Structure for controlling temperature of low-temperature substance

Abstract

The utility model relates to the technical field of temperature control, and discloses a structure for controlling the temperature of a low-temperature substance. The structure comprises a first-stage heat exchanger, a first-stage compressor, a first-stage pipeline, a second-stage heat exchanger, a second-stage compressor, a second-stage pipeline and an evaporator. The second-stage pipeline comprises a second-stage inlet pipe and a second-stage outlet pipe; an outlet of the evaporator is connected to a first heat exchange section of the second-stage heat exchanger through a second-stage outlet pipe, a second-stage compressor is installed on the second-stage outlet pipe, and an outlet of the first heat exchange section of the second-stage heat exchanger is connected to the evaporator through the second-stage outlet pipe. The first-stage pipeline comprises a first-stage inlet pipe and a first-stage outlet pipe; the second heat exchange section of the second-stage heat exchanger is connected to the first heat exchange section of the first-stage heat exchanger through a first-stage inlet pipe, a first-stage compressor is installed on a first-stage outlet pipe, and the first heat exchange section of the first-stage heat exchanger is connected to an inlet of the second heat exchange section of the second-stage heat exchanger through a first-stage outlet pipe.

Description

TECHNICAL FIELD

[0001] The utility model relates to temperature control technical field especially relates to a structure for controlling low temperature matter temperature. BACKGROUND

[0002] The ultra-low temperature refrigeration system (such as below-70 DEG C) generally adopts two-stage compressor step-down technology, relies on the evaporation and condensation of low temperature matter to realize heat exchange, but its core problem lies in that only single extremely low temperature low temperature matter can be output, and relatively high temperature matter (such as-40 DEG C to 20 DEG C) cannot be dynamically supplied, leading to the difficulty in heat matching with evaporator and other equipment.

[0003] At present, high temperature low temperature matter (such as 100 DEG C) and low temperature low temperature matter are directly mixed, which can easily cause severe temperature fluctuation, and the traditional system lacks dynamic adjustment mechanism, relies on fixed flow distribution or mechanical bypass valve, and has the problems of high energy consumption, slow response and low reliability. UTILITY MODEL CONTENTS

[0004] The utility model solves the technical problems that the temperature matching between the ultra-low temperature system and the evaporator is difficult, and the equipment size and energy consumption are reduced.

[0005] In order to solve the above technical problems, the utility model provides a structure for controlling low temperature matter temperature including: a primary heat exchanger, a primary compressor, a primary pipeline, a secondary heat exchanger, a secondary compressor, a secondary pipeline and an evaporator.

[0006] The secondary pipeline includes a secondary inlet pipe and a secondary outlet pipe.

[0007] The outlet of the evaporator is connected to the first heat exchange section inlet of the secondary heat exchanger through the secondary outlet pipe, the secondary outlet pipe is provided with the secondary compressor, the secondary compressor is located between the evaporator and the secondary heat exchanger, and the first heat exchange section outlet of the secondary heat exchanger is connected to the inlet of the evaporator through the secondary outlet pipe.

[0008] The primary pipeline includes a primary inlet pipe and a primary outlet pipe.

[0009] The second heat exchange section outlet of the secondary heat exchanger is connected to the first heat exchange section inlet of the primary heat exchanger through the primary inlet pipe, the primary outlet pipe is provided with the primary compressor, the primary compressor is located between the secondary heat exchanger and the primary heat exchanger, and the first heat exchange section outlet of the primary heat exchanger is connected to the second heat exchange section inlet of the secondary heat exchanger through the primary outlet pipe.

[0010] The second heat exchange section of the primary heat exchanger is used for heat exchange with an external cold source.

[0011] The evaporator is used for providing an ultra-low temperature test environment for chip low temperature test.

