Temperature acquisition assembly, integrated busbar and battery cell assembly

Abstract

The utility model discloses a temperature acquisition assembly, an integrated busbar and a cell assembly, the temperature acquisition assembly comprises an acquisition circuit board, the acquisition circuit board comprises an acquisition main body and an acquisition branch structure, and the acquisition branch structure comprises an acquisition branch circuit board, a temperature sensing device, a reinforcing plate and a buffer structural member. The temperature sensing device is fixed on the upper surface of the acquisition branch circuit board, the reinforcing plate is fixed on the lower surface of the acquisition branch circuit board, and the projection of the temperature sensing device on the acquisition branch circuit board falls in the projection of the reinforcing plate on the acquisition branch circuit board. The buffer structural member surrounds the periphery of the temperature sensing device, is fixed on the upper surface of the acquisition branch circuit board, and can be compressed in the thickness direction. The collection and feedback speed is higher, materials are reduced, the cost is reduced, the materials are integrated on the temperature collection assembly, neglected loading is avoided in the assembly process of the integrated busbar, pasting is firmer, and falling off or damage is not likely to happen in the turnover process.

Description

TECHNICAL FIELD

[0001] The utility model relates to power battery technical field, concretely relates to a temperature acquisition subassembly, integrated busbar and electric core subassembly. BACKGROUND

[0002] With the rapid development of electric vehicle industry, the electrification trend of power assembly is more and more obvious. As the power core of electric vehicle, the battery is a very important part of the whole electric vehicle, and its temperature characteristics directly affect the performance, service life and durability of electric vehicle. At present, under the condition that the capacity of power battery is limited, the grouping technology level of power battery, especially the power battery thermal management system, is crucial to improve the consistency of power battery and ensure the safety of the whole vehicle. During the operation of electric vehicle, a large amount of heat will be generated during the charging and discharging of power battery. If heat dissipation is not carried out in time, the internal temperature of power battery pack will rise sharply, resulting in continuous increase of temperature difference, thus aggravating the inconsistency of power battery internal resistance and capacity, and even leading to thermal runaway, which has great safety hidden danger. Therefore, according to the demand of electric core system, a certain number of temperature signal acquisition structures will be arranged on the CCS integrated busbar to monitor the temperature.

[0003] According to the different temperature signal acquisition positions, it is generally divided into electric core top cover temperature acquisition and busbar temperature acquisition. For electric core top cover acquisition, the commonly used scheme is heat-conducting silica gel pad temperature acquisition structure. Exemplarily, PI film is used as temperature sensing device (NTC) back reinforcement plate, PI film reinforcement plate is pasted on the lower surface of acquisition branch circuit board through heat curing glue, temperature sensing device is welded on the PI film reinforcement area of the lower surface of acquisition branch circuit board, FR4 protection block is pasted around the temperature sensing device and point protection glue is used, the protection block of temperature acquisition structure is pasted on the lower surface of aluminum bar, heat-conducting silica gel pad is pasted below the PI film reinforcement plate of temperature acquisition structure, and the two surfaces of heat-conducting silica gel pad are provided with back adhesive. During the assembly of electric core, the heat-conducting silica gel pad is pasted with the electric core top cover, and the busbar is welded with the electric core tab. The heat-conducting silica gel pad will be compressed during the welding of busbar and electric core tab, so as to ensure that the reinforcement plate is pasted with the electric core top cover. The temperature acquisition structure of the above technical scheme has high acquisition accuracy, but the applicant finds that the following defects still exist: because the thickness of heat-conducting silica gel pad is relatively thick, usually more than 3mm, the temperature feedback speed is relatively slow; in addition, the risk of missing pasting heat-conducting silica gel pad is easily caused during the assembly of electric core, and heat-conducting silica gel pad is on the lower surface of product, which needs to additionally increase inspection hole and inspection process, so the process is complex; in addition, the material of heat-conducting silica gel pad is relatively soft, which has the risk of being easily damaged during the turnover and transportation. Therefore, it is necessary to develop a new type of temperature acquisition subassembly, integrated busbar and electric core subassembly to solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model discloses a temperature acquisition feedback speed fast, processing simple and low -cost temperature acquisition assembly, integrated busbar and battery cell assembly for at least one of above-mentioned technical problems.

