Grid array packaging clamp and communication module
By wrapping the fixture probes with a grounding layer and using an insulating layer, the problem of poor contact during LGA packaging was solved, improving RF performance and production yield.
Patent Information
- Application Number
- CN202520137268.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2035-01-20
AI Technical Summary
During the mass production of LGA packages, the small contact area of the fixture probes leads to calibration line loss and unstable RF performance, affecting the production yield of communication modules.
A grounding coating is wrapped around the clamp probe to increase the contact area and improve grounding contact stability. An insulating layer and a telescopic antenna probe head are used to ensure stable contact.
It improves the stability of the radio frequency performance and production yield of the communication module, reduces production line defects caused by poor ground contact, and does not significantly increase costs.
Smart Images
Figure CN223810124U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of communication, in particular to a Land Grid Array (LGA) clamp and a communication module. BACKGROUND
[0002] With the development of the technology field, the use of module type electronic devices is becoming more and more popular. The LGA (Land Grid Array) communication module provides obvious convenience in use, but in the scenario of mass production, the probe contact area of the clamp is small and unstable in the production process of the LGA package, which can easily cause calibration line loss, thereby causing line defects, and thus greatly affecting the radio frequency performance of the produced communication module. CONTENT OF THE UTILITY MODEL
[0003] The present application provides a Land Grid Array (LGA) clamp and a communication module.
[0004] The LGA clamp according to the embodiments of the present application comprises a clamp main body and a clamp probe fixedly connected to the clamp main body, and the clamp probe is provided with a grounding cladding layer.
[0005] The clamp probe is configured to cooperate with a target package circuit to improve the radio frequency performance stability of the target package circuit by increasing the contact area of the grounding.
[0006] In some embodiments, the clamp probe comprises an antenna probe head, the grounding cladding layer insulatingly clads the outer side surface of the antenna probe head, and the grounding cladding layer is configured to contact the target package circuit to expand the contact area of the grounding region.
[0007] In some embodiments, the clamp probe further comprises an insulating layer, which is arranged between the antenna probe head and the grounding cladding layer, and the insulating layer is filled with a predetermined insulating material.
[0008] In some embodiments, the insulating material comprises insulating rubber, insulating plastic, glass and / or insulating ceramic.
[0009] In some embodiments, the antenna probe head is in corresponding contact with a target pad of the target package circuit.
[0010] In some embodiments, the antenna probe head is configured to support telescopic extension to enable the target pad to be in sufficient contact with the grounding cladding layer during the packaging process of the target package circuit.
[0011] In some embodiments, a plurality of the clamp probes are linearly distributed on the clamp main body.
[0012] In some embodiments, the plurality of clamp probes are distributed in a grid pattern on the clamp body.
[0013] In some embodiments, the clamp body is provided with a probe accommodating hole, and the clamp probe is arranged in the probe accommodating hole.
[0014] Thus, the grid array package clamp in the embodiments of the present application is provided with a grounding layer around the clamp probe, so that the contact area between the clamp probe and the corresponding communication module can be increased, and the stability of the grounding contact between the communication module and the LGA clamp can be improved, the radio frequency performance of the target package circuit can be kept stable during the packaging process, the production pass rate of the target package circuit is improved, and the phenomenon of line defects caused by poor grounding contact can be effectively reduced without significantly increasing the production cost, thereby improving the yield of the target package circuit in the production line.
[0015] The communication module in the embodiments of the present application is obtained by packaging based on the above-mentioned grid array package clamp.
[0016] Additional aspects and advantages of the embodiments of the present application will be in part apparent and in part pointed out hereinafter in the description of the embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The above-mentioned and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
[0018] Figure 1 FIG. 1 is a schematic view of the appearance of a grid array package clamp in the embodiments of the present application;
[0019] Figure 2 FIG. 3 is a schematic view of the structure of a clamp probe in the embodiments of the present application;
[0020] Figure 3 FIG. 5 is a schematic view of a second appearance of a grid array package clamp in the embodiments of the present application.
[0021] In the drawings: 10, grid array package clamp; 11, clamp body; 12, clamp probe; 121, antenna probe head; 122, grounding cladding layer; 123, insulating layer; 13, probe accommodating hole. DETAILED DESCRIPTION
[0022] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the embodiments of the present application, and cannot be understood as limiting the embodiments of the present application.
