Circuit board heat dissipation device

By designing clamping and support components, the problems of complex and inconvenient fan disassembly in circuit board heat dissipation devices are solved, enabling convenient disassembly and maintenance, and improving the practicality and ease of use of the device.

CN223816341UActive Publication Date: 2026-01-20SUZHOU NINGHONG ELECTRONIC TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202520349462.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2026-01-20
Estimated Expiration
2035-03-03

AI Technical Summary

Technical Problem

Existing circuit board heat dissipation devices involve complex fan removal operations, making partial disassembly difficult. They also hinder the removal and installation of the heat dissipation device and the circuit board, resulting in insufficient practicality.

Method used

The design incorporates clamping and support components. The clamping component uses clamping plates and guide blocks to achieve stable installation and easy disassembly of the circuit board, while the support component uses threaded rods and L-shaped support rods to facilitate the disassembly and maintenance of the heat dissipation components.

Benefits of technology

It enables convenient disassembly and maintenance of the fan and heat dissipation components, improves the practicality of the device, simplifies the circuit board disassembly process, and enhances ease of use.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223816341U_ABST
    Figure CN223816341U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of circuit board heat dissipation, and particularly relates to a circuit board heat dissipation device, which comprises a mounting plate, a plurality of uniformly distributed heat dissipation fins are fixedly mounted on the left side and the right side of the top of the mounting plate, a clamping assembly is arranged at the bottom of the mounting plate, and a circuit board body is mounted at the bottom of the mounting plate through the clamping assembly. A penetrating groove is formed in the center of the interior of the mounting plate, a supporting assembly is arranged at the top of the mounting plate, and a heat dissipation assembly is mounted in the penetrating groove through the supporting assembly; the L-shaped supporting rod and the mounting plate can be connected and mounted through the threaded rod, the heat dissipation assembly is supported through the threaded rod and the L-shaped supporting rod, and meanwhile the supporting assembly can be detached from the top of the mounting plate after the threaded rod is rotated to be rotated out of the interior of the mounting plate; and the heat dissipation assembly can be disassembled, overhauled and replaced conveniently, operation is convenient, and therefore the device is convenient to use and high in practicability.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board heat dissipation technical field, specifically a circuit board heat dissipation device. BACKGROUND

[0002] The circuit board is a kind of board for bearing electronic components and connecting circuit, and it is mainly divided into ceramic circuit board, aluminum oxide ceramic circuit board, PCB board and aluminum substrate.The circuit board in prior art is mainly formed by board and various electronic components, in use process, by installing circuit board to specified position, after fixing is completed, the circuit board can be used.But in prior art, it is found that the circuit board generates a lot of heat when working, due to the poor heat dissipation effect of the circuit board itself, the electronic components of the circuit board are damaged when the heat of the circuit board is high, thereby affecting the use effect of the circuit board.

[0003] Patent application CN221381257U discloses a kind of circuit board heat dissipation device, including circuit board body;The fixed block is fixed to the side wall of the circuit board body;Multiple fixed blocks are evenly distributed on the side wall of the circuit board body and are the same structure;In use, first hold card block and pull, after pulling apart, then insert mounting block into the side wall of sliding slot, then release card block, card block will automatically restore and insert into the side wall of card slot, then when the circuit board body is working, start fan at the same time, blow the circuit board body, to dissipate heat for the circuit board body, in this process, the poor heat dissipation effect of the existing circuit board body itself can be reduced, which causes the circuit board body to be damaged when the temperature is high during use, at this time, the fan is set, and the heat dissipation effect of the circuit board body during use is achieved, and the fan can be easily disassembled and collected through the sliding slot.

[0004] However, the existing circuit board heat dissipation device is complex to disassemble the fan during use, and it is inconvenient to disassemble only the local fan, and it is inconvenient to disassemble and install the heat dissipation device and the circuit board, so that the device is not convenient to use, and the practicality is not strong enough, therefore, a kind of circuit board heat dissipation device is provided for the above problems. UTILITY MODEL CONTENTS

[0005] In order to make up for the shortcomings of the prior art, the existing circuit board heat dissipation device is complex to disassemble the fan during use, and it is inconvenient to disassemble only the local fan, and it is inconvenient to disassemble and install the heat dissipation device and the circuit board, so that the device is not convenient to use, and the practicality is not strong enough, therefore, a kind of circuit board heat dissipation device is provided for the above problems.

[0006] The utility model discloses a technical scheme that solves its technical problem is adopted: a kind of circuit board heat sink of the utility model, including mounting plate, the mounting plate top left and right sides are uniformly distributed with multiple fixed mounting of heat dissipation fin;

[0007] The mounting plate bottom is provided with clamping assembly, and the mounting plate bottom is provided with circuit board body by clamping assembly.

