A power supply board batch repair device and a repair method thereof

Abstract

The application discloses a power supply board batch repair device and a repair method thereof, and relates to the technical field of power supply board repair, which comprises a circuit board repair box, an inlet is fixedly installed at one end of the outer part of the circuit board repair box, an outlet is fixedly installed at the other end of the outer part of the circuit board repair box, two groups of first identification cameras are symmetrically installed at one side of the outer part of the circuit board repair box, and two groups of second identification cameras are symmetrically installed at the other side of the outer part of the circuit board repair box. Through the cooperation of the repair control system and the first identification cameras, the types of pollutants on the board surface and the back surface of the circuit board can be automatically identified, the identification results are used to control the automatic adjustment of the cleaning agent in the built-in adjustment liquid storage cavity of the cleaning water tank through the repair control sub-module, the opening and closing degrees of the valves are automatically adjusted according to the differences between the board surface and the back surface to change the cleaning intensity, the board surface is gently cleaned, the precise components are prevented from being damaged, the back surface is strongly flushed, and the residual welding slag is prevented.

Description

Technical Field

[0001] This invention relates to the field of power board repair technology, specifically to a batch repair device and method for power power boards. Background Technology

[0002] As a core component of power electronic equipment, power supply boards are widely used in industrial power supplies, communication power supplies, new energy vehicle charging piles, photovoltaic inverters and other fields. These boards typically carry high-power devices and are subjected to high voltage, high current and high thermal stress during operation, making them prone to faults such as solder joint cracking, copper foil burning, component aging and flux residue carbonization. With the continuous improvement of the integration of electronic equipment and the continuous increase in power density, the demand for rework of power supply boards is growing, which puts forward higher requirements for the automation of rework processes, cleaning effect, component protection capabilities and post-rework reliability.

[0003] Existing rework equipment typically uses uniform cleaning parameters to clean the entire circuit board, making it difficult to achieve efficient cleaning while protecting components. This results in unstable cleaning effects and significant waste of cleaning agents. Furthermore, existing rework processes lack effective means to inspect the structural integrity of the circuit board after cleaning and drying. After undergoing high-temperature cleaning and hot air drying processes, the board surface is prone to warping or twisting due to accumulated thermal stress, severely reducing the long-term reliability of the reworked product. Improvements are needed. Summary of the Invention

[0004] The purpose of this invention is to provide a batch repair device and method for power supply boards in existing devices, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a power supply board batch rework device, comprising a circuit board rework box, an inlet fixedly installed at one external end of the circuit board rework box, an outlet fixedly installed at the other external end of the circuit board rework box, two sets of first recognition cameras symmetrically installed on one external side of the circuit board rework box, located on both sides of the inlet, two sets of second recognition cameras symmetrically installed on the other external side of the circuit board rework box, located on both sides of the outlet, a third recognition camera fixedly installed at one top end of the inner wall of the circuit board rework box, a circuit board conveyor belt is provided inside the circuit board rework box, several sets of circuit boards are placed on the circuit board conveyor belt, and a first rework component and a second rework component are also provided inside the circuit board rework box; The first rework assembly includes three sets of first cleaning nozzles, three sets of first electric valves, three sets of second cleaning nozzles, three sets of second electric valves, three sets of third cleaning nozzles, three sets of third electric valves, three sets of fourth cleaning nozzles, three sets of fourth electric valves, a cleaning water tank, a first pump, a second pump, and a first conveying pipe. The three sets of first cleaning nozzles are spaced apart and installed on one side of the inside of the circuit board rework box, with the positions of the three sets of first cleaning nozzles corresponding to the positions of the circuit board conveyor belt. The three sets of second cleaning nozzles are spaced apart and installed on the other side of the inside of the circuit board rework box, with the positions of the three sets of second cleaning nozzles corresponding to the positions of the circuit board conveyor belt. The three sets of third cleaning nozzles are spaced apart and installed inside the circuit board rework box on one side, located on the side of the first cleaning nozzle; the three sets of fourth cleaning nozzles are spaced apart and installed inside the circuit board rework box on one side, located on the side of the second cleaning nozzle. The cleaning water tank is fixedly installed inside one end of the circuit board repair box. The cleaning water tank has a built-in liquid storage chamber. One end of the first delivery pipe is connected to the cleaning water tank, and the other end is connected to the first cleaning nozzle, the second cleaning nozzle, the third cleaning nozzle, and the fourth cleaning nozzle, respectively.

[0006] The present invention further illustrates that the first pump and the second pump are fixedly installed on the first delivery pipe; The three sets of first electric valves are respectively fixedly installed inside the first conveying pipe at one end near the three sets of first cleaning nozzles, and the three sets of second electric valves are respectively fixedly installed inside the first conveying pipe at one end near the three sets of second cleaning nozzles. The three sets of third electric valves are respectively fixedly installed inside the first conveying pipe at one end near the three sets of third cleaning nozzles, and the three sets of fourth electric valves are respectively fixedly installed inside the first conveying pipe at one end near the three sets of fourth cleaning nozzles.

