Liquid recovery device and equipment

Abstract

The utility model provides a liquid recovery device and equipment, and relates to the field of semiconductor manufacturing. The liquid recovery device is applied to the wafer slotting equipment, and the wafer slotting equipment comprises a rotary carrying table. The liquid recycling device comprises a first liquid collecting mechanism, a liquid feeding assembly and a recycling mechanism. The first liquid collecting mechanism is arranged on the periphery of the rotary carrying table, and the inner diameter of the first liquid collecting mechanism is larger than the outer diameter of the rotary carrying table. One end of the liquid feeding assembly is connected with the first liquid collecting mechanism, and the other end of the liquid feeding assembly is connected with the recycling mechanism. According to the liquid recovery device provided by the utility model, the first liquid collection mechanism is arranged at the periphery of the rotary carrying table of the wafer slotting equipment, and the liquid feeding assembly of which the two ends are respectively connected with the first liquid collection mechanism and the recovery mechanism is arranged, so that the protection liquid on the surface of the wafer on the rotary carrying table can be collected by the first liquid collection mechanism; and the liquid flows into the recovery mechanism through the liquid feeding assembly. Therefore, the protection liquid is saved, and the cost of grooving the wafer is saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, specifically, relate to a liquid recovery device and equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, wafer slotting is an important process step. In order to prevent the wafer from being damaged or contaminated during slotting, a protective liquid is usually coated on the surface of the wafer. After coating a certain amount of protective liquid, most of the protective liquid is thrown out by centrifugal force, so that a small amount of protective liquid is attached to the surface of the wafer for processing.

[0003] In the prior art, most of the protective liquid thrown out is generally directly discharged into the wastewater pipeline as wastewater treatment, thus causing waste of protective liquid and increasing the cost of wafer slotting. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a liquid recovery device and equipment, which can at least partially solve the above technical problems.

[0005] In a first aspect, the utility model provides a liquid recovery device applied to a wafer slotting equipment, wherein the wafer slotting equipment comprises a rotating table; the liquid recovery device comprises a first liquid collecting mechanism, a liquid feeding assembly and a recovery mechanism;

[0006] The first liquid collecting mechanism is arranged at the periphery of the rotating table, and the inner diameter of the first liquid collecting mechanism is greater than the outer diameter of the rotating table;

[0007] One end of the liquid feeding assembly is connected with the first liquid collecting mechanism, and the other end is connected with the recovery mechanism.

[0008] Optionally, the first liquid collecting mechanism comprises a first liquid baffle and a second liquid baffle;

[0009] The first liquid baffle is annularly arranged at the periphery of the rotating table, and the height of the first liquid baffle is higher than the height of the table top of the rotating table;

[0010] The second liquid baffle is annularly arranged between the rotating table and the first liquid baffle, the height of the second liquid baffle is higher than the height of the table top of the rotating table, and lower than the height of the first liquid baffle;

[0011] An annular protective liquid channel is arranged between the first liquid baffle and the second liquid baffle, and the first liquid baffle and the second liquid baffle are connected and fixed through the annular protective liquid channel.

[0012] Optionally, the first liquid collecting mechanism further comprises a liquid leakage hole;

[0013] The liquid leakage hole is arranged on the annular protection liquid channel.

[0014] One end of the liquid feeding assembly is connected with the liquid leakage hole.

[0015] Optionally, the liquid recovery device further comprises a lifting mechanism.

[0016] The lifting mechanism is fixedly connected with one side of the annular protection liquid channel away from the first liquid blocking plate through a backing plate.

[0017] Optionally, the lifting mechanism comprises a pneumatic cylinder, a lifting rod and a sliding groove.

[0018] The sliding groove is fixedly connected with the backing plate and one end of the lifting rod, respectively.

[0019] The lifting rod is arranged in the pneumatic cylinder in a lifting manner.

