Novel module packaging structure with PCB

Abstract

The utility model discloses a novel module packaging structure with a PCB, comprising a PCB, a plurality of power devices mounted on the surface of the PCB, a signal loop arranged on the surface of the PCB, a driving clamping part mounted on the surface of the signal loop, a signal terminal connected with the driving clamping part, the signal terminal arranged on the PCB, a capacitor mounted on the surface of the PCB, and a capacitor connected with the capacitor. Thin copper layers are installed on the upper side and the lower side in the PCB, and wiring of a power loop is achieved between the thin copper layers on the upper side and the lower side. Power devices in traditional packaging are arranged on the PCB in a single-tube surface-mounted device mode, the surface layer of the PCB is used for wiring of a signal loop, meanwhile, an MOS in a driving clamp can be arranged on the surface of the PCB through the surface-mounted technology so that more accurate driving can be achieved, two thin copper layers in the PCB are used for wiring of a power loop, and therefore the reliability of the PCB is improved. The PCB can realize internal double-layer wiring, so that the size of the module is more compact, and meanwhile, the laminated wiring can effectively reduce loop inductance.

Description

TECHNICAL FIELD

[0001] The utility model belongs to power module technical field, concretely relates to a novel module package structure with PCB. BACKGROUND

[0002] Power module (Power Module) is the power switch device, such as insulated gate bipolar transistor (IGBT), metal-oxide semiconductor field effect transistor (MOSFET), fast recovery diode (FWD) are encapsulated into a module whole, through the external gate circuit board and control unit, complete direct current / alternating current both sides conversion, utilize battery or other energy drive motor operation.The module that realizes current conversion can be single switch, half bridge and three-phase six units, and the package structure is responsible for providing the mechanical support required for power module, electrical insulation, heat dissipation channel, guaranteeing the high current, high power and high reliability of power chip.

[0003] In the package of power module, the loop inductance of module is a very important parameter, and excessive loop inductance can cause the peak voltage of module to be too high in switching process and damage the module.

[0004] In the traditional power module package, as shown in the drawing, the standard package of ceramic backing plate is adopted, the chip is placed on the upper copper layer of ceramic backing plate, the wiring in the module is realized through the upper copper layer and wire bonding, the power loop and signal loop are led out through the power terminal and signal terminal respectively, and the ceramic in the backing plate is used for the insulation between the upper and lower copper layers, and the lower copper layer is used for connecting with the heat sink and conducting heat. Figure 1

[0005] However, the ceramic backing plate has only one wiring loop for the wire of power loop, and other signal loops need to be realized through wire bonding, and the copper layer of ceramic backing plate needs to be etched to realize the wiring, and the etching of ceramic backing plate is limited in shape and etching width, which affects the arrangement of the whole wiring, and the above two points determine that the loop inductance of the traditional power module using ceramic backing plate is relatively large, which affects the switching action of the module, and due to the difficulty in arranging the wiring of ceramic backing plate, it is difficult to integrate the drive loop in the module. UTILITY MODEL CONTENTS

[0006] In view of the problems in the above background art, the utility model aims to provide a novel module package structure with PCB.

[0007] To achieve the above technical purpose, the utility model adopts the following technical scheme:

[0008] ​The utility model provides a novel module packaging structure with PCB, including PCB board, the surface of the PCB board is surface mounted with a plurality of power devices, the surface of the PCB board is equipped with signal loop, the surface of the signal loop is surface mounted with drive clamping part, the drive clamping part is connected with signal terminal, the signal terminal is installed on the PCB board, the surface of the PCB board is surface mounted with electric capacity, the inside of the PCB board is installed with thin copper layer on the two sides, the thin copper layer between the two sides is used for realizing the wire of power loop.

[0009] Further limit, the two sides of the PCB board are equipped with mounting hole. Such structure design is convenient for the connection and installation of the PCB board and radiator.

[0010] Further limit, the bottom of the power device is inlaid with thick copper of the PCB board. Such structure design realizes the heat dissipation of the power device.

[0011] Further limit, the electric capacity is arranged between the positive and negative of the whole loop. Such structure design reduces the inductance of the whole loop.