[0007] The present invention further describes that the second rework assembly includes a fan, a second conveying pipe, a third conveying pipe, a hot air drying box, a fourth conveying pipe, a fifth conveying pipe, an electric one-way valve, four sets of first drying nozzles, four sets of second drying nozzles, three sets of third drying nozzles, three sets of fourth drying nozzles, a fifth electric valve, two sets of first cooling nozzles, and two sets of second cooling nozzles. The four sets of first drying nozzles are spaced apart and installed on one side of the inside of the circuit board rework box, located on one side of the fourth cleaning nozzle. The four sets of second drying nozzles are spaced apart and installed on the other side of the inside of the circuit board rework box, located on one side of the third cleaning nozzle.

[0008] The present invention further illustrates that the three sets of the third drying nozzles are installed at intervals inside the circuit board rework box, located on one side of the first drying nozzle, and the three sets of the fourth drying nozzles are installed at intervals inside the circuit board rework box, located on one side of the second drying nozzle. The fan is fixedly installed inside the circuit board repair box at the other end. The hot air drying box is fixedly installed inside the circuit board repair box, located on one side of the fan. One end of the second conveying pipe is connected to the fan, and the other end is connected to the hot air drying box. One end of the fourth conveying pipe is connected to the hot air drying box, and the other end is connected to the third drying nozzle and the fourth drying nozzle, respectively.

[0009] The present invention further illustrates that one end of the third conveying pipe is connected to the end of the second conveying pipe near the fan, and the other end of the third conveying pipe is connected to the first drying nozzle, the second drying nozzle, the first cooling nozzle, and the second cooling nozzle, respectively.

[0010] The present invention further illustrates that one end of the fifth conveying pipe is connected to the fourth conveying pipe, and the other end is connected to the first conveying pipe, and the electric one-way valve is fixedly installed inside the fifth conveying pipe.

[0011] The present invention further illustrates that the fifth electric valve is fixedly installed inside the fourth conveying pipe at one end near the third drying nozzle; Two sets of the first cooling nozzles are installed at intervals inside the circuit board rework box, located on one side of the fourth drying nozzle. Two sets of the second cooling nozzles are installed at intervals inside the circuit board rework box, located on one side of the third drying nozzle. The circuit board rework box is placed on the floor of the production workshop, and the interior of the circuit board rework box is hollow.

[0012] The present invention further illustrates that the circuit board rework box is equipped with a rework control system, which includes a data acquisition module and a control module. The data acquisition module and the control module are connected by a signal. The data acquisition module includes a circuit board identification submodule and an analysis submodule. The circuit board identification submodule is electrically connected to a first identification camera, a second identification camera, and a third identification camera. The control module includes a rework control submodule, a temperature control submodule, and a drying control submodule. The rework control submodule is electrically connected to the first pump, the second pump, five sets of electric valves, an electric check valve, and the built-in mixing and storage chamber of the cleaning water tank. The temperature control submodule is electrically connected to the hot air drying box, and the drying control submodule is electrically connected to the fan.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention, through the combined use of the rework control system, the first identification camera and four sets of electric valves, can automatically identify the type of contaminants on the front and back of the circuit board, and according to the identification results, control the cleaning agent to be automatically mixed in the mixing and storage chamber built into the cleaning water tank through the rework control submodule. At the same time, the opening and closing degree of the valves is automatically adjusted according to the difference between the front and back of the board to change the cleaning intensity, so as to gently clean the front of the board to avoid damaging the precision components, and to powerfully flush the back to prevent solder residue. By using a fan, a third drying nozzle, a fourth drying nozzle, and a rework control system in conjunction with the system, forced cold air blowing can be used after cleaning to quickly and thoroughly remove excess cleaning solvent remaining on the circuit board surface, component gaps, and around solder joints, avoiding secondary pollution caused by solvent residue. Simultaneously, the back and front sides of the circuit board can be blown separately, achieving double-sided synchronous blowing, improving processing efficiency while ensuring that cleaning solvent is fully removed from both sides. After blowing, different drying temperatures are set according to the structural characteristics of the front and back sides. Low temperature is used to dry the front side to avoid high temperature damage to sensitive components, while high temperature is used to dry the back side to quickly evaporate residual moisture, prevent solder pad oxidation, and improve drying efficiency. The first and second cooling nozzles simultaneously cool the back and front sides of the circuit board, ensuring a uniform temperature drop on both sides, eliminating internal stress caused by uneven cooling, preventing performance degradation of heat-sensitive components due to accumulated thermal stress, and improving the long-term reliability of the reworked circuit board. By using an electric one-way valve, a fifth delivery pipe, and a rework control system in conjunction, the temperature of the cleaning agent can be adjusted according to the degree of contamination on the front and back of the circuit board, thereby improving the cleaning effect. The hot air is mixed with the cold cleaning agent, keeping the cleaning agent at a warm temperature, which effectively avoids component damage caused by high temperature and ensures the integrity and reliability of components during the rework process. At the same time, it can significantly enhance the chemical activity of the cleaning agent, effectively remove stubborn flux residue and solder slag around the solder joints, and improve cleaning efficiency. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective; Figure 3 This is a schematic diagram of the structure of the first rework component of the present invention; Figure 4 This is a schematic diagram of the first rework component structure from another perspective of the present invention; Figure 5 This is the invention Figure 4 Enlarged schematic diagram of the structure in region A; Figure 6 This is the invention Figure 4 Enlarged schematic diagram of the structure in region B; Figure 7 This is a schematic diagram showing the location of the cleaning water tank in this invention; Figure 8 This is a schematic diagram of the pipeline structure of the present invention; Figure 9 This is a schematic diagram of the control system of the present invention.

