Electronic device and electronic device system

Abstract

The utility model discloses electronic equipment and an electronic equipment system and relates to the technical field of electronic equipment. Electronic equipment comprises a board body and a slot seat, and the board body is provided with a bonding pad part; the slot seat is provided with a first connecting part and a second connecting part, and the first connecting part and the second connecting part are arranged on the side, facing the board body, of the slot seat and are connected with the bonding pad part respectively; wherein the connection strength of the first connection part and the bonding pad part is greater than the connection strength of the second connection part and the bonding pad part.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to an electronic device and an electronic device system. BACKGROUND

[0002] The memory slot, also known as a memory stick slot, is a special interface on a computer motherboard for installing a memory module. When the overall length of the memory slot is relatively long, it is easy to cause virtual soldering and empty soldering during the production process. CONTENT OF THE UTILITY MODEL

[0003] To solve the above technical problems, the embodiments of the present disclosure provide the following technical solutions:

[0004] The first aspect of the present disclosure provides an electronic device, comprising:

[0005] a board body having a pad portion;

[0006] a slot seat having a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are both arranged on the side of the slot seat facing the board body and are connected to the pad portion respectively;

[0007] The connection strength of the first connecting portion to the pad portion is greater than the connection strength of the second connecting portion to the pad portion.

[0008] In some modified embodiments of the first aspect of the present disclosure, the first connecting portions are arranged at intervals in the first direction on the slot seat, and the first connecting portions are symmetrically arranged or asymmetrically arranged in the second direction.

[0009] In some modified embodiments of the first aspect of the present disclosure, the pad portion includes a first pad portion and a second pad portion, the first connecting portion is a ground pin, the second connecting portion is a signal pin, the first connecting portion is connected to the first pad portion, and the second connecting portion is connected to the second pad portion.

[0010] In some modified embodiments of the first aspect of the present disclosure, the first pad portion is provided with an opening, and the first connecting portion is inserted into the opening.

[0011] In some modified embodiments of the first aspect of the present disclosure, a plurality of first connecting portions are arranged, and the plurality of first connecting portions are distributed at intervals among the plurality of second connecting portions.

[0012] In some modified embodiments of the first aspect of the present disclosure, two first connecting portions are arranged at both ends of the second connecting portion, and at least one first connecting portion is arranged at a middle position of the slot seat.

[0013] In some modified embodiments of the first aspect of the present disclosure, the first connecting portion includes a connecting segment and an insertion segment connected to each other, the connecting segment is connected to the side of the slot seat facing the board body, and the insertion segment is inserted into the opening.

[0014] In some modified embodiments of the first aspect of the present disclosure, the end of the plug-in section is provided with a clamping section, which can be elastically deformed to clamp on the first pad part.

[0015] In some modified embodiments of the first aspect of the present disclosure, the clamping section is selected from at least one of the following combinations:

[0016] The clamping section is curved into a circular arc shape;

[0017] The clamping section is continuously curved in two opposite directions;

[0018] The clamping section comprises an elliptical protrusion, which can be elastically deformed along its axis direction;

[0019] The clamping section comprises a rhombic protrusion, which can be elastically deformed along its axis direction.

[0020] The second aspect of the present disclosure provides an electronic device system, comprising:

[0021] The electronic device comprises a board body and a socket seat, the board body has a pad part, the socket seat has a first connecting part and a second connecting part, both of which are arranged on the side of the socket seat facing the board body and are connected with the pad part respectively; wherein the connection strength of the first connecting part with the pad part is greater than that of the second connecting part with the pad part;

[0022] The memory is detachably connected with the socket seat. BRIEF DESCRIPTION OF DRAWINGS

[0023] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will be readily understood through reading the detailed description of the exemplary embodiments of the present disclosure below in conjunction with the accompanying drawings. In the drawings, several embodiments of the present disclosure are illustrated by way of example and not limitation, in which the same or corresponding elements are referred to with the same or corresponding reference numerals, in which:

[0024] Figure 1 A structural schematic diagram of an electronic device is schematically shown;

[0025] Figure 2 A structural schematic diagram of an electronic device is schematically shown.

