Anti-sticking pressure head, testing seat and testing device

Abstract

The utility model provides an anti-sticking pressure head, a test seat and a test device. The anti-sticking pressure head comprises a pressure head main body, a thrust piece is arranged on the side, making contact with the chip product, of the pressing head body. And after the chip product is tested, the thrust generated by the thrust piece counteracts the adhesive force between the pressure head main body and the chip product, so that the pressure head main body is separated from the chip product. The anti-sticking pressure head provided by the utility model can solve the problem that an existing anti-sticking pressure head is easy to stick to a chip product.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor device package test, more specifically, relates to a kind of anti-sticking pressure head, test seat and testing device. BACKGROUND

[0002] In the electronic device production process, chip package product is made after completion, needs to carry out last step's package test, and specific package test process is as follows:

[0003] As shown in Figure 1 The chip package product 2' made after completion is placed in test seat 3' (Socket) first, then test is carried out, and in testing, the pressure head 1' on the upper die of test seat is pressed down, contacts the upper surface of product, and chip package product 1' is extruded under the pressure head 2' and completes subsequent test;Chip package product 2' is tested, and the pressure head 2' on test seat 3' is lifted, and the upper surface of chip package product 2' is separated.

[0004] In actual test process, since the size of chip product is small, and the quality is light, after testing is completed, product is often adhered to pressure head with the lifting of pressure head, which causes the risk that pressure head takes product away from original position of test seat 3'. Thus, product damage, product loss, test pause and other adverse effects are caused.

[0005] Based on the above technical problem, a scheme capable of effectively preventing product and pressure head from adhering is required. UTILITY MODEL CONTENT

[0006] In view of the above problems, the purpose of the utility model is to provide an anti-sticking pressure head to solve the problem that the existing anti-sticking pressure head is easy to adhere to chip product.

[0007] The anti-sticking pressure head provided by the utility model comprises a pressure head main body;Pushing piece is arranged on the side of the pressure head main body in contact with chip product.

[0008] When the chip product is tested, the pushing force generated by the pushing piece offsets the adhesion between the pressure head main body and the chip product, so that the pressure head main body and the chip product are separated.

[0009] In addition, preferably, the pushing piece comprises a gas outlet arranged on the side of the pressure head main body in contact with chip product, and the gas outlet is communicated with external gas supply device.

[0010] In addition, preferably, a cavity is arranged in the inside of the pressure head main body, one end of the gas outlet away from the chip product is communicated with the cavity;And,

[0011] A gas input pipe is arranged on the side of the pressure head body far from the chip product and communicates with the cavity.

[0012] In addition, preferably, an electromagnetic valve is arranged on the gas input pipe.

[0013] In addition, preferably, at least two gas output ports are arranged on the side of the pressure head body in contact with the chip product, and each gas output port communicates with the cavity.

[0014] In addition, preferably, the gas output ports are uniformly distributed on the side of the pressure head body in contact with the chip product.

[0015] In another aspect, the utility model also provides a test seat, including lower mould and upper mould, the upper mould includes preceding anti -sticking material pressure head, anti -sticking material pressure head with chip product upper and lower position correspondence.

[0016] In addition, preferably, the lower mould includes a test seat bottom plate and a test seat side plate, the test seat bottom plate and the test seat side plate form a test groove, and the chip product is placed in the test groove.

[0017] In another aspect, the utility model also provides a test device, including the test seat.

[0018] In addition, preferably, a test circuit board is arranged on the side of the test seat bottom plate far from the anti-sticking material pressure head, and a test probe electrically connected with the test circuit board is arranged in the test seat bottom plate.

[0019] The chip product in the test groove is electrically connected with the test circuit board through the test probe.

[0020] Compared with the prior art, the anti-sticking material pressure head, the test seat and the test device according to the utility model have the following beneficial effects:

[0021] The anti-sticking material pressure head provided by the utility model can generate a pushing force on the chip product through the pushing element when the test of the chip product is completed, the pushing force generated by the pushing element offsets the adhesion between the pressure head body and the chip product, so that the pressure head body and the chip product are separated, and the adhesion between the pressure head body and the chip product is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0022] Other purposes and results of the utility model will be more apparent and easy to understand by referring to the content of the following description and claims in combination with the drawings and with the more comprehensive understanding of the utility model.