[0012] Preferably, the structure for controlling temperature of low-temperature substance further comprises a coaxial heat exchanger, the coaxial heat exchanger is installed on the second outlet pipe and between the evaporator and the second compressor, a first heat exchange section of the coaxial heat exchanger is used for connecting the second outlet pipe, and a second heat exchange section of the coaxial heat exchanger is used for heat exchange with an external cold source.

[0013] Preferably, the structure for controlling temperature of low-temperature substance further comprises a connecting pipe and a solenoid valve, the solenoid valve is installed on the connecting pipe, an inlet of the connecting pipe is connected to the second outlet pipe between the coaxial heat exchanger and the second compressor, and an outlet of the connecting pipe is connected to the second inlet pipe.

[0014] Preferably, the structure for controlling temperature of low-temperature substance further comprises a control system, the control system is electrically connected with the solenoid valve.

[0015] Preferably, the connecting pipe is a capillary tube.

[0016] Preferably, the solenoid valve is a one-way valve.

[0017] Preferably, the structure for controlling temperature of low-temperature substance further comprises a shell, the shell is internally provided with the first heat exchanger, the first compressor, the first pipe, the second heat exchanger, the second compressor and the second pipe.

[0018] Preferably, the structure for controlling temperature of low-temperature substance further comprises an air cooling device, the air cooling device is arranged outside the shell and is spaced from the shell, and the air cooling device is used for cooling the first compressor and the second compressor.

[0019] Compared with the prior art, the structure for controlling temperature of low-temperature substance has the following beneficial effects:

[0020] (1) The second low-temperature substance at the outlet of the evaporator enters the first heat exchange section of the second heat exchanger through the second outlet pipe, exchanges heat here, is pressurized by the second compressor, and then returns to the inlet of the evaporator. This process enables the second low-temperature substance to continuously absorb heat in the evaporator, thereby maintaining the low-temperature state in the evaporator and providing a stable ultra-low-temperature environment for the chip low-temperature test.

[0021] (2) The first low-temperature substance at the outlet of the second heat exchange section of the second heat exchanger enters the first heat exchange section of the first heat exchanger through the first inlet pipe, is pressurized by the first compressor, and then returns to the second heat exchange section of the second heat exchanger through the first outlet pipe.

[0022] (3) The second heat exchange section of the first heat exchanger is used for heat exchange with an external cold source. In the circulation process of the first low-temperature substance in the first pipe, when the first low-temperature substance flows through the first heat exchange section and the second heat exchange section of the first heat exchanger, heat exchange with the external cold source can be performed. The low-temperature characteristics of the external cold source can be utilized to further reduce the temperature of the low-temperature substance, thereby reducing the working load of the first compressor.

[0023] (4) through the primary heat exchanger, a primary compressor, a secondary heat exchanger, a secondary compressor and evaporator connection, formed a low-temperature substance circulation system. In this system, the primary low-temperature substance in the primary heat exchanger, a primary compressor and a primary pipeline between flow, secondary low-temperature substance in the secondary heat exchanger, a secondary compressor and a secondary pipeline between flow, constantly heat exchange and state change, so that two-stage compressor stepwise cooling, can accurately control the temperature in the evaporator, for chip low-temperature test to provide stable ultra-low temperature environment. BRIEF DESCRIPTION OF DRAWINGS

[0024] Fig. 1 is the schematic diagram of the embodiment of the utility model;

[0025] Fig. 2 is another schematic diagram of the embodiment of the utility model;

[0026] Fig. 3 is the sectional view of the low-temperature structure of the embodiment of the utility model.

[0027] In the drawing, 1, primary heat exchanger; 2, primary compressor; 3, secondary heat exchanger; 4, secondary compressor; 5, evaporator;

[0028] 6, primary pipeline; 61, primary inlet pipe; 62, primary outlet pipe;

[0029] 7, secondary pipeline; 71, secondary inlet pipe; 72, secondary outlet pipe;

[0030] 8, coaxial heat exchanger; 9, connecting pipe; 10, electromagnetic valve; 11, shell; 12, cold supply inlet pipe; 13, soft inlet pipe; 14, soft outlet pipe; 15, cold supply return pipe; 16, intercepting valve; 17, low-temperature structure; 18, hose fixing block. DETAILED DESCRIPTION

[0031] The specific embodiments of the utility model are described in further detail below in combination with the drawings and embodiments. The following embodiments are used to illustrate the utility model, but not to limit the scope of the utility model.

