High-precision automatic alignment device for semiconductor packaging equipment

Abstract

The utility model belongs to the technical field of semiconductor packaging, in particular to a high-precision automatic alignment device for semiconductor packaging equipment, which comprises a packaging platform and a packaging assembly, the packaging assembly comprises a lower die holder, a die core and a steel mesh sleeve frame, the high-precision automatic alignment device further comprises a rotating disc, the rotating disc is rotatably arranged above the packaging platform, and the rotating disc is arranged on the lower die holder. The multiple steel mesh sleeve frames are fixed to the rotating disc at equal intervals in the circumferential direction. A top plate; the motor frame is located under the top plate, and the rotating disc is rotationally connected to the motor frame; the servo motor is fixed in the motor frame and is used for driving the rotating disc to rotate; a vertical cylinder; according to the utility model, the servo motor drives the rotating disc to rotate, different steel mesh sleeve frames are switched, and the vertical air cylinder is matched for realizing alignment of the steel mesh sleeve frames and the mold core, so that on the premise of ensuring the alignment precision, the production efficiency is greatly improved, the batch production requirement is met, and the enterprise income is facilitated.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, specifically relating to a high-precision automatic alignment device for semiconductor packaging equipment. Background Technology

[0002] BGA ball bonding is a common packaging technology in semiconductor packaging. BGA ball bonding is a process in which tiny solder balls are soldered to the solder joints on the bottom of the BGA chip in ball grid array packaging (BGA) technology.

[0003] The mold core and stencil frame are the core components of the BGA ball-mounting process. The mold core is used to fix the semiconductor chip to be ball-mounted. The stencil frame usually includes two parts: the solder paste stencil frame and the BGA under-ball stencil frame. The solder paste stencil frame is used to place solder on the semiconductor chip, and the BGA under-ball stencil frame is used to fix the solder balls on the semiconductor chip.

[0004] In existing technologies, stencil frames are all manually aligned. After soldering, the stencil frame with printed solder paste needs to be manually removed and the stencil frame with solder balls under the BGA needs to be installed. Although this can ensure the accuracy of alignment, it is inefficient and difficult to adapt to the needs of mass production.

[0005] To address the aforementioned problems, this utility model proposes a high-precision automatic alignment device for semiconductor packaging equipment. Utility Model Content

[0006] To address the aforementioned problems in the existing technology, this utility model provides a high-precision automatic alignment device for semiconductor packaging equipment, which features convenient use, accurate alignment, and high processing efficiency.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-precision automatic alignment device for semiconductor packaging equipment, comprising a packaging platform and a packaging assembly disposed on the top of the packaging platform. The packaging assembly includes a lower mold base, a mold core fixed to the top of the lower mold base, and a steel mesh frame located above the lower mold base. The top surface of the steel mesh frame has an upper groove with mesh holes, and the top surface of the mold core has a placement groove. The device further includes:

[0008] A rotating disk is rotatably disposed above the packaging platform, and a plurality of steel mesh frames are fixed on the rotating disk at equal intervals along the circumferential direction;

[0009] A top plate, which is supported and fixed above the packaging platform by support columns, and the rotating disk is located directly below the top plate;

[0010] A motor frame is located directly below the top plate, and the rotating disc is rotationally connected to the motor frame.

[0011] A servo motor is fixed in the motor frame and used for driving the rotating disc to rotate.

[0012] A vertical air cylinder is fixed to the top of the top plate, and a piston rod of the vertical air cylinder is fixedly connected to the motor frame after penetrating through the top plate.

[0013] As a preferred technical scheme of the utility model, a lower embedding groove is formed on the bottom surface of the steel mesh cover frame, and the mold core is embedded in the lower embedding groove.

[0014] As a preferred technical scheme of the utility model, an inclined chamfer is formed on the top surface edge of the mold core.

[0015] As a preferred technical scheme of the utility model, further comprising:

[0016] A positioning pin is fixed to the top surface of the lower die holder, and a positioning hole for embedding the positioning pin is formed on the steel mesh cover frame.

[0017] As a preferred technical scheme of the utility model, further comprising:

[0018] A first fixing block is fixed to the top surface of the steel mesh cover frame.

[0019] A second fixing block is fixed to the top surface of the rotating disc.

[0020] An installation rod penetrates through the first fixing block and the second fixing block.

[0021] A first manual bolt is installed on the first fixing block in a threaded screwing manner.

[0022] A second manual bolt is installed on the second fixing block in a threaded screwing manner.

