PCB (printed circuit board) processing dispensing machine

Abstract

The utility model discloses a PCB (printed circuit board) processing glue dispenser which comprises a glue dispenser main body, a PCB adjusting mechanism is mounted in the middle of the glue dispenser main body, a glue dispensing head adjusting mechanism is mounted at the rear end of the glue dispenser main body, a glue dispensing head is mounted on the glue dispensing head adjusting mechanism, and cooling mechanisms are fixedly mounted at the left end and the right end of the glue dispensing head. The cooling mechanisms are installed on the two sides of the glue dispensing head, glue obtained after glue dispensing can be cooled, the glue curing speed is increased, the arranged draught fan enters the cooling cylinder through the air inlet holes, when the gas passes through the cooling pipe, heat exchange can be conducted on the gas, then the gas is cooled, and the cooling efficiency is improved. And the arranged heat conduction columns, the vapor chamber and the cooling fins can dissipate heat of cooling water after heat exchange in the second annular hollow plate, the time needed by refrigeration of the refrigeration fins is shortened, the cooling effect is further improved, the positions of the hollow cylinders on the periphery are adjusted according to the size of the PCB, and the height of the fixing blocks is adjusted according to the thickness of the PCB till the PCB is positioned.

Description

TECHNICAL FIELD

[0001] The utility model relates to the point gum machine technical field, concretely is a kind of PCB board processing point gum machine. BACKGROUND

[0002] Point gum machine is also called glueing machine, glue dropping machine, glue hitting machine, glue filling machine etc., is specially controlled to fluid. And fluid is dropped, coated on product surface or product inside the automatic machine, can realize three-dimensional, four-dimensional path point gum, accurate positioning, its PCB board processing process needs to be carried out by point gum machine, point gum can form a layer of protective film, prevent moisture, dust or other corrosive substances from invading circuit board and component, thereby prolong the service life of circuit board and component.

[0003] The prior art discloses a PCB board point gum machine, and relates to the field of PCB boards, and the PCB board point gum machine comprises a base, sliding rail grooves are formed in the two sides of the base, sliding blocks are arranged on the inner walls of the sliding rail grooves, supporting frames are arranged on the one sides of the sliding blocks, a workbench is arranged at the bottom of the base, and movable grooves are symmetrically formed in the top of the workbench.

[0004] The above technical scheme does not provide a cooling structure for point gum, so that the glue after point gum is not easy to quickly solidify, thereby leading to a long time for point gum solidification and reducing the efficiency of PCB board point gum. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of PCB board processing point gum machine to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of PCB board processing point gum machine, including point gum machine main body, PCB board adjusting mechanism is installed in the middle of the point gum machine main body, point gum head adjusting mechanism is installed at the rear end of the point gum machine main body, point gum head is installed on the point gum head adjusting mechanism, cooling and temperature reduction mechanism is fixedly installed at the left and right ends of the point gum head.

[0007] The cooling and temperature reduction mechanism includes cooling cylinder, the cooling cylinder is arranged at the two sides of the outer wall of point gum head, cooling assembly is fixedly connected at the lower portion of the outer wall of the cooling cylinder, the cooling assembly includes annular hollow plate two, cooling pipe is arranged in the inner side of the annular hollow plate two, the cooling pipe passes through the cooling cylinder, refrigeration fin is arranged on the front outer wall of the annular hollow plate two, the refrigeration fin is electrically connected with external power supply, the bottom side of the annular hollow plate two is fixedly connected with heat evenly plate, heat conduction column is arranged on the heat evenly plate and extends to the inside of the annular hollow plate two by passing through the bottom side of the annular hollow plate two.

[0008] In the technical scheme, when the gas passes through the cooling pipe, the gas can be heat-exchanged, and then cooled, the heat-conducting column, the heat-diffusing plate and the radiating fins can radiate the cooling water after heat-exchange in the annular hollow plate II, the time required for refrigeration of the refrigeration sheet is reduced, and the cooling effect is further improved.

[0009] As a further preferred aspect of the present technical solution, an operation table is mounted on the PCB plate adjusting mechanism, and a sliding groove is formed around the operation table.

[0010] As a further preferred aspect of the present technical solution, a hollow cylinder is slidingly connected in the sliding groove, a fixing block is inserted into the hollow cylinder, and a plug rod is inserted into a through hole between the hollow cylinder and the fixing block.

[0011] In the technical scheme, the positions of the hollow cylinders around the PCB plate can be adjusted according to the size of the PCB plate, and the height of the fixing block can be adjusted according to the thickness of the PCB plate, until the PCB plate is positioned.

[0012] As a further preferred aspect of the present technical solution, a pad is arranged on the side of the hollow cylinder opposite to the side facing the fixing block and the bottom side of the fixing block, and the pad is in contact with the PCB plate.

[0013] In the technical scheme, the pad further improves the positioning effect of the PCB plate and reduces the phenomenon of slipping.