[0032] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "longitudinal", "transverse", "vertical", "horizontal", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and the like in the utility model are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the indicated device or element to have a specific orientation, to be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] like Figs. 1-2 As shown, a preferred embodiment of the present invention for controlling the temperature of a cryogenic substance includes: a primary heat exchanger 1, a primary compressor 2, a primary pipeline 6, a secondary heat exchanger 3, a secondary compressor 4, a secondary pipeline 7, and an evaporator 5;

[0035] The secondary pipeline 7 includes a secondary inlet pipe 71 and a secondary outlet pipe 72;

[0036] The outlet of evaporator 5 is connected to the inlet of the first heat exchange section of the second-stage heat exchanger 3 through a secondary outlet pipe 72. A second-stage compressor 4 is installed on the secondary outlet pipe 72. The second-stage compressor 4 is located between evaporator 5 and the second-stage heat exchanger 3. The outlet of the first heat exchange section of the second-stage heat exchanger 3 is connected to the inlet of evaporator 5 through the secondary outlet pipe 72.

[0037] The primary pipeline 6 includes a primary inlet pipe 61 and a primary outlet pipe 62;

[0038] The outlet of the second heat exchange section of the secondary heat exchanger 3 is connected to the inlet of the first heat exchange section of the primary heat exchanger 1 through the primary inlet pipe 61. The primary compressor 2 is installed on the primary outlet pipe 62. The primary compressor 2 is located between the secondary heat exchanger 3 and the primary heat exchanger 1. The outlet of the first heat exchange section of the primary heat exchanger 1 is connected to the inlet of the second heat exchange section of the secondary heat exchanger 3 through the primary outlet pipe 62.

[0039] The second heat exchange section of the primary heat exchanger 1 is used for heat exchange with an external cold source;

[0040] Evaporator 5 is used to provide an ultra-low temperature testing environment for chip low-temperature testing.

[0041] The working process of the utility model is: the secondary low-temperature material of the outlet of evaporator 5 enters the first heat exchange section of secondary heat exchanger 3 through secondary outlet pipe 72, exchanges heat here, is pressurized by secondary compressor 4 again, and then returns to the inlet of evaporator 5 again. The primary low-temperature material of the outlet of the second heat exchange section of secondary heat exchanger 3 enters the first heat exchange section of primary heat exchanger 1 through primary inlet pipe 61, is pressurized by primary compressor 2 again, and then returns to the second heat exchange section of secondary heat exchanger 3 through primary outlet pipe 62. The second heat exchange section of primary heat exchanger 1 is used for heat exchange with an external cold source. In the circulation process of the primary low-temperature material in primary pipeline 6, when the primary low-temperature material flows through the first heat exchange section and the second heat exchange section of primary heat exchanger 1, heat exchange with the external cold source can be carried out.

[0042] Based on the above scheme, by connecting the primary heat exchanger 1, the primary compressor 2, the secondary heat exchanger 3, the secondary compressor 4 and the evaporator 5, a low-temperature material circulation system is formed. In this system, the primary low-temperature material flows between the primary heat exchanger 1, the primary compressor 2 and the primary pipeline 6, and the secondary low-temperature material flows between the secondary heat exchanger 3, the secondary compressor 4 and the secondary pipeline 7, and heat exchange and state change are continuously carried out, so that the two-stage compressor carries out stepwise cooling, and the temperature in the evaporator 5 can be accurately controlled, thereby providing a stable ultra-low temperature environment for chip low-temperature testing.