[0008] The center of the mounting plate is provided with a through slot, and the mounting plate top is provided with a supporting assembly.

[0009] Preferably, the clamping assembly includes a groove opened at the four corners of the mounting plate bottom, a fixed rod fixedly connected inside the groove, a guide block slidingly connected inside the groove, a through hole opened in the guide block, a spring fixedly connected between the guide block and the groove, the fixed rod penetrating the spring and the through hole, the bottom of the guide block penetrating the bottom of the mounting plate, a clamping plate fixedly connected to the bottom of the guide block, a clamping groove opened on the outer surface of the clamping plate, and the circuit board body located between the four clamping grooves.

[0010] Preferably, the supporting assembly includes a plurality of threaded rods screwed into the mounting plate, the threaded rods extend above the mounting plate, the threaded rods are screwed with L-shaped support rods on the outer surface, and the heat dissipation assembly is fixedly installed between the four L-shaped support rods.

[0011] Preferably, the heat dissipation assembly includes a motor fixedly connected between the four L-shaped support rods, the motor output is located inside the through slot, and the motor output is fixedly connected with a heat dissipation fan blade.

[0012] Preferably, the top of the clamping plate is attached to the bottom of the mounting plate, and the clamping plate is slidingly connected to the mounting plate.

[0013] Preferably, the top of the circuit board body and the upper surface between the clamping grooves leave a heat dissipation space for heat dissipation.

[0014] Preferably, the outer surface of the clamping plate is provided with anti-slip lines.

[0015] The utility model has the advantages that:

[0016] 1. The utility model connects and installs L-shaped support rod and mounting plate through threaded rod, supports heat dissipation assembly through threaded rod and L-shaped support rod, and when threaded rod is rotated and moved out from the inside of mounting plate, supporting assembly can be disassembled from the top of mounting plate, heat dissipation assembly can be disassembled, repaired and replaced conveniently, and operation is convenient, so that the device is convenient to use, and has high practicability.

[0017] 2. The utility model discloses through moving the clamping plate makes the clamping plate slide at the bottom of the mounting plate, and the clamping plate slides and drives the guide block to slide in the recess, and the fixed rod passes through the guide block, so the guide block can stably slide in the recess, and also can not fall off from the recess, then the sliding of guide block can stretch the spring, and the spring has rebound force after being stretched, and four clamping slots of clamping plate can clamp and install the circuit board body through the rebound force of spring, when needing to disassemble the circuit board body, moves the clamping plate to make it separate the clamping of circuit board body, thereby the device convenient to use, and the circuit board body is convenient to disassemble. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, below will to the embodiment or prior art description needed to use the drawing briefly introduce, obviously, below description in the drawing is only some embodiments of the utility model, for the person skilled in the art comes, under the premise of not paying the creative labor, can also obtain other drawings according to these drawings.

[0019] Figure 1 It is the stereogram structure schematic diagram in embodiment one;

[0020] Figure 2 It is the bottom structure schematic diagram in embodiment one;

[0021] Figure 3 It is the local right section structure schematic diagram in embodiment one;

[0022] Figure 4 It is the structure schematic diagram in embodiment one Figure 3 It is the enlarged structure schematic diagram in A place;

[0023] Figure 5 It is the anti -skid line structure schematic diagram in embodiment two.

[0024] In the drawing: 1, circuit board body;2, clamping plate;3, mounting plate;4, heat dissipation fin;5, motor;6, L type support rod;7, through groove;8, threaded rod;9, heat dissipation fan blade;10, clamping slot;11, recess;12, spring;13, fixed rod;14, guide block;15, through -hole;16, anti -skid line. DETAILED DESCRIPTION

[0025] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Embodiment one

[0027] Please refer to Figures 1-4 As shown in FIG. 1, a circuit board heat dissipation device comprises a mounting plate 3, and a plurality of evenly distributed heat dissipation fins 4 are fixedly installed on the top of the mounting plate 3.

[0028] A clamping assembly is arranged at the bottom of the mounting plate 3, and a circuit board body 1 is installed on the mounting plate 3 through the clamping assembly.

[0029] A through groove 7 is formed in the center of the mounting plate 3, a supporting assembly is arranged on the top of the mounting plate 3, and a heat dissipation assembly is installed in the through groove 7 through the supporting assembly. When working, the circuit board body 1 is installed on the mounting plate 3 through the clamping assembly, and the heat dissipation fins 4 on the top of the mounting plate 3 and the heat dissipation assembly together dissipate heat from the circuit board body 1, so that the heat dissipation effect is better. At the same time, the supporting assembly facilitates local disassembly, repair and replacement of the heat dissipation assembly, and the whole heat dissipation device does not need to be disassembled, so that the device is convenient to use.