[0014] As a further preferred aspect of the present technical solution, an annular hollow plate I is fixedly connected to the upper side of the outer wall of the cooling cylinder, a fan is arranged around the inner side of the annular hollow plate I, and the fan is in communication with the cooling cylinder through an air inlet hole.

[0015] In the technical scheme, the fan can enter the cooling cylinder through the air inlet hole.

[0016] As a further preferred aspect of the present technical solution, a heat-diffusing plate is arranged on the outer surface of the heat-diffusing plate, and the heat-diffusing plate, the heat-diffusing plate and the heat-conducting column are made of copper.

[0017] In the technical scheme, the heat-diffusing plate, the heat-diffusing plate and the heat-conducting column are made of copper, so that heat energy can be quickly and uniformly transmitted, and the heat-conducting effect is better.

[0018] As a further preferred aspect of the present technical solution, a water inlet channel is arranged above the annular hollow plate II, and a water outlet channel is arranged below the outer surface of the annular hollow plate II.

[0019] The present application provides a PCB processing glue dispensing machine, which has the following advantages:

[0020] (1) The cooling mechanism is installed on both sides of the dispensing head, can cool the glue after dispensing, improve the speed of glue curing, the fan enters the cooling cylinder through the air inlet hole, can heat exchange when passing through the cooling pipe, and then cool the gas, and the heat conducting column, the heat spreading plate and the cooling fins can heat the cooling water in the annular hollow plate II, reduce the time required for refrigeration, and further improve the cooling effect.

[0021] (2) The utility model discloses a adjustable fixed block is set up on the operation platform, can according to the size of PCB board adjustment four around's hollow cylinder position, and according to the thickness of PCB board adjustment fixed block's height, until the positioning of PCB board, improve the stability of PCB board positioning, avoid the offset in the dispensing process. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is the overall structure schematic diagram of the utility model;

[0023] Figure 2 It is the structure schematic diagram of the PCB board adjusting mechanism of the utility model;

[0024] Figure 3 It is the enlarged view of A of the utility model;

[0025] Figure 4 It is the structure schematic diagram of the dispensing head of the utility model;

[0026] Figure 5 It is the local section view of the cooling mechanism of the utility model;

[0027] Figure 6 It is the enlarged view of B of the utility model;

[0028] In the drawing: 1, dispensing machine main body;11, PCB board adjusting mechanism;12, dispensing head adjusting mechanism;2, dispensing head;3, cooling mechanism;111, operation platform;112, sliding slot;113, hollow cylinder;114, fixed block;115, plug rod;116, pad;31, cooling cylinder;32, annular hollow plate one;321, fan;33, cooling assembly;331, annular hollow plate two;332, cooling pipe;333, refrigeration piece;334, heat conducting column;335, heat spreading plate;336, cooling fin. DETAILED DESCRIPTION

[0029] The technical scheme in the embodiments of the utility model will be described clearly and completely in conjunction with the drawings in the embodiments of the utility model.

[0030] The utility model provides technical scheme: as Figure 1As shown, in this embodiment, a PCB processing glue dispenser includes a glue dispenser body 1, a PCB adjusting mechanism 11 is installed in the middle of the glue dispenser body 1, a glue head adjusting mechanism 12 is installed at the rear end of the glue dispenser body 1, a glue head 2 is installed on the glue head adjusting mechanism 12, the glue head 2 press the glue into the feeding pipe connected with the piston through compressed air, when the piston is in the upper stroke, the piston chamber is filled with glue; when the piston is pushed down, the glue is pressed out from the glue head, the cooling mechanism 3 is fixedly installed on the left and right ends of the glue head 2.

[0031] As shown in Figure 2 and Figure 3 , the operation table 111 is installed on the PCB adjusting mechanism 11, the sliding groove 112 is formed around the operation table 111, the hollow cylinder 113 is slidably connected in the sliding groove 112, the fixed block 114 is inserted into the hollow cylinder 113, the plug rod 115 is inserted into the through hole between the hollow cylinder 113 and the fixed block 114, the gasket 116 is arranged on the side of the hollow cylinder 113 and the bottom side of the fixed block 114, the gasket 116 is in contact with the PCB, by setting the adjustable fixed block 114 on the operation table 111, the position of the hollow cylinder 113 around can be adjusted according to the size of the PCB, and the height of the fixed block 114 can be adjusted according to the thickness of the PCB, until the PCB is positioned, the stability of the PCB positioning is improved, and the deviation in the glue dispensing process is avoided.