[0043] Further, the temperature control structure for low-temperature material further comprises a coaxial heat exchanger 8, the coaxial heat exchanger 8 is installed on the secondary outlet pipe 72 and between the evaporator 5 and the secondary compressor 4, the first heat exchange section of the coaxial heat exchanger 8 is used for communicating with the secondary outlet pipe 72, and the second heat exchange section of the coaxial heat exchanger 8 is used for heat exchange with an external cold source.

[0044] Based on the above scheme, since the coaxial heat exchanger 8 reduces the temperature of the refrigerant entering the secondary compressor 4, the energy consumed by the secondary compressor 4 in the compression process is also correspondingly reduced. This is because the working load of the compressor is related to the temperature and pressure of the refrigerant, and the refrigerant with a lower temperature requires relatively less energy in the compression process. Therefore, through the cooling effect of the coaxial heat exchanger 8, the energy consumption of the secondary compressor 4 can be reduced, and the energy utilization efficiency of the whole system can be improved.

[0045] Further, the temperature control structure for low-temperature material further comprises a connecting pipe 9 and an electromagnetic valve 10, the electromagnetic valve 10 is installed on the connecting pipe 9, the inlet of the connecting pipe 9 is connected to the secondary outlet pipe 72 between the coaxial heat exchanger 8 and the secondary compressor 4, and the outlet of the connecting pipe 9 is connected to the secondary inlet pipe 71.

[0046] Based on the above scheme, the electromagnetic valve 10 installed on the connecting pipe 9 enables precise control of the flow direction of the secondary low-temperature substance in the system. When the electromagnetic valve 10 is open, the secondary low-temperature substance in the secondary outlet pipe 72 between the coaxial heat exchanger 8 and the secondary compressor 4 can flow into the secondary inlet pipe 71 through the connecting pipe 9. The flexible control mode enables the system to adjust the flow direction of the secondary low-temperature substance according to different working requirements and operating conditions, further optimizing the operating efficiency and performance of the system.

[0047] Further, the low-temperature substance temperature control structure further comprises a control system electrically connected with the electromagnetic valve 10.

[0048] Based on the above scheme, when the ultra-low-temperature system needs to output ultra-low-temperature refrigerant, the electromagnetic valve 10 is closed, and the high-temperature refrigerant cannot flow from the connecting pipe 9, and the ultra-low-temperature system returns to the initial state.

[0049] Further, the connecting pipe 9 is a capillary tube.

[0050] Based on the above scheme, the flow direction of the refrigerant is ensured by the pressure measurement. The refrigerant in the secondary inlet pipe 71 is high-pressure, and the refrigerant in the secondary outlet pipe 72 is low-pressure. When the high-temperature refrigerant in the secondary outlet pipe 72 enters the secondary inlet pipe 71 and flows rapidly through the capillary tube, a siphon effect is generated, which sucks the high-temperature refrigerant in the secondary outlet pipe 72 into the secondary inlet pipe 72, thereby realizing mixing and generating relatively high-temperature refrigerant.

[0051] Further, the electromagnetic valve 10 is a one-way valve.

[0052] Based on the above scheme, when the system fails, such as when the secondary compressor 4 suddenly stops working or the pressure abnormally rises, the one-way valve 10 can automatically prevent the abnormal flow of the secondary low-temperature substance, preventing further damage to the system. This self-protection mechanism improves the safety of the system, reduces the potential risks caused by failures, and enables the system to maintain a relatively stable operating state when facing various emergencies.

[0053] Further, the low-temperature substance temperature control structure further comprises a housing 11, and the housing 11 is provided with the primary heat exchanger 1, the primary compressor 2, the primary pipeline 6, the secondary heat exchanger 3, the secondary compressor 4, and the secondary pipeline 7.

[0054] Based on the above scheme, the various components are centrally arranged in the housing 11, realizing the integration of the system. This integrated design makes the entire low-temperature substance temperature structure more compact and reasonable, reducing the land area and space requirements of the system.

