Connection structure for BMS daughter board and signal acquisition circuit board in power battery

Abstract

The utility model discloses a connecting structure for a BMS (Battery Management System) daughter board and a signal acquisition circuit board in a power battery, one end of the BMS daughter board is provided with a row of connecting points which are arranged side by side at intervals, and the signal acquisition circuit board integrated with a plurality of signal acquisition lines and the BMS daughter board are respectively fixed at different positions on the same insulating bracket. And the signal acquisition lines are in one-to-one correspondence with the connection points at one end of the BMS daughter board, are oppositely arranged at intervals, and are welded and connected together through connecting pieces. And defects such as tin stacking, welding slag and welding deviation of tin materials are avoided, the appearance is attractive, the performance is stable, the yield is high, and a welding area can be subjected to AVI detection. The BMS daughter board does not pass through a high-temperature environment, the type selection of components on the BMS daughter board is simple, the cost is controllable, and the BMS daughter board can be replaced and maintained if the BMS daughter board breaks down in the later use process.

Description

TECHNICAL FIELD

[0001] The utility model relates to power battery technical field, concretely relates to the connecting structure for BMS daughter board and signal acquisition circuit board in power battery. BACKGROUND

[0002] With the rapid development of electric vehicle industry, the electrification trend of powertrain is more and more obvious. As the power core of electric vehicles, batteries are a very important part of the entire electric vehicle.

[0003] The integrated busbar (CCS) is also called battery cover plate assembly, which is widely used in the fields of power battery module, large storage air-cooled battery module, large storage liquid-cooled battery module and household energy storage battery module, etc. It provides temperature sampling and cell voltage sampling functions of the battery and realizes high-voltage series and parallel connection of the cells. It provides temperature and voltage to the BMS system through PCB, FPC and connector assembly, and belongs to part of the BMS system.

[0004] In the traditional power battery integrated busbar, the signal acquisition line is connected with the BMS (Battery Management System) daughter board. The signal acquisition line of the signal acquisition circuit board is connected with the corresponding connection point of the BMS daughter board by using the tin soldering process, and then it is assembled and pressed together with the busbar, insulating support, insulating film and other parts. However, the applicant found that the BMS daughter board and the signal acquisition circuit board of the above technical solution at least have the following disadvantages: 1. The BMS daughter board is first connected with the signal acquisition line by tin soldering, and then integrated with other parts. If the BMS daughter board fails during the use of the battery pack, the entire circuit is in an electrified state, the distance between the solder pads of the soft and hard boards is very small, and the soft and hard board solder pads are easily short-circuited during disassembly and maintenance, causing product burnout, so the BMS daughter board cannot be replaced and maintained during the later use. 2. The existing hot-pressing CCS processing process needs to first solder the signal acquisition line and the BMS daughter board, and then press and integrate them. The electronic components on the BMS daughter board cannot avoid high-temperature environment, and the electronic components after high-temperature baking are prone to performance problems. The selection of the electronic components must be resistant to high temperature, which increases the cost. 3. During tin soldering, the welding head is pressed on the connection point, and the tin material is melted by the heating of the welding head, thereby connecting the signal acquisition circuit and the BMS daughter board. However, the flow direction of the molten tin is uncontrollable, and the welding process is prone to tin accumulation, welding slag, welding deviation and virtual welding. 4. The solder is clamped between the signal acquisition line and the solder pad of the BMS daughter board. During inspection, there is a blind area, and it is impossible to detect from the appearance whether the solder filling is full and whether there are air bubbles. Therefore, it is necessary to develop a new connecting structure for the BMS daughter board and the signal acquisition circuit board in the power battery to solve the above problems. UTILITY MODEL CONTENTS

[0005] In order to solve the problems of virtual welding, solder accumulation, great processing difficulty, undetectable welding quality, and unreplaceable and unrepairable BMS sub-plate in the prior art, the utility model aims at providing a connecting structure for a BMS sub-plate and a signal acquisition circuit board in a power battery, improving product quality and productivity, and providing customers with more stable and high-quality products.

[0006] The technical scheme of the utility model is:

[0007] The utility model discloses a connecting structure for a BMS sub-plate and a signal acquisition circuit board in a power battery, one end of the BMS sub-plate is provided with a row of connecting points arranged in parallel and spaced apart, a signal acquisition circuit board integrated with a plurality of signal acquisition lines is fixed at different positions on the same insulating support with the BMS sub-plate, the signal acquisition lines and the connecting points at one end of the BMS sub-plate are one-to-one corresponding, relatively spaced apart, and directly welded or connected together through connecting pieces.