[0023] As a preferred technical scheme of the utility model, the first fixing block, the second fixing block, the installation rod, the first manual bolt and the second manual bolt are all symmetrically distributed with two.

[0024] As a preferred technical scheme of the utility model, further comprising a positioning mechanism, which cooperates with the installation rod and is used for positioning the rotating position of the rotating disc, and the positioning mechanism comprises:

[0025] A double-shaft air cylinder is fixed to the top surface of the packaging platform.

[0026] A positioning block fixed to the top end of the piston rod of the double-shaft cylinder;

[0027] A rubber block fixedly bonded to the outer wall of the positioning block.

[0028] As a preferred technical scheme of the utility model, the support column is diagonally distributed with four.

[0029] Compared with the prior art, the utility model has the beneficial effects that:

[0030] In the utility model, the servo motor drives the rotating disc to rotate to switch different steel mesh sleeve frames, and the vertical cylinder is used to realize the alignment of the steel mesh sleeve frame and the mold core, the production efficiency is greatly improved under the premise of ensuring the alignment accuracy, the batch production demand is met, and the enterprise benefit is favorable.

[0031] Other additional advantages and beneficial effects of the utility model will be partially given in the following description, some will become obvious from the following description, or will be understood through the practice of the utility model. DRAWINGS

[0032] The drawings are used to provide further understanding of the utility model, and constitute a part of the specification, are used to explain the utility model together with the embodiments of the utility model, and do not constitute the limitation to the utility model. In the drawings:

[0033] Figure 1 It is the structural schematic diagram of the utility model;

[0034] Figure 2 It is the encapsulation platform axonometric structure schematic diagram in the utility model;

[0035] Figure 3 It is the encapsulation assembly cross section structure schematic diagram in the utility model;

[0036] Figure 4 It is the A place enlarged structure schematic diagram in the utility model Figure 2 ;

[0037] Figure 5 It is the positioning mechanism axonometric structure schematic diagram in the utility model.

[0038] In the figure: 1, packaging platform; 2, packaging assembly; 21, lower die holder; 211, positioning pin; 22, die core; 221, placing groove; 222, inclined chamfer; 23, steel mesh sleeve frame; 231, upper embedding groove; 232, mesh hole; 233, lower embedding groove; 234, positioning hole; 3, rotating disc; 4, top plate; 5, support column; 6, motor frame; 7, servo motor; 8, vertical air cylinder; 9, positioning mechanism; 91, double-shaft air cylinder; 92, positioning block; 93, rubber block; 10, No. 1 fixed block; 11, No. 2 fixed block; 12, mounting rod; 13, No. 1 manual bolt; 14, No. 2 manual bolt. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0040] Please refer to Figures 1-5 The utility model provides the following technical scheme: a high-precision automatic alignment device for semiconductor packaging equipment, comprising a packaging platform 1 and a packaging assembly 2 arranged on the top of the packaging platform 1, the packaging assembly 2 comprising a lower die holder 21, a die core 22 fixed on the top of the lower die holder 21 and a steel mesh sleeve frame 23 located above the lower die holder 21, the top surface of the steel mesh sleeve frame 23 being provided with an upper embedding groove 231, and the upper embedding groove 231 being provided with a mesh hole 232, the top surface of the die core 22 being provided with a placing groove 221, further comprising a rotating disc 3, a top plate 4, a motor frame 6, a servo motor 7 and a vertical air cylinder 8.