[0023] Referring to Figure 1 The grid array package clamp 10 in the embodiments of the present application comprises a clamp body 11 and clamp probes 12 fixedly connected to the clamp body 11, and the clamp probes 12 are provided with a grounding cladding layer 122.
[0024] The clamp probes 12 are configured to cooperate with a target package circuit, and the radio frequency performance stability of the target package circuit is improved by increasing the contact area of grounding.
[0025] Specifically, referring to Figure 1 , Figure 1 The clamp body 11 in the grid array package clamp 10 and the clamp probes 12 provided on the clamp body 11 are shown. Among them, Figure 1 The clamp body 11 shown in the above embodiment is the bearing body part of the grid array package clamp 10. It should be pointed out that the main part for clamping the package in the above clamp is not shown, and the main part for clamping the package and the above bearing body can be connected in a hinged or other connection mode that can realize the opening and closing clamping. In addition, the main part for clamping the package and the above bearing body can also be configured as a split body. When packaging the target package circuit, the main part for clamping the package cooperates with the bearing body to clamp the target package circuit, and when idle, the two are separated into two independent parts.
[0026] Further, a plurality of clamp probes 12 are fixedly provided on the clamp body 11. During the process of packaging the circuit by using the above grid array package clamp 10, the clamp probes 12 are in contact with the target package circuit. The above contact is generally realized by the corresponding contact between the clamp probes 12 and each target pad on the target package circuit. However, since the contact between the clamp probes 12 and the target pad is generally point contact, it is easy to cause poor grounding contact. Then, the probability of the target package circuit appearing calibration line loss in the above packaging process will also increase, which will further cause a relatively large negative impact on the radio frequency performance of the target package circuit during the packaging process, and finally affect the production through rate and yield rate of the target package circuit.
[0027] Exemplarily, the ground coating layer 122 is arranged on the clamp probe 12 in the grid array package clamp 10 of the embodiment of the present application. The ground coating layer 122 is generally wrapped on the outermost layer of the clamp probe 12 and has a certain thickness, so that the area of the ground coating layer 122 covering on the clamp main body 11 is much larger than the contact area of the tip of the clamp probe 12 and the target pad on the target package circuit. The main function is to expand the contact area of the ground contact when the target pad and the clamp probe 12 are in contact, so as to improve the ground contact between the clamp probe 12 and the target pad. In the case that the ground contact between the clamp probe 12 and the target pad can be kept normal, the radio frequency performance of the target package circuit can be kept stable during the packaging process, and on this basis, the production yield of the target package circuit can be improved. Without significantly increasing the cost, the phenomenon of line failure caused by poor ground contact can be effectively reduced, thereby improving the yield of the target package circuit in the production line.
[0028] Thus, the grid array package clamp 10 in the embodiment of the present application is provided with a ground layer around the clamp probe 12, so as to increase the ground contact area between the clamp probe 12 and the corresponding target package circuit, and further improve the stability of the ground contact between the target package circuit and the grid array package clamp 10. On the basis that the radio frequency performance of the target package circuit can be kept stable during the packaging process, the production yield of the target package circuit can be improved. Without significantly increasing the cost, the phenomenon of line failure caused by poor ground contact can be effectively reduced, thereby improving the yield of the target package circuit in the production line.
[0029] Please refer to Figure 2 In some embodiments, the clamp probe 12 includes an antenna probe head 121, the ground coating layer 122 insulatingly coats the outer side of the antenna probe head 121, and the ground coating layer 122 is configured to contact the target package circuit to expand the contact area of the ground contact area.
[0030] Further, in some embodiments, the clamp probe 12 further includes an insulating layer 123 arranged between the antenna probe head 121 and the ground coating layer 122, and the insulating layer is filled with a predetermined insulating material.
[0031] In some embodiments, the insulating material includes insulating rubber, insulating plastic, glass and / or insulating ceramic.
[0032] In addition, in some embodiments, the antenna probe head 121 is in corresponding contact with the target pad of the target package circuit.
[0033] In some embodiments, the antenna probe head 121 is configured to support telescoping to allow the target pad to be in sufficient contact with the ground cover layer 122 during the packaging process of the target packaging circuit.