[0008] Preferably, the signal acquisition lines and the connecting points are one-to-one corresponding and welded together through bonding connecting pieces.

[0009] Preferably, the bonding connecting pieces comprise a first section, a second section and a third section connected in sequence, the first section and the third section are respectively welded and fixed with the signal acquisition lines and the corresponding welding points, and the position of the second section is higher than the height of the plane where the first section and the third section are located, so that the second section is arranged across the signal acquisition lines and the corresponding welding points.

[0010] Preferably, the signal acquisition circuit board and the BMS sub-plate are detachably fixed on the same insulating support.

[0011] Preferably, the insulating support has opposite first and second fixed regions, the first fixed region is used for fixing the BMS sub-plate, and the second fixed region is used for fixing one end of the signal acquisition circuit board and the bonding welding of the connecting points.

[0012] Preferably, a double-sided adhesive film is further arranged between the signal acquisition circuit board and the second fixed region, and the area of the double-sided adhesive film is not less than the area of the bonding surface of the signal acquisition circuit board and the insulating support.

[0013] Preferably, the double-sided adhesive film is positioned by cooperating with the positioning hole arranged on the signal acquisition circuit board through the positioning column on the insulating support.

[0014] Preferably, the length of the second fixed region is greater than the width of the signal acquisition circuit board.

[0015] Preferably, the welding surface of the signal acquisition circuit board and the BMS sub-board are in the same plane, and the height of the second fixing area is greater than the height of the first fixing area.

[0016] Preferably, the BMS sub-board is integrated on the insulating support; and / or

[0017] The signal acquisition line is integrated on the insulating support.

[0018] Compared with the prior art, the coupling structure for the BMS sub-board and the signal acquisition circuit board in the power battery has the following advantages:

[0019] The coupling structure for the BMS sub-board and the signal acquisition circuit board in the power battery solves the problems of virtual welding, solder accumulation, great processing difficulty, undetectable welding quality, unreplaceable and unrepairable BMS sub-board caused by the tin soldering of the signal acquisition line and the BMS sub-board in the prior art.

[0020] 1. The signal acquisition circuit board and the BMS sub-board are fixed on the same insulating support, effectively preventing the bonding area from being coupled invalid due to vibration, and the signal acquisition line of the signal acquisition circuit board and the coupling point on the BMS sub-board are welded together through the bonding connector;

[0021] 2. No tin, slag, welding offset and other defects, the appearance is beautiful, the performance is stable, the yield is high, the welding area can be detected by AVI, and the welding defects are effectively prevented;

[0022] 3. The BMS sub-board is fixed on the insulating support by hot riveting, so that the BMS sub-board can be replaced and repaired if a fault occurs during the later use, and the BMS sub-board does not pass through a high-temperature environment, thereby reducing the maintenance cost. BRIEF DESCRIPTION OF DRAWINGS

[0023] The utility model will be further described in connection with the drawings and embodiments:

[0024] Figure 1 It is a structure schematic view of a power battery integrated busbar (part) comprising the coupling structure for the BMS sub-board and the signal acquisition circuit board in the power battery of the utility model embodiment;

[0025] Figure 2 It is Figure 1 A local enlarged view of the middle A part;

[0026] Figure 3 It is a structure schematic view of one group of signal acquisition lines, bonding connectors (part) and coupling points of the coupling structure for the BMS sub-board and the signal acquisition circuit board in the power battery of the utility model embodiment.