[0020] The sliding groove is slidably fixed on the side surface of the pneumatic cylinder, and the shape of the sliding groove is matched with the side surface of the pneumatic cylinder.

[0021] Optionally, the liquid recovery device further comprises a second liquid collecting mechanism; the second liquid collecting mechanism comprises a third liquid blocking plate and a fourth liquid blocking plate.

[0022] The third liquid blocking plate is annularly arranged outside the first liquid blocking plate, and the height of the third liquid blocking plate is higher than the height of the table surface of the rotary turntable.

[0023] The fourth liquid blocking plate is arranged between the first liquid blocking plate and the third liquid blocking plate, the height of the fourth liquid blocking plate is higher than the height of the table surface of the rotary turntable, and is lower than the height of the third liquid blocking plate.

[0024] An annular waste liquid channel is arranged between the third liquid blocking plate and the fourth liquid blocking plate, and the third liquid blocking plate and the fourth liquid blocking plate are fixedly connected through the annular waste liquid channel.

[0025] Optionally, the wafer slotting device further comprises a coating arm, and the third liquid blocking plate is provided with an opening.

[0026] The coating arm extends into above the table surface of the rotary turntable from the opening.

[0027] Optionally, the liquid feeding assembly is a liquid feeding pipe.

[0028] The recovery mechanism is in communication with the first liquid collecting mechanism through the liquid feeding pipe.

[0029] Optionally, the recovery mechanism is a recovery barrel.

[0030] The utility model provides a kind of liquid recovery equipment, and the liquid recovery equipment includes the liquid recovery device of any one of the above.

[0031] The liquid recovery device and equipment provided by the utility model have the following beneficial effects:

[0032] By setting the first liquid collecting mechanism on the periphery of the rotating table of the wafer slotting equipment, and setting the liquid feeding assembly connected with the first liquid collecting mechanism and the recovery mechanism at both ends, the protective liquid on the wafer surface of the rotating table can be collected by the first liquid collecting mechanism and flow into the recovery mechanism through the liquid feeding assembly. The protective liquid is saved, and the cost of wafer slotting is saved. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the utility model, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0034] Figure 1 The schematic diagram of the liquid recovery device provided by the embodiments of the utility model is shown in the figure.

[0035] Figure 2 The structural schematic diagram of the first liquid collecting mechanism provided by the embodiments of the utility model is shown in the figure.

[0036] Figure 3 The schematic diagram of the lifting mechanism provided by the embodiments of the utility model is shown in the figure.

[0037] Figure 4 The structural schematic diagram of the lifting mechanism provided by the embodiments of the utility model is shown in the figure.

[0038] Figure 5 The top view of the positional relationship between the first liquid collecting mechanism and the second liquid collecting mechanism provided by the embodiments of the utility model is shown in the figure.

[0039] Figure 6 The schematic diagram of the second liquid collecting mechanism provided by the embodiments of the utility model is shown in the figure.

[0040] Figure legend: 01-liquid recovery device; 10-first liquid collecting mechanism; 101-first liquid baffle; 102-second liquid baffle; 103-annular protective liquid channel; 104-liquid leakage hole; 11-liquid feeding assembly; 12-recovery mechanism; 13-lifting mechanism; 1311-cylinder; 1312-lifting rod; 1313-slotted chute; 14-second liquid collecting mechanism; 141-third liquid baffle; 142-fourth liquid baffle; 143-annular waste liquid channel; 02-wafer slotting equipment; 20-rotating table; 21-coating arm. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present application.

[0043] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0044] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0045] In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "provision", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0047] In the manufacturing process of semiconductor, wafer slotting is an important process step. In order to prevent the wafer from being damaged or contaminated during the slotting process, it is usually necessary to coat a layer of protective liquid on the surface of the wafer. After a certain amount of protective liquid is coated, the rotating table carrying the wafer rotates, and most of the protective liquid is thrown out by the centrifugal force, so that a small amount of protective liquid is attached to the surface of the wafer, and then the wafer slotting processing is carried out.