[0030] The clamping assembly comprises grooves 11 opened at the four corners of the bottom of the mounting plate 3, fixed rods 13 fixedly connected inside the grooves 11, guide blocks 14 slidably connected inside the grooves 11, through holes 15 opened in the guide blocks 14, springs 12 fixedly connected between the guide blocks 14 and the grooves 11, the fixed rods 13 penetrating the springs 12 and the through holes 15, the guide blocks 14 penetrating the bottom of the mounting plate 3, clamping plates 2 fixedly connected to the bottom of the guide blocks 14, clamping grooves 10 opened on the outer surfaces of the clamping plates 2, and the circuit board body 1 located between the four clamping grooves 10.

[0031] The support assembly comprises a plurality of threaded rods 8 threadedly connected inside the mounting plate 3, the threaded rods 8 extending above the mounting plate 3, L-shaped support rods 6 threadedly connected to the outer surfaces of the threaded rods 8, and the heat dissipation assembly fixedly installed between the four L-shaped support rods 6.

[0032] The heat dissipation assembly comprises a motor 5 fixedly connected between the four L-shaped support rods 6, the output end of the motor 5 located inside the through groove 7, and heat dissipation fan blades 9 fixedly connected to the output end of the motor 5.

[0033] The top of the clamping plate 2 is attached to the bottom of the mounting plate 3, and the clamping plate 2 is slidably connected to the mounting plate 3.

[0034] The top of the circuit board body 1 and the upper surface of the inside of the clamping groove 10 are left with a heat dissipation space for heat dissipation; during operation, the heat dissipation of the part of the top of the circuit board body 1 located in the inside of the clamping groove 10 is avoided from being affected.

[0035] Embodiment two

[0036] Please refer to Figure 5 As another embodiment of the utility model, the outer surface of the clamping plate 2 is provided with anti-skid lines 16, as compared with embodiment one; during operation, the design of the anti-skid lines 16 facilitates the hand-held clamping plate 2 to pull and move the clamping plate 2, and makes the outer surface of the clamping plate 2 have better anti-skid effect.

[0037] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] The basic principles, main features and advantages of the utility model are shown and described above. It should be understood by those skilled in the art that the utility model is not limited by the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model can also have various changes and improvements, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A circuit board heat dissipation device, comprising a mounting plate (3), wherein multiple uniformly distributed heat dissipation fins (4) are fixedly mounted on the top left and right sides of the mounting plate (3); Its features are: The mounting plate (3) is provided with a clamping component at its bottom, and the circuit board body (1) is mounted on the bottom of the mounting plate (3) through the clamping component; The mounting plate (3) has a through slot (7) at its center, and a support component is provided on the top of the mounting plate (3). A heat dissipation component is installed inside the through slot (7) through the support component.

2. The circuit board heat dissipation device according to claim 1, characterized in that: The clamping assembly includes grooves (11) at the four corners of the bottom of the mounting plate (3). A fixing rod (13) is fixedly connected inside the groove (11). A guide block (14) is slidably connected inside the groove (11). A through hole (15) is opened inside the guide block (14). A spring (12) is fixedly connected between the guide block (14) and the groove (11). The fixing rod (13) passes through the spring (12) and the through hole (15). The bottom of the guide block (14) passes through the bottom of the mounting plate (3). A clamping plate (2) is fixedly connected to the bottom of the guide block (14). A clamping groove (10) is opened on the outer surface of the clamping plate (2). The circuit board body (1) is located between the four clamping grooves (10).

3. A circuit board heat dissipation device according to claim 2, characterized in that: The support assembly includes multiple threaded rods (8) threaded inside the mounting plate (3), the top of the threaded rods (8) extending above the mounting plate (3), and L-shaped support rods (6) threaded to the outer surface of the threaded rods (8). The heat dissipation assembly is fixedly installed between the four L-shaped support rods (6).

4. A circuit board heat dissipation device according to claim 3, characterized in that: The heat dissipation assembly includes a motor (5) fixedly connected between four L-shaped support rods (6), the output end of the motor (5) is located inside the through slot (7), and a heat dissipation fan blade (9) is fixedly connected to the output end of the motor (5).

5. A circuit board heat dissipation device according to claim 4, characterized in that: The top of the clamping plate (2) is attached to the bottom of the mounting plate (3), and the clamping plate (2) and the mounting plate (3) are slidably connected.

6. A circuit board heat dissipation device according to claim 5, characterized in that: A heat dissipation space is provided between the top of the circuit board body (1) and the upper surface inside the clamping groove (10) for heat dissipation.

7. A circuit board heat dissipation device according to claim 6, characterized in that: The outer surface of the clamping plate (2) is provided with anti-slip texture (16).

Citation Information

Patent Citations

  • Circuit board heat dissipation device

    CN221381257U