[0027] Wherein: 100, integrated busbar; 110, BMS daughterboard; 111, connection point; 120, signal acquisition circuit board; 121, signal acquisition line; 130, double-sided adhesive film; 140, insulating bracket; 141, first fixing area; 142, second fixing area; 150, bonding connector; 151, first segment; 152, second segment; 153, third segment. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0029] The connection structure between the BMS daughterboard and the signal acquisition circuit board in a power battery according to this embodiment of the utility model is shown in the figure. Figures 1 to 3 One end of the BMS daughterboard 110 is also like... Figure 2 As shown, there is a row of parallel intervals on the left end, that is... Figure 2 The connection points 111 are shown as spaced apart. In this embodiment of the invention, the connection points 111 on the BMS daughterboard 110 and the signal acquisition lines 121 are connected one-to-one and directly welded or welded through connectors (preferably through bonding connectors 150 in this embodiment). Specifically, the BMS daughterboard 110 and the signal acquisition circuit board 120 are respectively fixed on the same insulating bracket 140, such that one end of the acquisition line is opposite to and spaced apart from the end of the BMS daughterboard 110 with the connection points 111. Then, a bonding process is used to weld the signal acquisition lines 121 to the connection points 111 of the BMS daughterboard 110 one-to-one through a bonding welding device or through connectors such as bonding connectors. The connection structure of this embodiment of the invention is free from defects such as solder buildup, solder slag, and welding misalignment, has an aesthetically pleasing appearance, stable performance, high yield, and the welding area can be detected by AVI. This invention solves the problems of poor soldering, solder buildup, high processing difficulty, inability to detect soldering quality, and inability to replace or repair the BMS daughterboard 110 caused by soldering the signal acquisition line 121 to the BMS daughterboard 110 in the existing technology. The signal acquisition line and the BMS daughterboard are fixed on the same insulating support structure, effectively preventing connection failure in the bonding area due to vibration; the signal acquisition line 120 and the BMS daughterboard 110 are not directly connected, but indirectly connected through bonding connectors 150, such as bonding wires; the BMS daughterboard 110 is fixed to the insulating support 140 by heat riveting, allowing for replacement and repair.

[0030] According to some preferred embodiments of the present invention, such as Figure 2As shown, the insulating support 140 has opposite first and second fixing regions 141 and 142, the first fixing region 141 is used for fixing the BMS sub-board 110, and the second fixing region 142 is used for fixing the end of the signal acquisition circuit board 120 welded with the connecting point 111. Preferably, the area of the second fixing region 142 is smaller than the area of the first fixing region 141, Figure 2 As shown in the middle, the second fixing region 142 is like Figure 2 As shown in the left square block region, the first fixing region 141 is like Figure 2 As shown in the right square region, the length direction of the second fixing region 142 is like Figure 2 As shown in the front-rear direction, the width direction is like Figure 2 As shown in the left-right direction, the length direction of the first fixing region 141 is like Figure 2 As shown in the front-rear direction, the width direction is like Figure 2 As shown in the front-rear direction, the length of the first fixing region 141 is greater than the length and width of the second fixing region 142, and the width of the first fixing region 141 is greater than the length of the second fixing region 142. Preferably, the signal acquisition line 121 and the BMS sub-board 110 of the utility model embodiment are at the same height, which is convenient for the bonding and welding equipment to perform bonding and welding operation, and the BMS sub-board 110 has a certain thickness, so the height of the second fixing region 142 is greater than the height of the first fixing region 141, and preferably the height of the second fixing region 142 should be consistent with the sum of the thickness of the first fixing region 141 and the BMS sub-board 110, that is, the welding surface of the signal acquisition circuit board 120 and the BMS sub-board 110 is in the same plane.

[0031] As shown in the middle, the second fixing region 142 is like Figure 2 As shown in the middle, the second fixing region 142 is like Figure 2The two connecting lugs 131' shown are connected with the thermal rivet columns 160' on the BMS sub-plate 110, but a square shape consistent with the size and area of the second fixing area 142 is adopted, and then integrated with the signal acquisition circuit board 120 on the second fixing area 142 of the insulating support 140 through a hot pressing process, and the double-sided adhesive film 130 is between the signal acquisition circuit board 120 and the insulating support 140, so that the structure is simpler and the processing cost is lower. The BMS sub-plate 110 is fixed on the first fixing area 141 of the insulating support 140 through the existing conventional thermal riveting process. The purpose of such design is that the connection process of the connection points 111 of the signal acquisition circuit board 120 and the BMS sub-plate 110, the signal acquisition circuit board 120 and the double-sided adhesive film 130 are integrated through hot pressing, and then the BMS sub-plate 110 is assembled through the thermal riveting process. The BMS sub-plate 110 does not pass through a high-temperature environment, and if a fault occurs during the later use process, it can be replaced and repaired.

[0032] As shown in Figure 1 The length of the second fixing area 142 is greater than the width of the signal acquisition line 121, so that the end of the signal acquisition circuit board 120 welded with the connection points 111 on the BMS sub-plate 110 can be supported on the second fixing area 142 as a whole, improving the stability and reliability of the subsequent bonding process.

