Edge grinding device for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to an edge grinding device for semiconductor processing, which comprises a base, a first stand column is fixed at the top of the base, a tray is fixed at the top end of the first stand column, a C-shaped plate is fixed on the outer side of the base, and a first electric push rod is fixed at the top of the C-shaped plate. A pressing disc is fixed to the output end of the first electric push rod, and a supporting ring is fixed to the top of the base. According to the edge grinding device, the output end of the second electric push rod drives the edge grinding wheels on the multiple edge grinding mechanisms to be attached to a wafer, the second motor drives the edge grinding wheels to rotate for edge grinding, and meanwhile the first motor drives the circular carrier plate to drive the edge grinding wheels on the multiple edge grinding mechanisms to rotate around the first stand column in the circumferential direction; the edge grinding wheel can move to different positions on the outer side of the wafer to conduct edge grinding, the effect of rapid all-dimensional edge grinding on the wafer is achieved, the dust collection box is attached to the outer side of the edge grinding wheel, the edge grinding wheel is cleaned while grinding is conducted, and chippings on the edge grinding wheel are prevented from damaging the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, and specifically relates to an edge grinding device for semiconductor processing. BACKGROUND

[0002] A wafer is a thin slice of a cylindrical semiconductor crystal and is a common type of semiconductor, and is mainly used as a substrate of a carrier in an integrated circuit process. In the process of manufacturing a wafer by using a thin slice, the circular edge of the wafer needs to be ground. The current edge grinding device mainly comprises a clamping assembly and a grinding assembly. The wafer is clamped and fixed by the clamping assembly, and then the edge grinding is performed by using the grinding assembly.

[0003] During the edge grinding process of the wafer, edge grinding debris will be generated. Some debris will be attached to the edge grinding wheel of the grinding assembly. If the debris is not cleaned in time, the debris may have a negative impact on the grinding quality, such as scratching the surface of the semiconductor and affecting the grinding accuracy. In addition, some semiconductor edge grinding devices can only grind and process semiconductor wafers with a single diameter size, and have low applicability. SUMMARY

[0004] The utility model aims at providing an edge grinding device for semiconductor processing to solve the problems in the background art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme.

[0006] An edge grinding device for semiconductor processing comprises:

[0007] A base is provided with a first vertical column at the top, a tray is fixed at the top of the first vertical column, and a U-shaped plate is fixed to the outside of the base.

[0008] An electric push rod one is fixed at the top of the U-shaped plate, and a pressure plate is fixed to the output end of the electric push rod one.

[0009] A support ring is fixed at the top of the base, and a circular carrier plate is rotatably arranged in the support ring.

[0010] A plurality of edge grinding mechanisms are arranged on the top of the circular carrier plate in a ring shape and are angularly connected to each other. The edge grinding mechanism comprises a second vertical column, a U-shaped seat is fixed to the top of the second vertical column, an edge grinding wheel is rotatably arranged in the U-shaped seat, and a dust collection box is slidably arranged on the outside of the edge grinding wheel.

[0011] A plurality of electric push rod twos are fixed to the top of the circular carrier plate, and the electric push rod twos can drive the second vertical column to move.

[0012] Further, the opening of the dust collection box is arc-shaped, and two symmetrically distributed brushes are fixed to the opening end of the dust collection box.

[0013] Further in, the outside of the dust collection box is fixedly connected with a dust collection pipe, and the dust collection pipe is fixedly connected with an external dust collector through a hose.

[0014] Further in, the top surface of the base is fixed with a motor one, the output end of the motor one and the bottom surface of the circular carrier plate are fixed with gears, and the two gears are in meshing transmission.

[0015] Further in, the outside of the second column is fixedly sleeved with a material receiving disc, and the bottom of the second column is fixed with a sliding block which is slidingly connected with the circular carrier plate.

[0016] Further in, the top of the H-shaped seat is fixed with a motor two which can drive the edge grinding wheel to rotate, and the H-shaped seat and the second column are fixed with a supporting block.

[0017] Further in, the top surface of the tray and the bottom surface of the pressing disc are fixedly sleeved with rubber pads.