[0055] Further, the low-temperature substance temperature control structure further comprises an air cooling device, which is spaced apart from the shell 11 and located outside the shell 11, and is used to cool the primary compressor 2 and the secondary compressor 4.

[0056] Based on the above scheme, the air cooling device is specially used to cool the primary compressor 2 and the secondary compressor 4. The primary compressor 2 and the secondary compressor 4 will generate a large amount of heat during operation. If the heat cannot be dissipated in time and effectively, the temperature of the compressor will be too high, which will affect the performance and service life of the compressor. The air cooling device can quickly and effectively reduce the temperature of the compressor by forced air flow to take away heat, so as to ensure that the compressor operates within an appropriate temperature range, thereby improving the efficiency and reliability of the compressor.

[0057] Further, the low-temperature substance temperature control structure further comprises a cold supply inlet pipe 12, a soft inlet pipe 13, a soft outlet pipe 14, a cold supply return pipe 15, a cut-off valve 16, a low-temperature structure 17, and a soft pipe fixing block 18.

[0058] The cut-off valve 16 is installed on the cold supply inlet pipe 12, the cold supply inlet pipe 12 and the soft inlet pipe 13 are connected through the soft pipe fixing block 18, and the cold supply outlet pipe and the soft outlet pipe 14 are connected through the soft pipe fixing block 18.

[0059] The outlet of the evaporator 5 is sequentially connected to the inlet of the low-temperature structure 17 through the cold supply inlet pipe 12 and the soft pipe, and the outlet of the low-temperature structure 17 is sequentially connected to the inlet of the evaporator 5 through the soft outlet pipe 14 and the cold supply outlet pipe, and the low-temperature structure 17 is used to cool the chip.

[0060] Based on the above scheme, the cold supply inlet pipe 12 and the soft inlet pipe 13 are connected through the soft pipe fixing block 18, the cold supply outlet pipe and the soft outlet pipe 14 are connected through the soft pipe fixing block 18, and the evaporator 5 and the low-temperature structure 17 are connected in a detachable manner, so that the connection between the evaporator 5 and the low-temperature structure 17 is more flexible, a plurality of low-temperature structures 17 can be cooled at one time, and only the soft pipe needs to be disconnected, which greatly reduces the disassembly difficulty and time cost.

[0061] Further, the number of the cold supply inlet pipes 12 is multiple, and the number of the cut-off valves 16 corresponds to the number of the cold supply inlet pipes 12.

[0062] Based on the above scheme, the design of multiple cold supply inlet pipes 12 combined with one-to-one corresponding cut-off valves 16 makes the flow of each cold supply inlet pipe 12 adjustable independently. In the low-temperature substance temperature control structure, different cold supply inlet pipes 12 may be responsible for supplying refrigerant to different parts or different areas of the low-temperature structure 17. By controlling the opening degree of each cut-off valve 16 respectively, the refrigerant flow of each branch can be accurately adjusted according to the actual demand, so as to realize fine regulation of the cooling effect of the entire low-temperature structure 17.

[0063] Further, the low-temperature structure 17 is internally provided with a coil pipe, which is arranged in a spiral shape inside the low-temperature structure 17. Compared with a conventional straight pipe or other simple-shaped pipe, the coil pipe greatly increases the contact area with the low-temperature substance. This enables the refrigerant to flow inside the low-temperature structure 17 to more fully exchange heat with the coil pipe, thereby more effectively taking away heat and enhancing the cooling capacity of the low-temperature structure 17.

[0064] In summary, the embodiment of the present application provides a temperature control structure for low-temperature substance, which is connected between a first heat exchanger 1, a first compressor 2, a second heat exchanger 3, a second compressor 4 and an evaporator 5 to form a low-temperature substance circulation system. In this system, the first low-temperature substance flows between the first heat exchanger 1, the first compressor 2 and a first pipeline 6, and the second low-temperature substance flows between the second heat exchanger 3, the second compressor 4 and a second pipeline 7, and continuously exchanges heat and changes state, so that the two-stage compressor performs stepwise cooling, and the temperature in the evaporator 5 can be accurately controlled to provide a stable ultra-low-temperature environment for chip low-temperature testing.

