TOF module capable of avoiding glue overflow
By designing an overflow groove and a retaining wall structure in the TOF module, the problem of glue overflow caused by insufficient retaining wall width was solved, ensuring optical performance and appearance quality, improving production yield and reducing costs.
Patent Information
- Application Number
- CN202520228937.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-13
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-02-13
AI Technical Summary
Traditional TOF modules suffer from glue siphoning due to insufficient width of the retaining wall in a limited space, resulting in glue overflow that contaminates the light-passing holes, affecting optical performance and appearance quality.
An overflow groove is added to the filter element, and a first and a second raised baffle are set between the cover plate and the filter element to form an adhesive groove structure, which increases the amount of adhesive to be contained and prevents overflow.
It effectively prevents glue overflow, protects the light-transmitting holes from contamination, improves the production yield, and reduces production costs.
Smart Images
Figure CN223810098U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip packaging technical field, concretely relates to a TOF module that avoids glue overflow. BACKGROUND
[0002] Time of Flight (TOF) is to measure the time interval t (often referred to as pulse ranging method) or the phase generated by laser to and fro measured object once (phase difference ranging method) to realize the distance measurement between measured object (or measured object detection area) and sensor.
[0003] The cover plate and the optical filter of the conventional single-chip TOF packaging structure are usually bonded by glue, and this connection mode requires that the amount of glue must be accurate enough to ensure the normal work and good optical performance of the optical filter. The anti-glue overflow capability of the baffle wall on the cover plate is a key characteristic that determines whether it can effectively prevent glue overflow and protect the light transmission area from being contaminated. In theory, the wider the baffle wall is, the stronger its blocking effect on glue is, so the anti-glue overflow capability is positively correlated with the baffle wall width.
[0004] However, in the actual design and manufacturing process, due to the volume limitation, the surface area of the cover plate is relatively limited. In order to meet the bonding force of the cover plate and the optical filter, the glue groove size needs to be increased as much as possible to increase the contact area of the optical filter and the glue, thereby reducing the width of the baffle wall. In the case where the baffle wall width is insufficient, during the glue spreading or curing process, due to the effect of surface tension, the glue may produce siphon phenomenon to cross the baffle wall, resulting in contamination of the light transmission hole area. This contamination not only affects the appearance quality of the product, but also may have a negative impact on the optical performance of the product, such as reducing the light transmittance, increasing the scattering, etc. SUMMARY
[0005] The technical problem to be solved by the utility model is to provide a TOF module with simple structure, which can increase the capacity of glue in limited space and avoid glue overflow caused by siphon phenomenon.
[0006] In order to solve the above technical problems, the utility model provides a technical scheme,
[0007] A TOF module capable of avoiding glue overflow, comprising,
[0008] The cover plate body comprises a top wall and a side wall, and the top wall and the side wall jointly form a mounting cavity with an open bottom. The top wall is provided with a light transmission hole penetrating through the cover plate body. The top wall is provided with glue grooves recessed inward at a distance of a predetermined threshold value from both sides of the light transmission hole near the mounting cavity. A first protruding baffle wall is arranged between the glue grooves and the light transmission hole.
[0009] A substrate is connected with the sidewall of the cover plate body to form a closed module, and a light receiving chip is arranged on the substrate corresponding to the position of the light hole;
[0010] A filter is adhered to the mounting cavity of the cover plate body by the glue in the glue groove, and an inwardly recessed overflow groove is arranged on the filter corresponding to the position between the glue groove and the first protruding retaining wall on the cover plate body, and the distance between the first protruding retaining wall and the light hole is smaller than the distance between the overflow groove and the light hole.
[0011] Further, the shape of the overflow groove includes but is not limited to square, V-shaped or semicircular.
[0012] Further, the overflow groove formed on the filter has a depth of 3-10um and a width of 3-5um.
[0013] Further, the first protruding retaining wall has a height of 25-35um and a width of 140-160um.
[0014] Further, the glue grooves are symmetrically arranged on both sides of the light hole, and the side of the glue groove away from the light hole and the side of the top wall close to the mounting cavity form a second protruding retaining wall.
