Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device which comprises a supporting mechanism, a cleaning mechanism and a driving mechanism. The supporting mechanism comprises a supporting frame and an adsorption assembly. The cleaning mechanism comprises a cleaning tank and a cleaning assembly; the driving mechanism comprises a first driving assembly and a second driving assembly; the wafer is adsorbed to the center of the cleaning tank, the cleaning assembly is arranged on the side, away from the first driving assembly, of the cleaning tank, the cleaning assembly makes contact with the surface of the wafer by adjusting the horizontal height, the wafer is driven by the first driving assembly to rotate, and cleaning sewage is conveyed to the edge of the wafer and discharged between the wafer and the cleaning tank. According to the wafer cleaning device, the cleaning assembly is arranged to clean the surface of the wafer, sewage generated by cleaning is conveyed to the edge of the wafer, and the first driving assembly drives the adsorption assembly to rotate so as to drive the wafer to rotate, so that the sewage generated by cleaning quickly flows out from a gap between the wafer and the cleaning tank; sewage is prevented from staying on the surface of the wafer, and the cleaning efficiency and the cleaning effect are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field, specifically relates to a wafer cleaning device. BACKGROUND

[0002] Wafer cleaning is the process of removing the contaminants produced by the contact with various organic matters, particles and metals during the continuous processing and polishing of wafer. It is an important process step in wafer manufacturing process. In the semiconductor manufacturing process, a large number of particles will be produced in each process, which will cause short circuit or open circuit of the chip if not removed, and seriously affect the quality and performance of the product.

[0003] The wafer cleaning method of the prior art adopts the rolling brush cleaning, and the working principle is that the wafer is rotated, and the cleaning liquid such as deionized water and chemical liquid is supplied to the wafer from the supply nozzle, and the rolling brush is in sliding contact with the wafer. The wafer surface is cleaned by the friction between the rolling brush and the wafer in the presence of the cleaning liquid.

[0004] When the rolling brush cleaning is adopted, the sewage produced in the cleaning process will not immediately fall off from the wafer surface, so that part of the impurities in the sewage will sink to the bottom and adhere to the wafer surface again, thereby affecting the cleaning efficiency and cleaning effect. UTILITY MODEL CONTENTS

[0005] Therefore, the utility model aims at providing a wafer cleaning device, which aims at solving the problem that when the rolling brush cleaning is adopted, the sewage produced in the cleaning process will not immediately fall off from the wafer surface, so that part of the impurities in the sewage will sink to the bottom and adhere to the wafer surface again, thereby affecting the cleaning efficiency and cleaning effect.

[0006] To achieve the above-mentioned purpose, the utility model realizes the technical scheme as follows: a wafer cleaning device, which comprises a supporting mechanism, a cleaning mechanism arranged on the supporting mechanism, and a driving mechanism for driving the cleaning mechanism.

[0007] The supporting mechanism comprises a supporting frame for supporting the cleaning mechanism, and a suction assembly for supporting and driving the wafer to rotate.

[0008] The cleaning mechanism comprises a cleaning tank arranged on the supporting frame, and a cleaning assembly for cleaning the wafer.

[0009] The driving mechanism comprises a first driving assembly for driving the suction assembly to rotate, and a second driving assembly for driving the cleaning assembly to rotate.

[0010] The wafer is adsorbed in the center of the cleaning tank, the cleaning assembly is arranged on the side of the cleaning tank away from the first driving assembly, and the cleaning assembly is adjusted to contact the surface of the wafer, the wafer is driven to rotate by the first driving assembly, and the cleaning sewage is transported to the edge of the wafer to be discharged from the gap between the wafer and the cleaning tank.

[0011] According to the wafer cleaning device, the cleaning assembly is arranged to clean the surface of the wafer, the sewage generated in the cleaning process is transported to the edge of the wafer, the adsorption assembly is driven to rotate by the first driving assembly, the wafer is driven to rotate, the sewage generated in the cleaning process is quickly discharged from the gap between the wafer and the cleaning tank, the sewage is prevented from remaining on the surface of the wafer, and the cleaning efficiency and the cleaning effect are improved; the wafer is adsorbed by the suction assembly, the wafer is firmly adsorbed, and the edge of the wafer is not damaged, the pipe shaft is driven to rotate by the first driving assembly, the suction disc seat is driven to rotate by the rotation of the pipe shaft, and the wafer is driven to rotate, so that the wafer is cleaned by the cleaning assembly.

