Electroplating device

Abstract

The utility model provides an electroplating device and relates to the technical field of electroplating. The electroplating device disclosed by the utility model is used for electroplating the surface of the target object. The electroplating device comprises at least one set of electroplating assembly arranged on at least one side face of a target object, and each set of electroplating assembly comprises an upper plating assembly and a deplating assembly which are arranged side by side; the upper plating assembly comprises an anode, the deplating assembly comprises a cathode and a conductive roller arranged between the cathode and a target object, and the conductive roller rotates continuously and makes contact with the target object all the time so that the target object can form the cathode. The upper plating assembly and the deplating assembly are arranged side by side, so that an upper plating electric field and a deplating electric field are separated from each other, the electric field interference is reduced, and the quality and effect of electroplating and deplating are further ensured.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to an electroplating apparatus. Background Technology

[0002] There are many types of cathodes used in horizontal electroplating, including clamp-type, frame-type, and roller-type. Roller-type cathode rollers (i.e., conductive rollers) can use spring sheets to conduct electricity in contact with the object being plated, conductive wires to conduct electricity in contact with the object being plated, or metal rollers to conduct electricity directly in contact with the object being plated. All roller-type cathode rollers suffer from the problem of plating residue on the cathode roller during electroplating. If this residue cannot be removed, it will severely affect the object being plated, making continuous production impossible. In existing technologies, to achieve continuous deplating on the cathode roller, an anode is added above the cathode roller, and the object being plated below acts as the cathode. This creates an electric field between the lower part of the cathode roller and the object being plated to electroplat the object, while an electric field is formed above the cathode roller and the upper anode to deplat the cathode roller. However, this method creates two electric fields, which can interfere with each other, affecting both the electroplating and deplating processes. Utility Model Content

[0003] One objective of the first aspect of this utility model is to provide an electroplating apparatus that solves the problem of interference between the electric fields of electroplating and deplating in the prior art.

[0004] The second objective of the first aspect of this utility model is to solve the problem of insufficient anti-interference capability between the electric fields of electroplating and deplating.

[0005] In particular, this utility model also provides an electroplating apparatus for electroplating the surface of a target object, comprising at least one set of electroplating components disposed on at least one side of the target object, each set of electroplating components comprising an upper plating component and a lower plating component disposed side by side; the upper plating component comprises an anode, the lower plating component comprises a cathode and a conductive roller disposed between the cathode and the target object, the conductive roller continuously rotating and always in contact with the target object so that the target object forms a negative electrode.

[0006] Optionally, the number of electroplating components is multiple sets, and the multiple sets of electroplating components are arranged side by side on one side of the target object.

[0007] Optionally, the number of electroplating components is multiple sets, and the multiple sets of electroplating components are arranged on both sides of the target object, with the electroplating components on each side of the target object arranged side by side.

[0008] Optionally, the plating assembly located on one side of the target object is correspondingly provided with the plating removal assembly located on the other side of the target object.

[0009] Optionally, at least one set of first blocking components is further included, each of the first blocking components is arranged at a corresponding one of the upper plating components, and is configured to carry the anode and to block an upper plating electric field formed between the anode and the target object from the outside.

[0010] Optionally, each of the first blocking components includes:

[0011] a first carrier plate in a hollow structure, configured to carry the anode; and

[0012] a first partition plate arranged at both ends of the first carrier plate in parallel to a movement direction of the target object, and the first partition plate is parallel to a direction of the upper plating electric field.

[0013] Optionally, at least one set of second blocking components is further included, each of the second blocking components is arranged at a corresponding one of the upper plating components, and is configured to carry the anode and to block an upper plating electric field formed between the anode and the target object from the outside.

[0014] Optionally, each of the second blocking components includes:

[0015] a second carrier plate, configured to carry the cathode; and

[0016] a second partition plate arranged at both ends of the second carrier plate in parallel to a movement direction of the target object, and the second partition plate is parallel to a direction of the upper plating electric field.

[0017] Optionally, one end of the first partition plate extends to the second carrier plate, and the other end of the first partition plate extends to the conductive roller.

[0018] Optionally, a conveying component is further included, and the conveying component includes a plurality of transmission rollers arranged at a lower side of the target object or arranged at an upper side and a lower side of the target object to drive the target object to move.