[0034] In some embodiments, the jig body 11 is provided with a probe accommodating hole 13, and the jig probe 12 is configured in the probe accommodating hole 13.
[0035] Specifically, on the basis of the above-mentioned embodiments, in order to achieve the purpose of expanding the ground contact area in the above-mentioned embodiments, in some examples, the jig probe 12 at least includes the above-mentioned ground cover layer 122 and the antenna probe head 121 two parts, wherein the antenna probe head 121 is provided with a tip that contacts the target pad in the target packaging circuit, and the tip of the antenna probe head 121 directly contacts the target pad during the packaging process. Further exemplarily, the ground cover layer 122 covers the outer side of the antenna probe head 121, while the tip of the antenna probe head 121 is exposed outside the ground cover layer 122, which facilitates the antenna probe head 121 to maintain a contact relationship with the target pad. For details, please refer to Figure 2 The structure of the jig probe 12 is shown. The above-mentioned antenna probe head 121 is a radio frequency signal pin, which maintains contact with the target pad to ensure the radio frequency performance of the target packaging circuit during the packaging process.
[0036] It should be noted that, in order to ensure the correctness and sufficiency of the ground contact during packaging, exemplarily, the above-mentioned antenna probe head 121 and the ground cover layer 122 need to maintain insulation. For the way to achieve the above-mentioned insulation, such as spacing the antenna probe head 121 and the ground cover layer 122, keeping the antenna probe head 121 and the ground cover layer 122 spaced apart by air to achieve insulation.
[0037] In addition, in order to further improve the insulation between the antenna probe head 121 and the ground cover layer 122, and avoid the air between the antenna probe head 121 and the ground cover layer 122 being punctured in some extreme cases to cause insulation failure, exemplarily, an insulation layer 123 is provided between the antenna probe head 121 and the ground cover layer 122, and the insulation layer 123 is filled with a predetermined insulation material. The above-mentioned insulation material is generally solid or liquid, and considering the convenience of using the grid array packaging jig 10, the above-mentioned insulation material is preferably solid, such as insulating rubber, insulating plastic, glass, insulating ceramic, etc. For details, please refer to Figure 2 , Figure 2The antenna probe head 121, the insulating layer 123 and the ground covering layer 122 are coaxially arranged, the tip of the antenna probe head 121 is exposed outside the ground covering layer 122, the ground covering layer 122 covers the outer side of the antenna probe head 121, and the insulating layer 123 is arranged between the outer side of the antenna probe head 121 and the ground covering layer 122.
[0038] In addition, exemplarily, in order to ensure the contact of the tip of the antenna probe head 121 with the target pad on one hand, and to maintain the stable grounding contact of the target packaging circuit on the other hand, the antenna probe head 121 is supported to be telescopic in the axial direction thereof, and when the grid array packaging clamp 10 is in the idle state, the antenna probe head 121 is exposed to the maximum extent outside the ground covering layer 122, so that the antenna probe head 121 can be in correct contact with the corresponding target pad when the packaging process of the target packaging circuit starts. During the packaging process of the target packaging circuit, the antenna probe head 121 is compressed in the axial direction thereof when the antenna probe head 121 contacts the target pad and is pressed by the target packaging circuit and the main body part of the clamp main body 11 for clamping the packaging, so that the target pad can approach the ground covering layer 122 and finally maintain sufficient contact with the ground covering layer 122.
[0039] Further exemplarily, the clamp main body 11 is provided with a probe accommodating hole 13, each clamp probe 12 is arranged in the probe accommodating hole 13, and the probe accommodating hole 13 provides space for the telescopic extension of the antenna probe head 121 and the arrangement of the ground covering layer 122 and the insulating layer 123. The antenna probe head 121 is supported to be telescopic in the axial direction thereof, and when the grid array packaging clamp 10 is in the idle state, the antenna probe head 121 is exposed to the maximum extent outside the ground covering layer 122, so that the tip of the antenna probe head 121 is exposed outside the probe accommodating hole 13. During the packaging process of the target packaging circuit, the antenna probe head 121 is compressed in the axial direction thereof and returns to the probe accommodating hole 13 when the antenna probe head 121 contacts the target pad and is pressed by the target packaging circuit and the main body part of the clamp main body 11 for clamping the packaging, so that the target pad can approach the ground covering layer 122 and finally maintain sufficient contact with the ground covering layer 122. For details, please refer to Figure 1 , Figure 1 The ground covering layer 122, the insulating layer 123 and the antenna probe head 121 are arranged in the probe accommodating hole 13, and the tip of the antenna probe head 121 is exposed outside the probe accommodating hole 13 when the antenna probe head 121 is exposed to the maximum extent outside the ground covering layer 122.
