Printed board with high heat dissipation performance
By using easily detachable connecting components and a heat-conducting structure, the problems of poor heat dissipation and inconvenient disassembly of printed circuit boards are solved, achieving efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202520212096.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-02-11
AI Technical Summary
Existing printed circuit boards have poor heat dissipation during long-term operation, and are inconvenient, time-consuming and labor-intensive to disassemble and repair.
The first and second mounting plates are connected by easily detachable connecting components. Heat is transferred and dissipated using thermally conductive copper sheets and heat dissipation fins, combined with a cooling fan for rapid cooling. The motherboard can be easily disassembled through a limiting groove and a damping telescopic rod.
It improves the heat dissipation of the printed circuit board, facilitates the disassembly and repair of the motherboard, and saves time and effort.
Smart Images
Figure CN223810034U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to printed board technical field, especially a printed board with high heat dissipation performance. BACKGROUND
[0002] Printed board is an important electronic component, is the support body of electronic components, is the carrier of electrical mutual connection of electronic components, and the conductive pattern formed by printing circuit, printed element or combination of both on the insulating material according to predetermined design is called printed circuit, and the finished board of printed circuit is called printed circuit board, which takes insulating board as base material, is cut into a certain size, has at least one conductive pattern and is provided with holes, is used to replace the past device chassis, and realizes the mutual connection between components.
[0003] As the announcement number is: CN221652991U, a printed board with high heat dissipation performance relates to printed board field, including mainboard, the both sides of mainboard are installed with the clamping block, the inner wall of clamping block is installed with the anti-bending rod, the both ends of anti-bending rod are fixedly connected with the fixed sleeve, the outer wall of anti-bending rod is installed with the positioning sleeve, the side of positioning sleeve is welded with the clamping sleeve, the side of mainboard is pasted with the metal base plate, the side of metal base plate is pasted with the fin. The utility model discloses through the setting of anti-bending rod and positioning sleeve, and the anti-bending rod is clamped and fixed to the positioning sleeve, when using the device, the setting of anti-bending rod and positioning sleeve is convenient for the bending protection of printed board, increases the usability of the device, through the setting of metal base plate and fin, the metal base plate is closely pasted to the fin, when using the device, the setting of metal base plate and fin is convenient for the rapid heat dissipation of printed board, increases the service life of electronic components.
[0004] Common printed board can be cooled by fin when cooling, but when the printed board works for a long time, the heat is difficult to discharge in time, the cooling effect is poor, and when the mainboard is disassembled and repaired, it is inconvenient, time-consuming and laborious, and the efficiency is low. UTILITY MODEL CONTENTS
[0005] In order to overcome the technical defects in the prior art, the utility model provides a printed board with high heat dissipation performance, which can improve the heat dissipation effect and facilitate the disassembly and replacement of the mainboard.
[0006] The utility model discloses a technical scheme adopted is: including mainboard, first mounting plate and second mounting plate, first mounting plate with second mounting plate is connected through the connecting component convenient to dismantle, the mainboard is installed between first mounting plate with second mounting plate, install the heat conduction copper sheet between first mounting plate with second mounting plate, the heat conduction copper sheet with mainboard is close, one end fixed mounting of heat conduction copper sheet has the heat conduction column, the heat dissipation fin is installed to the linear array outside heat conduction column, first mounting plate with second mounting plate one end both sides are equipped with square hole, install the heat dissipation subassembly in square hole, when using, the heat dissipation subassembly is used for the quick cooling of heat dissipation fin, the heat dissipation fin is used for the heat dissipation of mainboard, the heat conduction copper sheet with heat conduction column is used for transmitting heat, the connecting component is used for connecting first mounting plate with second mounting plate.
[0007] Preferably, in order to fix the square block, the connecting component comprises a square block, a damping telescopic rod and a spring, square grooves are formed at both ends of the first mounting plate, one end of the square block is inserted into the square groove, the other end of the square block is fixedly connected with the second mounting plate, a U-shaped rod is inserted at one end of the first mounting plate, circular holes are formed at both sides of one end of the square block, the U-shaped rod extends into the circular holes at both ends, the size of the square groove matches the size of the square block, and the U-shaped rod is used to limit the position of the square block.
[0008] Preferably, in order to enable the U-shaped rod to move smoothly, a circular groove is formed at one end of the first mounting plate, one end of the damping telescopic rod is fixedly installed in the circular groove, and the free end of the damping telescopic rod is fixedly connected with the U-shaped rod.
[0009] Preferably, in order to enable the U-shaped rod to move automatically, the spring is sleeved outside the damping telescopic rod, one end of the spring is fixedly installed in the circular groove, and the other end of the spring is fixedly connected with the U-shaped rod.
[0010] Preferably, in order to install and fix the mainboard, first limiting grooves are formed at the upper ends of the inner sides of the first mounting plate and the second mounting plate, first limiting plates are inserted into the first limiting grooves, the first limiting plates are fixedly connected with the mainboard, and the size of the first limiting plates matches the size of the first limiting grooves.