[0026] BRIEF DESCRIPTION OF DRAWINGS

[0027] 1, board body; 2, socket seat; 21, first connecting part; 211, connecting section; 212, plug-in section; 213, clamping section; 22, second connecting part; 3, pad part; 4, opening. DETAILED DESCRIPTION

[0028] Exemplary embodiments of the present disclosure will be described in greater detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0029] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present disclosure should be understood as the common meanings understood by those skilled in the art to which the present disclosure belongs.

[0030] The memory slot, also known as the memory stick slot, is a special interface on the computer motherboard for installing memory modules. At present, due to the problem of high-speed signal quality of electronic devices, the memory slot adopts SMD (Surface Mount Device) material. However, the connection strength of SMD (Surface Mount Device) material is low, the memory slot has too many pins, and the overall length is relatively long. Due to the influence of thermal stress, the memory slot using SMD (Surface Mount Device) material is prone to cause pin virtual welding and empty welding in the production process.

[0031] In order to solve the above technical problems, the present disclosure provides an electronic device and an electronic device system, which can avoid the situation that the memory slot causes pin virtual welding and empty welding.

[0032] Embodiment 1

[0033] As shown in Figure 1 and Figure 2 An electronic device includes a board body 1 and a slot seat 2, the board body 1 has a pad part 3; the slot seat 2 has a first connecting part 21 and a second connecting part 22, the first connecting part 21 and the second connecting part 22 are both arranged on the side of the slot seat 2 facing the board body 1, and are respectively connected with the pad part 3; wherein the connection strength of the first connecting part 21 with the pad part 3 is greater than the connection strength of the second connecting part 22 with the pad part 3.

[0034] The board 1 is a support for electronic components and a carrier for electrical connections. Specifically, the board 1 can be a Printed Circuit Board (PCB) with various structures such as lines, pads, vias, etc. arranged for connecting different components and elements. More specifically, the board 1 can be a single-sided board with copper foil on one side only, with all components mounted on the same side and wires located on this side only. The board 1 can also be a double-sided board with copper foil on both sides, allowing components to be mounted on both sides and electrical connections between the two sides to be made through vias. The board 1 can also be a multi-layer board containing three or more layers of copper foil, with multiple layers of insulating material in between. These additional layers can be power layers, ground layers, or signal layers, helping to increase wiring density, reduce interference, and optimize performance. More specifically, component pins can pass through holes in the PCB and be secured by soldering, suitable for larger-sized components. Components can also be directly mounted on the surface of the PCB without the need for holes, suitable for miniaturization and high-density wiring. Combining the advantages of both, both through-hole components and surface-mounted components can be used.

[0035] The pad 3 refers to a metallized area designed on the surface of the PCB. The pad 3 can be composed of copper, which can be coated with a layer of tin-lead alloy, pure tin, gold, etc. to improve soldering performance and prevent oxidation. The pad 3 provides physical support for electronic components, ensuring their stable installation on the PCB. Through the pad 3, component pins can be connected to wires or other pads 3 on the PCB, realizing electrical paths. The pads of high-power components can also be designed with additional heat dissipation paths to help dissipate heat. The pad 3 can be a round pad, suitable for most through-hole components. The pad 3 can also be a square pad, used for Surface Mount Devices (SMD), especially those that require a larger contact area. The pad 3 can also be a rectangular pad, similar to a square pad but with different length and width, suitable for component pins of specific shapes. The pad 3 can also be an oval pad, combining the characteristics of round and rectangular pads, suitable for some special-shaped pins. The pad 3 can also be a teardrop-shaped pad, designed in a teardrop shape at the connection between the pad and the wire to increase the connection strength and reduce the risk of breakage.