[0015] In the diagram: 1. Circuit board rework box; 11. Feed inlet; 12. Discharge outlet; 13. First identification camera; 14. Second identification camera; 15. Third identification camera; 16. Circuit board conveyor belt; 2. First repair component; 21. First cleaning nozzle; 211. First electric valve; 22. Second cleaning nozzle; 221. Second electric valve; 23. Third cleaning nozzle; 231. Third electric valve; 24. Fourth cleaning nozzle; 241. Fourth electric valve; 25. Cleaning water tank; 251. First pump; 252. Second pump; 26. First delivery pipe; 3. Second rework component; 31. Fan; 311. Second conveying pipe; 312. Third conveying pipe; 32. Hot air drying box; 321. Fourth conveying pipe; 322. Fifth conveying pipe; 323. Electric check valve; 33. First drying nozzle; 34. Second drying nozzle; 35. Third drying nozzle; 351. Fifth electric valve; 36. Fourth drying nozzle; 37. First cooling nozzle; 38. Second cooling nozzle; 4. Circuit board. Detailed Implementation

[0016] The following detailed, non-limiting description of the technical solution of the present invention, in conjunction with preferred embodiments and accompanying drawings, is provided. Obviously, the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0017] Please see Figure 1-9The present invention provides a technical solution: a power supply board batch rework device, including a circuit board rework box 1. The interior of the circuit board rework box 1 is hollow. An inlet 11 is fixedly installed at one end of the exterior of the circuit board rework box 1, and an outlet 12 is fixedly installed at the other end of the exterior of the circuit board rework box 1. Two sets of first recognition cameras 13 are symmetrically installed on one side of the exterior of the circuit board rework box 1, located on both sides of the inlet 11, for use in recognition and detection operations. Two sets of second recognition cameras 14 are symmetrically installed on the other side of the exterior of the circuit board rework box 1, located on both sides of the outlet 12, for use in recognition and detection operations. A third recognition camera 15 is fixedly installed at one end of the top of the inner wall of the circuit board rework box 1 for use in rework detection operations. A circuit board conveyor belt 16 is provided inside the circuit board rework box 1 for use in rework conveying operations. Several sets of circuit boards 4 are vertically placed on the circuit board conveyor belt 16. The circuit board rework box 1 also contains a first rework component 2 and a second rework component 3. The first rework assembly 2 includes three sets of first cleaning nozzles 21, three sets of first electric valves 211, three sets of second cleaning nozzles 22, three sets of second electric valves 221, three sets of third cleaning nozzles 23, three sets of third electric valves 231, three sets of fourth cleaning nozzles 24, three sets of fourth electric valves 241, a cleaning water tank 25, a first pump 251, a second pump 252, and a first conveying pipe 26. The three sets of first cleaning nozzles 21 are spaced apart and installed on one side of the inside of the circuit board rework box 1. The positions of the three sets of first cleaning nozzles 21 correspond to the positions of the circuit board conveyor belt 16, and are used to cooperate in cleaning the back of the circuit board 4. The three sets of second cleaning nozzles 22 are spaced apart and installed on the other side of the inside of the circuit board rework box 1. The positions of the three sets of second cleaning nozzles 22 correspond to the positions of the circuit board conveyor belt 16, and are used to cooperate in cleaning the surface of the circuit board 4. The first cleaning nozzle 21 and the second cleaning nozzle 22 are used to clean polar contaminants. Three sets of third cleaning nozzles 23 are spaced apart and installed inside one side of the circuit board rework box 1, located on the side of the first cleaning nozzle 21, to cooperate in cleaning the back of the circuit board 4. Three sets of fourth cleaning nozzles 24 are spaced apart and installed inside one side of the circuit board rework box 1, located on the side of the second cleaning nozzle 22, to cooperate in cleaning the back of the circuit board 4. The third cleaning nozzle 23 and the fourth cleaning nozzle 24 are used to clean non-polar contaminants; The cleaning water tank 25 is fixedly installed inside one end of the circuit board rework box 1 and is used to transport different types of cleaning solvents. The cleaning water tank 25 has a built-in liquid storage chamber for regulating solvent-based cleaning agents and water-based cleaning agents (not shown in the figure). One end of the first delivery pipe 26 is connected to the cleaning water tank 25, and the other end is connected to the first cleaning nozzle 21, the second cleaning nozzle 22, the third cleaning nozzle 23, and the fourth cleaning nozzle 24 respectively. The first pump 251 and the second pump 252 are fixedly installed on the first delivery pipe 26 to cooperate in pumping out the cleaning solvent; Three sets of first electric valves 211 are respectively fixedly installed inside the first conveying pipe 26 near one end of the three sets of first cleaning nozzles 21, and three sets of