Cold plate heat dissipation device for achieving gas-liquid two-phase heat dissipation for RTX5090 display card
By employing a two-phase gas-liquid cooling system and a split-type hybrid material structure design, combined with shovel-shaped heat exchange enhancement, the problems of low cooling efficiency, uneven temperature, and blockage risk of high-performance graphics cards have been solved, achieving efficient, lightweight, and low-cost cooling performance.
Patent Information
- Application Number
- CN202522672012.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-17
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-12-17
AI Technical Summary
Existing graphics card cooling methods are inefficient, have uneven temperatures, pose a risk of clogging, and are costly and heavy, making it difficult to meet the cooling requirements of high-performance graphics cards.
It adopts the principle of gas-liquid two-phase heat dissipation, combined with a split hybrid material structure and a toothed heat exchange structure. It uses copper to make a cold plate cavity and aluminum heat dissipation cold plate. It achieves efficient heat dissipation through the latent heat of gas-liquid two-phase conversion, and a toothed structure is set inside the cold plate to increase the contact area and avoid blockage.
It achieves efficient and uniform heat dissipation, reduces device weight and cost, improves reliability and lifespan, and meets the heat dissipation requirements of high-performance graphics cards.
Smart Images
Figure CN223808702U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and more specifically, to a cold plate heat dissipation device for achieving gas-liquid two-phase heat dissipation for RTX5090 graphics cards. Background Technology
[0002] As electronic devices, especially high-performance graphics processing units (GPUs) such as the NVIDIA RTX 5090 graphics card, continue to increase in power and performance, their heat generation is increasing dramatically. At the same time, the shrinking chip size is causing heat flux density (power generated per unit area) to soar. Traditional cooling methods are no longer sufficient to meet the growing heat dissipation demands of high-power, high-heat-flux-density electronic devices.
[0003] Currently, the main cooling methods for high-performance graphics cards include air cooling and single-phase liquid cooling. Air cooling uses a fan to drive airflow, carrying away heat through the base, heat pipes, and fins. However, air cooling has limited efficiency and is difficult to handle extremely high heat flux densities.
[0004] Single-phase liquid cooling uses a single-phase liquid cooling plate, where a pump drives the coolant to flow through channels inside the plate, relying on the increase in the liquid's temperature (sensible heat) to remove heat. Although single-phase liquid cooling is more efficient than air cooling, it has inherent physical limitations. First, its heat dissipation capacity mainly depends on the liquid's flow rate and specific heat capacity; to remove more heat, the flow rate needs to be increased, leading to increased pump power consumption and system pressure. Second, the liquid temperature continuously rises from inlet to outlet, resulting in uneven cooling efficiency on the chip surface, creating a temperature gradient, and making it difficult to efficiently handle localized hot spots.
[0005] Furthermore, to improve efficiency, single-phase liquid-cooled cold plates typically employ a microchannel design to increase the heat exchange area. However, microchannel structures are complex, difficult to manufacture, and prone to clogging, increasing the risk of leakage and resulting in lower system reliability.
[0006] On the other hand, high-performance graphics cards generate a lot of heat not only from the main GPU chip, but also from the surrounding power supply and memory modules. Existing full-coverage heatsink designs are usually made of a single material (such as all copper), which, while ensuring heat dissipation performance, results in a larger overall weight and higher cost.
[0007] Therefore, how to provide a heat dissipation solution with higher heat dissipation efficiency, better temperature uniformity, reliable structure, and a balance between lightweight and cost is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0008] The utility model provides a kind of cold plate heat sink for RTX5090 graphic card realizes gas-liquid two-phase heat dissipation, to at least solve the efficiency of existing heat dissipation scheme in relevant technology is limited, temperature is uneven, there is the risk of plugging and the problems of higher cost and weight. With the development of strategic emerging industries, the chip integration and power density of high-end router, single-slot processing router and other computer equipment, new generation mobile communication base station equipment, digital program-controlled switch and other communication system equipment are increasing. The gas-liquid two-phase heat dissipation and mixed material toothed structure design proposed by the utility model are not only suitable for high-performance graphic card, but also can meet the stringent requirements of high reliability, high heat dissipation efficiency and lightweight in the above fields.