[0023] In the drawings:

[0024] Figure 1 is a structural schematic diagram of an existing test device;

[0025] Figure 2 is a structural schematic diagram of a test device provided by the present application;

[0026] Reference signs: pressure head 1', chip package product 2', test seat 3', pressure head main body 1, cavity 11, electromagnetic valve 12, gas input pipe 13, gas output port 14, chip product 2, test seat side plate 31, test seat bottom plate 32, test probe 4, test circuit board 5.

[0027] The same reference signs in all the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0028] In the following description, for the purposes of providing a thorough understanding of one or more embodiments, numerous specific details are set forth. It is apparent, however, to one skilled in the art that the embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate a description of one or more embodiments.

[0029] In the description of the present application, it should be explained that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application; the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] Figure 2 The structural principle of the test device provided by the present application is shown, which contains the basic structure of the anti-sticking material pressure head and the test seat provided by the present application, such as Figure 2As shown, the utility model provides a prevent sticking pressure head, main include for to chip product 2 carry out the pressure head main body 1 of down pressure, prevent the pressure head main body 1 from leaving chip product 2 and the pressure head main body 1 adhesion, in the pressure head main body 1 with chip product 2 contact one side (such as Figure 2 The lower surface of the pressure head main body 1) is provided with a thrust element, the thrust element can produce a controllable thrust on the chip product 2; in the actual operation process, when the chip product 2 test is completed, the thrust generated by the thrust element offsets the adhesion between the pressure head main body 1 and the chip product 2, so that the pressure head main body 1 and the chip product 2 are separated, and then the pressure head main body leaves.

[0031] In one specific embodiment of the utility model, to realize the design of the thrust element, the thrust element can include a gas outlet 14 arranged on the side of the pressure head main body 1 in contact with the chip product 2, and the gas outlet 14 is in communication with an external gas supply device (such as a gas pump). In the actual operation process, when the chip product 2 test is completed, the gas supply device sends gas (such as air) to the gas outlet 14, and the gas is blown out from the gas outlet 14 to the chip product 2 to generate a thrust on the chip product 2, and the generated thrust offsets the adhesion between the pressure head main body 1 and the chip product 2, so that the pressure head main body 1 and the chip product 2 are separated, and then the pressure head main body leaves.

[0032] To realize the communication of the gas outlet 14 and the gas supply device, a cavity 11 containing gas can be arranged inside the pressure head main body, and one end of the gas outlet 14 away from the chip product 2 is in communication with the cavity 11; and a gas inlet pipe 13 in communication with the cavity 11 is arranged on the side of the pressure head main body away from the chip product 2, and one end of the gas inlet pipe 13 away from the chip product 2 is connected with the gas supply device.

[0033] In addition, to realize the control of the airflow in the whole gas circuit, an electromagnetic valve 12 can be arranged on the gas inlet pipe 13. In the actual use process, when the chip product 2 test is completed and the pressure head main body 1 needs to leave, control the electromagnetic valve 12 to open the gas circuit, a small amount of airflow enters the cavity 11 from the gas inlet pipe 13 above the pressure head main body 1, then enters the gas outlet 14 from the bottom of the pressure head main body 1, and flows out from the gas outlet 14, generating a downward thrust to resist the adhesion of the chip product 2 and the pressure head main body 1, which is sufficient to separate the chip product 2 and the pressure head main body 1 quickly, solving the problem of pressure head sticking.

[0034] It should be noted that, in order to increase the force area of the thrust member and the chip product 2, the gas outlet 14 can be provided on the side of the pressure head body 1 in contact with the chip product 2, and multiple (at least two) gas outlets 14 are provided, each of which is in communication with the cavity 11, and the thrust force is generated to the chip product 2 at different positions through the multiple gas outlets 14. Further, in order to ensure the stability of the thrust force generated by the thrust member to the chip product 2, the gas outlets 14 are uniformly distributed on the side of the pressure head body 1 in contact with the chip product 2; through this design, the chip product 2 can be uniformly stressed on the side close to the thrust member, preventing the thrust force at a certain position from being too large, and avoiding local damage to the chip product 2.