second electric valves 221 are respectively fixedly installed inside the first conveying pipe 26 near one end of the three sets of second cleaning nozzles 22. Three sets of third electric valves 231 are respectively fixedly installed inside the first conveying pipe 26 near one end of the three sets of third cleaning nozzles 23, and three sets of fourth electric valves 241 are respectively fixedly installed inside the first conveying pipe 26 near one end of the three sets of fourth cleaning nozzles 24. The second rework assembly 3 includes a fan 31, a second conveying pipe 311, a third conveying pipe 312, a hot air drying box 32, a fourth conveying pipe 321, a fifth conveying pipe 322, an electric one-way valve 323, four sets of first drying nozzles 33, four sets of second drying nozzles 34, three sets of third drying nozzles 35, three sets of fourth drying nozzles 36, a fifth electric valve 351, two sets of first cooling nozzles 37, and two sets of second cooling nozzles 38. The four sets of first drying nozzles 33 are spaced apart and installed on one side of the inside of the circuit board rework box 1, located on one side of the fourth cleaning nozzle 24, for use in conjunction with solvent purging operations. The four sets of second drying nozzles 34 are spaced apart and installed on the other side of the inside of the circuit board rework box 1, located on one side of the third cleaning nozzle 23, for use in conjunction with solvent purging operations. Three sets of third drying nozzles 35 are installed at intervals inside the circuit board rework box 1, located on one side of the first drying nozzle 33, and are used to cooperate in the hot air drying operation on the surface of the circuit board 4. Three sets of fourth drying nozzles 36 are installed at intervals inside the circuit board rework box 1, located on one side of the second drying nozzle 34, and are used to cooperate in the hot air drying operation on the back of the circuit board 4. The fan 31 is fixedly installed inside the circuit board rework box 1 at the other end. The hot air drying box 32 is fixedly installed inside the circuit board rework box 1, located on one side of the fan 31. One end of the second conveying pipe 311 is connected to the fan 31, and the other end is connected to the hot air drying box 32. One end of the fourth conveying pipe 321 is connected to the hot air drying box 32, and the other end is connected to the third drying nozzle 35 and the fourth drying nozzle 36 respectively. One end of the third delivery pipe 312 is connected to the end of the second delivery pipe 311 near the fan 31, and the other end of the third delivery pipe 312 is connected to the first drying nozzle 33, the second drying nozzle 34, the first cooling nozzle 37, and the second cooling nozzle 38 respectively, for diverting cold air for the cleaning solvent blowing operation of the circuit board 4. One end of the fifth delivery pipe 322 is connected to the fourth delivery pipe 321, and the other end is connected to the first delivery pipe 26. It is used to divert hot air for heating the cleaning solvent and improve the cleaning effect. The electric one-way valve 323 is fixedly installed inside the fifth delivery pipe 322 to control the flow of hot air. The fifth electric valve 351 is fixedly installed inside the fourth delivery pipe 321 at one end near the third drying nozzle 35, and is used to control the flow of hot air. Two sets of first cooling nozzles 37 are installed at intervals inside the circuit board rework box 1, located on one side of the fourth drying nozzle 36, to cooperate in cooling the back of the circuit board 4. Two sets of second cooling nozzles 38 are installed at intervals inside the circuit board rework box 1, located on one side of the third drying nozzle 35, to cooperate in cooling the surface of the circuit board 4. The circuit board rework box 1 is equipped with a rework control system, which includes a data acquisition module and a control module. The data acquisition module and the control module are connected by a signal. The data acquisition module includes a circuit board identification submodule and an analysis submodule. The circuit board identification submodule is electrically connected to the first identification camera 13, the second identification camera 14, and the third identification camera 15. The control module includes a rework control submodule, a temperature control submodule, and a drying control submodule. The rework control submodule is electrically connected to the first pump 251, the second pump 252, five sets of electric valves, the electric check valve 323, and the built-in mixing and storage chamber of the cleaning water tank 25. The temperature control submodule is electrically connected to the hot air drying box 32, and the drying control submodule is electrically connected to the fan 31.

[0018] The rework control system includes the following operating steps: S1. When circuit board 4 needs to be repaired, the staff manually inserts circuit board 4 into the circuit board conveyor belt 16 at the feed port 11. At this time, the repair control system controls the first recognition camera 13 through the data acquisition module to detect the degree of contamination on the front and back of the circuit board 4.