[0019] The electroplating device in the present solution can include at least one set of electroplating components, each set of electroplating components can include an upper plating component and a plating-eliminating component arranged side by side, and since the upper plating component and the plating-eliminating component are arranged side by side, the upper plating electric field and the plating-eliminating electric field are separated from each other, the electric field interference is reduced, and the quality and effect of electroplating and plating-eliminating are ensured.

[0020] In the present solution, the first blocking component is arranged at the upper plating component, the first blocking component blocks the anode from other components, thereby reducing the influence of the outside on the electric field formed between the anode and the target object, and also reducing the influence of the electric field on the outside.

[0021] The second blocking assembly is arranged at the plating-eliminating assembly, so that the plating-eliminating electric field formed between the cathode and the conductive roller at the plating-eliminating assembly is blocked, the diffusion of the plating-eliminating electric field is isolated, the influence of the electric field at the plating-eliminating assembly on the outside world is reduced, meanwhile, the influence of the outside world on the electric field at the plating-eliminating assembly is reduced, the mutual interference between the plating electric field and the plating-eliminating electric field is avoided, and the quality and effect of plating and plating elimination are ensured.

[0022] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] Some embodiments of the present application will now be described, by way of example only, with reference to the accompanying drawings. The same reference numbers in different drawings identify the same or similar elements or parts. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:

[0024] Figure 1 is a schematic structural view of a plating device according to one specific embodiment of the present application;

[0025] Figure 2 is a schematic structural view of a plating device according to another specific embodiment of the present application;

[0026] Figure 3 is a schematic structural view of a plating device according to still another specific embodiment of the present application;

[0027] Figure 4 is a partial schematic view of a plating device according to one specific embodiment of the present application.

[0028] BRIEF DESCRIPTION OF DRAWINGS

[0029] plating device - 100; tank body - 110; target object - 200; plating assembly - 300; plating assembly - 310; anode - 311; plating-eliminating assembly - 320; cathode - 321; conductive roller - 322; first blocking assembly - 330; first carrier plate - 331; first partition plate - 332; second blocking assembly - 340; second carrier plate - 341; second partition plate - 342; conveying assembly - 400; transmission roller - 410. DETAILED DESCRIPTION

[0030] In the description of the present embodiment, it needs to be understood that the terms "length", "width", "height", "upper", "lower", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model.

[0031] Figure 1 is a schematic structural diagram of the electroplating device 100 according to one specific embodiment of the present utility model. As one specific embodiment of the present utility model, the present embodiment provides an electroplating device 100 for electroplating the surface of a target object 200. Specifically, the target object 200 in the present embodiment can be a silicon wafer. Specifically, the electroplating device 100 of the present embodiment can include at least one set of electroplating assemblies 300 arranged on at least one side of the target object 200, each set of electroplating assemblies 300 including an upper plating assembly 310 and a plating-eliminating assembly 320 arranged side by side. The upper plating assembly 310 can include an anode 311, and the plating-eliminating assembly 320 can include a cathode 321 and a conductive roller 322 arranged between the cathode 321 and the target object 200. The conductive roller 322 is constantly rotating and always in contact with the target object 200 to make the target object 200 surface attach a negative charge to form a negative electrode.

[0032] Specifically, the electroplating device 100 in the present embodiment can include at least one set of electroplating assemblies 300, and each set of electroplating assemblies 300 can include an upper plating assembly 310 and a plating-eliminating assembly 320 arranged side by side. Since the upper plating assembly 310 and the plating-eliminating assembly 320 in the present embodiment are arranged side by side, the upper plating electric field and the plating-eliminating electric field are separated from each other, the electric field interference is reduced, and the quality and effect of electroplating and plating-elimination are guaranteed.

[0033] Specifically, in the present embodiment, the upper plating assembly 310 includes an anode 311, and the plating-eliminating assembly 320 is a cathode 321 and a conductive roller 322. The conductive roller 322 is in contact with the target object 200. When the conductive roller 322 is electrified, the target object 200 surface forms a negative electrode. At this time, the anode 311 serves as a positive electrode, an electric field (i.e., an upper plating electric field, direction as shown by arrow A in Figure 2 the middle) is formed in the electroplating solution, electron transfer occurs, and at this time, metal ions continuously plate on the surface of the target object 200 to form a metal layer. Since the conductive roller 322 is also a negative electrode during the upper plating electroplating process, the conductive roller 322 will also be plated with a layer of metal in the area close to the target object 200. The area of the conductive roller 322 close to the target object 200 is a negative zone (as shown by b in Figure 1 the middle), and the area far from the target object 200 naturally forms a positive zone (as shown by a in Figure 1After the cathode 321 is added above the conductive roller 322, the cathode 321 serves as a negative electrode, and an electric field (i.e., a stripping electric field, and the direction is indicated by arrow B) is formed above the conductive roller 322. Figure 1 Under the action of the electric field, the metal layer on the conductive roller 322 is dissolved, and the cathode 321 is plated with the metal layer. The metal layer on the conductive roller 322 is continuously stripped, and the target object 200 is continuously plated with the metal layer in the process of continuously moving in the preset direction, while the conductive roller 322 is continuously rotated.