[0036] Specifically, the pad section 3 can be a through-hole pad for through-hole components, with holes through the board 1 for component pins to be soldered through. The pad section 3 can also be a surface mount pad for surface mount components, with pads directly on the surface of the board 1 without holes, for components to be soldered directly to the pads using reflow or wave soldering. The pad section 3 can also be a test point pad, designed specifically for testing and debugging, for easy electrical measurement using probes. The pad section 3 can also be a ground pad, a large area pad connected to a ground plane, for providing a good ground connection to help reduce electromagnetic interference. The pad section 3 can also be a power pad, for connecting power supply lines, usually larger than normal pads to carry higher currents.

[0037] The socket 2 is a component in electronic devices for receiving and securing connectors or expansion cards. It provides a mechanical interface for external devices, modules, or cards to be inserted and electrically connected to the motherboard or other circuit boards. Specifically, the socket 2 can be a memory slot for installing memory modules. The socket 2 can be an expansion card slot for installing various expansion cards such as graphics cards, sound cards, network cards, etc. More specifically, the socket 2 can be a straight-in socket with the insertion direction parallel to the plane of the circuit board, suitable for most desktop and server applications. The socket 2 can also be a vertical socket with the insertion direction perpendicular to the plane of the circuit board, commonly used in situations where space is limited, such as laptops and embedded systems. The socket 2 can also be a push-in socket that requires the use of special tools or buttons to insert or remove the connector, providing a more secure locking mechanism. The socket 2 can also be a spring-loaded socket that uses the pressure of the spring to maintain the tight contact of the connector, suitable for situations where the connector is frequently inserted and removed. The socket 2 can be unlocked, simply inserted, suitable for situations where the connector does not need to be frequently inserted and removed. The socket 2 can be screw-locked, fixed to the socket 2 by screws, providing a more secure connection. The socket 2 can be a snap-locked, using a buckle or sliding block mechanism to lock the connector, facilitating quick insertion and removal. The socket 2 can also be a spring-loaded socket that uses the pressure of the spring to maintain the tight contact of the connector, suitable for situations where the connector needs to be frequently inserted and removed.

[0038] Specifically, the slot socket 2 may include a housing, pins, a locking mechanism, a guiding structure, and a protective structure. The housing is made of plastic or metal, depending on the application requirements. Plastic housings are lightweight and have good insulation properties, while metal housings provide better shielding and mechanical strength. The housing provides physical support for the entire slot socket 2, protecting the internal components from external shocks and vibrations. The pins may be made of highly conductive materials such as copper alloys or phosphor bronze, and plated with anti-oxidation coatings such as gold, tin, or nickel to improve conductivity and corrosion resistance. The pins of the slot socket 2 establish electrical connections with the corresponding pins on the inserted connector or card and the board body 1, ensuring reliable signal and power transmission, and providing mechanical support through close contact with the inserted component to prevent loosening. The locking mechanism ensures that the connector will not loosen due to vibration or other external forces during use. The protective structure protects the slot socket 2 and the inserted component from the external environment, extending their service life. For example, the protective structure may be a dust cover or a waterproof seal.

[0039] The first connecting portion 21 and the second connecting portion 22 refer to two different types of connections between the slot socket 2 and the solder pad portion 3 on the board body 1. The first connecting portion 21 provides a higher connection strength between the slot socket 2 and the board body 1. It offers stronger connection strength to prevent the slot socket 2 from detaching from the board body 1 due to thermal stress during soldering, thus preventing cold solder joints and open circuits. Specifically, the first connecting portion 21 can be a pin-type lead, i.e., a through-hole lead, which is inserted into the board body 1 and provides high connection strength. Alternatively, the first connecting portion 21 can be a spring-clip lead, which uses spring pressure to maintain contact, also providing high connection strength. The second connecting portion 22 provides a lower connection strength between the slot socket 2 and the board body 1. Specifically, the second connecting portion 22 can be a blade-type lead, i.e., a flat lead, suitable for surface mount technology, thereby increasing the contact area between the slot socket 2 and the board body 1 and improving transmission quality.