[0012] The utility model discloses a novel module packaging structure with PCB, which arranges power devices in the form of single-pipe surface-mounted devices on a PCB board in traditional packaging, and the number of power devices is determined according to the flow capacity of the module. The surface layer of the PCB board is used for the wire of the signal loop, and traditional wire bonding is not needed. Meanwhile, the MOS in the drive clamp can also be placed on the surface of the PCB board through the surface mounting process to realize more accurate driving. The two thin copper layers inside the PCB board are used for the wire of the power loop. The double-layer wire inside the PCB board can make the size of the module more compact, and the wire of the laminated layer can also effectively reduce the inductance of the loop. To further reduce the inductance of the loop, a capacitor is arranged between the positive and negative terminals. To solve the heat dissipation problem of the surface-mounted power devices on the surface of the PCB board, thick copper is embedded under the power devices to connect with the radiator to realize the heat dissipation of the power devices. BRIEF DESCRIPTION OF DRAWINGS

[0013] The utility model can be further illustrated by the non-limiting embodiments shown in the drawings.

[0014] Figure 1 It is a schematic diagram of the existing power module packaging structure.

[0015] Figure 2 It is a schematic diagram of the axial side structure of the novel module packaging structure with PCB according to the embodiment of the utility model.

[0016] Figure 3 It is a schematic diagram of the internal structure of the novel module packaging structure with PCB according to the embodiment of the utility model.

[0017] The symbols for the main components are explained below:

[0018] PCB board 1, power devices 2, signal circuits 3, signal terminals 4, capacitors 5, thin copper layer 6, mounting holes 7, thick copper 8. Detailed Implementation

[0019] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] like Figures 2-3 As shown, this utility model discloses a novel modular packaging structure with a PCB. Several power devices 2 are mounted on the surface of the PCB board 1. A signal circuit 3 is provided on the surface of the PCB board 1. A drive clamping component is mounted on the surface of the signal circuit 3. The drive clamping component is connected to a signal terminal 4. The signal terminal 4 is mounted on the PCB board 1. A capacitor 5 is mounted on the surface of the PCB board 1. Thin copper layers 6 are installed on the upper and lower sides inside the PCB board 1. The traces of the power circuit are implemented between the upper and lower thin copper layers 6.

[0021] Preferably, mounting holes 7 are provided on both sides of the PCB board 1. This structural design facilitates the connection and installation of the PCB board 1 with the heat sink. In practice, other mounting structure shapes of the PCB board 1 can also be considered depending on the specific circumstances.

[0022] Preferably, a thick copper plate 8 is embedded and mounted on the bottom of the power device 2 on the PCB board 1. This structural design is intended to achieve heat dissipation for the power device 2. In practice, other heat dissipation structures of the anti-jump mount 2 can also be considered depending on the specific circumstances.

[0023] Preferably, capacitor 5 is positioned between the positive and negative terminals of the entire circuit. This structural design reduces the overall circuit inductance. However, other mounting configurations for capacitor 5 can also be considered depending on the specific circumstances.

[0024] In this embodiment, power devices 2 are mounted on the surface of PCB board 1. The power devices 2 are arranged on PCB board 1 in the form of single-tube surface-mount devices, forming the core structure of the module. The number of power devices 2 is determined according to the outflow capacity of the module. Signal traces are made on the surface of PCB board 1, and signal loops 3 are set up. At the same time, a drive clamping component is surface-mounted and led out through signal terminals 4. Surface-mount capacitors 5 on the surface of PCB board 1 are placed between the positive and negative terminals of the entire loop to reduce the inductance of the entire loop. The upper and lower thin copper layers 6 inside PCB board 1 are used to realize the power loop traces. The two layers of traces have a limited area overlap to reduce the inductance of the entire loop. The power loop is led out through the surface-mount power devices 2. Thick copper 8 is embedded under the surface-mount power devices 2 inside PCB board 1 to realize the heat dissipation of the surface-mount power devices 2. Mounting holes are provided at both ends of PCB board 1 to realize the connection between the module and the heat sink.

[0025] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed by the present application should be covered by the claims of the present application.

Claims

1. A novel module package structure with PCB, characterized in that: The PCB board (1) is provided with a plurality of power devices (2) mounted on the surface thereof, a signal loop (3) is arranged on the surface of the PCB board (1), a driving clamping component is mounted on the surface of the signal loop (3), a signal terminal (4) is connected to the driving clamping component, the signal terminal (4) is mounted on the PCB board (1), a capacitor (5) is mounted on the surface of the PCB board (1), and thin copper layers (6) are arranged on the upper and lower sides of the PCB board (1), and wires for realizing a power loop are arranged between the thin copper layers (6) on the upper and lower sides.

2. The novel module package structure with PCB according to claim 1, characterized in that: Mounting holes (7) are arranged on the two sides of the PCB board (1).

3. The novel module package structure with PCB according to claim 2, characterized in that: Thick copper (8) is inlaid and mounted on the bottom of the power device (2).

4. The novel module package structure with PCB according to claim 3, characterized in that: The capacitor (5) is arranged between the positive and negative of the entire loop.

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