[0011] Preferably, in order to match the size of the second limiting plate with the size of the second limiting groove, second limiting grooves are formed at the lower ends of the inner sides of the first mounting plate and the second mounting plate, second limiting plates are inserted into the second limiting grooves, and the second limiting plates are fixedly connected with the heat conduction copper sheet.
[0012] Preferably, in order to dissipate heat of the heat dissipation fin, the heat dissipation assembly comprises a heat dissipation fan, which is installed in the square hole.
[0013] Preferably, in order to prevent external dust from entering the square hole, a dustproof screen is fixedly installed inside one end of the square hole.
[0014] The utility model discloses the beneficial effect is: the utility model discloses when using, the outside is removed U -shaped rod through manual, removes the fixed opposite square block again, and then removes the mainboard and can dismantle or overhaul, convenient and fast, save time and labour, also can manual start heat dissipation fan, and the heat dissipation fin is cooled down fast, thereby timely discharges the heat of mainboard, improves the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is whole structure schematic diagram of the utility model.
[0016] Figure 2 It is first mounting plate and second mounting plate explosion structure schematic diagram of the utility model.
[0017] Figure 3 It is heat conduction copper sheet and heat dissipation fin connecting structure schematic diagram of the utility model.
[0018] Figure 4 It is connecting assembly structure schematic diagram of the utility model.
[0019] Figure 5 It is heat dissipation assembly structure schematic diagram of the utility model.
[0020] BRIEF DESCRIPTION OF DRAWINGS: in drawing: 1, mainboard;2, first mounting plate;3, second mounting plate;4, connecting assembly;401, square block;402, damping telescopic link;403, spring;404, U-shaped rod;405, round hole;5, heat conduction copper sheet;6, heat conduction column;7, heat dissipation fin;8, square hole;9, heat dissipation assembly;901, heat dissipation fan;902, dustproof screen;10, square groove;11, first limit slot;12, first limit plate;13, second limit slot;14, second limit plate. DETAILED DESCRIPTION
[0021] The utility model makes further explanation in combination with the drawings, obviously, the described embodiment only is a part embodiment of the utility model, not all embodiments. Based on the embodiment in the utility model, all other embodiments that the ordinary skill in the art obtains under the premise of not making creative labor belong to the range of protection of the utility model.
[0022] As Figures 1-5The embodiment shown provides a printed board with high heat dissipation performance, comprising a main board 1, a first mounting plate 2 and a second mounting plate 3, the first mounting plate 2 and the second mounting plate 3 are connected through a detachable connecting assembly 4, the main board 1 is mounted between the first mounting plate 2 and the second mounting plate 3, a heat-conducting copper sheet 5 is mounted between the first mounting plate 2 and the second mounting plate 3, the heat-conducting copper sheet 5 is in close contact with the main board 1, one end of the heat-conducting copper sheet 5 is fixedly mounted with a heat-conducting column 6, the outer side of the heat-conducting column 6 is linearly arrayed with heat dissipation fins 7, square holes 8 are formed on both sides of one end of the first mounting plate 2 and the second mounting plate 3, heat dissipation assemblies 9 are mounted in the square holes 8, first limiting grooves 11 are formed on the inner side of the first mounting plate 2 and the second mounting plate 3, first limiting plates 12 are inserted into the first limiting grooves 11, the first limiting plates 12 are fixedly connected with the main board 1, second limiting grooves 13 are formed on the inner side of the first mounting plate 2 and the second mounting plate 3, second limiting plates 14 are inserted into the second limiting grooves 13, the second limiting plates 14 are fixedly connected with the heat-conducting copper sheet 5, when the main board 1 needs to be disassembled and repaired, the first mounting plate 2 and the second mounting plate 3 are first separated through the connecting assembly 4, then the first limiting plate 12 at one end of the main board 1 is moved out of the first limiting groove 11, and then the main board 1 is repaired or replaced, which is convenient, fast, time-saving and labor-saving, and the heat-conducting copper sheet 5 and the heat dissipation fins 7 can also be disassembled, when the main board 1 works for a short time, the heat generated by the main board 1 is transferred to the heat dissipation fins 7 through the heat-conducting copper sheet 5 and the heat-conducting column 6, and then discharged through the heat dissipation fins 7, when the main board 1 works for a long time, the heat dissipation assemblies 9 can be manually started to quickly cool the heat dissipation fins 7, so that the heat generated by the main board 1 is discharged in time, and the heat dissipation effect is improved.