[0040] Please refer to Figure 1 In some embodiments, the plurality of clamp probes 12 are linearly distributed on the clamp main body 11.
[0041] Further, please refer to Figure 3 In some embodiments, the plurality of clamp probes 12 are arranged in a grid pattern on the clamp body 11.
[0042] Specifically, in order to adapt to various target package circuits, the distribution of the clamp probes 12 on the clamp body 11 is also various. For example, for a target package circuit in which the target pads are arranged in a straight line, the corresponding clamp probes 12 on the clamp body 11 can be arranged in a corresponding straight line distribution. Please refer to Figure 1 , Figure 1 In the clamp body 11 shown in Figure 1 It can be known that the points corresponding to the axes of the clamp probes 12 are on the straight line in the top view. It should be noted that Figure 1 In
[0043] Further, for example, in order to adapt to more types of target package circuits, the clamp probes 12 on the clamp body 11 can also be arranged in a grid pattern. Please refer to Figure 3 , Figure 3 In the clamp body 11 shown in Figure 3 It can be known that the points corresponding to the axes of the clamp probes 12 are on the grid in the top view. It should be noted that Figure 3 In Figure 3 In the clamp body 11 shown in Figure 1 The target pad distribution that can be supported by the clamp body 11, thereby effectively expanding the target pad distribution that can be supported by the grid array package clamp 10.
[0044] The communication module in the embodiments of the present application is obtained by packaging the above-mentioned grid array package clamp 10.
[0045] In the description of the specification, the description using the terms "certain embodiments", "one example", "exemplarily", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Also, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples, without contradiction.
[0046] The scope of the preferred embodiments of the present application includes additional implementations, in which functions can be performed in an order different from that shown or discussed, including in a substantially simultaneous manner or in the reverse order, in accordance with the functions involved, as would be understood by one skilled in the art to which the embodiments of the present application belong.
[0047] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, substitutions and variations to the above-described embodiments within the scope of the present application.
Claims
1. A grid array packaging fixture, characterized in that, The clamp comprises a clamp body and a plurality of clamp probes fixedly connected to the clamp body, the clamp probes being provided with a grounding cladding layer; The clamp probes are configured to cooperate with a target package circuit, and the radio frequency performance stability of the target package circuit is improved by increasing the contact area of the grounding.
2. The clamp of claim 1, wherein The clamp probes comprise an antenna probe head, and the grounding cladding layer is insulatively cladded to the outer side of the antenna probe head, and the grounding cladding layer is configured to expand the grounding contact area of the target package circuit.
3. The clamp of claim 2, wherein The clamp probes further comprise an insulating layer, which is arranged between the antenna probe head and the grounding cladding layer, and the insulating layer is filled with a preset insulating material.
4. The clamp of claim 3, wherein The insulating material comprises insulating rubber, insulating plastic, glass and / or insulating ceramic.
5. The clamp of claim 3, wherein In the packaging process of the target package circuit, the antenna probe head is in corresponding contact with a target pad of the target package circuit.
6. The clamp of claim 5, wherein, The antenna probe head is configured to support telescopic extension, so that the target pad is in sufficient contact with the grounding cladding layer in the packaging process of the target package circuit.
7. The clamp of any one of claims 1-6, wherein, A plurality of the clamp probes are linearly distributed on the clamp body.
8. The clamp of any one of claims 1-6, wherein, A plurality of the clamp probes are grid-like distributed on the clamp body.
9. The clamp of any one of claims 1-6, wherein, The clamp body is provided with a probe accommodating hole, and the clamp probes are configured in the probe accommodating hole.
10. A communication module, characterized in that The communication module is obtained based on the grid array package clamp according to any one of claims 1-9.