[0012] According to an aspect of the above technical solution, the adsorption assembly comprises a vacuum pump arranged on the support frame, a negative pressure pipe connected to the vacuum pump, a pipe shaft arranged in the center of the cleaning tank, a suction disc seat arranged on the pipe shaft, and a rotary joint connecting the negative pressure pipe and the pipe shaft, and the vacuum pump is used to adjust the negative pressure state in the suction disc seat so that the suction disc seat is used for the wafer.

[0013] According to an aspect of the above technical solution, the first driving assembly comprises a first motor arranged on the support frame, a driving gear arranged on the first motor, and a driven gear arranged on the pipe shaft, and the driving gear and the driven gear are meshed and connected to drive the pipe shaft to rotate.

[0014] According to an aspect of the above technical solution, the support frame is provided with a fixed plate facing the center of the cleaning tank, at least one electric cylinder is arranged on the fixed plate, and the electric cylinder is connected to the cleaning assembly to drive the cleaning assembly to move up and down.

[0015] According to an aspect of the above technical solution, the cleaning assembly comprises a mounting frame for connecting the electric cylinder, rollers arranged at two ends of the mounting frame respectively, and a transmission belt sleeved on the two rollers, and the transmission belt drives the two rollers to rotate synchronously.

[0016] According to an aspect of the above technical solution, the outer wall of the rotating belt is covered with cleaning brushes.

[0017] According to an aspect of the above technical solution, the side wall of the mounting frame is further provided with a liquid spraying assembly, the liquid spraying assembly comprises a flexible hose and a plurality of spray heads connected to the flexible hose, and the spray heads are arranged on the mounting frame through a spraying pipe.

[0018] According to an aspect of the above technical solution, the flexible hose is further connected with a conveying pipe for conveying cleaning liquid.

[0019] According to an aspect of the above technical solution, the second driving assembly comprises a second motor arranged on the mounting frame, a driving wheel arranged on the second motor, a driven wheel arranged on the side wall of the mounting frame, and a belt sleeved on the driving wheel and the driven wheel, and the driven wheel is coaxially connected with the roller to drive the roller to rotate.

[0020] According to an aspect of the above technical solution, the cleaning tank is further provided with an arc-shaped baffle and a liquid discharge pipe.

[0021] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

[0023] Figure 1 FIG. 1 is a structure schematic view of a wafer cleaning device in one embodiment of the present application from one perspective;

[0024] Figure 2 FIG. 2 is a structure schematic view of the wafer cleaning device in one embodiment of the present application from another perspective;

[0025] Figure 3 FIG. 3 is a side view of the wafer cleaning device in one embodiment of the present application;

[0026] Figure 4 FIG. 4 is a structure schematic view of a cleaning assembly in one embodiment of the present application from one perspective;

[0027] Figure 5 FIG. 5 is a structure schematic view of the cleaning assembly in one embodiment of the present application from another perspective.

[0028] Explanation of symbols of components in drawings:

[0029] 1, cleaning tank; 2, cleaning space; 3, pipe shaft; 4, adsorption disc seat; 5, support frame; 6, electric cylinder; 7, mounting frame; 8, roller; 9, transmission belt; 10, cleaning brush; 11, injection pipe; 12, spray head; 13, flexible hose; 14, driven gear; 15, first motor; 16, driving gear; 17, vacuum pump; 18, negative pressure pipe; 19, rotary joint; 20, second motor; 21, driving wheel; 22, driven wheel; 23, belt; 24, fixed plate; 25, conveying pipe; 26, arc-shaped baffle; 27, liquid discharge pipe. DETAILED DESCRIPTION

[0030] In order to make the purpose, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixedly attached" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can be present. As used herein the terms "vertical", "horizontal", "left", "right", "upper", "lower", and the like as well as the like are used for explanation only and not to indicate or imply that a specific orientation of the device or element is required thereby limiting the scope of the present application.

[0032] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] Please refer to Figures 1-5 , it is a structure schematic diagram of a wafer cleaning device provided in an embodiment of the present application, the wafer cleaning device comprises a supporting mechanism, a cleaning mechanism arranged on the supporting mechanism, and a driving mechanism for driving the cleaning mechanism, wherein:

[0034] For the purpose of providing support to the cleaning mechanism and the driving mechanism, the support mechanism comprises a support frame 5 supporting the cleaning mechanism, and a suction assembly for supporting and driving the wafer to rotate. In the embodiment, the support frame 5 is an L-shaped bracket. The cleaning mechanism comprises a cleaning tank 1 arranged on the support frame 5, and a cleaning assembly for cleaning the wafer, and the cleaning tank 1 is provided with an annular cleaning space 2. The driving mechanism comprises a first driving assembly driving the suction assembly to rotate, and a second driving assembly driving the cleaning assembly to rotate. The wafer is suctioned to the center of the cleaning tank 1, the cleaning assembly is arranged on the side of the cleaning tank 1 away from the first driving assembly, and the height is adjusted so that the cleaning assembly contacts the surface of the wafer. The wafer is driven to rotate by the first driving assembly, so as to transport the cleaning sewage to the edge of the wafer, and discharge the sewage from the wafer and the cleaning tank 1.