[0009] The utility model provides a kind of cold plate heat sink for RTX5090 graphic card realizes gas-liquid two-phase heat dissipation, to at least solve the efficiency of existing heat dissipation scheme in relevant technology is limited, temperature is uneven, there is the risk of plugging and the problems of higher cost and weight. With the development of strategic emerging industries, the chip integration and power density of high-end router, single-slot processing router and other computer equipment, new generation mobile communication base station equipment, digital program-controlled switch and other communication system equipment are increasing. The gas-liquid two-phase heat dissipation and mixed material toothed structure design proposed by the utility model are not only suitable for high-performance graphic card, but also can meet the stringent requirements of high reliability, high heat dissipation efficiency and lightweight in the above fields.
[0010] Cold plate cavity, made of heat-conducting material, cavity structure for accommodating cooling liquid and realizing gas-liquid two-phase heat exchange is formed inside, the cold plate cavity is suitable for the main chip of the RTX5090 graphic card is attached;
[0011] Left end heat dissipation cold plate and right end heat dissipation cold plate are respectively detachably connected to the left side and the right side of the cold plate cavity, and the left end heat dissipation cold plate and the right end heat dissipation cold plate are suitable for the auxiliary heating components of the RTX5090 graphic card are attached;
[0012] Among them, the cold plate cavity is made of first heat-conducting material, the left end heat dissipation cold plate and the right end heat dissipation cold plate are made of second heat-conducting material, the heat-conducting coefficient of the first heat-conducting material is higher than the heat-conducting coefficient of the second heat-conducting material, and the density of the first heat-conducting material is higher than the density of the second heat-conducting material.
[0013] On the one hand, the cold plate cavity includes:
[0014] Cavity cover plate is provided with liquid inlet hole and air outlet hole, and the liquid inlet hole and the air outlet hole communicate with the cavity structure;
[0015] Cold plate cavity bottom plate is used for contact with the main chip;
[0016] Intermediate support plate is arranged between the cavity cover plate and the cold plate cavity bottom plate.
[0017] On the other hand, the cavity cover plate, the intermediate support plate and the cold plate cavity bottom plate are integrally connected by brazing process.
[0018] On the other hand, the inner surface of the cold plate cavity bottom plate and / or the surface of the intermediate support plate is provided with a plurality of toothed structures, the toothed structure extends into the cavity structure, for increasing the contact area with the cooling liquid.
[0019] In another aspect, the surface of the left end heat dissipation cold plate and the right end heat dissipation cold plate is provided with a plurality of spade tooth structures.
[0020] In another aspect, the parameters of the spade tooth structure include that the spade tooth thickness is 0.3mm, the spade tooth height is 10mm, the spade tooth length is 9mm, the transverse interval between spade teeth is 1.2mm, and the vertical interval between spade teeth is 1mm.
[0021] In another aspect, the first heat conductive material is red copper, and the second heat conductive material is aluminum.
[0022] In another aspect, the liquid inlet hole and the gas outlet hole are both 1 / 4 internal thread holes.
[0023] The liquid inlet hole is used for mounting a PU pipe quick connector with an outer diameter of 4mm and an inner diameter of 2.5mm.
[0024] The gas outlet hole is used for mounting a PU pipe quick connector with an outer diameter of 12mm and an inner diameter of 10mm.
[0025] In another aspect, the bottom of the left end heat dissipation cold plate, the right end heat dissipation cold plate and the middle support plate is designed with an internal thread screw hole station column and a protruding part.
[0026] The internal thread screw hole station column is used for matching and locking with the circuit board of the RTX5090 graphics card.
[0027] The protruding part is used for fitting the auxiliary heating component, and the auxiliary heating component includes a power supply module and a memory module.
[0028] By the utility model, the cold plate cavity for high heat flux density main chip heat dissipation and the left and right end heat dissipation cold plates for low heat flux density auxiliary heating component heat dissipation are separated and combined by adopting split type design. The cold plate cavity adopts the first heat conductive material (such as red copper) with high heat conductivity, and utilizes latent heat of gas-liquid two-phase change to carry out high-efficiency heat dissipation. Compared with single-phase liquid cooling sensible heat dissipation, latent heat greatly improves heat dissipation efficiency and provides excellent isothermality. The left and right end heat dissipation cold plates adopt the second heat conductive material (such as aluminum) with low density and low cost, which meets the heat dissipation demand of auxiliary heating component, and realizes lightweight and cost reduction of the overall device.