[0040] By providing a first connecting part 21 on the side of the slot 2 facing the board 1, and making the connection strength between the first connecting part 21 and the pad part 3 greater than the connection strength between the second connecting part 22 and the pad part 3, the first connecting part 21 can provide stronger connection strength, preventing some pins of the slot 2 from detaching from the board 1 due to thermal stress during soldering, thus preventing pin cold solder joints and empty solder joints.

[0041] like Figure 1 and Figure 2 As shown, in some modified embodiments of this disclosure, the first connecting portion 21 is provided at intervals along the first direction on the slot seat 2, and the first connecting portion 21 is provided symmetrically or asymmetrically in the second direction.

[0042] Specifically, the first direction is the length direction of the socket seat 2, that is, the extension direction of the socket seat 2. The second direction is the width direction of the socket seat 2, that is, the direction perpendicular to the first direction and parallel to the mainboard. The first connecting part 21 is provided in plurality, and the plurality of first connecting parts 21 can be arranged at intervals in the first direction on the socket seat 2, thereby improving the connection strength between the socket seat 2 and the board body 1, avoiding warping due to thermal stress when welding the second connecting part 22 between two first connecting parts 21, thereby causing the conditions of false welding and empty welding. More specifically, the first connecting part 21 can be arranged at intervals in the first direction on the socket seat 2, thereby further avoiding the conditions of false welding and empty welding. The first connecting part 21 is arranged in a symmetrical manner in the second direction. The symmetrical design can ensure that the socket seat 2 is uniformly stressed when inserted or removed, reduce mechanical stress concentration, and improve the stability of the overall structure. The first connecting part 21 arranged in an asymmetrical manner in the second direction can be optimized according to specific application requirements, for example, to adapt to different signal paths, power distribution or heat dissipation requirements.

[0043] In some modified embodiments of the present disclosure, the pad part 3 includes a first pad part and a second pad part, the first connecting part 21 is a ground pin, the second connecting part 22 is a signal pin, the first connecting part 21 is connected with the first pad part, and the second connecting part 22 is connected with the second pad part. The ground pin refers to a pin connected to a common reference point of a circuit, which is usually referred to as "ground" or "0V". It is a reference potential in the circuit, and all voltage measurements and calculations are made with respect to this point. The signal pin is a pin used to transmit data, instructions or status information, which can carry analog or digital signals. The first pad part is specially used for ground pins, which has a large area and a thick copper layer to provide good electrical connection and heat dissipation performance. The first connecting part 21 is connected with the first pad part, which ensures the reliability and low impedance connection of the ground pin, provides a stable ground potential for the entire system, reduces electromagnetic interference, improves signal integrity and stability of the system. In addition, setting the first connecting part as a ground pin does not affect the signal transmission speed. The second pad part is specially used for signal pins, and the second connecting part 22 is connected with the second pad part. The second connecting part 22 can be a blade pin, that is, a flat pin, which is used by surface mount technology, thereby increasing the contact area between the socket seat 2 and the board body 1, and further ensuring the stability and high reliability of signal transmission while avoiding the conditions of false welding and empty welding of the memory socket pin.

[0044] As Figure 1 and Figure 2As shown, in some modified embodiments of this disclosure, the first pad portion is provided with an opening 4, and the first connecting portion 21 is inserted into the opening 4. These openings 4 on the first pad portion can be circular, square, or other shapes, depending on the application requirements and manufacturing process. The first connecting portion 21 has an insert-type structure, allowing it to be directly inserted into the opening 4 of the first pad portion, forming a robust mechanical and electrical connection. It can withstand significant external forces without loosening and effectively resist vibration and impact, making it particularly suitable for applications requiring high stability, such as industrial control equipment and portable devices. This further enhances the connection strength and prevents the slot holder 2 from detaching from the board 1 due to thermal stress during soldering, thus preventing pin defects such as cold solder joints and open solder joints.