[0018] Compared with the prior art, the utility model has the advantages that:

[0019] 1. The semiconductor wafer is placed on the top surface of the tray, the output ends of the plurality of electric push rods two are retracted, the plurality of edge grinding mechanisms arranged at equal angles in a ring shape move with the plurality of edge grinding wheels to the wafer direction, so that the wafer is arranged in the center of the top surface of the tray, the output end of the electric push rod one moves downward with the pressing disc to press and fix the wafer on the top surface of the tray, the output end of the motor two rotates with the edge grinding wheel to grind the burr edge of the wafer, and the motor one drives the circular carrier plate to rotate, so that the edge grinding wheel can move along the outer side of the wafer to grind the edge, thereby facilitating the all-round edge grinding of the outer edge of the wafer.

[0020] 2. The dust collection box is arranged on one side of the edge grinding wheel, the dust collection box is fixed with a brush at an open end, the brush can wipe off the debris attached to the edge grinding wheel during the rotation and edge grinding of the edge grinding wheel, the debris can fall into the dust collection box, the dust collection pipe outside the dust collection box is connected with the suction end of the external dust collector, so that the dust collection pipe can suck the debris in the dust collection box, the debris attached to the outside of the edge grinding wheel is automatically cleaned, the wafer surface is effectively prevented from being scratched by the debris, and the wafer is protected during edge grinding to a certain extent.

[0021] 3. The distance between the edge grinding wheel on the edge grinding mechanism and the tray can be adjusted through the electric push rod two, when the diameter of the wafer placed on the top surface of the tray is large, the edge grinding wheel can be driven away from the tray through the electric push rod two, so that the wafer with a large size can be placed on the tray, when the diameter of the wafer placed on the top surface of the tray is small, the edge grinding wheel can be driven to be close to the tray through the electric push rod two, so that the wafer with a small size can be placed on the tray, and the wafer with different sizes can be edge ground by the edge grinding device. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is the overall structure schematic diagram of the utility model;

[0023] Figure 2 is the polishing wafer state structure schematic diagram in the utility model;

[0024] Figure 3 is the support ring internal structure schematic diagram in the utility model;

[0025] Figure 4 is the electric push rod two, edge grinding mechanism structure schematic diagram in the utility model;

[0026] Figure 5 is the dust absorption box open structure schematic diagram in the utility model.

[0027] In the drawing: 100, base;110, stand one;111, tray;120, U-shaped plate;130, motor one;200, electric push rod one;210, pressure plate;300, support ring;310, circular carrier plate;311, sliding groove;400, edge grinding mechanism;410, stand two;411, material receiving disc;412, sliding block;420, U-shaped seat;421, motor two;430, edge grinding wheel;440, dust absorption box;441, brush;442, dust absorption pipe;500, electric push rod two;510, transmission block. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0029] Embodiment one, please refer to Figure 1 - Figure 5The utility model discloses an edge grinding device for semiconductor processing, which comprises a base 100, a stand column one 110 fixed on the top of the base 100, a tray 111 fixed on the top end of the stand column one 110, a U-shaped plate 120 fixed on the outer side of the base 100, an electric push rod one 200 fixed on the top of the U-shaped plate 120, a pressure plate 210 fixed on the output end of the electric push rod one 200, a supporting ring 300 fixed on the top of the base 100, a circular carrier plate 310 rotating in the supporting ring 300, a plurality of edge grinding mechanisms 400 slidingly and angularly connected to the top of the circular carrier plate 310, the edge grinding mechanism 400 comprising a stand column two 410, a U-shaped seat 420 fixed on the top of the stand column two 410, an edge grinding wheel 430 rotating on the inner side of the U-shaped seat 420, a dust collection box 440 slidingly attached to the outer side of the edge grinding wheel 430, a plurality of electric push rods two 500 fixed on the top surface of the circular carrier plate 310, and the electric push rod two 500 being capable of driving the stand column two 410 at the corresponding position to move.