[0034] Figure 2 is a schematic structural view of a plating device according to another specific embodiment of the present application. As a specific embodiment of the present application, as shown in Figure 2 The number of the plating assemblies 300 in the embodiment is multiple, and the multiple plating assemblies 300 are arranged side by side on one side of the target object 200.

[0035] In the embodiment, when the number of the plating assemblies 300 is multiple, they are arranged on one side of the target object 200, for example, on the upper side or the lower side of the target object 200. The plating device 100 in the embodiment can only plate the metal layer on one side (the upper side or the lower side) of the target object 200. The multiple plating assemblies 300 are arranged side by side in sequence, and the plating assembly 310 of each plating device 100 can plate the metal layer on the target object 200 after starting plating. The stripping assembly 320 continuously strips the conductive roller 322 while continuously plating the target object 200, so that the target object 200 can be continuously plated.

[0036] Figure 3 is a schematic structural view of a plating device according to another specific embodiment of the present application. As a specific embodiment of the present application, as shown in Figure 4 is a partial schematic view of a plating device according to a specific embodiment of the present application. As a specific embodiment of the present application, as shown in Figure 3 and Figure 4 The number of the plating assemblies 300 in the embodiment is multiple, and the multiple plating assemblies 300 are arranged on both sides of the target object 200. The plating assemblies 300 on each side of the target object 200 are arranged side by side.

[0037] In the embodiment, the target object 200 has the plating device 100 on both sides, so that the metal layer required for the two sides of the target object 200 can be plated, thereby avoiding the need for manual or other mechanisms to turn the target object 200, and improving the efficiency.

[0038] In addition, no matter how many plating assemblies 300 are arranged, and no matter which side of the target object 200 the plating assemblies 300 are arranged on, the plating and deplating principles of each plating assembly 300 are the same, and thus will not be described herein.

[0039] As a specific embodiment of the present application, the plating assembly 310 on one side of the target object 200 is arranged in correspondence with the deplating assembly 320 on the other side of the target object 200.

[0040] As a specific embodiment of the present application, the leftmost upper side of the target object 200 is the plating assembly 310, and thus the target object 200 is plated at the position of the plating assembly 310, and the corresponding deplating assembly 320 is arranged below. At this time, the deplating assembly 320 is the conductive roller 322 for deplating. In this way, in the process of continuously extending to the right side, each position of the target object 200 has one side of the deplating assembly 320 and the other side of the plating assembly 310, and the two sides of the target object 200 are plated at the same position at different times, thereby avoiding the high fragment rate caused by plating on both sides of the target object 200 at the same time, and improving the yield.

[0041] As a specific embodiment of the present application, the plating device 100 can further include at least one first blocking assembly 330, each first blocking assembly 330 being arranged at a corresponding plating assembly 310 and used for bearing the anode 311 and blocking the electric field formed between the anode 311 and the target object 200 from the outside.

[0042] In the present embodiment, the first blocking assembly 330 is arranged at the plating assembly 310, and the first blocking assembly 330 blocks the anode 311 from other components, thereby reducing the influence of the outside on the electric field formed between the anode 311 and the target object 200, and reducing the influence of the electric field on the outside.

[0043] As a specific embodiment of the present application, each first blocking assembly 330 can include a first carrier plate 331 and a first partition plate 332. The first carrier plate 331 is a hollow structure and is used for bearing the anode 311. The first partition plate 332 is arranged at the positions of both ends of the first carrier plate 331 in the parallel preset direction, and the first partition plate 332 is parallel to the direction of the plating electric field.

[0044] Specifically, the first carrier plate 331 in the present embodiment can bear the anode 311 and also connect the two first partition plates 332 to each other. The first partition plate 332 is arranged vertically, thereby isolating the deplating electric field on the left and right sides of the electric field of the plating assembly 310, reducing the interference with the deplating electric field, and ensuring the quality and effect of plating and deplating.