[0005] The utility model discloses a technical scheme:

[0006] One of the purposes of the utility model is to provide a temperature acquisition assembly, including acquisition circuit board, the acquisition circuit board includes acquisition main part and with acquisition branch structure of acquisition main body electric connection, the acquisition branch structure includes acquisition branch circuit board, temperature sensing device, reinforcing plate and buffer structural member, temperature sensing device is fixed on the upper surface of acquisition branch circuit board, the reinforcing plate is fixed on the lower surface of acquisition branch circuit board, and the projection of temperature sensing device on acquisition branch circuit board falls in the projection of reinforcing plate on acquisition branch circuit board, and buffer structural member surrounds the outer periphery of temperature sensing device and is fixed on the upper surface of acquisition branch circuit board and its thickness direction can compress.

[0007] Preferably, one side of the buffer structural member away from the acquisition branch circuit board is provided with a first connecting piece, and one side of the reinforcing plate away from the acquisition branch circuit board is provided with a second connecting piece.

[0008] Preferably, the first connecting piece and the second connecting piece are double-sided adhesive tapes.

[0009] Preferably, the buffer structural member is a buffer foam with a relief groove in the middle for avoiding the temperature sensing device, and the relief groove is filled with protective glue.

[0010] Preferably, the buffer structural member is pasted on the upper surface of the acquisition branch circuit board; and / or

[0011] The reinforcing plate is pasted on the lower surface of the acquisition branch circuit board.

[0012] Preferably, the thickness of the buffer structural member after compression is less than or equal to 3 mm.

[0013] Preferably, the reinforcing plate is made of a high-thermal-conductivity material.

[0014] Preferably, the reinforcing plate is one of a silicon carbide sheet, an aluminum sheet, a copper sheet, a nickel sheet, and a stainless steel sheet.

[0015] Another purpose of the utility model is to provide an integrated busbar, which comprises a temperature acquisition assembly and a plurality of busbars connected to the temperature acquisition assembly, wherein the temperature acquisition assembly is any one of the temperature acquisition assemblies described above, and the upper surface of the buffer structural member of the temperature acquisition assembly is fixedly connected to the lower surface of the busbar.

[0016] The utility model also has a purpose in providing a kind of battery assembly, including the integrated busbar of assembly in the top cover of battery, the integrated busbar is above-mentioned integrated busbar, the lower surface of the temperature acquisition component of the integrated busbar the upper surface of the top cover of battery is fixedly connected with the reinforcing plate.

[0017] Compared with the prior art, the utility model has the advantages that:

[0018] The temperature acquisition component, the integrated busbar and the battery assembly of the utility model, 1, adopt aluminum reinforcing plate, and heat conductivity is good and thickness is thin, and acquisition feedback speed is faster, and battery temperature can be more real-time feedback;2, omitted heat-conducting silica gel pad, material is reduced, and cost is reduced;3, material is integrated on temperature acquisition component, and it will not be missed in the assembly process of integrated busbar, and it is more reliable to stick, and it is not easy to fall off or damage in the process of turnover. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model will be further described in connection with the drawings and examples:

[0020] Figure 1 It is the explosion view of the acquisition branch structure of the temperature acquisition component of the utility model embodiment;

[0021] Figure 2 It is the structure schematic drawing of the integrated busbar of the temperature acquisition component of the utility model embodiment; Figure 1

[0022] It is the local amplification structure schematic drawing of A part in Figure 3 Figure 2 It is the structure schematic drawing of the battery assembly of the integrated busbar;

[0023] Figure 4 Figure 2 It is the structure schematic drawing of the battery assembly of the integrated busbar;

[0024] Figure 5 It is the local amplification view of B part in Figure 4

[0025] Among them: 100, temperature acquisition component;10, acquisition circuit board;11, acquisition main body;12, acquisition branch structure;121, acquisition branch circuit board;1211, bending section;122, temperature sensing device;123, reinforcing plate;124, buffer structure;125, protective glue;126, first connecting piece;127, second connecting piece;20, voltage acquisition nickel sheet;200, busbar;1000, integrated busbar;2000, top cover of battery;10000, battery assembly. DETAILED DESCRIPTION