[0029] In addition, by setting the spade tooth structure in the cold plate instead of the traditional microchannel structure, the relatively spacious flow channel is provided while the large contact area required for boiling evaporation is ensured, the risk of microchannel blockage and liquid leakage in single-phase liquid cooling is effectively avoided, and the reliability and service life of the heat dissipation device are improved. BRIEF DESCRIPTION OF DRAWINGS
[0030] To make the technical solutions in the embodiments of the present application or the related art clearer, the accompanying drawings needed in the embodiments or the related art description will be briefly introduced below, and obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other accompanying drawings can be obtained by those skilled in the art without creative effort on the premise that the provided accompanying drawings are not creative.
[0031] Figure 1 A structure schematic view of a cold plate heat dissipation device provided by the present application.
[0032] Figure 2 Another structure schematic view of a cold plate heat dissipation device provided by the present application.
[0033] Figure 3 Still another structure schematic view of a cold plate heat dissipation device provided by the present application.
[0034] Reference signs:
[0035] 10-cold plate cavity, 11-cavity cover plate, 12-intermediate support plate, 13-cold plate cavity bottom plate, 20-left end heat dissipation cold plate, 30-right end heat dissipation cold plate, 40-dental structure, 50-internal thread screw hole station column, 51-protruding part. DETAILED DESCRIPTION
[0036] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application, and obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the present application.
[0037] It should be noted that in the description of the present application, the terms "upper", "lower", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0038] The purpose of the present application is to provide an efficient, reliable and economical heat dissipation solution to cope with the extremely high heat flux density challenge brought by high-performance graphics cards such as RTX5090. The present application realizes this purpose by adopting the gas-liquid two-phase heat dissipation principle, combining the innovative split-type mixed material structure and the dental heat exchange enhancement structure.
[0039] Please refer to Figures 1 to 3This utility model embodiment provides a cold plate heat dissipation device for RTX5090 graphics cards to achieve gas-liquid two-phase heat dissipation. Its overall structure adopts a split design, including a cold plate cavity 10, a left end heat dissipation cold plate 20 and a right end heat dissipation cold plate 30.
[0040] The cold plate cavity 10, located in the center of the device, is primarily responsible for cooling the main chip (GPU core) of the RTX 5090 graphics card. The main chip is the area on the graphics card with the highest heat generation and heat flux density. The cold plate cavity 10 forms a cavity structure to hold the coolant. During operation, the coolant absorbs the heat generated by the main chip within the cavity and undergoes a phase change (boiling and evaporation), utilizing the latent heat of the phase change to dissipate a large amount of heat.
[0041] The left-end heat dissipation plate 20 and the right-end heat dissipation plate 30 are located on both sides of the heat dissipation plate cavity 10, and are mainly responsible for dissipating heat from auxiliary heat-generating components on the graphics card, such as the power supply module (VRM) and memory module (VRAM). The heat generated by these components is relatively low compared to the main chip.
[0042] like Figure 1 and Figure 3 As shown, the left-end heat dissipation plate 20 and the right-end heat dissipation plate 30 are detachably combined with the heat dissipation plate cavity 10 by means of screws, forming a complete heat dissipation device covering the main heat-generating areas of the graphics card. This split design facilitates manufacturing, assembly and maintenance.
[0043] One of the core innovations of this invention lies in its hybrid material design. Specifically, the cold plate cavity 10 is made of a first thermally conductive material, while the left-end heat dissipation cold plate 20 and the right-end heat dissipation cold plate 30 are made of a second thermally conductive material. Preferably, the thermal conductivity of the first thermally conductive material is significantly higher than that of the second thermally conductive material to meet the high-efficiency heat dissipation requirements of the main chip; at the same time, the density of the first thermally conductive material is usually also higher than that of the second thermally conductive material.
[0044] In a preferred embodiment, the first thermally conductive material is copper. Copper has excellent thermal conductivity, making it ideal for rapid heat transfer in areas with high heat flux density. The second thermally conductive material is aluminum. While aluminum's thermal conductivity is slightly lower than copper's, it is sufficient to meet the heat dissipation requirements of the power supply module and memory module. Crucially, aluminum has a much lower density than copper and is also less expensive.
[0045] Through this copper-aluminum combined split design, this invention ensures the ultimate heat dissipation performance of the core area (main chip) while significantly reducing the overall weight (lightweighting) and manufacturing cost of the entire heat dissipation device, achieving the best balance between performance, weight and cost.