[0019] S2. The rework control system starts the first rework component 2 and the second rework component 3 to perform rework cleaning operation on the circuit board 4, and adjusts the cleaning intensity according to the degree of contamination on the front and back of the circuit board 4. Specifically, the rework control system collects image data of the front and back of the circuit board 4 through the first identification camera 13 and compares it with the set value through the analysis submodule. The rework control system sets the degree of contamination to A1. Then, the first identification camera 13 detects the type of contaminant and controls the mixing and storage chamber built into the cleaning water tank 25 to automatically mix the cleaning agent. When the rework control system detects that the degree of contamination is ≤A1, it determines that it is lightly contaminated. The rework control system controls the two sets of pumps to start, the second electric valve 221 and the fourth electric valve 241 to open to 1 / 3, and the first electric valve 211 and the third electric valve 231 to open completely. If the contaminant is mainly polar contaminant, the rework control system controls the cleaning water tank 25 to mix water-based cleaning agent. Two sets of pumps pump water-based cleaning agent into the first delivery pipe 26, and then spray it from the second cleaning nozzle 22 and the fourth cleaning nozzle 24 onto the surface of the circuit board 4 for gentle cleaning. At the same time, the water-based cleaning agent is also sprayed from the first cleaning nozzle 21 and the third cleaning nozzle 23 onto the back of the circuit board 4 for powerful rinsing and cleaning. If the contaminants are mainly non-polar contaminants, the rework control system controls the cleaning water tank 25 to prepare solvent-based cleaning agent. Two sets of pumps pump the solvent-based cleaning agent into the first delivery pipe 26, and then spray it from the second cleaning nozzle 22 and the fourth cleaning nozzle 24 onto the surface of the circuit board 4 for gentle cleaning. At the same time, the solvent-based cleaning agent is also sprayed from the first cleaning nozzle 21 and the third cleaning nozzle 23 onto the back of the circuit board 4 for powerful rinsing and cleaning.

[0020] When the rework control system detects a contamination level value > A1, it determines the contamination to be highly contaminated. The system then activates two sets of pumps, fully opening the second electric valve 221 and the fourth electric valve 241, as well as the first electric valve 211 and the third electric valve 231. The rework control system then prepares a composite cleaning agent online by mixing the liquid in the cleaning water tank 25 with the solvent in a 3:1 volume ratio. If the contaminant is predominantly polar, the two sets of pumps are activated first to pump the composite cleaning agent. The solvent is pre-washed by spraying from the first cleaning nozzle 21 and the third cleaning nozzle 23 into the first delivery pipe 26 for 10 seconds. Then, the second cleaning nozzle 22 and the fourth cleaning nozzle 24 are started for water-based main washing for 20 seconds. If the contaminants are mainly non-polar contaminants, the two sets of pumps are started first to pump the composite cleaning agent into the first delivery pipe 26, and then sprayed from the second cleaning nozzle 22 and the fourth cleaning nozzle 24 for water-based pre-washing. Finally, the first cleaning nozzle 21 and the third cleaning nozzle 23 are used for solvent main washing.

[0021] By using the rework control system, the first identification camera 13 and four sets of electric valves in combination, the type of contaminants on the front and back of the circuit board 4 can be automatically identified. Based on the identification results, the rework control submodule controls the built-in mixing and storage chamber of the cleaning water tank 25 to automatically mix the cleaning agent. At the same time, the opening and closing degree of the valve is automatically adjusted according to the difference between the front and back of the board to change the cleaning intensity. The front of the board is gently cleaned to avoid damaging the precision components, while the back of the board is strongly flushed to prevent solder residue.

[0022] S3. After the rework cleaning is completed, the rework control system controls the cleaning solvent removal and drying operation. After drying, the material is automatically discharged and quality is inspected. Specifically, after the above cleaning operation is completed, the rework control system starts the fan 31, and the air drying control submodule controls the fan 31 to output cold air. The cold air is diverted through the second conveying pipe 311 and the third conveying pipe 312 to the first drying nozzle 33 and the second drying nozzle 34. The first drying nozzle 33 and the second drying nozzle 34 respectively blow the back and the front of the circuit board 4 to remove the residual cleaning solvent from the surface of the circuit board 4.

[0023] After completing the solvent purging operation, the rework control system starts the hot air drying chamber 32. The temperature control submodule heats the hot air drying chamber 32 to the preset temperature. The fan 31 blows cold air into the second delivery pipe 311. After being heated by the hot air drying chamber 32, the air is distributed through the fourth delivery pipe 321 to the third drying nozzle 35 and the fourth drying nozzle 36. The third drying nozzle 35 dries the surface of the circuit board 4 with hot air, and the fourth drying nozzle 36 dries the back of the circuit board 4 with hot air. During the hot air drying process, the rework control system sets the surface drying temperature to 60°C and the back drying temperature to 100°C. The rework control system first heats the hot air drying chamber 32 to 60°C. At this time, the fan 31 blows cold air into the second delivery pipe 311. After the drying chamber 32 is heated, the air is diverted to the third drying nozzle 35 and the fourth drying nozzle 36 through the fourth conveying pipe 321. The third drying nozzle 35 dries the surface of the circuit board 4 with hot air for 10 seconds. When the drying time is up, the rework control system controls the drying temperature of the hot air drying chamber 32 to rise to 100°C. At this time, the rework control system controls the fifth electric valve 351 to close. The fan 31 blows cold air into the second conveying pipe 311. After being heated by the hot air drying chamber 32, the air is diverted to the fourth drying nozzle 36 through the fourth conveying pipe 321. The fourth drying nozzle 36 dries the back of the circuit board 4 with hot air. The temperature control submodule adjusts the air volume of the third drying nozzle 35 through the fifth electric valve 351 to achieve differentiated drying of the surface and the back of the board.