[0026] ​​​To make the purpose, technical scheme and advantages of the present application more clearly, the present application will be further described in detail below with reference to the specific embodiments and the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of the known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0027] The temperature acquisition assembly of the present application embodiment, see Figures 1 to 5 , comprising a circuit board, the acquisition circuit board 10 includes an acquisition main body 11 and an acquisition branch structure 12 electrically connected with the acquisition main body 11, wherein the acquisition main body 11 is a long strip-shaped flexible circuit board (exemplary FPC), the acquisition branch structure 12 includes an acquisition branch circuit board 121, a temperature sensing device 122 (exemplary for the existing conventional NTC), a reinforcing plate 123 and a buffer structure 124. The acquisition branch circuit board 121 is a small strip-shaped flexible circuit board that can be bent and formed on the side edge of the acquisition main body 11 and is electrically connected with the acquisition main body 11. Exemplarily, the end of the acquisition branch circuit board 121 connected with the acquisition main body 11 can be optionally smaller in width than the end with the temperature sensing device 122. Preferably, the acquisition main body 11 and the acquisition branch circuit board 121 are an integral structure. The temperature sensing device 122 is fixed on the upper surface of the acquisition branch circuit board 121. The reinforcing plate 123 is fixed on the lower surface of the acquisition branch circuit board 121, and the reinforcing plate 123 strengthens the acquisition branch circuit board 121 to form a reinforcing area on the acquisition branch circuit board 121 corresponding to the position of the reinforcing plate 123. The temperature sensing device 122 is fixedly connected, such as welded, on the upper surface of the acquisition branch circuit board 121 and corresponds to the reinforcing area, that is, the projection of the temperature sensing device 122 on the acquisition branch circuit board 121 falls within the projection of the reinforcing plate 123 on the acquisition branch circuit board 121. The buffer structure 124 is compressibly fixed on the upper surface of the acquisition branch circuit board 121 and surrounds the outer periphery of the temperature sensing device 122 and is protected by the protective glue 125 (the protective glue 125 is the existing conventional NTC protective glue 125 that can connect the bus bar 200 and the acquisition branch structure 12). It should be noted that the compressibility of the buffer structure 124 means that the thickness is compressible. When the temperature acquisition assembly 100 is assembled on the top cover 2000 of the battery cell, the buffer structure 124 can be compressed from the initial first thickness (uncompressed thickness, i.e., H1 as shown in Figure 3 Figure 5 ​As shown in H2), it is clear that H1 > H2. The buffer structure 124 serves to protect the temperature sensing device 122 and ensures a secure connection between the temperature acquisition component 100 and the cell top cover 2000. This embodiment of the invention improves upon the existing temperature acquisition structure of the cell top cover 2000 by using a compressible buffer structure 124 instead of the difficult-to-compress FR4 protective block in the prior art, while also omitting the thermally conductive silicone pad. The structure is simpler, with fewer parts or materials, lower cost, and faster temperature acquisition feedback. The materials are integrated into the temperature acquisition component 100, preventing any omissions during the assembly of the acquisition busbar.

[0028] Regarding the material and structure of the buffer structure 124, for example, the buffer structure 124 of this utility model is easier to compress than the thermally conductive silicone pad of the prior art. That is, under the same initial thickness and the same compressed thickness, the pressure required for compression of the buffer structure 124 of this application is less than the pressure required for compression of the thermally conductive silicone pad of the prior art. Specific details are not described or limited. In some embodiments of this utility model, the buffer structure 124 is a conventional buffer foam, such as... Figure 1 As shown, the specific structure is a cube structure with a clearance groove running through its thickness to avoid the temperature sensing device 122. Structurally similar to the existing FR4 protective block, only the material differs. The connection method between the buffer structure 124 and the acquisition branch circuit board 121 and the temperature sensing device 122 can be adhesive bonding. During installation, the bottom surface of the buffer foam is bonded to the top surface of the acquisition branch circuit board 121, with the temperature sensing device 122 located within the clearance groove. Then, NTC protective adhesive 125 is filled into the clearance groove. Regarding the thickness of the buffer structure 124, in some embodiments of this invention, the first thickness (e.g.) Figure 3 The thickness shown as H1) is the initial uncompressed state thickness greater than 3mm, and the second thickness (as shown) Figure 5 The thickness shown as H2, i.e., the compressed thickness is less than or equal to 3mm, is smaller than that of the thermally conductive silicone pad in the prior art, resulting in faster temperature feedback. It should be noted that, at the second thickness, due to the effect of the NTC protective adhesive 125 in the clearance groove of the buffer structure 124, the cell top cover 2000 and busbar 200 will not compress or damage the temperature sensing device 122 inside the buffer structure 124.