[0015] Further, the light receiving chip and the substrate are connected through a bonding wire.
[0016] The TOF module for avoiding overflow of the utility model has the following beneficial effects compared with the prior art:
[0017] The utility model discloses a cleverly added overflow groove on the filter, which can increase the capacity of the glue in the limited internal space. Through this improvement, the problem of glue overflow caused by insufficient retaining wall width and siphon effect is successfully avoided, thereby eliminating the risk of contamination of the light hole on the cover plate, reducing material scrap, significantly improving the production yield, and further reducing the production cost. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 A TOF module packaging step S1 schematic view provided for the utility model embodiment of avoiding overflow;
[0019] Figure 2 A TOF module packaging step S2 schematic view provided for the utility model embodiment of avoiding overflow;
[0020] Figure 3 A TOF module packaging step S3 schematic view provided for the utility model embodiment of avoiding overflow;
[0021] Figure 4A TOF module packaging step S4 schematic diagram for avoiding overflow of the utility model embodiment is provided,
[0022] Figure 5 A TOF module packaging step S5 schematic diagram for avoiding overflow of the utility model embodiment is provided, that is, the TOF module schematic diagram for avoiding overflow of the utility model embodiment is completed,
[0023] Mark explanation:
[0024] 1-cover plate body;11-top wall;111-light hole;112-gum groove;113-first convex retaining wall;114-second convex retaining wall;12-side wall;13-mounting cavity;2-glue;3-filter;31-glue overflow groove;4-substrate;5-bonding wire;6-light receiving chip. Specific implementation
[0025] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the following will be further described in detail in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.
[0026] In the description of the utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model.
[0027] In the description of the utility model, it should be pointed out that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, integral connection, or detachable connection;It can be the communication between the two elements;It can be directly connected, or indirectly connected through an intermediate medium, for those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0028] A TOF module for avoiding overflow of the embodiment, as shown in the figure, comprising, Figure 5
[0029] The cover plate body 1 has a wall thickness of 18±0.05 mm, includes a top wall 11 and a side wall 12, and encloses a bottom-opened mounting cavity 13; the top wall 11 is provided with a light transmission hole 111 penetrating through the cover plate body 1, and the diameter of the light transmission hole 111 is 0.28-0.42 mm; the top wall 11 is provided with a glue groove 112 formed by inwardly recessing at a preset threshold distance on both sides of the light transmission hole 111 near the mounting cavity 13, and the preset threshold is 0.55-0.65 mm; the glue groove 112 is used for placing glue 2 for bonding the optical filter 3 and the cover plate body 1; and a first raised barrier wall 113 is arranged between the glue groove 112 and the light transmission hole 111; the height of the first raised barrier wall is 25-35 um, and the width is 140-160 um; in the embodiment, preferably, the height of the first raised barrier wall 113 is 30 um, and the width is 150 um, which can play a certain blocking and guiding role, so that the glue 2 is more accurately stayed in the predetermined application area.
[0030] The substrate 4 is connected with the side wall 12 of the cover plate to form a closed module, and the substrate 4 is provided with a light receiving chip 6 corresponding to the position of the light transmission hole 111; the light receiving chip 6 and the substrate 4 are connected through a bonding wire 5.
[0031] The filter 3 is bonded to the mounting cavity 13 of the cover plate by the adhesive arranged in the glue groove 112, the filter 3 is provided with an overflow glue groove 31 formed by inwardly recessing at a position corresponding to the glue groove 112 and the first raised barrier wall 113 on the cover plate, and the distance between the first raised barrier wall 113 and the light transmission hole 111 is less than the distance between the overflow glue groove 31 and the light transmission hole 111. The shape of the overflow glue groove 31 includes but is not limited to square, V-shaped or semicircular. Since the overflow glue groove 31 can capture excess glue and prevent the glue from overflowing to the light transmission hole 111 area through the first raised barrier wall 113, it effectively reduces the risk of direct contact and contamination of the light transmission hole 111 by the glue 2.
[0032] Further, the thickness of the optical filter 3 is 0.21±0.05 mm, the width is 2.4±0.1 mm, the depth of the overflow glue groove arranged on the filter 3 is 3-10 um, and the width is 3-5 um.