[0033] As shown in Figure 2 Figure 3 For the connecting piece, it can be a conventional metal connecting piece in the prior art, and the bonding connecting piece 150 used in the bonding and welding process is preferably selected in the embodiment of the utility model. For the bonding connecting piece 150, a conventional metal welding wire can be selected. For its structure, it comprises a first section 151, a second section 152 and a third section 153 connected in sequence, that is, the first section 151 and the third section 153 are located at both ends of the second section 152, and the first section 151 and the third section 153 are respectively used for welding and fixing with the signal acquisition line 121 and the corresponding connection points 111 on the BMS sub-plate 110, and the second section 152 is arranged across the signal acquisition line 121 and the corresponding connection points 111, that is, the height of the second section 152 is higher than the height of the plane where the first section 151 and the third section 153 are located, that is, the bonding connecting piece 150 is roughly in the shape of an arch bridge, which is high in the middle and low at both ends, and has higher structural strength and stability.

[0034] The fixing mode of the signal acquisition circuit board 120 and the insulating support 140 or the fixing mode of the BMS sub-board 110 and the insulating support 140 is preferably integrated on the insulating support 140 in a detachable fixing mode, and the specific description and limitation are not made, which is well known and easily realized by those skilled in the art, and the purpose is to facilitate the replacement and maintenance of the BMS sub-board in the subsequent use process. Exemplarily, the signal acquisition circuit board 120 is integrated on the insulating support 140 through a hot-pressing process, and the BMS sub-board 110 is integrated on the insulating support 140 through a hot riveting process.

[0035] The signal acquisition line 121 and the BMS sub-board 110 are connected, the signal acquisition circuit board 120 soft plate and the double-sided adhesive film 130 are integrated on the insulating support 140 through a hot-pressing process, then the BMS sub-board 110 is integrated on the same insulating support 140 through a hot riveting process, which effectively prevents the bonding area connection from being invalid due to vibration, after the two are completely fixed in the corresponding position, the signal acquisition line 121 and the BMS sub-board 110 connection point 111 area are bonded and welded by using a bonding welding device, finally 100% AVI detection welding area is carried out, which effectively prevents poor welding. The signal acquisition circuit 120 and the BMS sub-board 110 are not directly connected, but are indirectly connected through a bonding wire, and the BMS sub-board 110 can be replaced and maintained if it fails in the later use process.

[0036] It should be understood that the above specific embodiments of the utility model are only used for example or explanation of the principle of the utility model, and do not constitute the limitation of the utility model. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the utility model should be included in the protection scope of the utility model. In addition, the appended claims of the utility model are intended to cover all changes and modifications falling within the scope and boundary of the appended claims, or the equivalent form of such scope and boundary.

Claims

1. A coupling structure for a BMS sub-board and a signal acquisition circuit board in a power battery, one end of the BMS sub-board is provided with a row of coupling points arranged side by side at intervals, characterized in that, The signal collection line circuit board integrated with a plurality of signal collection lines is fixed on the same insulating support as the BMS sub-board, the signal collection lines and the connecting points at one end of the BMS sub-board are arranged in one-to-one correspondence and relative spacing and are directly welded or welded together through connecting pieces.

2. The coupling structure of claim 1, wherein The signal collection lines and the connecting points are welded together in one-to-one correspondence through bonding connecting pieces.

3. The coupling structure according to claim 2, characterized by The bonding connecting pieces include first, second and third sections connected in sequence, the first and third sections are respectively welded and fixed with the signal collection lines and the corresponding welding points, and the position of the second section is higher than the plane where the first and third sections are located, so that the second section is arranged between the signal collection lines and the corresponding welding points.

4. The coupling structure according to any one of claims 1 to 3, characterized in that, The signal collection line circuit board and the BMS sub-board are detachably fixed on the same insulating support.

5. The coupling structure according to any one of claims 1 to 3, characterized in that, The insulating support has opposite first and second fixed regions, the first fixed region is used for fixing the BMS sub-board, and the second fixed region is used for fixing one end of the signal collection line circuit board and the bonding welding of the connecting points.

6. The coupling structure according to claim 5, characterized by A double-sided adhesive film is further arranged between the signal collection line circuit board and the second fixed region, and the area of the double-sided adhesive film is not less than the area of the bonding surface of the signal collection line circuit board and the insulating support.

7. The coupling structure according to claim 6, characterized by The double-sided adhesive film is positioned by cooperating with the positioning hole arranged on the signal collection line circuit board through the positioning column on the insulating support.

8. The coupling structure of claim 5, wherein The length of the second fixed region is greater than the width of the signal collection line circuit board.

9. The coupling structure according to any one of claims 1 to 3, characterized by The BMS sub-board is integrated on the insulating support; and / or The signal collection lines are integrated on the insulating support.

Images