[0035] It should be noted that the thrust member formed by the gas outlet 14, the cavity 11, the gas inlet pipe 13 and the like is only one feasible embodiment provided by the present application; of course, in the actual design process, other structures of the thrust member can be designed, for example, the thrust member is designed by controlling the switch, cooperating with the spring and the buffer, etc., as long as the controllable thrust force generated by the thrust member to the chip can be met, and the thrust force can not only offset the adhesion between the pressure head body 1 and the chip product 2, but also will not damage the chip product 2.

[0036] On the other hand, in order to realize the adaptation of the chip product 2 and the test seat, the utility model also provides a test seat, which comprises a lower die and an upper die, the upper die comprises the aforementioned anti-sticking die head, and the anti-sticking die head corresponds to the upper and lower positions of the chip product 2; the lower die comprises a test seat bottom plate 32 and a test seat side plate 31, and the test groove is formed between the test seat bottom plate 32 and the test seat side plate 31, and the chip product 2 is placed in the test groove.

[0037] In addition, in order to realize the test of the chip product 2, the utility model also provides a test device, which comprises the aforementioned test seat; the test circuit board 5 is arranged on the side of the test seat bottom plate 32 away from the anti-sticking die head, and the test probe 4 electrically connected with the test circuit board 5 is arranged in the test seat bottom plate 32; and the chip product 2 in the test groove is electrically connected with the test circuit board 5 through the test probe 4.

[0038] In the actual test process, the chip product 2 is first placed in the test groove, and then the anti-sticking die head is pressed on the chip product 2, and in the process of pressing the chip product 2 by the anti-sticking die head, the chip product 2 is tested by the test circuit board 5 cooperating with the test probe 4; after the test is completed, the anti-sticking die head is separated from the chip product 2 by the thrust member, and finally the anti-sticking die head is separated.

[0039] As described above with reference to Figure 2The anti-sticking pressure head, the test seat and the test device according to the present application are described by way of examples. However, it should be understood by those skilled in the art that various improvements can be made to the anti-sticking pressure head, the test seat and the test device according to the present application without departing from the content of the present application. Therefore, the protection scope of the present application should be determined by the content of the appended claims.

Claims

1. An anti-sticking material press head, comprising a press head body; characterized in that, A thrust element is provided on the side of the pressure head body that contacts the chip product; After the chip product is tested, the thrust generated by the thrusting component counteracts the adhesion between the pressure head body and the chip product, thereby separating the pressure head body from the chip product.

2. The anti-sticking material press head as described in claim 1, characterized in that, The thrust component includes a gas outlet located on the side of the pressure head body that contacts the chip product, and the gas outlet is connected to an external gas supply device.

3. The anti-sticking material press head as described in claim 2, characterized in that, A cavity is provided inside the pressure head body, and the end of the gas outlet furthest from the chip product is connected to the cavity; and... A gas input pipe connected to the cavity is provided on the side of the pressure head body away from the chip product, and the end of the gas input pipe away from the chip product is connected to the gas supply device.

4. The anti-sticking material press head as described in claim 3, characterized in that, A solenoid valve is installed on the gas input pipe.

5. The anti-sticking material press head as described in claim 3 or 4, characterized in that, At least two gas outlets are provided on the side of the pressure head body that comes into contact with the chip product, and each gas outlet is connected to the cavity.

6. The anti-sticking material press head as described in claim 5, characterized in that, The gas outlets are evenly distributed on the side of the pressure head body that comes into contact with the chip product.

7. A test fixture, comprising a lower mold and an upper mold, characterized in that, The upper mold includes an anti-sticking pressure head as described in any one of claims 1 to 6, wherein the anti-sticking pressure head corresponds vertically to the chip product.

8. The test fixture as described in claim 7, characterized in that, The lower mold includes a test base plate and a test base side plate, and a test groove is formed between the test base plate and the test base side plate, and the chip product is placed in the test groove.

9. A testing device, characterized in that, Includes the test socket as described in claim 7 or 8.

10. The testing apparatus as described in claim 9, characterized in that, A test circuit board is disposed on the side of the test base plate away from the anti-stick pressure head, and test probes electrically connected to the test circuit board are disposed inside the test base plate; and... The chip product located in the test slot is electrically connected to the test circuit board through the test probe.

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