[0065] The above description is only the preferred embodiment of the present application, and it should be pointed out that, for those skilled in the art, without departing from the technical principles of the present application, a number of improvements and replacements can be made, and these improvements and replacements should also be considered as the protection scope of the present application.

Claims

1. A structure for controlling the temperature of cryogenic materials, characterized in that, The application relates to a super-low temperature test system for a chip, which comprises a primary heat exchanger (1), a primary compressor (2), a primary pipeline (6), a secondary heat exchanger (3), a secondary compressor (4), a secondary pipeline (7) and an evaporator (5). The secondary pipeline (7) comprises a secondary inlet pipe (71) and a secondary outlet pipe (72). An outlet of the evaporator (5) is connected to an inlet of the secondary heat exchanger (3) through the secondary outlet pipe (72), the secondary outlet pipe (72) is provided with the secondary compressor (4), the secondary compressor (4) is located between the evaporator (5) and the secondary heat exchanger (3), and an outlet of a first heat exchange section of the secondary heat exchanger (3) is connected to an inlet of the evaporator (5) through the secondary outlet pipe (72). The primary pipeline (6) comprises a primary inlet pipe (61) and a primary outlet pipe (62). An outlet of a second heat exchange section of the secondary heat exchanger (3) is connected to an inlet of a first heat exchange section of the primary heat exchanger (1) through the primary inlet pipe (61), the primary outlet pipe (62) is provided with the primary compressor (2), the primary compressor (2) is located between the secondary heat exchanger (3) and the primary heat exchanger (1), and an outlet of the first heat exchange section of the primary heat exchanger (1) is connected to an inlet of the second heat exchange section of the secondary heat exchanger (3) through the primary outlet pipe (62). A second heat exchange section of the primary heat exchanger (1) is used for heat exchange with an external cold source. The evaporator (5) is used for providing a super-low temperature test environment for chip low-temperature test. The application further comprises a coaxial heat exchanger (8), the coaxial heat exchanger (8) is arranged on the secondary outlet pipe (72) and located between the evaporator (5) and the secondary compressor (4), a first heat exchange section of the coaxial heat exchanger (8) is used for communicating with the secondary outlet pipe (72), and a second heat exchange section of the coaxial heat exchanger (8) is used for heat exchange with an external cold source.

2. The temperature control structure for a cryogenic substance according to claim 1, wherein The application further comprises a connecting pipe (9) and an electromagnetic valve (10), the electromagnetic valve (10) is arranged on the connecting pipe (9), an inlet of the connecting pipe (9) is connected to the secondary outlet pipe (72) located between the coaxial heat exchanger (8) and the secondary compressor (4), and an outlet of the connecting pipe (9) is connected to the secondary inlet pipe (71).

3. The temperature control structure for a cryogenic substance according to claim 2, wherein The application further comprises a control system, the control system is electrically connected with the electromagnetic valve (10).

4. The temperature control structure for a cryogenic substance according to claim 3, wherein The connecting pipe (9) is a capillary tube.

5. The temperature control structure for a cryogenic substance according to claim 3, wherein The electromagnetic valve (10) is a one-way valve.

6. The temperature control structure for a cryogenic substance according to claim 3, wherein The application further comprises a shell (11), the primary heat exchanger (1), the primary compressor (2), the primary pipeline (6), the secondary heat exchanger (3), the secondary compressor (4) and the secondary pipeline (7) are arranged in the shell (11).

7. The temperature control structure for a cryogenic substance according to claim 1, wherein The application further comprises an air cooling device, the air cooling device is arranged outside the shell (11) and spaced from the shell (11), and the air cooling device is used for cooling the primary compressor (2) and the secondary compressor (4).

8. The temperature control structure for a cryogenic substance according to claim 7, wherein ​

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