[0045] In some modified embodiments of this disclosure, multiple first connection portions 21 are provided, and the multiple first connection portions 21 are spaced apart between multiple second connection portions 22. By arranging the first connection portions 21 (ground pins) and the second connection portions 22 (signal pins) alternately, mutual interference between ground pins and signal pins can be effectively reduced, improving signal integrity and transmission quality. This ensures that the multiple second connection portions 22 provided between every two first connection portions 21 can remain stable during soldering, avoiding thermal stress deformation that could lead to pin cold solder joints and open solder joints, thereby preventing pin cold solder joints and open solder joints from forming on the entire socket 2.

[0046] In some modified embodiments of this disclosure, two first connecting portions 21 are disposed at both ends of the second connecting portion 22, and at least one first connecting portion 21 is disposed in the middle of the slot seat 2. The first connecting portions 21 at both ends provide uniform mechanical support, reduce local stress concentration, and prevent the slot seat 2 from loosening or being damaged by external forces. The first connecting portion 21 in the middle further enhances the mechanical strength of the slot seat 2, and is particularly suitable for elongated slot seats 2, preventing bending or deformation of the middle portion. This ensures the slot seat 2 remains stable during soldering, avoiding thermal stress deformation that could lead to poor soldering or open solder joints.

[0047] like Figure 1 As shown, in some modified embodiments of this disclosure, the first connecting portion 21 includes a connecting section 211 and a plug-in section 212 that are interconnected. The connecting section 211 is connected to the slot seat 2 on the side facing the plate 1, and the plug-in section 212 is plugged into the opening 4. This arrangement optimizes the mechanical connection and electrical performance through a segmented structure, ensuring good grounding and heat dissipation performance. The connecting section 211 is connected to the slot seat 2 by welding, screws, or other fixing methods, providing stable mechanical support and preventing the slot seat 2 from loosening or being damaged by external forces.

[0048] The connecting segment 211 is part of the first connecting portion 21, located on the side of the socket seat 2 facing the board 1, responsible for fixing the first connecting portion 21 on the socket seat 2 and providing mechanical support and electrical conduction. The connecting segment 211 is connected to the socket seat 2 by welding, screwing, clamping or other fixing methods, ensuring that the first connecting portion 21 is firmly installed on the socket seat 2, preventing loosening or damage due to external forces. The connecting segment 211 is made of materials with good electrical conductivity (such as gold-plated copper alloy, phosphor bronze, etc.), ensuring that the current can be smoothly conducted from the socket seat 2 to the plug-in segment 212 and finally to the first pad portion. The connecting segment 211 can also serve as part of the heat dissipation path, conducting heat from the plug-in segment 212 to the socket seat 2, and then dissipating it through the socket seat 2, helping to dissipate heat and prevent local overheating.

[0049] The plug-in segment 212 is another part of the first connecting portion 21, extending from the connecting segment 211 and inserted into the opening 4 of the first pad portion, forming a low-impedance electrical connection. The plug-in segment 212 is inserted into the opening 4 of the first pad portion, forming a low-impedance electrical connection, ensuring stable ground potential, reducing electromagnetic interference, improving signal integrity and system stability. The plug-in segment 212 can be provided with multiple contact points, such as spring clips or elastic contacts, within the opening 4, ensuring that even if one contact point fails, the others can still work normally, providing redundancy and reliability. The design of the plug-in segment 212 ensures a tight fit with the opening 4, preventing dust, moisture, etc. from entering, extending the service life. The design of the plug-in segment 212 makes it easier to disassemble and reassemble, facilitating maintenance and repair, especially in cases where frequent replacement or debugging is required.