[0048] In the prior art, most of the protective liquid thrown out is usually discharged through a pipeline for wastewater treatment, which makes the processing cost of wafer slotting high and the protective liquid is wasted in large quantities.

[0049] Based on the above situation, the embodiment of the present specification provides a liquid recovery device 01 and equipment, which can effectively alleviate the above technical problems.

[0050] Please refer to Figure 1 The embodiment provides a liquid recovery device 01 applied to a wafer slotting equipment 02, and the wafer slotting equipment 02 comprises a rotating table 20. The liquid recovery device 01 comprises a first liquid collecting mechanism 10, a liquid feeding assembly 11 and a recovery mechanism 12.

[0051] The first liquid collecting mechanism 10 is arranged at the periphery of the rotating table 20, and the inner diameter of the first liquid collecting mechanism 10 is greater than the outer diameter of the rotating table 20.

[0052] One end of the liquid feeding assembly 11 is connected with the first liquid collecting mechanism 10, and the other end is connected with the recovery mechanism 12.

[0053] The wafer is placed on the rotating table 20 before slotting, and after the protective liquid is coated on the wafer, the rotating table 20 is rotated by the driving of the motor, and part of the protective liquid is spread on the wafer due to the centrifugal force. The remaining protective liquid is thrown to the inner wall of the first liquid collecting mechanism 10 under the rotation of the rotating table 20, so as to achieve the purpose of leaving only a thin layer of protective liquid on the wafer. The protective liquid falling from the inner wall of the liquid collecting mechanism enters from one end of the liquid feeding assembly 11 and flows out from the other end, and finally reaches the recovery mechanism 12. The protective liquid recovered by the recovery mechanism 12 can be used again in the next time of coating the wafer without being contaminated, so as to achieve the effect of saving cost, and if it is contaminated, it can be collected for subsequent unified treatment to avoid pollution of the environment due to direct discharge.

[0054] Optionally, the first liquid collecting mechanism 10 comprises a first liquid blocking plate 101 and a second liquid blocking plate 102.

[0055] The first liquid blocking plate 101 is annularly arranged at the periphery of the rotating table 20, and the height of the first liquid blocking plate 101 is higher than the table surface of the rotating table 20.

[0056] The second baffle plate 102 is arranged in a ring between the rotating platform 20 and the first baffle plate 101. The height of the second baffle plate 102 is higher than the platform surface of the rotating platform 20 and lower than the first baffle plate 101.

[0057] An annular protective liquid channel 103 is provided between the first liquid baffle 101 and the second liquid baffle 102, and the first liquid baffle 101 and the second liquid baffle 102 are connected and fixed through the annular protective liquid channel 103.

[0058] like Figure 2 As shown, to ensure the protective liquid on the wafer surface of the rotating stage 20 can be smoothly splashed onto the first liquid collection mechanism 10, the lowest point of the first baffle plate 101 can be flush with the table surface of the rotating stage 20, while the other side is higher than the table surface of the rotating stage 20. When the protective liquid is splashed onto the first baffle plate 101 and slides down, to prevent the protective liquid from flowing back onto the wafer surface, a second baffle plate 102 can be set between the first baffle plate 101 and the rotating stage 20 to block the backflow of protective liquid. By connecting and fixing the first baffle plate 101 and the second baffle plate 102 through the annular protective liquid channel 103, the protective liquid can flow into the liquid delivery assembly 11 along the annular protective liquid channel 103, ultimately achieving the recovery of the protective liquid.

[0059] Optionally, the first liquid collection mechanism 10 further includes a leakage hole 104. The leakage hole 104 is formed on the annular protective liquid channel 103. One end of the liquid delivery assembly 11 is connected to the leakage hole 104.

[0060] like Figure 2 As shown, the leakage hole 104 is opened on the annular protective liquid channel 103. When the protective liquid sliding down from the first baffle plate 101 flows to the leakage hole 104 on the annular protective liquid channel 103, it can flow into the liquid delivery assembly 11 from the leakage hole 104.