[0046] Please refer to Figure 3In one embodiment, the cold plate cavity 10 is also composed of multiple components precisely assembled together, including the cavity cover plate 11, the middle support plate 12 and the cold plate cavity bottom plate 13.
[0047] The cavity cover plate 11 is located at the upper part of the cold plate cavity 10, and its side surface (as shown in Figure 1 ) is designed with ports for fluid inlet and outlet. Specifically, the cavity cover plate 11 is provided with a liquid inlet hole and a gas outlet hole, both of which are connected to the internal cavity structure. In one embodiment, both the liquid inlet hole and the gas outlet hole are standard 1 / 4 inner thread holes. The liquid inlet hole is used for injecting liquid coolant, and the gas outlet hole is used for guiding gaseous coolant (steam) out. Since the volume of gaseous fluid is much larger than that of liquid fluid, the size of the connected pipeline is also different. Preferably, the liquid inlet hole can be installed with a PU pipe quick connector with an outer diameter of 4 mm and an inner diameter of 2.5 mm; the gas outlet hole can be installed with a PU pipe quick connector with an outer diameter of 12 mm and an inner diameter of 10 mm.
[0048] The cold plate cavity bottom plate 13 is located at the bottom of the cold plate cavity 10, and its outer surface is used to contact and absorb heat from the main chip of the RTX5090.
[0049] The middle support plate 12 is arranged between the cavity cover plate 11 and the cold plate cavity bottom plate 13. The middle support plate 12 can play a role in structural support, enhancing the overall rigidity of the cold plate cavity 10.
[0050] In order to ensure the sealing and structural strength of the cold plate cavity 10, and to minimize the contact thermal resistance between the components, the cavity cover plate 11, the middle support plate 12 and the cold plate cavity bottom plate 13 are preferably welded by brazing process to form a solid integrated structure.
[0051] Another key innovation of the present utility model is the use of gullet structure to enhance heat exchange. As shown in Figure 3 , inside the cold plate cavity 10, especially on the inner surface of the cold plate cavity bottom plate 13 (i.e. the surface in contact with the coolant) and the surface of the middle support plate 12, a plurality of gullet structures 40 are provided. These gullet structures 40 extend into the cavity structure, greatly increasing the contact area with the coolant. In the two-phase heat dissipation process, these gullet structures 40 provide a large number of nucleation sites for the boiling of the coolant, significantly improving the boiling heat transfer coefficient.
[0052] Similarly, the surfaces of the left end heat dissipation cold plate 20 and the right end heat dissipation cold plate 30 are also designed with gullet structures 40 to enhance the heat dissipation capacity of these areas.
[0053] Compared with the micro-channel structure commonly used in single-phase liquid cooling, the gullet structure has significant advantages. The gullet structure provides a larger flow channel space, smaller flow resistance, and no risk of micro-channel blockage by impurities, greatly improving the reliability and long-term stability of the heat dissipation device.
[0054] In a preferred embodiment, in order to achieve the best balance between heat exchange area and fluid flow, the gill structure 40 has specific design parameters. Specifically, the gill thickness is 0.3mm, the gill height is 10mm, and the gill length is 9mm. The lateral spacing between the gills is 1.2mm, and the vertical spacing is 1mm. These parameters ensure that under the two-phase liquid cooling technology, both sufficient boiling evaporation heat contact area and smooth steam discharge can be provided.
[0055] Please refer to Figure 2 and Figure 3 In order to achieve stable installation with the RTX5090 graphics card circuit board (PCB) and good contact with each heat generating component, the utility model designs specific mounting structure at the bottom of the device. Specifically, the bottom of the left end heat dissipation cold plate 20, the right end heat dissipation cold plate 30 and the middle support plate 12 of the cold plate cavity 10 are all designed with internal thread screw hole station column 50 and protruding part 51.
[0056] The position of the internal thread screw hole station column 50 matches the mounting hole position on the RTX5090 circuit board, which is used to fix the entire heat dissipation device on the graphics card through screws.
[0057] The position and height of the protruding part 51 are accurately designed to correspond to the power supply module and memory module and other auxiliary heat generating components of the RTX5090. Through these protruding parts 51, the left end heat dissipation cold plate 20 and the right end heat dissipation cold plate 30 realize effective heat dissipation of these components.