[0033] The glue grooves 112 are symmetrically arranged on both sides of the light transmission hole 111, and the symmetrically arranged glue grooves 112 can provide more balanced and stable structural support, which helps to reduce deformation or stress concentration caused by uneven stress and enhances the overall structural stability of the cover plate. The glue grooves 112 are symmetrically distributed on both sides of the light transmission hole 111, and when dispensing glue, the glue can be more uniformly applied to both sides of the light transmission hole 111, ensuring the consistency and uniformity of the bonding surface and improving the bonding quality.
[0034] The side of the glue groove 112 away from the light-transmitting hole 111 and the side of the top wall 11 near the mounting cavity 13 form a second raised barrier 114. The second raised barrier 114 serves as a barrier on the other side of the glue groove 112, preventing glue from overflowing from the glue groove 112 and allowing the glue to stay more accurately in the predetermined application area.
[0035] The TOF module packaging process in this embodiment is as follows:
[0036] Step S1, prepare the adhesive dispensing, such as... Figure 1 As shown, the TOF module cover plate is inverted to prepare for the glue dispensing in the glue tank 112. Inverting the cover plate ensures that the glue can be accurately dripped into the predetermined glue tank 112 without flowing to other parts of the cover plate. This operation also facilitates the subsequent installation of the filter 3.
[0037] Step S2, apply glue 2, as shown Figure 2 As shown, an appropriate amount of glue 2 is applied to the glue tank 112 by the die bonder. The amount of glue 2 is precisely controlled by the machine to ensure that the filter 3 is firmly fixed without overflowing due to excessive amount.
[0038] Step S3, attach filter 3, such as Figure 3 As shown, the filter 3 is attached to the cover plate body 1. The bottom adhesive is squeezed and overflows to the surrounding area. Some of the adhesive flows into the filter overflow groove 31. The filter overflow groove 31 contains the excess adhesive to prevent the light transmission area from being contaminated, thereby ensuring the optical performance of the module.
[0039] Step S4, fix the substrate 4 and the cover plate body, as follows: Figure 4 As shown, glue 2 is applied around the substrate 4, which has been loaded with bonding wires 5 and light receiving chip 6, to fix the substrate 4 to the cover plate body 1.
[0040] Step S5, complete the packaging, as follows: Figure 5 As shown, flip the cover plate body 1 and attach it to the substrate 4 to complete the encapsulation.
[0041] In summary, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1.A TOF module capable of avoiding glue overflow, characterized in that, Including, The cover plate body (1) includes a top wall (11) and a side wall (12), and the top wall and the side wall enclose a bottom open installation cavity (13). The top wall is provided with a light through hole (111) penetrating through the cover plate body. The top wall is provided with a glue groove (112) formed by inwardly recessing on both sides of the light through hole at a distance of a preset threshold value from the installation cavity side. A first raised retaining wall (113) is arranged between the glue groove and the light through hole. The base plate (4) is connected with the side wall of the cover plate body to form a closed module. The base plate is provided with a light receiving chip (6) corresponding to the position of the light through hole. The filter (3) is bonded in the installation cavity of the cover plate body by the glue (2) arranged in the glue groove. The filter is provided with an overflow glue groove (31) formed by inwardly recessing corresponding to the position between the glue groove and the first raised retaining wall on the cover plate body. The distance between the first raised retaining wall and the light through hole is less than the distance between the overflow glue groove and the light through hole. 2.The TOF module of claim 1, wherein: The shape of the overflow glue groove includes but is not limited to square, V-shaped or semicircle. 3.The TOF module of claim 1 or 2, wherein: The depth of the overflow glue groove on the filter is 3-10um; the width is 3-5um. 4.The TOF module of claim 1, wherein: The height of the first raised retaining wall is 25-35um, and the width is 140-160um. 5.The TOF module of claim 1, wherein: The glue grooves are symmetrically arranged on both sides of the light through hole. The side of the glue groove away from the light through hole forms a second raised retaining wall (114) with the side of the top wall close to the installation cavity. 6.The TOF module of claim 1, wherein: The light receiving chip and the base plate are connected by a bonding wire (5).