[0030] Specifically, the wafer is clamped and fixed by using the tray 111 and the pressure plate 210, and before clamping the wafer, the wafer can be placed in the middle position of the tray 111 by moving the plurality of edge grinding wheels 430 to the center, which facilitates the circumferential edge grinding of the wafer in the later stage. The edge grinding wheel 430 on the plurality of edge grinding mechanisms 400 is driven to abut against the wafer by the output end of the electric push rod two 500, the motor two 421 drives the edge grinding wheel 430 to rotate for edge grinding, and at the same time, the motor one 130 drives the circular carrier plate 310 to rotate around the stand column one 110 with the edge grinding wheel 430 on the plurality of edge grinding mechanisms 400, so that the edge grinding wheel 430 can move to different positions outside the wafer for edge grinding, achieving the effect of rapid and omnidirectional edge grinding of the wafer. The dust collection box 440 is attached to the outer side of the edge grinding wheel 430, the brush 441 inside the dust collection box 440 wipes the rotating edge grinding wheel 430, which facilitates the cleaning of the debris attached to the edge grinding wheel 430 into the dust collection box 440, and at the same time, the dust collection box 440 is in communication with an external dust collector, the dust collector can timely clean and collect the debris inside the dust collection box 440, thereby realizing the cleaning of the edge grinding wheel 430 while edge grinding, preventing the debris on the edge grinding wheel 430 from damaging the wafer.

[0031] As shown in Figure 1 and Figure 3 in the embodiment, the top surface of the base 100 is fixed with a motor one 130, the output end of the motor one 130 is fixed with a gear on the bottom surface of the circular carrier plate 310, and the two gears are in meshing transmission, wherein the stand column one 110 rotates through the corresponding position gear, when the circular carrier plate 310 needs to be rotated, the output end of the motor one 130 rotates with the two gears in meshing transmission to rotate the circular carrier plate 310 inside the supporting ring 300,

[0032] In the embodiment, the circular carrier plate 310 is rotated around the column 110 with the edge grinding wheels 430 on the edge grinding mechanism 400, so that the edge grinding wheels 430 can grind the edge of the wafer at different positions, and since three edge grinding wheels 430 are arranged on the edge of the wafer, the circular carrier plate 310 can rotate 120 degrees with each edge grinding wheel 430 on the edge grinding mechanism 400 to realize the edge grinding of the edge grinding wheel 430 on the edge of the wafer, and then the circular carrier plate 310 can be reversely rotated 120 degrees to make the edge grinding wheel 430 return to the initial position, which is convenient for the edge grinding of the wafer and improves the grinding effect.

[0033] In the embodiment, since the circular carrier plate 310 only needs to rotate 120 degrees with the edge grinding mechanism 400 to complete the edge grinding of the wafer, the hose connected with the dust collection box 440 on the edge grinding mechanism 400 will not interfere with the rotation of the circular carrier plate 310.

[0034] In the utility model, the top surface of the tray 111 and the bottom surface of the pressing plate 210 are sleeved and fixed with rubber pads, so that the tray 111 and the pressing plate 210 are in flexible contact with the wafer, preventing the wafer from being damaged when the tray 111 and the pressing plate 210 clamp the wafer.

[0035] As shown in Figure 2 and Figure 3 In the embodiment, the top surface of the base 100 is annularly and equiangularly fixed with a plurality of supporting blocks, and the supporting blocks are fixed with the supporting ring 300, so that there is a space between the base 100 and the supporting ring 300 for installing the motor 130.

[0036] As shown in Figure 4 In the embodiment, the outer side of the column 410 is sleeved and fixed with a material receiving disc 411, and the material receiving disc 411 can contain the edge grinding debris falling during the edge grinding of the edge grinding wheel 430, which is conducive to keeping the edge grinding environment clean

[0037] As shown in Figure 3 and Figure 4 In the embodiment, the bottom of the column 410 is fixed with a sliding block 412 which is slidingly connected with the circular carrier plate 310, and the top surface of the circular carrier plate 310 is annularly and equiangularly provided with a plurality of sliding grooves 311, and the sliding block 412 is slidingly connected with the sliding groove 311, so that the column 410 can stably move the position of the entire edge grinding mechanism 400 on the circular carrier plate 310.

[0038] As shown in Figure 4As shown in the embodiment, the top of the U-shaped seat 420 is fixed with a motor 421 capable of driving the edging wheel 430 to rotate, the output end of the motor 421 is provided with the edging wheel 430 to rotate, so as to realize the rotation of the edging wheel 430 to edge, and the support block is fixed between the U-shaped seat 420 and the second column 410, so that the U-shaped seat 420 stably supports the edging wheel 430 and the dust collection box 440 on the top of the second column 410.