[0035] For the purpose of fixing the wafer, the suction assembly comprises a vacuum pump 17 arranged at the bottom of the support frame 5, a negative pressure pipe 18 connected to the vacuum pump 17, a pipe shaft 3 arranged at the center of the cleaning tank 1, a suction disc seat 4 arranged on the pipe shaft 3, and a rotary joint 19 connecting the negative pressure pipe 18 and the pipe shaft 3. The pipe shaft 3 penetrates the cleaning tank 1, so that the suction disc seat 4 is arranged at the center of the cleaning tank 1. The suction disc seat 4 is in a negative pressure state, so that the wafer placed on the suction disc seat 4 can be suctioned.

[0036] In order to drive the wafer to rotate, so as to transport the sewage generated by cleaning and cleaning to the edge of the wafer, so as to quickly discharge the sewage generated by cleaning from the edge of the wafer, avoid the sewage staying on the surface of the wafer, improve the cleaning efficiency and cleaning effect, the first driving assembly is further arranged at the bottom of the support frame 5. The first driving assembly comprises a first motor 15 arranged on the support frame 5, a driving gear 16 arranged on the first motor 15, and a driven gear 14 arranged on the pipe shaft 3. The driving gear 16 and the driven gear 14 are engaged to drive the pipe shaft 3 to rotate. The first motor 15 drives the driving gear 16 to rotate, and then drives the driven gear 14 to rotate through engagement, and finally drives the pipe shaft 3 to rotate. The wafer suctioned to the suction disc seat 4 rotates with the pipe shaft 3.

[0037] In order to drive the cleaning assembly to move up and down, the support frame 5 is provided with a fixed plate 24 towards the center of the cleaning tank 1, and at least one electric cylinder 6 is arranged on the fixed plate 24, and the electric cylinder 6 is connected to the cleaning assembly for driving the cleaning assembly to move up and down. In order to avoid liquid splashing during the cleaning process, an arc-shaped baffle 26 is arranged on the cleaning tank 1, and a liquid discharge pipe 27 is arranged at the bottom of the cleaning tank 1 for discharging the liquid in the cleaning tank 1. In the embodiment, the cleaning tank 1 is in the shape of a cylinder, and the diameter of the cleaning tank 1 is larger than the diameter of the wafer, so that the sewage can be discharged from the gap between the wafer and the cleaning tank 1.

[0038] In order to clean the wafer by cooperating with the first driving assembly, the cleaning assembly comprises a mounting frame 7 for connecting the electric cylinder 6, rollers 8 arranged at both ends of the mounting frame 7 respectively, and a transmission belt 9 sleeved on the rollers 8 at both ends, the transmission belt 9 drives the rollers 8 at both ends to rotate synchronously, and the outer side wall of the rotating belt is covered with cleaning brushes 10. When the first driving assembly indirectly drives the wafer to rotate, the electric cylinder 6 on the fixed plate 24 drives the mounting frame 7 to move downward, so that the cleaning brushes 10 contact the surface of the wafer, and then the wafer is brushed. A liquid spraying assembly is further arranged on the side wall of the mounting frame 7, and the liquid spraying assembly comprises a flexible hose 13 and a plurality of nozzles 12 connected to the flexible hose 13. The nozzles 12 are arranged on the mounting frame 7 through a spraying pipe 11, and the flexible hose 13 is further connected to a conveying pipe 25 for conveying cleaning liquid

[0039] In order to provide driving power to the cleaning assembly, the second driving assembly comprises a second motor 20 arranged on the mounting frame 7, a driving wheel 21 arranged on the second motor 20, a driven wheel 22 arranged on the side wall of the mounting frame 7, and a belt 23 sleeved on the driving wheel 21 and the driven wheel 22. The driven wheel 22 is coaxially connected with the roller 8, thereby driving the roller 8 to rotate. The second motor 20 drives the driving wheel 21 to rotate, thereby driving the driven wheel 22 to rotate through the belt 23. Since the driven wheel 22 is coaxially connected with the roller 8, the roller 8 drives the transmission belt 9 to rotate, thereby enabling the cleaning brushes 10 to cooperate with the cleaning liquid sprayed by the nozzles 12 to brush the surface of the wafer.

