area 142 is communicated with each air outlet hole 120 and the flow passage 150, the second area 142 is used to accommodate electronic devices, the top of the back plate 300 is fixedly connected with the box body 100, and the bottom of the back plate 300 is fixedly connected with the air deflector 210.

[0036] As a preferred embodiment, refer to Figure 2 and Figure 3 , the air-cooled machine case heat dissipation structure, a plurality of flow holes 214 are formed in the air deflector 210, each flow hole 214 is formed in the second air deflector face 212, and a part of air flow entering the air guide space 130 passes through each flow hole 214 and enters the first area 141 to blow and dissipate heat for the back plate 300.

[0037] As a preferred embodiment, refer to Figure 2 and Figure 3 , the air-cooled machine case heat dissipation structure further comprises a fan 400, and the outlet end of the fan 400 is communicated with each air inlet hole 110, so as to blow air into each air inlet hole 110.

[0038] As a preferred embodiment, refer to Figure 4 , the air-cooled machine case heat dissipation structure, the box body 100 comprises a box body 160 and a sealing plate 170, the box body 160 has a cavity, one side wall of the cavity is provided in an open mode, the sealing plate 170 is detachably arranged at the opening of the cavity to block the opening of the cavity, each air inlet hole 110 is formed in one side wall of the box body 160, and each air outlet hole 120 is formed in the top of the box body 160; the sealing plate 170 is detachably arranged at the opening of the cavity to block the opening of the cavity, so that components in the cavity are in a nearly completely closed state, a stable air duct is formed, and electronic devices can operate efficiently under forced air cooling.

[0039] In order to better understand the present application, the working principle of the technical scheme of the present application will be described in detail in combination with Figure 1 - Figure 5 ​

[0040] In use, the fan 400 is turned on, the fan 400 blows external air into the air guide space 130 through each air inlet hole 110, the cross-sectional area of the front end of the air guide space 130 is set as a, the cross-sectional area of the end of the air guide space 130 is set as b, a and b have a proportional relationship n, that is, a / b=n, because the height of the air inlet section 131 in the air guide space 130 gradually decreases along the airflow direction, the height of the air outlet section 132 is equal to the minimum height of the air inlet section 131, that is, a>b, n>1, the inflow air speed of the airflow in the air guide space 130 is set as v0, the outflow air speed of the airflow in the air guide space 130 is set as v1, according to the fluid mass conservation law, v1=n v0, because n>1, the outflow air speed of the airflow in the air guide space 130 is greater than the inflow air speed of the airflow in the air guide space 130, the airflow reaches the flow port 150, the air speed is significantly increased, and the airflow flows upwards along the flow port 150 to blow concentrated air volume to the electronic device, along the airflow direction in the air guide space 130, the height of each air deflecting plate 220 is set as h1, h2 and h3 in sequence, each air deflecting plate 220 receives the airflow flowing from the air guide space 130, the airflow is divided by the stepped height h1>h2>h3, so that the air volume of the front end and the rear end of the electronic device is uniformized, and the air volume can uniformly blow to each position of the electronic device, the air cooling case heat dissipation structure can concentrate air volume to blow the electronic device, under the condition of the same fan, the structure of the air guide plate 210 is used to enhance the air pressure, improve the air speed, improve the heat dissipation effect of the electronic device, save the operation space of the case, and miniaturize the case.

[0041] The air cooling case heat dissipation structure has the following beneficial effects:

[0042] (1) The air cooling case heat dissipation structure can divide the airflow by each air deflecting plate 220, so that the air volume can uniformly blow to each position of the electronic device, solve the problem of uneven air volume in the case, reduce the temperature of the electronic device to the lowest, and maximize the working performance of the electronic device.

[0043] (2) Because the traditional air cooling case heat dissipation structure has high requirements for the structure size space of the case, the fan and the heat source can be matched to maximize the performance only when the case meets the appropriate size space, the air cooling case heat dissipation structure saves the operation space of the case, miniaturizes the case, and reduces the weight of the equipment.

[0044] (3) The air-cooled machine box heat dissipation structure can concentrate air volume to blow and dissipate heat for electronic devices, and under the same fan condition, the structure of the air guide plate 210 is used to enhance air pressure, improve air speed, and improve the heat dissipation effect on the electronic devices.

[0045] The specific implementation of the present application described above does not constitute a limitation on the scope of protection of the present application. Any other corresponding changes and modifications made in accordance with the technical concept of the present application shall be included in the scope of protection of the present application.

Claims

1. An air-cooled machine case heat dissipation structure, characterized by comprising: The utility model relates to a cabinet, which comprises a plurality of air inlet holes on one side wall and a plurality of air outlet holes on the top; The cabinet further comprises a wind guide assembly, which comprises a wind guide plate arranged in the cabinet to divide the cabinet into a wind guide space and a containing space from bottom to top, the wind guide space being in communication with the air inlet holes, and the containing space being in communication with the air outlet holes, the height of the wind guide space gradually decreasing along the airflow direction, the end of the wind guide plate and the other side wall of the cabinet having a spacing to form a flow passage in communication with the wind guide space and the containing space, and the containing space directly above the flow passage being used to accommodate electronic devices. The wind guide space has an air inlet section and an air outlet section in communication with each other, the height of the air inlet section gradually decreasing along the airflow direction, and the height of the air outlet section being equal to the minimum height of the air inlet section.

2. The air-cooled machine case heat dissipation structure according to claim 1, characterized by, The wind guide plate comprises a first wind guide plate surface, a second wind guide plate surface and a third wind guide plate surface fixedly connected in sequence, the first wind guide plate surface being horizontally arranged, the second wind guide plate surface being obliquely arranged, and the third wind guide plate surface being horizontally arranged, the end of the third wind guide plate surface and the other side wall of the cabinet forming the flow passage.

3. The air-cooled machine case heat dissipation structure according to claim 2, characterized by, The connection of the first wind guide plate surface, the second wind guide plate surface and the third wind guide plate surface is in an arc shape.

4. The air-cooled machine case heat dissipation structure according to claim 3, characterized by, The flow passage is located directly below each air outlet hole.

5. The air-cooled machine box heat dissipation structure according to claim 1, characterized in that, The wind guide assembly further comprises a plurality of air deflector plates, each air deflector plate being arranged in the cabinet and being arranged at the flow passage along the airflow direction in the wind guide space, and the height of each air deflector plate gradually decreasing along the airflow direction in the wind guide space.

6. The air-cooled machine box heat dissipation structure according to claim 1, characterized in that, The air deflector plate comprises a first air deflector plate surface and a second air deflector plate surface fixedly connected, the first air deflector plate surface being horizontally arranged, and the second air deflector plate surface being vertically arranged.

7. The air-cooled machine case heat dissipation structure according to claim 6, characterized by, The connection of the first air deflector plate surface and the second air deflector plate surface is in an arc shape.

8. The air-cooled machine box heat dissipation structure according to claim 7, characterized in that, The wind guide assembly further comprises a bottom plate arranged in the cabinet and laid below the wind guide plate and each air deflector plate, the bottom plate and the wind guide plate forming the wind guide space.

9. The air-cooled machine case heat dissipation structure according to claim 6, characterized by, The cabinet further comprises a fan, the outlet end of the fan being in communication with each air inlet hole to blow air into each air inlet hole.

10. The air-cooled machine box heat dissipation structure according to claim 1, characterized in that, ​

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