[0045] As a specific embodiment of the utility model, the electroplating device 100 of the embodiment can further include a second blocking component 340, each second blocking component 340 is arranged at the corresponding depolarization component 320, and is used for bearing the cathode 321 and shielding the depolarization electric field formed between the cathode 321 and the conductive roller 322 from the outside.

[0046] In the embodiment, the second blocking component 340 is arranged at the depolarization component 320, so that the depolarization electric field formed between the cathode 321 and the conductive roller 322 at the depolarization component 320 is shielded, the diffusion of the depolarization electric field is isolated, the influence of the electric field at the depolarization component 320 on the outside is reduced, the influence of the outside on the electric field at the depolarization component 320 is also reduced, the mutual interference between the plating electric field and the depolarization electric field is avoided, and the quality and effect of electroplating and depolarization are ensured.

[0047] As a specific embodiment of the utility model, each second blocking component 340 of the embodiment can include a second carrier plate 341 and a second partition plate 342, wherein the second carrier plate 341 is used for bearing the cathode 321. The second partition plate 342 is arranged at the two end positions of the target object movement direction of the second carrier plate 341, and the second partition plate 342 is parallel to the direction of the depolarization electric field.

[0048] The second partition plate 342 in the embodiment can also be arranged at the two end portions of the target object movement direction of the second carrier plate 341, or can be arranged at the position close to the end portion. In addition, the second partition plate 342 is parallel to the direction of the depolarization electric field, so as to isolate the depolarization electric field.

[0049] As a specific embodiment of the utility model, one end of the first partition plate 332 of the embodiment extends to the second carrier plate 341, and the other end of the first partition plate 332 extends to the conductive roller 322. Specifically, in the embodiment, the first partition plate 332 mainly blocks the mutual interference of the plating electric field and other depolarization electric fields, so the partition plate needs to extend at least to the position close to the second carrier plate 341. In addition, the depolarization electric field is mainly concentrated on the side of the conductive roller 322 close to the cathode 321, so the first partition plate 332 extends to the conductive roller 322, specifically, the first partition plate 322 extends to at least 1 / 3 of the height position of the conductive roller 322, so as to block most of the electric field interference. Of course, if the first partition plate 332 wants to have better blocking effect on the depolarization electric field and the plating electric field, the first partition plate 332 at least extends to 1 / 2 of the conductive roller 322, and the closer to the target object 200, the better the blocking effect. Of course, it cannot completely contact the target object 200, and a certain gap is necessarily left between the first partition plate 332 and the target object 200, so as to avoid scratching the target object 200.

[0050] As one specific embodiment of the utility model, the electroplating device 100 of the embodiment can further include a conveying assembly 400, which can include a plurality of transmission rollers 410 arranged on the lower side of the target object 200 or on the upper and lower sides of the target object 200 to drive the target object 200 to move.

[0051] In the embodiment, the conveying assembly 400 continuously moves the target object 200 along the preset direction, so that the surface of the target object 200 can be electroplated by the electroplating assembly 300 to achieve the purpose of continuous production.

[0052] The following will be specifically described taking one of the embodiments as an example.

[0053] In the embodiment, the electroplating device 100 includes a tank body 110 containing an electroplating solution and a conveying assembly 400 and an electroplating assembly 300 arranged in the tank body 110. The conveying assembly 400 continuously transports the target object 200 from left to right. In the embodiment, three groups of electroplating assemblies 300 are arranged above the target object 200, and each group of electroplating assemblies 300 can include an upper plating assembly 310 on the left and a plating-removing assembly 320 on the right. In the embodiment, three groups of electroplating assemblies 300 are arranged below the target object 200, and each group of electroplating assemblies 300 includes a plating-removing assembly 320 on the left and an upper plating assembly 310 on the right, and the upper plating assembly 310 above and the plating-removing assembly 320 below are arranged correspondingly. The plating-removing assembly 320 above and the upper plating assembly 310 below are arranged correspondingly. The upper plating assembly 310 is provided with an anode 311 and a first blocking assembly 330, and the anode 311 is arranged at a first carrier plate 331 of the first blocking assembly 330. The plating-removing assembly 320 is provided with a cathode 321 and a conductive roller 322 located between the cathode 321 and the target object 200. The cathode 321 is arranged at a second carrier plate 341 of a second blocking assembly 340. The outer side of the conductive roller 322 is in contact with the target object 200.

