Spraying device

Abstract

The utility model discloses a spraying device, and belongs to the technical field of wafer production and processing. The spraying device comprises a bearing seat, a coater and a guide part, wherein the bearing seat is used for placing a wafer; the coater is movably arranged above the bearing seat in the first horizontal direction, a containing cavity used for containing a coating solution is formed in the coater, and the containing cavity is provided with a downward nozzle; and the guide piece is connected with the coater and is positioned below the nozzle, so that the coating solution obliquely flows to the wafer after passing through the guide piece. By arranging the coater moving relative to the wafer and the guide piece changing the flow direction of the coating solution, the utilization rate of the coating solution can be increased, the processing and maintenance cost is reduced, and the coating quality is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wafer production and processing, and particularly relates to a spraying device. BACKGROUND

[0002] In the wafer production process, a coating device is often used to form a uniform thin film of photoresist on the wafer surface to improve the electrical properties of the wafer. However, the current coating method is to spray liquid from a single center point and cooperate with wafer rotation, which leads to the technical problems of low liquid utilization rate, defects at the center of the wafer, high equipment cost and high maintenance difficulty. CONTENT OF THE INVENTION

[0003] The application aims to at least solve one of the technical problems in the prior art. To this end, the application provides a spraying device, which can improve the utilization rate of the coating solution, reduce the processing and maintenance costs, and improve the coating quality by setting a coating applicator moving relative to the wafer and a guide member changing the flow direction of the coating solution.

[0004] In a first aspect, the application provides a spraying device, comprising:

[0005] a carrier seat for placing a wafer;

[0006] a coating applicator movably arranged above the carrier seat along a first horizontal direction, the coating applicator forming a containing cavity for containing a coating solution, and the containing cavity having a downward nozzle;

[0007] a guide member connected with the coating applicator and located below the nozzle, so that the coating solution flows obliquely to the wafer after passing through the guide member.

[0008] According to the spraying device of the application, on the one hand, only the relative movement of the coating applicator along the first horizontal direction relative to the wafer is needed, so that the coating solution can be uniformly sprayed to all parts of the wafer, reducing the waste of the coating solution while improving the coating quality, and reducing the processing cost and maintenance difficulty; on the other hand, the downward flow of the coating solution from the nozzle is guided by the guide member to flow obliquely to the wafer surface, which can better cover the wafer while reducing the impact force on the wafer, and can also reduce the uneven falling of the coating solution due to the surface tension of the coating solution, thereby improving the coating quality.

[0009] According to one embodiment of the application, the top surface of the guide member has a guide surface, the projection of the nozzle in the up-down direction is located in the guide surface, and the guide surface and the bottom end of the coating applicator are connected at an obtuse angle.

[0010] According to one embodiment of the application, the guide member forms a guide groove with an upward notch, the guide groove extends along the first horizontal direction, and the guide surface is the groove bottom of the guide groove.

[0011] According to an embodiment of the present application, the mounting angle between the guide and the coater is adjustable.

[0012] According to an embodiment of the present application, a plurality of the nozzles are provided, and the plurality of nozzles are arranged in a second horizontal direction, and the first horizontal direction and the second horizontal direction intersect.

[0013] According to an embodiment of the present application, the guide forms a plurality of guide grooves, and the guide grooves and the nozzles correspond one by one.

[0014] According to an embodiment of the present application, further comprising:

[0015] A connecting member, the coater and the guide are arranged on the same side of the connecting member arranged in the first horizontal direction, and the coater is close to the upper part of the connecting member, and the guide is close to the lower part of the connecting member.

[0016] According to an embodiment of the present application, further comprising:

[0017] A position sensor arranged on the coater, for obtaining the position information of the coater.

[0018] According to an embodiment of the present application, further comprising:

[0019] A flow sensor arranged on the coater, for obtaining the spraying amount of the nozzle.

[0020] According to an embodiment of the present application, further comprising:

[0021] A linear drive member, the fixed end of the linear drive member is arranged on the machine table;

[0022] A support above the bearing seat, the support is connected with the coater, and the driving end of the linear drive member is connected with the support, for driving the support to move in the first horizontal direction.