[0024] After the hot air drying operation is completed, the rework control system controls the fan 31 to continue outputting cold air. The cold air is diverted through the second conveying pipe 311 and the third conveying pipe 312 to the first cooling nozzle 37 and the second cooling nozzle 38. The first cooling nozzle 37 cools the back of the circuit board 4, and the second cooling nozzle 38 cools the front of the circuit board 4 until the temperature of the circuit board 4 drops to room temperature. After cooling is completed, the circuit board conveyor belt 16 transports the circuit board 4 to the discharge port 12. At this time, the rework control system collects images of the front and back of the circuit board 4 through the second recognition camera 14 for final quality inspection. Circuit boards 4 that pass the inspection are output from the discharge port 12. Circuit boards 4 that fail the inspection are recorded by the control system and the non-conformance information is sent to the staff. The staff then manually remove the non-conformance circuit boards 4.

[0025] Furthermore, after cooling is complete, the rework control system controls the board surface deformation detection. The rework control system controls the third recognition camera 15 to collect image data of the board surface of the board 4 through the board recognition submodule. The analysis submodule extracts the contour features and curvature of the board surface of the board 4 and compares them with the preset deformation threshold X1 in the rework control system. The rework control system sets the deformation threshold X1, which includes the warp height threshold Y1 and the twist angle threshold Z1.

[0026] When the rework control system detects that the warpage height of the circuit board 4 is ≤Y1 and the twist angle is ≤Z1, the rework control system determines that the degree of deformation of the circuit board 4 is within the allowable range and no obvious deformation has occurred. At this time, the circuit board conveyor belt 16 will continue to transport the circuit board 4 forward to the subsequent quality inspection stage.

[0027] When the rework control system detects that the warpage height of the circuit board 4 is greater than Y1 or the torsion angle is greater than Z1, the rework control system determines that the circuit board 4 has undergone excessive deformation during the high-temperature drying process. The rework control system records the deformation data and corresponding position information of the circuit board 4, and issues an alarm signal through the control module to prompt the staff to manually remove the circuit board 4 for processing.

[0028] By using the fan 31, the third drying nozzle 35, the fourth drying nozzle 36 in conjunction with the rework control system, cold air can be forced to blow away excess cleaning solvent remaining on the circuit board surface, component gaps, and around solder joints after cleaning. This quickly and thoroughly removes the solvent residue, preventing secondary contamination caused by solvent residue. Simultaneously, the back and front sides of the circuit board 4 can be blown away separately, achieving simultaneous double-sided blowing. This improves processing efficiency while ensuring that cleaning solvent is fully removed from both sides. After blowing, different drying temperatures are set according to the structural characteristics of the front and back sides. Low temperature is used to dry the front side to avoid high temperature damage to sensitive components, while high temperature is used to dry the back side to quickly evaporate residual moisture, prevent solder pad oxidation, and improve drying efficiency. The first cooling nozzle 37 and the second cooling nozzle 38 simultaneously cool the back and front sides of the circuit board 4, ensuring that the temperature on both sides of the circuit board drops evenly. This eliminates internal stress caused by uneven cooling, prevents performance degradation of heat-sensitive components due to thermal stress accumulation, and improves the long-term reliability of the reworked circuit board.

[0029] The third recognition camera 15 can collect image data of the circuit board 4 surface in real time after the high-temperature drying and cooling process is completed, and compare it with the set value to extract the deformation parameters of warp height and torsion angle. This enables non-contact detection of the deformation of the circuit board surface, eliminating the need for manual visual inspection, significantly improving detection accuracy and efficiency, and effectively ensuring the reliability and safety of the reworked products.

[0030] S2 includes the following specific steps: During the cleaning operation, the rework control submodule adjusts the opening and closing of the electric check valve 323, and uses the fifth delivery pipe 322 to divert the hot air in the hot air drying box 32 to assist in heating the cleaning agent, and adjusts the temperature of the cleaning agent according to the degree of contamination on the front and back of the circuit board 4. Specifically, when the rework control system detects a contamination level value > A1, it determines that the contamination is high and the cleaning effect needs to be improved. The temperature control submodule controls the electric one-way valve 323 to open, and the hot air generated by the hot air drying box 32 is diverted to the first conveying pipe 26 through the fifth conveying pipe 322 to assist in heating the cleaning agent. At this time, the rework control system first controls the hot air drying box 32 to adjust the heating temperature to 60°C. The two sets of pumps pump the cold cleaning agent into the first conveying pipe 26, mix it with the hot air diverted by the fifth conveying pipe 322, and then spray it from the second cleaning nozzle 22 and the fourth cleaning nozzle 24 to the surface of the circuit board 4 for gentle cleaning. At the same time, the heated cleaning agent is also sprayed from the first cleaning nozzle 21 and the third cleaning nozzle 23 to the back of the circuit board 4 for powerful rinsing and cleaning.

[0031] By using the electric one-way valve 323, the fifth delivery pipe 322, and the rework control system in conjunction, the temperature of the cleaning agent can be adjusted according to the degree of contamination on the front and back of the circuit board 4, thereby improving the cleaning effect. The hot air is mixed with the cold cleaning agent to keep the cleaning agent in a warm state, which effectively avoids component damage caused by high temperature and ensures the integrity and reliability of the components during the rework process. At the same time, it can significantly enhance the chemical activity of the cleaning agent, effectively remove stubborn flux residue and solder slag around the solder joints, and improve the cleaning efficiency.