[0054] When the whole electroplating device 100 is powered, the transport assembly 400 starts to drive the target object 200 to move from left to right, the conductive roller 322 is powered and rotates continuously. The conductive roller 322 is in contact with the target object 200, the surface of the target object 200 is formed as a negative electrode, the anode 311 is a positive electrode, an upper plating electric field is formed in the electroplating solution (the direction is from the anode 311 to the target object 200), metal ions in the electroplating solution are continuously transferred to the surface of the target object 200 to form a metal layer. At this time, the area of the conductive roller 322 close to the target object 200 forms a negative electrode area, and the area away from the target object 200 forms a positive electrode area, and a metal layer is also plated on the negative electrode area of the conductive roller 322, so in the depolarization electric field (from the conductive roller 322 to the cathode 321) formed by the positive electrode area and the cathode 321, the metal layer will be eliminated. Therefore, the conductive roller 322 continuously rotates, a metal layer is plated on the negative electrode area, and when it rotates to the positive electrode area, it will be eliminated, thereby achieving the purpose of continuous production.

[0055] The first blocking assembly 330 is arranged at the anode 311 to block the diffusion of the upper plating electric field, and the second blocking assembly 340 is arranged at the cathode 321 to block the diffusion of the depolarization electric field, the first blocking assembly 330 and the second blocking assembly 340 isolate the upper plating electric field and the depolarization electric field from interfering with each other, thereby ensuring the quality and effect of electroplating and depolarization, and facilitating continuous production.

[0056] At this point, those skilled in the art should recognize that although the present application has been shown and described in detail in the above embodiments, many other variations or modifications can be determined or deduced directly according to the disclosure of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should be understood and recognized as covering all these other variations or modifications.

Claims

1. An electroplating apparatus for electroplating a surface of a target object, characterized by, The electroplating device comprises at least one set of electroplating assemblies arranged on at least one side of the target object, each set of the electroplating assemblies comprises an upper plating assembly and a plating-eliminating assembly arranged side by side, the upper plating assembly comprises an anode, the plating-eliminating assembly comprises a cathode and a conductive roller arranged between the cathode and the target object, the conductive roller rotates continuously and is always in contact with the target object to form the target object into a negative electrode.

2. The electroplating device according to claim 1, wherein the number of the electroplating assemblies is multiple sets, and the multiple sets of the electroplating assemblies are arranged side by side on one side of the target object.

3. The electroplating device according to claim 1, wherein the number of the electroplating assemblies is multiple sets, and the multiple sets of the electroplating assemblies are arranged on both sides of the target object, and the electroplating assemblies on each side of the target object are arranged side by side.

4. The electroplating device according to claim 3, wherein the upper plating assembly on one side of the target object is arranged correspondingly to the plating-eliminating assembly on the other side of the target object.

5. The electroplating device according to any one of claims 1-4, further comprising at least one set of first blocking assemblies, each of the first blocking assemblies is arranged at the corresponding upper plating assembly to carry the anode and block the upper plating electric field formed between the anode and the target object from the outside.

6. The electroplating device according to claim 5, wherein each of the first blocking assemblies comprises: a first carrier plate in a hollow structure for carrying the anode; and a first partition plate arranged at both ends of the first carrier plate parallel to the movement direction of the target object, and the first partition plate is parallel to the direction of the upper plating electric field.

7. The electroplating device according to claim 6, further comprising second blocking assemblies, each of the second blocking assemblies is arranged at the corresponding plating-eliminating assembly to carry the cathode and block the plating-eliminating electric field formed between the cathode and the conductive roller from the outside.

8. The electroplating device according to claim 7, wherein each of the second blocking assemblies comprises: a second carrier plate for carrying the cathode; and a second partition plate arranged at both ends of the second carrier plate parallel to the movement direction of the target object, and the second partition plate is parallel to the direction of the plating-eliminating electric field.

9. The electroplating device according to claim 8, wherein one end of the first partition plate extends to the second carrier plate, and the other end of the first partition plate extends to the conductive roller.

10. The electroplating device according to any one of claims 1-3, further comprising a conveying assembly, the conveying assembly comprises a plurality of transmission rollers arranged on the lower side of the target object or on the upper side and the lower side of the target object to drive the target object to move. ​ ​ ​

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