[0029] Regarding the connection method between the reinforcing plate 123 and the acquisition branch circuit board 121, in some embodiments of this utility model, the reinforcing plate 123 and the acquisition branch circuit board 121 are fixed by adhesive bonding. Regarding the shape of the reinforcing plate 123, as... Figure 1As shown, the exemplary is a square piece with a size smaller than the collecting branch circuit board 121. For the material of the reinforcing plate 123, it is preferred to be a high-thermal-conductivity material known in the market, which can be one of silicon carbide, aluminum, copper, nickel, and stainless steel. In a preferred embodiment of the present application, the material of the reinforcing plate 123 is aluminum, and the thickness is preferably 0.5 mm, which is thin and has good thermal conductivity, so that the feedback speed is fast during temperature collection, and the electrical temperature can be fed back in real time.

[0030] According to some preferred embodiments of the present application, in order to realize the connection of the temperature collection assembly 100 with the bus bar 200 and the top cover 2000 of the battery cell, as shown in Figure 1 The first connecting piece 126 is provided on the upper surface of the buffer structure 124 away from the collecting branch circuit board 121, and the second connecting piece 127 is provided on the lower surface of the reinforcing plate 123 away from the collecting branch circuit board 121. That is, the temperature collection assembly 100 is connected with the lower surface of the bus bar 200 through the first connecting piece 126, and the temperature collection assembly 100 is connected with the upper surface of the top cover 2000 of the battery cell through the second connecting piece 127. In some preferred embodiments of the present application, the first connecting piece 126 and the second connecting piece 127 are both double-sided adhesive tapes for the integrated bus bar 1000 of the power battery in the prior art, which has small thickness, simple structure, low cost, and is easy to process. The first connecting piece 126 and the second connecting piece 127 are different in structure, and specifically, as shown in Figure 1 The first connecting piece 126 is a back-shaped structure with a hollow part in the middle, which is consistent with the upper surface of the buffer structure 124, and the second connecting piece 127 is a square structure without a hollow part in the middle, which is consistent with the lower surface of the reinforcing plate 123.

[0031] The embodiment of the present application further provides an integrated bus bar 1000 (CCS), as shown in Figure 2 and Figure 3 The integrated bus bar 1000 (CCS) comprises a temperature collection assembly 100 and a plurality of bus bars 200 connected with the temperature collection assembly 100, the temperature collection assembly 100 is the temperature collection assembly 100 of the above-mentioned embodiment, and the upper surface of the buffer structure 124 of the temperature collection assembly 100 is fixedly connected with the lower surface of the bus bar 200. It should be noted that the voltage collection nickel piece 20 is also provided on the temperature collection assembly 100, and in the assembly of the integrated bus bar 1000, the voltage collection nickel piece 20 needs to be fixedly welded, for example, laser welded, with the bus bar 200 first, and then the collecting branch structure 12 is bent to the lower side of the bus bar 200 (as shown in Figure 1 and Figure 3As shown, a bent section 1211 is formed on the acquisition branch circuit board 121. This bent section 1211 is flat when the temperature acquisition component 100 is not assembled with the bus 200, and it is bent into a slope shape when the temperature acquisition component 100 and the bus 200 are assembled into an integrated bus 1000. It is connected to the lower surface of the bus 200 through the first connector 126 on the upper surface of the buffer structure 124. At this time, the buffer structure 124 is still in an uncompressed state (e.g., Figure 3 As shown, the thickness of the buffer structure 124 is H1. In some preferred embodiments, the upper surface of the buffer structure 124 of the temperature acquisition component 100 is fixedly connected to the lower surface of the busbar 200 by adhesive bonding, that is, the first connector 126 is an adhesive structure layer, exemplarily double-sided tape.