[0041] Further, by Figures 1-3As shown, in the embodiment, the rotating disc 3 is rotatably arranged above the packaging platform 1, a plurality of steel mesh sleeve frames 23 are fixed on the rotating disc 3 at equal intervals in the circumferential direction, the top plate 4 is supported and fixed above the packaging platform 1 by the support column 5, the rotating disc 3 is located directly below the top plate 4, the motor frame 6 is located directly below the top plate 4, the rotating disc 3 is rotatably connected to the motor frame 6, the servo motor 7 is fixed in the motor frame 6 and used to drive the rotating disc 3 to rotate, and the vertical cylinder 8 is fixed to the top of the top plate 4 and is fixedly connected with the motor frame 6 after the piston rod of the vertical cylinder 8 penetrates through the top plate 4. After the above scheme is used, in use, the semiconductor chip, the tin paste and the tin ball are all fed by using special conveying equipment, the tin paste as the flux helps the tin ball to be firmly welded on the welding point of the semiconductor chip, in ball planting, the semiconductor chip to be planted is placed in the placing groove 221, then the vertical cylinder 8 is started to pull the rotating disc 3 to rise, the steel mesh sleeve frame 23 rises, then the servo motor 7 is started to drive the rotating disc 3 to rotate, the steel mesh sleeve frame 23 is rotated to be located directly above the mold core 22, then the vertical cylinder 8 is started, the rotating disc 3 is driven by the vertical cylinder 8 to descend, the steel mesh sleeve frame 23 contacts the mold core 22, the tin paste is first coated on the welding point of the semiconductor chip, then the next steel mesh sleeve frame 23 is transferred in the same way as described above, the tin ball is conveyed into the steel mesh sleeve frame 23, and the tin ball is planted on the welding point of the semiconductor chip; the rotating disc 3 is driven by the servo motor 7 to rotate, different steel mesh sleeve frames 23 are switched, and the vertical cylinder 8 is used to realize the alignment of the steel mesh sleeve frame 23 and the mold core 22, the production efficiency is greatly improved under the premise of ensuring the alignment accuracy, the batch production demand is met, and the enterprise benefit is beneficial.

[0042] It should be noted that the utility model preferably adopts an even number of steel mesh sleeve frames 23, half of the steel mesh sleeve frames 23 are used for planting flux, and the other half of the steel mesh sleeve frames 23 are used for planting tin balls.

[0043] Preferably, the steel mesh sleeve frame 23 is provided with a plurality of planting grooves 231 arranged at equal intervals in the circumferential direction. Figures 1-3 As shown, in the embodiment, the bottom surface of the steel mesh sleeve frame 23 is provided with a lower embedding groove 233, and the mold core 22 is embedded in the lower embedding groove 233. After the above scheme is used, in use, the steel mesh sleeve frame 23 is positioned through the lower embedding groove 233, the mold core 22 is embedded in the lower embedding groove 233, the accuracy of the alignment of the steel mesh sleeve frame 23 and the mold core 22 is ensured, and the ball planting quality is ensured.

[0044] In addition, it should be noted that, from the above description, the thickness of the mold core 22 is equal to the groove depth of the lower embedding groove 233, and when the mold core 22 is embedded in the lower embedding groove 233, the outer wall of the mold core 22 abuts against the inner wall of the lower embedding groove 233, and has high stability.

[0045] Preferably, the steel mesh sleeve frame 23 is provided with a plurality of planting grooves 231 arranged at equal intervals in the circumferential direction. Figures 1-3As shown, in this embodiment, the top edge of the mold core 22 is provided with an inclined chamfer 222. After the above scheme is adopted, in use, the design of the inclined chamfer 222 makes the top edge of the mold core 22 smoother, reduces the risk of scratches and damage that may occur, and at the same time, the existence of the inclined chamfer 222 also provides better functionality and applicability for the mold core 22 in actual application, has the functions of guiding and automatic correction, and ensures the accuracy of the alignment of the steel mesh sleeve frame 23 and the mold core 22.

[0046] Preferably, the positioning pin 211 is fixed to the top surface of the lower mold base 21, and the steel mesh sleeve frame 23 has a positioning hole 234 for the positioning pin 211 to be embedded in. Figures 1-3 As shown, in this embodiment, the top edge of the mold core 22 is provided with an inclined chamfer 222. After the above scheme is adopted, in use, the design of the inclined chamfer 222 makes the top edge of the mold core 22 smoother, reduces the risk of scratches and damage that may occur, and at the same time, the existence of the inclined chamfer 222 also provides better functionality and applicability for the mold core 22 in actual application, has the functions of guiding and automatic correction, and ensures the accuracy of the alignment of the steel mesh sleeve frame 23 and the mold core 22.