[0061] Optionally, the liquid recovery device 01 also includes a lifting mechanism 13.

[0062] The lifting mechanism 13 is fixedly connected to the side of the annular protective liquid channel 103 away from the first baffle plate 101 via a pad.

[0063] like Figure 3 As shown, a pad can be installed on the bottom surface of the annular protective liquid channel 103, and a fixed lifting mechanism 13 is installed below the pad. After the protective liquid is coated on the wafer, the lifting mechanism 13 can be controlled to lift the first liquid collection mechanism 10. After the first liquid collection mechanism 10 rises to a set height, the rotating stage 20 is controlled to rotate. After the protective liquid is collected, the first liquid collection mechanism 10 is lowered back to its original position by controlling the lifting mechanism 13.

[0064] In order to make the rising and falling of the first liquid collecting mechanism 10 more stable, a lifting mechanism 13 can be arranged on each of the opposite sides below the first liquid collecting mechanism 10, or four lifting mechanisms 13 can be symmetrically arranged to further increase the stability of the rising and falling of the first liquid collecting mechanism 10.

[0065] Optionally, the lifting mechanism 13 comprises a pneumatic cylinder 1311, a lifting rod 1312 and a sliding groove 1313.

[0066] The sliding groove 1313 is fixedly connected with the base plate and one end of the lifting rod 1312, respectively.

[0067] The lifting rod 1312 is arranged in the pneumatic cylinder 1311 in a lifting manner.

[0068] The sliding groove 1313 is slidably fixed on the side surface of the pneumatic cylinder 1311, and the shape of the sliding groove 1313 is matched with the side surface of the pneumatic cylinder 1311.

[0069] Please refer to Figure 4 , in an optional embodiment, the lifting mechanism 13 can be arranged in the form of the pneumatic cylinder 1311, the lifting rod 1312 and the sliding groove 1313, the lifting rod 1312 is fixed with the sliding groove 1313, the lifting rod 1312 is arranged in the pneumatic cylinder 1311, and the sliding groove 1313 is slidably clamped on the pneumatic cylinder 1311. One end of the sliding groove 1313 is fixed with the base plate, when it is needed to make the first liquid collecting mechanism 10 rise, the pneumatic cylinder 1311 works to lift the lifting rod 1312, so that the sliding groove 1313 rises along the pneumatic cylinder 1311, and then drives the first liquid collecting mechanism 10 to rise.

[0070] Optionally, the liquid recovery device 01 further comprises a second liquid collecting mechanism 14; the second liquid collecting mechanism 14 comprises a third liquid blocking plate 141 and a fourth liquid blocking plate 142.

[0071] The third liquid blocking plate 141 is annularly arranged outside the first liquid blocking plate 101, and the height of the third liquid blocking plate 141 is higher than the table surface of the rotary table 20.

[0072] The fourth liquid blocking plate 142 is arranged between the first liquid blocking plate 101 and the third liquid blocking plate 141, and the height of the fourth liquid blocking plate 142 is higher than the table surface of the rotary table 20 and lower than the third liquid blocking plate 141.

[0073] An annular waste liquid channel 143 is arranged between the third liquid blocking plate 141 and the fourth liquid blocking plate 142, and the third liquid blocking plate 141 and the fourth liquid blocking plate 142 are connected and fixed through the annular waste liquid channel 143.