[0023] Additional aspects and advantages of the present application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0025] Figure 1 is a schematic view of the structure of the coater provided by the embodiment of the present application in the process of spraying the wafer;

[0026] Figure 2is a structural schematic diagram of a spraying device provided by an embodiment of the present application;

[0027] Figure 3 is one of structural schematic diagrams of a spraying device provided by an embodiment of the present application;

[0028] Figure 4 is another structural schematic diagram of a spraying device provided by an embodiment of the present application.

[0029] Reference signs:

[0030] 100, applicator;

[0031] 110, accommodating cavity; 120, spout;

[0032] 200, guide;

[0033] 210, guide groove;

[0034] 300, connecting piece;

[0035] 400, position sensor;

[0036] 500, flow sensor;

[0037] 600, support;

[0038] 900, wafer. DETAILED DESCRIPTION

[0039] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0040] The embodiments of the present application are described below by referring to Figures 1-4 The spraying device provided by the embodiments of the present application includes a bearing seat, an applicator 100 and a guide 200.

[0041] The bearing seat is used for placing a wafer 900. The material of the bearing seat includes but is not limited to metal. It should be noted that the shape and size of the bearing seat can be designed according to actual needs, and the embodiments of the present application do not make specific limitations thereto.

[0042] The coater 100 is movably arranged above the carrier seat along a first horizontal direction, the coater 100 forms a containing cavity 110 for containing the coating solution, and the containing cavity 110 has a downward spout 120. A guide 200 is connected to the coater 100 and located below the spout 120, so that the coating solution flows obliquely to the wafer 900 after passing through the guide 200. It should be noted that the size and shape of the containing cavity 110 and the spout 120 can be designed according to actual needs,

[0043] It can be understood that, on the one hand, only the coater 100 needs to move relative to the wafer 900 along the first horizontal direction, so that the coating solution can be uniformly sprayed everywhere on the wafer 900, reducing waste of the coating solution while improving the coating quality, and reducing processing cost and maintenance difficulty; on the other hand, through the guidance of the guide 200, the coating solution flowing downward from the spout 120 can flow obliquely to the surface of the wafer 900, which can better cover the wafer 900 while reducing the impact force on the wafer 900, and can also reduce the uneven falling of the coating solution due to the surface tension of the coating solution itself, thereby improving the coating quality.

[0044] According to the spraying device provided in the embodiments of the present application, by arranging the coater 100 to move relative to the wafer 900, and changing the flow direction of the coating solution by the guide 200, the utilization rate of the coating solution can be improved, the processing and maintenance costs can be reduced, and the coating quality can be improved.

[0045] In some embodiments, as shown in Figures 2 to 4 The top surface of the guide 200 has a guide surface, the projection of the spout 120 in the up-down direction is located in the guide surface, and the guide surface and the bottom end of the coater 100 are connected at an obtuse angle. It should be noted that the size of the obtuse angle can be designed according to actual needs, and the embodiments do not make specific limitations.

[0046] It can be understood that the projection of the spout 120 in the up-down direction is located in the guide surface, which means that the vertical projection line of the spout 120 will fall on the guide surface, which helps to ensure that the coating solution in the containing cavity 110 can be directly aligned with the guide surface after passing through the spout 120, thereby more accurately controlling the flow direction of the coating solution. At the same time, the guide surface and the bottom end of the coater 100 are connected at an obtuse angle, which helps the coating solution to form a wider coating area on the surface of the wafer 900 after passing through the guide surface, reduces the possibility of the coating solution directly impacting the center of the wafer 900, and ensures more uniform and accurate coating.

[0047] In some embodiments, as shown in Figure 3 and Figure 4As shown, the guide 200 forms a guide groove 210 with the notch facing upward, the guide groove 210 extends along the first horizontal direction, and the guide surface is the groove bottom of the guide groove 210. It should be noted that the shape and size of the guide groove 210 can be designed according to actual needs, and the present embodiment does not make specific limitations thereto. Exemplarily, the guide groove 210 is rectangular.

[0048] It can be understood that the projection of the nozzle 120 in the up-down direction is located in the guide groove 210, that is, the coating solution in the containing cavity 110 falls in the guide groove 210 after passing through the nozzle 120, and the flow direction of the coating solution is guided by the inclined arrangement of the guide groove 210, which reduces the direct impact of the coating solution on the center of the wafer 900, helps to more accurately control the flow direction and distribution of the coating solution, reduces the waste of the solution, and improves the utilization rate of the coating solution. At the same time, the design of the guide groove 210 helps to uniformly distribute the coating solution, reduces the phenomenon of glue accumulation on the surface of the wafer 900, and improves the coating quality of the wafer 900.