[0023] As Figure 4As shown, the connecting assembly 4 comprises a square block 401, a damping telescopic rod 402 and a spring 403, square slots 10 are formed at both ends of the first mounting plate 2, one end of the square block 401 is inserted into the square slot 10, and the other end of the square block 401 is fixedly connected with the second mounting plate 3, a U-shaped rod 404 is inserted at one end of the first mounting plate 2, round holes 405 are formed at both sides of one end of the square block 401, the U-shaped rod 404 extends into the round holes 405 at both ends, a circular groove is formed at one end of the first mounting plate 2, the damping telescopic rod 402 is fixedly installed at one end of the circular groove, the free end of the damping telescopic rod 402 is fixedly connected with the U-shaped rod 404, the spring 403 is sleeved outside the damping telescopic rod 402, one end of the spring 403 is fixedly installed in the circular groove, and the other end of the spring 403 is fixedly connected with the U-shaped rod 404, when in use, the U-shaped rod 404 is manually moved outward to make one end thereof disengaged from the round hole 405, so that the fixing effect of the square block 401 is released, at this time, the damping telescopic rod 402 is stretched, and the spring 403 is stretched, then the square block 401 is moved out of the square slot 10 to separate the first mounting plate 2 from the second mounting plate 3, then the main plate 1 can be disassembled for maintenance, the frictional force generated in the damping telescopic rod 402 can offset the elastic potential energy generated by the spring 403, so that the U-shaped rod 404 is prevented from repeatedly moving, and after the maintenance, the main plate 1 can be reset.
[0024] As Figure 5 As shown, the heat dissipation assembly 9 comprises a heat dissipation fan 901, the heat dissipation fan 901 is installed in the square hole 8, and a dust screen 902 is fixedly installed in the square hole 8 at one end, in use, the heat dissipation fan 901 is connected with the power supply through wires and a switch, when the main plate 1 works for a long time, the heat dissipation fan 901 can be powered by manually operating the switch to rotate, so that heat in the heat dissipation fins 7 is quickly dissipated, thereby timely discharging the heat generated by the main plate 1, the dust screen 902 plays a dustproof role to prevent dust from entering the square hole 8.
[0025] The basic principle, main features and advantages of the present application are shown and described above, and those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principle of the present application, and various changes and improvements can be made to the present application without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application, and the scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A printed board with high heat dissipation performance, comprising a main board (1), a first mounting board (2) and a second mounting board (3), characterized in that: The first mounting plate (2) and the second mounting plate (3) are connected through a detachable connecting assembly (4), the main plate (1) is installed between the first mounting plate (2) and the second mounting plate (3), a heat-conducting copper sheet (5) is installed between the first mounting plate (2) and the second mounting plate (3), the heat-conducting copper sheet (5) is tightly attached to the main plate (1), one end of the heat-conducting copper sheet (5) is fixedly installed with a heat-conducting column (6), the outer side of the heat-conducting column (6) is linearly arranged with radiating fins (7), square holes (8) are formed in the two sides of one end of the first mounting plate (2) and the second mounting plate (3), and radiating assemblies (9) are installed in the square holes (8).
2. The printed board having high heat dissipation performance according to claim 1, wherein: The connecting assembly (4) comprises a square block (401), a damping telescopic rod (402) and a spring (403), square grooves (10) are formed in the two ends of the first mounting plate (2), one end of the square block (401) is inserted into the square groove (10), the other end of the square block (401) is fixedly connected with the second mounting plate (3), a U-shaped rod (404) is inserted into one end of the first mounting plate (2), circular holes (405) are formed in the two sides of one end of the square block (401), and the two ends of the U-shaped rod (404) extend into the circular holes (405).
3. The printed board having high heat dissipation performance according to claim 2, wherein: A circular groove is formed in one end of the first mounting plate (2), one end of the damping telescopic rod (402) is fixedly installed in the circular groove, and the free end of the damping telescopic rod (402) is fixedly connected with the U-shaped rod (404).
4. The printed board having high heat dissipation performance according to claim 3, wherein: The spring (403) is sleeved outside the damping telescopic rod (402), one end of the spring (403) is fixedly installed in the circular groove, and the other end of the spring (403) is fixedly connected with the U-shaped rod (404).
5. The printed board having high heat dissipation performance according to claim 1, wherein: First limiting grooves (11) are formed in the inner upper ends of the first mounting plate (2) and the second mounting plate (3), first limiting plates (12) are inserted into the first limiting grooves (11), and the first limiting plates (12) are fixedly connected with the main plate (1).
6. The printed board having high heat dissipation performance according to claim 1, wherein: Second limiting grooves (13) are formed in the inner lower ends of the first mounting plate (2) and the second mounting plate (3), second limiting plates (14) are inserted into the second limiting grooves (13), and the second limiting plates (14) are fixedly connected with the heat-conducting copper sheet (5).
7. The printed board having high heat dissipation performance according to claim 1, wherein: The radiating assembly (9) comprises a radiating fan (901), and the radiating fan (901) is installed in the square hole (8).
8. The printed board having high heat dissipation performance according to claim 1, wherein: A dustproof net (902) is fixedly installed in one end of the square hole (8).