[0058] In summary, the cold plate heat dissipation device provided by the utility model adopts the gas-liquid two-phase heat dissipation technology for the main chip area, utilizes the latent heat of phase change, and realizes the heat dissipation efficiency and isothermality far exceeding the traditional single-phase liquid cooling and air cooling. Through the innovative split design, the core cold plate cavity is made of red copper, and the two side heat dissipation cold plates are made of aluminum, which realizes lightweight and cost control while ensuring extreme performance. By using the optimized gill structure instead of microchannels, the risk of channel blockage is completely solved while the heat exchange area is increased, and the reliability is improved.
[0059] The above describes in detail the cold plate heat dissipation device for realizing gas-liquid two-phase heat dissipation of the RTX5090 graphics card provided by the utility model. The principles and implementation modes of the utility model are described by applying specific examples in this paper. The above description of the embodiments is only used to help understand the method and core idea of the utility model. It should be pointed out that for ordinary skilled persons in the technical field, without departing from the principles of the utility model, the utility model can be improved and modified in many ways, and these improvements and modifications also fall within the protection scope of the claims of the utility model.
Claims
1. A cold plate heat dissipation device for implementing gas-liquid two-phase heat dissipation for an RTX5090 graphics card, characterized in that, The application relates to a cooling plate cavity (10) made of a heat-conducting material, which internally forms a cavity structure for containing cooling liquid and realizing gas-liquid two-phase heat exchange, and the cooling plate cavity (10) is suitable for being attached to a main chip of an RTX5090 graphics card; left and right end heat-dissipation cooling plates (20) and (30) are respectively detachably connected to the left and right sides of the cooling plate cavity (10), and the left and right end heat-dissipation cooling plates (20) and (30) are suitable for being attached to auxiliary heat-generating components of the RTX5090 graphics card. The cooling plate cavity (10) is made of a first heat-conducting material, and the left and right end heat-dissipation cooling plates (20) and (30) are made of a second heat-conducting material, the heat-conducting coefficient of the first heat-conducting material is higher than that of the second heat-conducting material, and the density of the first heat-conducting material is higher than that of the second heat-conducting material. The cooling plate cavity (10) comprises a cavity cover plate (11) provided with an inlet hole and an outlet hole, the inlet hole and the outlet hole being communicated with the cavity structure; a cooling plate cavity bottom plate (13) for being attached to the main chip; and an intermediate support plate (12) arranged between the cavity cover plate (11) and the cooling plate cavity bottom plate (13). The cavity cover plate (11), the intermediate support plate (12) and the cooling plate cavity bottom plate (13) are integrally connected through a brazing process.
2. The cold plate heat sink device of claim 1, wherein, The inner surface of the cooling plate cavity bottom plate (13) and / or the surface of the intermediate support plate (12) is provided with a plurality of toothed structures (40) extending into the cavity structure for increasing the contact area with the cooling liquid. The surfaces of the left and right end heat-dissipation cooling plates (20) and (30) are provided with a plurality of toothed structures (40). The parameters of the toothed structures (40) include a toothed thickness of 0.3 mm, a toothed height of 10 mm, a toothed length of 9 mm, a horizontal interval between toothed structures of 1.2 mm and a vertical interval between toothed structures of 1 mm. The first heat-conducting material is red copper, and the second heat-conducting material is aluminum.
3. The cold plate heat sink device of claim 2, wherein, The inlet hole and the outlet hole are both 1 / 4 inner thread screw holes.
4. The cold plate heat sink device of claim 2, wherein, The inlet hole is used for mounting a PU pipe quick connector with an outer diameter of 4 mm and an inner diameter of 2.5 mm.
5. The cold plate heat sink device of claim 1, wherein, The outlet hole is used for mounting a PU pipe quick connector with an outer diameter of 12 mm and an inner diameter of 10 mm.
6. The cold plate heat sink device of claim 4 or 5, wherein, The left and right end heat-dissipation cooling plates (20) and (30) and the intermediate support plate (12) are all designed with inner thread screw hole station columns (50) and protruding parts (51).
7. The cold plate heat spreading device of claim 1, wherein, The inner thread screw hole station columns (50) are used for matching and locking with the circuit board of the RTX5090 graphics card.
8. The cold plate heat sink device of claim 2, wherein, The protruding parts (51) are used for being attached to the auxiliary heat-generating components, and the auxiliary heat-generating components include a power supply module and a memory module. 9. The cold plate heat spreading device of claim 2, wherein,