[0047] Preferably, the positioning pin 211 is fixed to the top surface of the lower mold base 21, and the steel mesh sleeve frame 23 has a positioning hole 234 for the positioning pin 211 to be embedded in. Figures 1-4In the embodiment shown, it further includes: a first fixed block 10, a second fixed block 11, a mounting rod 12, a first manual bolt 13 and a second manual bolt 14, the first fixed block 10 is fixed to the top surface of the steel mesh sleeve frame 23, the second fixed block 11 is fixed to the top surface of the rotating disc 3, the mounting rod 12 penetrates the first fixed block 10 and the second fixed block 11, the first fixed block 10 is installed on the first fixed block 10 in a threaded screwing manner, and the second manual bolt 14 is installed on the second fixed block 11 in a threaded screwing manner. After the above scheme is adopted, when the relative position of the steel mesh sleeve frame 23 and the rotating disc 3 needs to be fixed during use, the operator first passes the mounting rod 12 through the mounting holes of the first fixed block 10 and the second fixed block 11 in sequence, and ensures that the center axes of the three coincide; then, the first manual bolt 13 is tightened to tightly abut against the mounting rod 12, which limits the axial movement freedom of the mounting rod 12 in the first fixed block 10, thereby preliminarily fixing the position of the steel mesh sleeve frame 23 relative to the mounting rod 12; then, the second manual bolt 14 is tightened to tightly abut against the mounting rod 12, further enhancing the fixing effect of the mounting rod 12 in the second fixed block 11, and at the same time, the relative position between the rotating disc 3 and the steel mesh sleeve frame 23 is stabilized. This double fixing mode effectively ensures that the steel mesh sleeve frame 23 and the rotating disc 3 will not relatively displace due to external force during subsequent processing or operation, thereby ensuring the stability of the entire equipment operation and the processing precision. In addition, the initial position of the steel mesh sleeve frame 23 can be adjusted by the first manual bolt 13 and the second manual bolt 14, and the steel mesh sleeve frame 23 can be conveniently disassembled, so that different steel mesh sleeve frames 23 can be replaced according to different ball planting requirements.

[0048] Preferably, the first fixed block 10 and the second fixed block 11 are made of metal. Figures 1-4 In the embodiment shown, the first fixed block 10, the second fixed block 11, the mounting rod 12, the first manual bolt 13 and the second manual bolt 14 are all relatively symmetrically distributed with two, and after the above scheme is adopted, in use, such symmetrical design greatly enhances the stability and reliability of the connection between the steel mesh sleeve frame 23 and the rotating disc 3.

[0049] Preferably, the first fixed block 10 and the second fixed block 11 are made of metal. Figures 1-5As shown, in the embodiment, the positioning mechanism 9 is used for positioning the rotating position of the rotating disc 3, and the positioning mechanism 9 is matched with the mounting rod 12 and comprises a double-shaft air cylinder 91, a positioning block 92 and a rubber block 93, the double-shaft air cylinder 91 is fixed to the top surface of the packaging platform 1, the positioning block 92 is fixed to the top end of the piston rod of the double-shaft air cylinder 91, and the rubber block 93 is fixedly bonded to the outer wall of the positioning block 92.

[0050] Secondly, the rubber block 93 can play a buffering role, so as to avoid damage to the mounting rod 12 caused by rigid collision.

[0051] Preferably, the rubber block 93 is made of rubber. Figure 1 As shown, in the embodiment, the support column 5 is diagonally arranged in four, so that the top plate 4 can be more stably supported.

[0052] It should be noted that the servo motor 7, the vertical air cylinder 8 and the double-shaft air cylinder 91 are all commercially available conventional devices, and the built-in power switch can be selected by a person skilled in the art according to the use requirement, the working principle thereof is well known to a person skilled in the art and has been fully disclosed in the prior art, and thus will not be described in detail herein.

[0053] The circuit connection of the utility model relates to a common means adopted by a person skilled in the art, and a technical inspiration can be obtained through a limited number of tests, and belongs to the prior art.

[0054] The components not described in detail herein are the prior art.

[0055] The working principle and use process of the utility model are as follows: in use, the semiconductor chip, the tin paste and the tin ball are all fed by using a special conveying device, the tin paste as a flux helps the tin ball to be firmly welded on the welding point of the semiconductor chip.

[0056] In the ball planting, the semiconductor chip to be planted is placed in the placing groove 221, then the vertical air cylinder 8 is started to pull the rotating disc 3 to rise, so that the steel mesh sleeve frame 23 rises, then the servo motor 7 is started to drive the rotating disc 3 to rotate, so that the steel mesh sleeve frame 23 is rotated to the upper side of the mold core 22, then the vertical air cylinder 8 is started to drive the rotating disc 3 to descend, so that the steel mesh sleeve frame 23 contacts the mold core 22.