[0039] As shown in the embodiment, the opening of the dust collection box 440 is arranged in an arc shape, the arc shape facilitates the abutting of the opening of the dust collection box 440 and the cylindrical edging wheel 430, and the opening end of the dust collection box 440 is fixed with two symmetrically distributed brushes 441, the brushes 441 are rubbed with the edging wheel 430 during the rotation of the edging wheel 430, so as to facilitate the cleaning of the debris attached to the outer side of the edging wheel 430. Figure 4 Figure 5 As shown in the embodiment, the outer side of the dust collection box 440 is communicated and fixed with a dust collection pipe 442, the dust collection pipe 442 is fixed with the suction end of an external dust collector through a hose, the dust collector sucks the airflow in the dust collection pipe 442 through the hose, so as to make the dust collection pipe 442 suck the airflow in the dust collection box 440, and facilitate the timely exhaust of the debris cleaned by the brushes 441, wherein the dust collection box 440 is detachably fixed with the U-shaped seat 420, and after the dust collection box 440 is used for a period of time, the dust collection box 440 can be detached to clean the debris remaining in the dust collection box 440.

[0040] As shown in the embodiment, the output end of the second electric push rod 500 is fixed with a transmission block 510, the transmission block 510 is fixed with the corresponding position of the second column 410, so that the second electric push rod 500 can drive the second column 410 to move through the transmission block 510.

[0041] As shown in the embodiment, the output end of the second electric push rod 500 is fixed with a transmission block 510, the transmission block 510 is fixed with the corresponding position of the second column 410, so that the second electric push rod 500 can drive the second column 410 to move through the transmission block 510. Figure 4 It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all aspects as illustrative and not restrictive, the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalents of the claims are intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.

[0042]

[0043] ​​Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature described. The specification can include implicit combinations of explicitly mentioned features and / or explicit combinations of implicitely mentioned features. Each embodiment depends on the explicit combinations of features and / or the implicit combinations of features made specifically within that embodiment, and each such embodiment can be combined with every other such embodiment to create further embodiments.

Claims

1. A grinding device for semiconductor processing, characterized in that, include: The base (100) has a column (110) fixed to the top of the base (100), a tray (111) fixed to the top of the column (110), and a U-shaped plate (120) fixed to the outside of the base (100). Electric push rod 1 (200) is fixed on the top of the shaped plate (120), and pressure plate (210) is fixed at the output end of electric push rod 1 (200). A support ring (300) is fixed to the top of the base (100), and a circular carrier plate (310) rotates inside the support ring (300). Multiple edge grinding mechanisms (400) are slidably engaged at the top of a circular carrier plate (310) in an annular shape. Each edge grinding mechanism (400) includes a second column (410), a U-shaped seat (420) is fixed to the top of the second column (410), an edge grinding wheel (430) rotates on the inner side of the U-shaped seat (420), and a dust collection box (440) slides against the outer side of the edge grinding wheel (430). Multiple electric push rods (500) are fixed to the top of the circular carrier plate (310). The electric push rods (500) can drive the corresponding column (410) to move.

2. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, The opening of the dust collection box (440) is set in an arc shape, and two symmetrically distributed brushes (441) are fixed at the opening end of the dust collection box (440).

3. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, A vacuum tube (442) is fixedly connected to the outside of the vacuum box (440), and the vacuum tube (442) is installed and fixed to an external vacuum cleaner through a hose.

4. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, A motor (130) is fixed on the top surface of the base (100). Gears are fixed on both the output end of the motor (130) and the bottom surface of the circular carrier plate (310). The two gears mesh and drive each other.

5. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, A receiving tray (411) is fixedly sleeved on the outer side of column 2 (410), and a slider (412) is fixedly fixed at the bottom of column 2 (410) to slide and engage with the circular carrier plate (310).

6. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, The top of the C-shaped base (420) is fixed with a motor (421) that can drive the grinding wheel (430) to rotate, and a support block is fixed between the C-shaped base (420) and the column (410).

7. The semiconductor processing edge grinding apparatus according to claim 1, characterized in that, Rubber pads are fitted and fixed to the top surface of the tray (111) and the bottom surface of the pressure plate (210).

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