[0032] This utility model embodiment also provides a battery cell assembly 10000, such as Figure 4 and Figure 5 As shown, the integrated busbar 1000 is assembled above the cell top cover 2000. The integrated busbar 1000 is the same as the integrated busbar 1000 described in the above embodiment. The lower surface of the reinforcing plate 123 of the temperature acquisition component 100 of the integrated busbar 100 is fixedly connected to the upper surface of the cell top cover 2000. During assembly, the temperature acquisition component 100 is first assembled onto the cell top cover 2000, and the second connector 127 on the lower surface of the reinforcing plate 123 is connected and fixed to the cell top cover 2000. Then, the busbar 200 is welded to the cell electrode tab, for example, by laser welding. Because the thickness of the temperature acquisition branch is designed for an interference fit, the buffer structure 124 will be compressed during the welding process between the busbar 200 and the cell electrode tab, causing the buffer structure 124 to be compressed from the first thickness (H1) to the second thickness (H2). Figure 5 As shown in H2 (H2 < H1), the buffer structure 124 is in a compressed state at this time to ensure that the reinforcing plate 123 can be firmly attached to the top cover 2000 of the battery cell, thereby ensuring the stability of temperature acquisition by the temperature acquisition component 100. In some preferred embodiments, the lower surface of the reinforcing plate 123 is fixedly connected to the upper surface of the top cover 2000 of the battery cell by adhesive, that is, the second connector 127 is an adhesive structure layer, exemplarily double-sided tape.

[0033] The temperature acquisition component 100, integrated busbar 1000, and battery cell assembly of this utility model embodiment have the following advantages: faster acquisition and feedback speed, and more real-time feedback of battery cell temperature; the thermal conductive silicone pad is omitted, reducing materials and lowering costs; the materials are integrated on the temperature acquisition component 100, so there will be no omissions during the assembly process of the integrated busbar 1000, and the adhesion is more reliable, making it less likely to fall off or be damaged during turnover.

[0034] It should be understood that the above specific embodiments of the present application are only used for illustrative or explanatory purposes of the principles of the present application, and do not constitute a limitation on the present application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all changes and modifications falling within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A temperature acquisition assembly comprising an acquisition circuit board, the acquisition circuit board comprising an acquisition main body and an acquisition branch structure electrically connected to the acquisition main body, characterized in that, The collection branch structure comprises a collection branch circuit board, a temperature sensing device, a reinforcing plate and a buffer structural member, the temperature sensing device is fixed on the upper surface of the collection branch circuit board, the reinforcing plate is fixed on the lower surface of the collection branch circuit board, the projection of the temperature sensing device on the collection branch circuit board falls within the projection of the reinforcing plate on the collection branch circuit board, and the buffer structural member is arranged around the outer periphery of the temperature sensing device, fixed on the upper surface of the collection branch circuit board and compressible in the thickness direction.

2. The temperature harvesting assembly of claim 1, wherein, The back surface of the buffer structural member is provided with a first connecting member, and the back surface of the reinforcing plate is provided with a second connecting member.

3. The temperature harvesting assembly of claim 2, wherein, The first connecting member and the second connecting member are double-sided adhesive tapes.

4. The temperature harvesting assembly of claim 1, wherein, The buffer structural member is a buffer foam with a relief groove in the middle for avoiding the temperature sensing device, and the relief groove is filled with protective glue.

5. The temperature harvesting assembly of claim 1, wherein, The buffer structural member is attached to the upper surface of the collection branch circuit board; and / or The reinforcing plate is attached to the lower surface of the collection branch circuit board.

6. The temperature harvesting assembly of claim 1, wherein, The thickness of the buffer structural member after compression is less than or equal to 3 mm.

7. The temperature harvesting assembly of claim 1, wherein, The reinforcing plate is made of high-thermal-conductivity material.

8. The temperature harvesting assembly of claim 1 or 7, wherein, The reinforcing plate is made of one of silicon carbide sheet, aluminum sheet, copper sheet, nickel sheet and stainless steel sheet.

9. An integrated busbar comprising a temperature acquisition assembly and a plurality of busbars connected to the temperature acquisition assembly, characterized in that, The temperature collection assembly is the temperature collection assembly according to any one of claims 1-8, and the upper surface of the buffer structural member of the temperature collection assembly is fixedly connected to the lower surface of the busbar.

10. An electric cell assembly comprising an integrated busbar assembled above a top cover of an electric cell, characterized in that, The integrated busbar is the integrated busbar according to claim 9, and the lower surface of the reinforcing plate of the temperature collection assembly of the integrated busbar is fixedly connected to the upper surface of the top cover of the battery cell.

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