[0049] In some embodiments, as shown in Figure 3 and Figure 4 , the nozzle 120 is provided with a plurality of nozzles 120, and the plurality of nozzles 120 are arranged along the second horizontal direction, and the first horizontal direction and the second horizontal direction intersect. It should be noted that the number and specific distribution of the nozzles 120 can be designed according to actual needs, and the present embodiment does not make specific limitations thereto.

[0050] It can be understood that the plurality of nozzles 120 are arranged along the second horizontal direction, thereby increasing the coverage area of the coating solution during the movement of the coater 100, improving the uniformity and efficiency of the coating, and adapting to the coating requirements of wafers 900 of different sizes.

[0051] In some embodiments, as shown in Figure 3 and Figure 4 , the guide 200 forms a plurality of guide grooves 210, and the guide grooves 210 and the nozzles 120 correspond one by one.

[0052] It can be understood that the plurality of guide grooves 210 are arranged along the second horizontal direction, and the projection of each nozzle 120 in the up-down direction is located in the corresponding guide groove 210, which can accurately control the flow direction of the coating solution sprayed by each nozzle 120, helps to optimize the distribution of the coating solution on the wafer 900, and reduces the accumulation or deficiency of the coating solution on the wafer 900. At the same time, since each nozzle 120 corresponds to a separate guide groove 210, it can reduce the cross contamination of the coating solution between different nozzles 120, improve the cleanliness of the coating process, and simplify the complexity and cost of the structure of the spraying device.

[0053] In some embodiments, as shown in Figures 2 to 4As shown, the spraying device further comprises a connecting member 300, the applicator 100 and the guide member 200 are arranged on the same side of the connecting member 300 along the first horizontal direction, and the applicator 100 is close to the upper part of the connecting member 300, and the guide member 200 is close to the lower part of the connecting member 300. The connection mode between the connecting member 300 and the applicator 100 and the guide member 200 respectively includes but is not limited to threaded connection, clamping or welding and the like.

[0054] It can be understood that the connecting member 300 is used to fix the support structure of the applicator 100 and the guide member 200, so as to ensure that the two can work cooperatively. At the same time, the applicator 100 and the guide member 200 are arranged on the same side of the connecting member 300 along the first horizontal direction, so as to realize that the projection of the spray port 120 in the up-down direction can fall in the guide groove 210. In addition, the applicator 100 and the guide member 200 are sequentially and spacedly arranged on the connecting member 300 from top to bottom, so as to accommodate the coating solution in the accommodating cavity 110 to be sprayed on the wafer 900 after sequentially passing through the spray port 120 and the guide surface, which can improve the efficiency and precision of coating and reduce the occupied space of the spraying device.

[0055] In some embodiments, as shown in Figures 2 to 4 The installation included angle between the guide member 200 and the applicator 100 is adjustable.

[0056] It can be understood that by adjusting the obtuse angle formed between the guide member 200 and the bottom end of the applicator 100, the inclination angle of the coating solution flowing to the wafer 900 is changed, so as to adapt to wafers 900 of different sizes and shapes, improve the uniformity and quality of coating, and reduce the need to replace parts due to the inadaptability of the spraying device to different wafers 900, thereby reducing the maintenance cost, reducing the waste of coating solution and improving the utilization rate of materials. It should be noted that the way to realize the adjustable installation included angle includes but is not limited to the matched rotating groove and external gear ring or rotating air cylinder, etc., which is not limited in the present embodiment.

[0057] In some embodiments, as shown in Figures 2 to 4 The spraying device further comprises a position sensor 400 arranged at the applicator 100, and the position sensor 400 is used to obtain the position information of the applicator 100. That is, by providing high-precision position feedback, the moving speed and moving direction of the applicator 100 are controlled, and the coating efficiency and precision are improved.

[0058] Exemplarily, the type of the position sensor 400 includes but is not limited to photoelectric sensor, proximity sensor, capacitive sensor, inductive sensor, Hall effect sensor, ultrasonic sensor, laser ranging sensor or magnetoresistive sensor.