[0050] As shown in Figure 1 In some modified embodiments of the present disclosure, the end of the plug-in segment 212 is provided with a clamping segment 213, which can elastically deform to clamp on the first pad portion. The clamping segment 213 is an additional part of the end of the plug-in segment 212, with the ability to elastically deform, capable of clamping on the first pad portion when inserted, providing additional mechanical fixation and electrical contact. The clamping segment 213 is made of elastic materials (such as phosphor bronze, spring steel, etc.), which can elastically deform when inserted, adapt to different opening 4 sizes, and restore to their original shape after insertion, clamping on the first pad portion. The clamping segment 213 firmly fixes the plug-in segment 212 on the first pad portion through the clamping mechanism, preventing the plug-in segment 212 from loosening or falling off due to external forces, especially in a vibrating or impact environment. The clamping segment 213 not only provides mechanical fixation, but also adds additional electrical contact points, further improving the reliability and redundancy of electrical connection. The design of the clamping segment 213 can effectively resist vibration and impact, especially suitable for industrial control equipment and portable devices that require high stability.

[0051] As shown in Figure 1As shown, in some modified embodiments of the present disclosure, the clamping section 213 is curved into a circular arc shape. When inserted into the opening 4 of the first pad portion, the two ends of the circular arc-shaped clamping section 213 will elastically deform to adapt to the shape of the opening 4, and restore to the original state after insertion, clamping on the edge of the opening 4. The circular arc-shaped clamping section 213 can provide stable mechanical fixation after insertion, preventing the plug-in section 212 from loosening or falling off. The design of the circular arc shape makes the insertion and removal more smooth, reduces the insertion and removal forces, and is suitable for occasions that require frequent plugging and unplugging.

[0052] In some modified embodiments of the present disclosure, the clamping section 213 is continuously curved in two opposite directions. The clamping section 213 is continuously curved in two opposite directions to form an S-shaped structure. When inserted into the opening 4 of the first pad portion, the S-shaped clamping section 213 will elastically deform to adapt to the shape of the opening 4, and restore to the original state after insertion, clamping on the edge of the opening 4. The S-shaped clamping section 213 can provide stronger mechanical fixation after insertion, and is particularly suitable for occasions that require high stability. The S-shaped design has a certain self-centering function, ensuring that the plug-in section 212 is accurately aligned with the first pad portion, avoiding misalignment or poor contact.

[0053] In some modified embodiments of the present disclosure, the clamping section 213 includes an elliptical protrusion that can elastically deform along its axis direction. When inserted into the opening 4 of the first pad portion, the elliptical protrusion will elastically deform to adapt to the shape of the opening 4, and restore to the original state after insertion, clamping on the edge of the opening 4. More specifically, the elliptical protrusion can be an elliptical ring structure, and openings can be provided on the outer periphery of the ring structure to make the elliptical protrusion easy to deform. More specifically, the major axis of the elliptical protrusion can be in the extension direction of the plug-in section 212, so that the minor axis of the elliptical protrusion is more likely to deform. The design of the elliptical protrusion can provide accurate clamping effect, ensuring that the plug-in section 212 is firmly fixed on the first pad portion. The design of the elliptical protrusion provides multiple contact points, ensuring low impedance electrical connection, reducing electromagnetic interference, improving signal integrity and system stability.

[0054] In some modified embodiments of the present disclosure, the clamping section 213 includes a diamond-shaped protrusion that can elastically deform along its axis direction. When inserted into the opening 4 of the first pad portion, the diamond-shaped protrusion will elastically deform to adapt to the shape of the opening 4, and restore to the original state after insertion, clamping on the edge of the opening 4. Similarly, the diamond-shaped protrusion can be a diamond-shaped ring structure, and openings can be provided on the outer periphery of the ring structure to make the elliptical protrusion easy to deform. The major axis of the elliptical protrusion can be in the extension direction of the plug-in section 212, so that the minor axis of the elliptical protrusion is more likely to deform. Compared with the elliptical structure, the diamond is more likely to deform to be inserted into the opening 4.