[0032] S3 includes the following specific steps: Specifically, the rework control system continuously collects image data of the circuit board 4 surface through the third recognition camera 15, and the analysis submodule calculates the deformation recovery of the circuit board 4. Specifically, the rework control system records the initial deformation parameters of circuit board 4 after cooling and presets a time interval. When the preset time interval is reached, the deformation parameters are collected again and the deformation recovery rate is calculated. When the deformation recovery rate is greater than the preset recovery value, the rework control system determines that the deformation is elastic deformation. When the deformation recovery rate is less than or equal to the preset recovery value, the rework control system determines that the deformation is plastic deformation.

[0033] Furthermore, when the rework control system determines that the circuit board 4 is elastically deformed, the rework control system executes the stress release program. The rework control system controls the first cooling nozzle 37 and the second cooling nozzle 38 to continue to output cold air to extend the cooling of the circuit board 4. The cooling time is extended to 30 seconds. At the same time, the circuit board conveyor belt 16 is stopped to allow the circuit board 4 to release its internal stress naturally in a static state. After the extended cooling is completed, the rework control system collects deformation parameters again through the third recognition camera 15 for re-inspection.

[0034] If, after re-inspection, the deformation parameters recover to within the range of warpage height ≤ Y1 and twist angle ≤ Z1, then the deformation is determined to have been eliminated, and the circuit board conveyor belt 16 will continue to transport the circuit board 4 forward to the subsequent quality inspection stage.

[0035] If the deformation parameters still exceed the threshold range after re-inspection, but the deformation recovery rate is further improved, the extended cooling procedure is repeated until the deformation is eliminated or it is confirmed that it cannot be recovered.

[0036] When the rework control system determines that circuit board 4 has undergone plastic deformation, it determines that circuit board 4 is a defective product and sends an error message to the staff.

[0037] By calculating the deformation recovery rate, it is possible to accurately distinguish between elastic deformation and plastic deformation, avoid misjudging temporary warping caused by thermal stress as permanent damage, reduce unnecessary scrap, and eliminate deformation without adding extra processes by extending cooling time and static stress release, thus avoiding misjudging recoverable circuit boards as scrap and improving rework utilization.

[0038] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features, and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A power supply board mass repair apparatus comprising a circuit board repair box (1), characterized in that, The circuit board rework box (1) has a feed inlet (11) fixedly installed at one end of its exterior and a discharge outlet (12) fixedly installed at the other end of its exterior. Two sets of first identification cameras (13) are symmetrically installed on one side of the exterior of the circuit board rework box (1) and located on both sides of the feed inlet (11). Two sets of second identification cameras (14) are symmetrically installed on the other side of the exterior of the circuit board rework box (1) and located on both sides of the discharge outlet (12). A third identification camera (15) is fixedly installed at the top of the inner wall of the circuit board rework box (1). A circuit board conveyor belt (16) is provided inside the circuit board rework box (1). Several sets of circuit boards (4) are placed on the circuit board conveyor belt (16). A first rework component (2) and a second rework component (3) are also provided inside the circuit board rework box (1). The first rework assembly (2) includes three sets of first cleaning nozzles (21), three sets of first electric valves (211), three sets of second cleaning nozzles (22), three sets of second electric valves (221), three sets of third cleaning nozzles (23), three sets of third electric valves (231), three sets of fourth cleaning nozzles (24), three sets of fourth electric valves (241), a cleaning water tank (25), a first pump (251), a second pump (252), and a first conveying pipe (26). The three sets of first cleaning nozzles (21) are installed at intervals on one side of the inside of the circuit board rework box (1), and the positions of the three sets of first cleaning nozzles (21) correspond to the positions of the circuit board conveyor belt (16). The three sets of second cleaning nozzles (22) are installed at intervals on the other side of the inside of the circuit board rework box (1), and the positions of the three sets of second cleaning nozzles (22) correspond to the positions of the circuit board conveyor belt (16). The three sets of third cleaning nozzles (23) are installed at intervals on one side inside the circuit board rework box (1), located on one side of the first cleaning nozzle (21), and the three sets of fourth cleaning nozzles (24) are installed at intervals on one side inside the circuit board rework box (1), located on one side of the second cleaning nozzle (22). The cleaning water tank (25) is fixedly installed inside one end of the circuit board repair box (1). The cleaning water tank (25) has a liquid storage chamber. One end of the first delivery pipe (26) is connected to the cleaning water tank (25), and the other end is connected to the first cleaning nozzle (21), the second cleaning nozzle (22), the third cleaning nozzle (23), and the fourth cleaning nozzle (24) respectively.

2. The power supply board bulk repair apparatus of claim 1, wherein, The first pump (251) and the second pump (252) are fixedly installed on the first delivery pipe (26); The three sets of first electric valves (211) are respectively fixedly installed inside the first conveying pipe (26) at one end near the three sets of first cleaning nozzles (21), and the three sets of second electric valves (221) are respectively fixedly installed inside the first conveying pipe (26) at one end near the three sets of second cleaning nozzles (22); The three sets of third electric valves (231) are respectively fixedly installed inside the first conveying pipe (26) at one end near the three sets of third cleaning nozzles (23), and the three sets of fourth electric valves (241) are respectively fixedly installed inside the first conveying pipe (26) at one end near the three sets of fourth cleaning nozzles (24).