[0040] In summary, according to the wafer cleaning device provided by the utility model, the cleaning assembly is arranged to clean the surface of the wafer, and the sewage generated by cleaning is transported to the edge of the wafer. The first driving assembly drives the adsorption assembly to rotate, thereby driving the wafer to rotate, so that the sewage generated by cleaning quickly flows out from the gap between the wafer and the cleaning tank, avoiding the sewage staying on the surface of the wafer, and improving the cleaning efficiency and cleaning effect. The wafer sheet is adsorbed by the adsorption assembly, which is firm and will not damage the edge of the wafer sheet. At the same time, the first driving assembly drives the pipe shaft to rotate, the pipe shaft drives the adsorption disc seat to rotate, thereby driving the wafer sheet to rotate, which is conducive to the cleaning assembly to clean the wafer sheet comprehensively.

[0041] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0042] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be noted that, for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The wafer cleaning device comprises a supporting mechanism, a cleaning mechanism arranged on the supporting mechanism, and a driving mechanism for driving the cleaning mechanism; The supporting mechanism comprises a supporting frame for supporting the cleaning mechanism, and a suction assembly for supporting and rotating the wafer; The cleaning mechanism comprises a cleaning tank arranged on the supporting frame, and a cleaning assembly for cleaning the wafer; The driving mechanism comprises a first driving assembly for rotating the suction assembly, and a second driving assembly for driving the cleaning assembly to rotate; The wafer is suctioned to the center of the cleaning tank, the cleaning assembly is arranged on the side of the cleaning tank away from the first driving assembly, and the horizontal height of the cleaning assembly is adjusted to contact the surface of the wafer, the wafer is rotated by the first driving assembly to transport the cleaning sewage to the edge of the wafer, and the sewage is discharged from the wafer and the cleaning tank.

2. The wafer cleaning apparatus according to claim 1, wherein The suction assembly comprises a vacuum pump arranged on the supporting frame, a negative pressure pipe connected to the vacuum pump, a pipe shaft arranged in the center of the cleaning tank, a suction disc seat arranged on the pipe shaft, and a rotary joint connecting the negative pressure pipe and the pipe shaft, and the vacuum pump is used to adjust the negative pressure state in the suction disc seat to make the suction disc seat for the wafer.

3. The wafer cleaning apparatus according to claim 2, wherein The first driving assembly comprises a first motor arranged on the supporting frame, a driving gear arranged on the first motor, and a driven gear arranged on the pipe shaft, and the driving gear and the driven gear are engaged to drive the pipe shaft to rotate.

4. The wafer cleaning apparatus of claim 1, wherein The supporting frame is provided with a fixed plate towards the center of the cleaning tank, and at least one electric cylinder is arranged on the fixed plate, and the electric cylinder is connected to the cleaning assembly to drive the cleaning assembly to move up and down.

5. The wafer cleaning apparatus according to claim 4, wherein The cleaning assembly comprises a mounting frame connected to the electric cylinder, rollers arranged at both ends of the mounting frame respectively, and a transmission belt sleeved on the rollers, and the transmission belt drives the rollers at both ends to rotate synchronously.

6. The wafer cleaning apparatus according to claim 5, wherein The outer wall of the rotating belt is covered with cleaning brushes.

7. The wafer cleaning apparatus according to claim 6, wherein The side wall of the mounting frame is further provided with a liquid spraying assembly, and the liquid spraying assembly comprises a flexible hose and a plurality of nozzles connected to the flexible hose, and the nozzles are arranged on the mounting frame through a spraying pipe.

8. The wafer cleaning apparatus according to claim 7, wherein The flexible hose is further connected to a conveying pipe for conveying cleaning liquid.

9. The wafer cleaning apparatus of claim 1, wherein The second driving assembly comprises a second motor arranged on the mounting frame, a driving wheel arranged on the second motor, a driven wheel arranged on the side wall of the mounting frame, and a belt sleeved on the driving wheel and the driven wheel, and the driven wheel is coaxially connected with the roller to drive the roller to rotate.

10. The wafer cleaning apparatus of claim 1, wherein The cleaning tank is further provided with an arc-shaped baffle and a liquid discharge pipe.

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