[0074] As Figure 5 , Figure 6As shown, after the collection of the protective liquid splashed on the wafer surface is completed, the wafer surface needs to be cleaned with clean water. Therefore, a second liquid collecting mechanism 14 can be further arranged at the periphery of the first liquid collecting mechanism 10, and the height of the third liquid blocking plate 141 of the second liquid collecting mechanism 14 is higher than the height of the first liquid blocking plate 101. Similarly, a ring-shaped waste liquid channel 143 similar to the ring-shaped protective liquid channel 103 can be arranged, and a fourth liquid blocking plate 142 similar to the second liquid blocking plate 102 can be arranged. The third liquid blocking plate 141 and the fourth liquid blocking plate 142 are connected and fixed through the ring-shaped waste liquid channel 143. After the collection of the protective liquid is completed, the first liquid collecting mechanism 10 is lowered through the lifting mechanism 13, and the wafer surface is cleaned with clean water. The waste liquid after cleaning is splashed onto the third liquid blocking plate 141 of the second liquid collecting mechanism 14, flows into the ring-shaped waste liquid channel 143, and finally flows out.

[0075] Please refer to Figure 5 , which is a top view of the positional relationship between the first liquid collecting mechanism 10 and the second liquid collecting mechanism 14. From Figure 5 it can be seen that the first liquid collecting mechanism 10 is arranged at the periphery of the rotating table 20, wherein the second liquid blocking plate 102 is arranged at the periphery of the rotating table 20, and the ring-shaped protective liquid channel 103, the first liquid blocking plate 101 are arranged from inside to outside. The second liquid collecting mechanism 14 is arranged at the periphery of the first liquid collecting mechanism 10, wherein the fourth liquid blocking plate 142 is arranged at the periphery of the first liquid blocking plate 101, and the ring-shaped waste liquid channel 143, the third liquid blocking plate 141 are arranged from inside to outside.

[0076] Optionally, the wafer grooving device 02 further comprises a coating arm 21, and the third liquid blocking plate 141 is provided with an opening. The coating arm 21 extends into the upper side of the table top of the rotating table 20 from the opening.

[0077] Still taking Figure 6 as an example, the opening is arranged on the third liquid blocking plate 141, so that the coating arm 21 of the wafer grooving device 02 can extend from the outside to the upper side of the rotating table 20 to perform coating work on the wafer. In an optional embodiment, the height of the coating arm 21 can be higher than the height of the first liquid blocking plate 101.

[0078] Optionally, the liquid feeding assembly 11 is a liquid feeding pipe. The recovery mechanism 12 is in communication with the first liquid collecting mechanism 10 through the liquid feeding pipe.

[0079] In the specific implementation process, the liquid feeding pipe can be Figure 1 a hard pipe as shown, or a soft pipe structure, or other pipes that can transmit liquid, and the utility model does not make specific limitations on this.

[0080] Optionally, the recovery mechanism 12 is a recovery barrel. In addition to being arranged as Figure 1In addition to the recovery barrel shown, any device that can contain wafer protection liquid can be provided, and the present application does not make specific limitations thereto.

[0081] Based on the same inventive concept, the present application provides a liquid recovery device, which comprises the liquid recovery device 01 of any one of the above.

[0082] As to the above liquid recovery device, the specific functions and structures of each part have been described in detail in the embodiments of the liquid recovery device 01 provided in the present application, and will not be described in detail here.

[0083] The above scheme in the embodiments of the present application at least has the following technical effects:

[0084] By setting the first liquid collecting mechanism outside the rotating table of the wafer slotting device, and setting the liquid sending assembly connected with the first liquid collecting mechanism and the recovery mechanism at both ends, when the rotating table works, the protection liquid on the surface of the wafer on the rotating table will be thrown to the first liquid blocking plate of the first liquid collecting mechanism by centrifugal force, so as to be collected by the first liquid collecting mechanism, and then flow into the recovery mechanism through the liquid sending assembly. The protection liquid is saved, and the cost of wafer slotting is saved.

[0085] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid recovery device, characterized by, The application is applied to a wafer slotting device (02), and the wafer slotting device (02) comprises a rotating table (20); the liquid recovery device (01) comprises a first liquid collecting mechanism (10), a liquid feeding assembly (11) and a recovery mechanism (12); The first liquid collecting mechanism (10) is arranged at the periphery of the rotating table (20), and the inner diameter of the first liquid collecting mechanism (10) is greater than the outer diameter of the rotating table (20); One end of the liquid feeding assembly (11) is connected with the first liquid collecting mechanism (10), and the other end is connected with the recovery mechanism (12).