[0055] Example 2

[0056] An electronic device system comprises an electronic device and a memory, the electronic device comprises a board body 1 and a socket seat 2, the board body 1 has a pad part 3, the socket seat 2 has a first connecting part 21 and a second connecting part 22, the first connecting part 21 and the second connecting part 22 are arranged on the side of the socket seat 2 facing the board body 1, and are connected with the pad part 3 respectively; wherein the connection strength of the first connecting part 21 with the pad part 3 is greater than the connection strength of the second connecting part 22 with the pad part 3, and the memory is detachably connected with the socket seat 2.

[0057] Specifically, the specific structure of the electronic device can be as described in Embodiment 1, which will not be repeated here. The memory is a module detachably connected with the socket seat 2, used for storing data or program code. For example, the memory can be a DDR memory (double data rate synchronous dynamic random access memory), an SSD (solid state disk), etc. Specifically, the memory is plugged with the socket seat 2, and the memory is connected with the board body 1 through the socket seat 2, supporting hot plug function, facilitating users to replace or upgrade the memory without shutting down the computer.

[0058] By arranging the first connecting part 21 on the side of the socket seat 2 facing the board body 1, and making the connection strength of the first connecting part 21 with the pad part 3 greater than the connection strength of the second connecting part 22 with the pad part 3, so that the first connecting part 21 can provide stronger connection strength, preventing the socket seat 2 from being separated from the board body 1 due to thermal stress during welding, so as to cause the situation of virtual welding and empty welding of pins.

[0059] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: The electronic device comprises: a board body having a pad portion; a socket seat having a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are arranged on the side of the socket seat facing the board body and are connected with the pad portion respectively; wherein the connecting strength of the first connecting portion and the pad portion is greater than the connecting strength of the second connecting portion and the pad portion.

2. The electronic device according to claim 1, wherein the first connecting portions are arranged on the socket seat in a first direction and are symmetrically arranged or asymmetrically arranged in a second direction.

3. The electronic device according to claim 2, wherein the pad portion comprises a first pad portion and a second pad portion, the first connecting portion is a ground pin, the second connecting portion is a signal pin, the first connecting portion is connected with the first pad portion, and the second connecting portion is connected with the second pad portion.

4. The electronic device according to claim 3, wherein the first pad portion is provided with an opening, and the first connecting portion is inserted into the opening.

5. The electronic device according to claim 1, wherein a plurality of first connecting portions are arranged, and the plurality of first connecting portions are distributed in the plurality of second connecting portions.

6. The electronic device according to claim 5, wherein two first connecting portions are arranged at two ends of the second connecting portion, and at least one first connecting portion is arranged at a middle position of the socket seat.

7. The electronic device according to claim 4, wherein the first connecting portion comprises a connecting segment and an insertion segment connected with each other, the connecting segment is connected with the side of the socket seat facing the board body, and the insertion segment is inserted into the opening.

8. The electronic device according to claim 7, wherein an end of the insertion segment is provided with a clamping segment, and the clamping segment can be elastically deformed to be clamped on the first pad portion.

9. The electronic device of claim 8, wherein, The clamping segment is selected from at least one of the following combinations: the clamping segment is bent into a circular arc shape; the clamping segment is continuously bent in two opposite directions; the clamping segment comprises an elliptical protrusion which can be elastically deformed along the axis direction thereof; the clamping segment comprises a rhombic protrusion which can be elastically deformed along the axis direction thereof.

10. An electronic device system, characterized by comprising: The electronic device comprises: a board body having a pad portion; a socket seat having a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are arranged on the side of the socket seat facing the board body and are connected with the pad portion respectively; wherein the connecting strength of the first connecting portion and the pad portion is greater than the connecting strength of the second connecting portion and the pad portion. a memory, which is detachably connected with the socket seat.

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