[0059] In the present embodiment, as shown in Figures 2 to 4 The position sensor 400 is located at the upper part of the applicator 100.

[0060] In some embodiments, as shown in Figure 2 The spraying device further comprises a flow sensor 500 arranged on the coater 100, which is used to obtain the spraying amount of the spray nozzle 120, so as to ensure uniform coating while reducing the impact on the surface of the wafer 900.

[0061] Exemplarily, the types of the flow sensor 500 include, but are not limited to, electromagnetic flow meters, ultrasonic flow meters, turbine flow meters, positive displacement flow meters, differential pressure flow meters, thermal mass flow meters, target flow meters, photoelectric flow meters, or magnetic induction flow meters, etc.

[0062] In this embodiment, as shown in Figure 2 The flow sensor 500 is arranged close to the spray nozzle 120.

[0063] In some embodiments, as shown in Figure 2 The spraying device further comprises a bracket 600 and a linear drive, the fixed end of the linear drive is arranged on the machine table; the bracket 600 is located above the bearing seat and extends along the first horizontal direction, the bracket 600 is connected with the coater 100, and the driving end of the linear drive is connected with the bracket 600, which is used to drive the bracket 600 to move along the first horizontal direction, so as to realize the relative movement of the coater 100 along the first horizontal direction with respect to the wafer 900, thereby realizing the coating of the wafer 900. The material of the bracket 600 includes, but is not limited to, metal. The linear drive includes, but is not limited to, a linear cylinder. Exemplarily, the connection mode between the bracket 600 and the coater 100 includes, but is not limited to, magnetic attraction.

[0064] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the objects before and after are in an "or" relationship.

[0065] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application.

[0066] In the description of the application, "first feature" and "second feature" can include one or more of the features.

[0067] In the description of the application, "a plurality of" means two or more.

[0068] In the description of the application, "above" or "below" the first feature of the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them.

[0069] In the description of the application, "above", "over" and "on" the first feature of the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher than the second feature in horizontal height.

[0070] In the description of the application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the description of the application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0071] Although embodiments of the application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirit of the application, and the scope of the application is defined by the claims and their equivalents.

Claims

1. A spray device, characterized in that The application relates to a coating device for a wafer, which comprises: a supporting base for placing the wafer; a coater movably arranged above the supporting base along a first horizontal direction, the coater forming a containing cavity for containing a coating solution, and the containing cavity having downward nozzles; a guide connected with the coater and located below the nozzles, so that the coating solution flows obliquely to the wafer after passing through the guide.

2. The spray device of claim 1, wherein, The top surface of the guide has a guide surface, the projection of the nozzles in the vertical direction is located in the guide surface, and the guide surface and the bottom end of the coater are connected at an obtuse angle.

3. The spray device of claim 2, wherein, The guide forms a guide groove with an upward notch, the guide groove extends along the first horizontal direction, and the guide surface is the groove bottom of the guide groove.

4. The spray device of claim 2, wherein, The mounting angle between the guide and the coater is adjustable.

5. The spray device according to any one of claims 1 to 4, characterized in that The nozzles are arranged in multiple numbers, the multiple nozzles are arranged at intervals along a second horizontal direction, and the first horizontal direction intersects with the second horizontal direction.

6. The spray device of claim 5, wherein, The guide forms multiple guide grooves, and the guide grooves and the nozzles correspond to each other in one-to-one mode.

7. The spray device according to any one of claims 1 to 4, wherein Further comprising: a connecting piece, the coater and the guide are arranged on the same side of the connecting piece arranged along the first horizontal direction, the coater is close to the upper part of the connecting piece, and the guide is close to the lower part of the connecting piece.

8. The spray device according to any one of claims 1 to 4, wherein Further comprising: a position sensor arranged on the coater, used for obtaining the position information of the coater.

9. The spray device according to any one of claims 1 to 4, wherein Further comprising: a flow sensor arranged on the coater, used for obtaining the spraying amount of the nozzles.

10. The spray device according to any one of claims 1 to 4, characterized in that Further comprising: a linear driving part, the fixed end of the linear driving part is arranged on a machine table; a support located above the supporting base, the support is connected with the coater, and the driving end of the linear driving part is connected with the support, used for driving the support to move along the first horizontal direction.

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