[0032] As shown in Figure 4 , Figure 5 and Figure 6As shown, the cooling mechanism 3 includes cooling cylinders 31, which are arranged on both sides of the outer wall of the glue dispensing head 2, and cooling assemblies 33 are fixedly connected to the lower part of the outer wall of the cooling cylinders 31. The cooling assembly 33 includes a hollow annular plate two 331, and cooling pipes 332 are arranged on the inner side of the hollow annular plate two 331 and pass through the cooling cylinders 31. The front outer wall of the hollow annular plate two 331 is provided with a refrigeration fin 333, which is a device for refrigeration by using the Peltier effect. The device has two sides, one side absorbs heat, and the other side radiates heat, so as to achieve the refrigeration effect. The refrigeration fin 333 is electrically connected to an external power supply. The bottom side of the hollow annular plate two 331 is fixedly connected to a heat conduction plate 335, and heat conduction columns 334 are arranged on the heat conduction plate 335 and extend to the inside of the hollow annular plate two 331 through the bottom side of the hollow annular plate two 331. The upper part of the outer wall of the cooling cylinder 31 is fixedly connected to a hollow annular plate one 32, and fans 321 are arranged around the inner side of the hollow annular plate one 32 and communicate with the cooling cylinder 31 through air inlet holes. The outer surface of the heat conduction plate 335 is provided with heat dissipation fins 336, and the heat dissipation fins 336, the heat conduction plate 335 and the heat conduction columns 334 are made of copper. The upper part of the hollow annular plate two 331 is provided with a water inlet channel, and the lower part of the outer surface of the hollow annular plate two 331 is provided with a water outlet channel. By arranging the cooling mechanism 3 on both sides of the glue dispensing head 2, the glue after dispensing can be cooled, and the solidification speed of the glue is improved. The fans 321 arranged on the air inlet holes can heat the gas when passing through the cooling pipes 332, so as to cool and cool the gas. The heat conduction columns 334, the heat conduction plate 335 and the heat dissipation fins 336 can dissipate heat of the cooling water in the hollow annular plate two 331, reduce the time required for refrigeration of the refrigeration fin 333, and further improve the cooling effect.

[0033] The utility model provides a kind of PCB processing point gum machine, and specific working principle is as follows: when glueing to PCB, the size of the hollow cylinder 113 around PCB is adjusted, and the height of fixed block 114 is adjusted according to the thickness of PCB, until fixed block 114 presses PCB;When dispensing, glue dispensing head adjusting mechanism 2 is used to glue to PCB, and fan 321 is started simultaneously to make gas enter cooling cylinder 31 through air inlet hole, when passing through cooling pipe 332, gas can be heated, and then cooled, and glue is cooled and solidified, heat conduction column 334, heat conduction plate 335 and heat dissipation fin 336 are arranged to dissipate heat of cooling water in hollow annular plate two 331, reduce the time required for refrigeration of refrigeration fin 333.

[0034] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB processing dispensing machine, comprising a dispensing machine main body (1), characterized in that: The point glue machine body (1) middle installation has PCB board adjusting mechanism (11), the point glue machine body (1) rear end installation has point glue head adjusting mechanism (12), the point glue head adjusting mechanism (12) on installation has point glue head (2), the point glue head (2) left and right two ends are fixedly installed with cooling mechanism (3); The cooling mechanism (3) includes a cooling cylinder (31), the cooling cylinder (31) is arranged on both sides of the outer wall of the point glue head (2), the outer wall of the cooling cylinder (31) is fixedly connected with a cooling assembly (33), the cooling assembly (33) includes a hollow ring plate (331), the cooling tube (332) is arranged in the inner side of the hollow ring plate (331), the cooling tube (332) passes through the cooling cylinder (31), the outer wall of the front side of the hollow ring plate (331) is provided with a refrigeration fin (333), the refrigeration fin (333) is electrically connected with an external power supply, the bottom side of the hollow ring plate (331) is fixedly connected with a heat plate (335), the heat plate (335) is arranged with a heat conduction column (334), and the heat conduction column (334) extends through the bottom side of the hollow ring plate (331) to the inside of the hollow ring plate (331).

2. The PCB processing glue dispenser according to claim 1, characterized in that: The PCB board adjusting mechanism (11) is provided with an operation table (111), and the operation table (111) is provided with a sliding groove (112) around.

3. The PCB processing glue dispenser machine according to claim 2, characterized in that: The sliding groove (112) is slidably connected with a hollow cylinder (113), the hollow cylinder (113) is inserted with a fixed block (114), and the hollow cylinder (113) and the fixed block (114) are inserted with a plug rod (115) in the through hole.

4. The PCB processing glue dispenser according to claim 3, characterized in that: The opposite side of the hollow cylinder (113) and the bottom side of the fixed block (114) are provided with a pad (116), and the pad (116) is in contact with the PCB board.

5. The PCB processing glue dispenser according to claim 1, characterized in that: The outer wall of the cooling cylinder (31) is fixedly connected with a hollow ring plate (32), the inner side of the hollow ring plate (32) is provided with a fan (321), and the fan (321) is communicated with the cooling cylinder (31) through an air inlet hole.

6. The PCB processing glue dispenser according to claim 1, characterized in that: The outer surface of the heat plate (335) is arranged with a heat dissipation fin (336), and the heat dissipation fin (336), the heat plate (335) and the heat conduction column (334) are made of copper.

7. The PCB processing glue dispenser according to claim 1, characterized in that: The upper side of the hollow ring plate (331) is provided with a water inlet channel, and the lower side of the outer surface of the hollow ring plate (331) is provided with a water outlet channel.

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