2. The liquid recovery apparatus of claim 1, wherein The first liquid collecting mechanism (10) comprises a first liquid blocking plate (101) and a second liquid blocking plate (102); The first liquid blocking plate (101) is annularly arranged at the periphery of the rotating table (20), and the height of the first liquid blocking plate (101) is higher than the height of the table top of the rotating table (20); The second liquid blocking plate (102) is annularly arranged between the rotating table (20) and the first liquid blocking plate (101), the height of the second liquid blocking plate (102) is higher than the height of the table top of the rotating table (20) and lower than the height of the first liquid blocking plate (101); An annular protection liquid channel (103) is arranged between the first liquid blocking plate (101) and the second liquid blocking plate (102), and the first liquid blocking plate (101) and the second liquid blocking plate (102) are connected and fixed through the annular protection liquid channel (103).

3. The liquid recovery apparatus of claim 2, wherein The first liquid collecting mechanism (10) further comprises a liquid leakage hole (104); The liquid leakage hole (104) is arranged on the annular protection liquid channel (103); One end of the liquid feeding assembly (11) is connected with the liquid leakage hole (104).

4. The liquid recovery apparatus of claim 2, wherein The liquid recovery device (01) further comprises a lifting mechanism (13); The lifting mechanism (13) is fixedly connected with one side of the annular protection liquid channel (103) away from the first liquid blocking plate (101) through a backing plate.

5. The liquid recovery apparatus of claim 4, wherein, The lifting mechanism (13) comprises a gas cylinder (1311), a lifting rod (1312) and a sliding groove (1313); The sliding groove (1313) is fixedly connected with the backing plate and one end of the lifting rod (1312) respectively; The lifting rod (1312) is arranged in the gas cylinder (1311) in a lifting manner; The sliding groove (1313) is fixedly arranged on the side surface of the gas cylinder (1311) in a sliding manner, and the shape of the sliding groove (1313) is matched with the side surface of the gas cylinder (1311).

6. The liquid recovery apparatus of claim 2, wherein The liquid recovery device (01) further comprises a second liquid collecting mechanism (14); the second liquid collecting mechanism (14) comprises a third liquid blocking plate (141) and a fourth liquid blocking plate (142); The third liquid blocking plate (141) is annularly arranged at the periphery of the first liquid blocking plate (101), and the height of the third liquid blocking plate (141) is higher than the height of the table top of the rotating table (20); The fourth liquid blocking plate (142) is arranged between the first liquid blocking plate (101) and the third liquid blocking plate (141), the height of the fourth liquid blocking plate (142) is higher than the height of the table top of the rotating table (20) and lower than the height of the third liquid blocking plate (141); An annular waste liquid channel (143) is arranged between the third liquid blocking plate (141) and the fourth liquid blocking plate (142), and the third liquid blocking plate (141) and the fourth liquid blocking plate (142) are fixedly connected through the annular waste liquid channel (143).

7. The liquid recovery apparatus of claim 6, wherein The wafer slotting device (02) further comprises a coating arm (21), and the third liquid blocking plate (141) is provided with an opening; The coating arm (21) extends into the space above the table top of the rotating table (20) from the opening.

8. The liquid recovery apparatus of claim 1, wherein, The liquid feeding assembly (11) is a liquid feeding pipe. The recycling mechanism (12) is in communication with the first liquid collecting mechanism (10) through the liquid feeding pipe.

9. The liquid recovery apparatus of claim 1, wherein, The recycling mechanism (12) is a recycling barrel.

10. A liquid recovery apparatus, characterized by, The liquid recycling device comprises the liquid recycling device (01) according to any one of claims 1-9.

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