3. The power supply board mass rework apparatus of claim 2, wherein, The second rework assembly (3) includes a fan (31), a second conveying pipe (311), a third conveying pipe (312), a hot air drying box (32), a fourth conveying pipe (321), a fifth conveying pipe (322), an electric one-way valve (323), four sets of first drying nozzles (33), four sets of second drying nozzles (34), three sets of third drying nozzles (35), three sets of fourth drying nozzles (36), a fifth electric valve (351), two sets of first cooling nozzles (37), and two sets of second cooling nozzles (38). The four sets of first drying nozzles (33) are spaced apart and installed on one side of the inside of the circuit board rework box (1), located on one side of the fourth cleaning nozzle (24). The four sets of second drying nozzles (34) are spaced apart and installed on the other side of the inside of the circuit board rework box (1), located on one side of the third cleaning nozzle (23).

4. The power supply board mass rework apparatus of claim 3, wherein, The three sets of third drying nozzles (35) are installed at intervals inside the circuit board rework box (1) and located on one side of the first drying nozzle (33). The three sets of fourth drying nozzles (36) are installed at intervals inside the circuit board rework box (1) and located on one side of the second drying nozzle (34). The fan (31) is fixedly installed inside the circuit board repair box (1) at the other end. The hot air drying box (32) is fixedly installed inside the circuit board repair box (1) and located on one side of the fan (31). One end of the second conveying pipe (311) is connected to the fan (31), and the other end is connected to the hot air drying box (32). One end of the fourth conveying pipe (321) is connected to the hot air drying box (32), and the other end is connected to the third drying nozzle (35) and the fourth drying nozzle (36) respectively.

5. The power supply board mass rework apparatus of claim 4, wherein, One end of the third conveying pipe (312) is connected to the end of the second conveying pipe (311) near the fan (31), and the other end of the third conveying pipe (312) is connected to the first drying nozzle (33), the second drying nozzle (34), the first cooling nozzle (37), and the second cooling nozzle (38), respectively.

6. The power supply board mass rework apparatus of claim 5, wherein, One end of the fifth delivery pipe (322) is connected to the fourth delivery pipe (321), and the other end is connected to the first delivery pipe (26). The electric one-way valve (323) is fixedly installed inside the fifth delivery pipe (322).

7. A batch rework device for power supply boards according to claim 6, characterized in that, The fifth electric valve (351) is fixedly installed inside the fourth delivery pipe (321) at one end near the third drying nozzle (35); Two sets of first cooling nozzles (37) are installed at intervals inside the circuit board rework box (1), located on one side of the fourth drying nozzle (36). Two sets of second cooling nozzles (38) are installed at intervals inside the circuit board rework box (1), located on one side of the third drying nozzle (35). The circuit board rework box (1) is placed on the floor of the production workshop, and the interior of the circuit board rework box (1) is hollow.

8. A batch rework device for power supply boards according to claim 7, characterized in that, The circuit board rework box (1) is equipped with a rework control system. The rework control system includes a data acquisition module and a control module. The data acquisition module and the control module are connected by a signal. The data acquisition module includes a circuit board identification submodule and an analysis submodule. The circuit board identification submodule is electrically connected to the first identification camera (13), the second identification camera (14), and the third identification camera (15). The control module includes a rework control submodule, a temperature control submodule, and a drying control submodule. The rework control submodule is electrically connected to the first pump (251), the second pump (252), five sets of electric valves, an electric check valve (323), and the built-in mixing and storage chamber of the cleaning water tank (25). The temperature control submodule is electrically connected to the hot air drying box (32), and the drying control submodule is electrically connected to the fan (31).

9. A method of using a power supply board batch repair device, for implementing the power supply board batch repair device as described in claim 8, characterized in that, include: S1. When the circuit board (4) needs to be repaired, the staff manually inserts the circuit board (4) into the circuit board conveyor belt (16) at the feed port (11) in sequence. At this time, the repair control system controls the first identification camera (13) through the data acquisition module to detect the degree of contamination on the front and back of the circuit board (4). S2. The rework control system starts the first rework component (2) and the second rework component (3) to perform rework cleaning on the circuit board (4) and changes the cleaning intensity according to the degree of contamination on the front and back of the circuit board (4). S3. After the rework cleaning is completed, the rework control system controls the cleaning solvent removal and drying operation. After drying, the material is automatically discharged and quality is tested.

10. The method of using the power supply board batch rework device according to claim 9, characterized in that, S2 further includes the following specific steps: During the cleaning operation, the rework control submodule adjusts the opening and closing of the electric check valve (323) and uses the fifth delivery pipe (322) to divert the hot air in the hot air drying box (32) to assist in heating the cleaning agent, and adjusts the temperature of the cleaning agent according to the degree of contamination on the front and back of the circuit board (4).

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