[0057] The tin paste is coated on the soldering points of the semiconductor chip first, and then the next steel mesh sleeve frame 23 is transferred in the same way as mentioned above, the tin balls are transported into the steel mesh sleeve frame 23, and the tin balls are planted on the soldering points of the semiconductor chip;

[0058] The utility model discloses a servo motor 7 drive rotary disc 3 rotates, and the different steel mesh sleeve frame 23 is switched, and is matched with vertical cylinder 8, is used for realizing the alignment of steel mesh sleeve frame 23 and mould core 22, under the premise of guaranteeing alignment accuracy, has improved production efficiency greatly, satisfies the production demand of batch, is favorable to enterprise income,

[0059] In another aspect of the utility model, when the rotating position of rotary disc 3 needs to be controlled and positioned accurately, double-shaft cylinder 91 will start to work, when mounting rod 12 is close to positioning mechanism 9, double-shaft cylinder 91 starts, and its drive positioning block 92 rises, and mounting rod 12 is positioned by positioning block 92, when mounting rod 12 hits positioning block 92, rotary disc 3 cannot continue to rotate, and this position is the best alignment position.

[0060] Finally, it should be noted that: the above only for the preferred embodiment of the utility model has been described, and is not used to limit the utility model, although the utility model is described in detail with reference to the foregoing embodiment, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part technical features. Any modification, equivalent replacement, improvement etc. that is made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A high-precision automatic alignment device for semiconductor packaging equipment, comprising a packaging platform (1) and a packaging assembly (2) disposed on the top of the packaging platform (1), the packaging assembly (2) comprising a lower mold base (21), a mold core (22) fixed to the top of the lower mold base (21), and a steel mesh frame (23) located above the lower mold base (21), wherein the top surface of the steel mesh frame (23) has an upper groove (231) and a mesh hole (232) is provided in the upper groove (231), and the top surface of the mold core (22) has a placement groove (221), characterized in that, Also include: Rotary disc (3), the rotary disc (3) is rotatably arranged above the packaging platform (1), a plurality of steel mesh sleeve frame (23) is fixed on the rotary disc (3) in the circumferential direction equally spaced; Top plate (4), the top plate (4) is supported and fixed on the top of the packaging platform (1) by support column (5), the rotary disc (3) is located directly below the top plate (4); Motor frame (6), the motor frame (6) is located directly below the top plate (4), the rotary disc (3) is rotatably connected to the motor frame (6); Servo motor (7), the servo motor (7) is fixed in the motor frame (6), used for driving the rotary disc (3) to rotate; Vertical cylinder (8), the vertical cylinder (8) is fixed on the top of the top plate (4), and the piston rod of the vertical cylinder (8) penetrates through the top plate (4) and is fixedly connected with the motor frame (6).

2. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 1, characterized in that: The bottom surface of the steel mesh sleeve frame (23) has a lower embedding groove (233), and the mold core (22) is embedded in the lower embedding groove (233).

3. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 1, characterized in that: A bevel chamfer (222) is processed at the top edge of the mold core (22).

4. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 1, characterized in that: Also include: Positioning pin (211), the positioning pin (211) is fixed to the top surface of the lower die seat (21), and the positioning hole (234) is provided on the steel mesh sleeve frame (23) for embedding the positioning pin (211).

5. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 1, characterized in that: Also include: No. 1 fixed block (10), the no. 1 fixed block (10) is fixed to the top surface of the steel mesh sleeve frame (23); No. 2 fixed block (11), the no. 2 fixed block (11) is fixed to the top surface of the rotary disc (3); Mounting rod (12), the mounting rod (12) penetrates through the no. 1 fixed block (10) and the no. 2 fixed block (11); No. 1 manual bolt (13), the no. 1 fixed block (10) is installed on the no. 1 fixed block (10) by threaded screwing; No. 2 manual bolt (14), the no. 2 manual bolt (14) is installed on the no. 2 fixed block (11) by threaded screwing.

6. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 5, characterized in that: The no. 1 fixed block (10), the no. 2 fixed block (11), the mounting rod (12), the no. 1 manual bolt (13) and the no. 2 manual bolt (14) are all relatively symmetrical and distributed with two.

7. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 6, characterized in that: Also include positioning mechanism (9), the positioning mechanism (9) cooperates with the mounting rod (12), used for positioning the rotary position of the rotary disc (3), and the positioning mechanism (9) comprises: Double shaft air cylinder (91), the double shaft air cylinder (91) is fixed to the top surface of the packaging platform (1); Positioning block (92), the positioning block (92) is fixed to the top end of the piston rod of the double shaft air cylinder (91); Rubber block (93), the rubber block (93) is adhesively fixed to the outer wall of the positioning block (92).

8. The high-precision auto-alignment device for semiconductor packaging equipment according to claim 1, characterized in that: The support column (5) is diagonally distributed with four.

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