Automatic chip testing device

Abstract

The invention discloses an automatic chip testing device, which belongs to the field of chip testing and comprises a working plate and supporting legs fixedly connected to the lower surface of the working plate, a mounting mechanism is mounted on the upper surface of the working plate, and a testing mechanism is mounted on one side of the upper surface of the working plate. The mounting mechanism comprises a mounting plate slidably connected to the upper surface of the working plate, and mounting grooves are formed in the upper surface of the mounting plate in a rectangular array mode. Through cooperative use of the devices, a driving motor is started according to the position of a chip body, so that a threaded rod drives an abutting spring and a bearing plate to move, the position of the chip body is finely adjusted, positioning of the chip body is more accurate, and through arrangement of a pressure sensor, the connection pressure of a pin and an elastic probe is monitored in real time, so that the accuracy of chip positioning is improved. According to the pressure setting threshold value and the electric push rod, the chip body is driven to move up and down, and the connection between the pin and the elastic probe is adjusted, so that the connection between the chip body and the elastic probe is more accurate.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to an automated chip testing device. Background Technology

[0002] Electric vehicle chips are the "brain" and "nerve center" of electric vehicles, as important as chips are to computers and mobile phones. Compared with traditional fuel vehicles, electric vehicles have an exponential increase in the demand for the quantity, performance, and types of chips. Chips are the core components that determine the level of intelligence and electrification of electric vehicles. Electric vehicle chips are the core technology that drives the transformation of the automotive industry. They enable cars to evolve from simple means of transportation into mobile intelligent terminals, energy storage units, and digital spaces. Understanding the classification and functions of these chips is key to understanding the competitive landscape and technological development of modern intelligent electric vehicles.

[0003] An investigation revealed that an invention patent (publication number: CN114200174B) discloses an automated testing device for chip testing, comprising: a testing workbench; a chip detection device installed on one side of the upper surface of the testing workbench; a first conveyor belt embedded on the side of the upper surface of the testing workbench away from the chip detection device, wherein multiple chips to be tested are evenly arranged on the first conveyor belt; a second conveyor belt used to transport and reject unqualified chips after testing; a transfer component vertically disposed in the middle of the upper surface of the testing workbench, which can be rotated relative to the chip detection device, and is used to transfer the chip to be tested from the first conveyor belt to the chip detection device for testing. When the chip passes the test, it is transferred back to its original position, and when the chip fails the test, it is transferred to the second conveyor belt; and a pick-and-place component symmetrically disposed on both sides of the transfer component.

[0004] While the aforementioned patent utilizes a pick-and-place assembly to tilt and grip the chip under test, allowing it to preferentially contact the inverted L-shaped latch on the slot via its tilted lower edge, and then be horizontally positioned by the adsorption and fixing device under deflection, thus preventing surface scratches after contact with the test probe and effectively improving testing efficiency, the traditional test boards often use fixed pin slots or manual soldering to install the chip. This can lead to wear and increased contact resistance at the metal points of the slots after prolonged use, resulting in increased current measurement errors. Consequently, the accuracy of subsequent chip testing decreases, affecting the final test results.

[0005] Therefore, the present invention provides an automated chip testing device to solve the above-mentioned problems. Summary of the Invention

[0006] (a) Technical problems to be solved This invention provides an automated chip testing device, which aims to solve the problems mentioned in the background art.

[0007] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: an automated chip testing device, comprising a working board and a support leg fixedly connected to the lower surface of the working board, wherein an installation mechanism is mounted on the upper surface of the working board, and a testing mechanism is mounted on one side of the upper surface of the working board; The mounting mechanism includes a mounting plate slidably connected to the upper surface of the working plate. The upper surface of the mounting plate has mounting grooves arranged in a rectangular array. The two inner walls of the mounting grooves are slidably connected to a bearing plate. The two outer edges of the bearing plate are fixedly connected to a retaining spring. One end of each of the retaining springs is fixedly connected to a threaded rod. A threaded cylinder is threaded onto the surface of the threaded rod. One end of the threaded cylinder is fixedly connected to a drive motor slidably connected to the mounting plate by bolts. The lower surface of the drive motor is fixedly connected to an electric push rod fixedly connected to the mounting plate.

[0008] As a preferred technical solution of this application, the testing mechanism includes a test box fixedly connected to one side of the upper surface of the work plate, a mounting frame fixedly connected inside the test box, a pneumatic push rod fixedly connected in a rectangular array on the lower surface of the mounting frame, a hollow box fixedly connected to the output end of the pneumatic push rod, and a clamping plate fixedly connected inside the hollow box.

[0009] As a preferred technical solution of this application, the testing mechanism further includes a set of return springs fixedly connected in a rectangular array inside the hollow box. One end of several of the return springs is fixedly connected to a protective box that is slidably connected to the hollow box. The protective box corresponds to the mounting slot. Both inner walls of the protective box are fixedly connected in a path array to electromagnetic coils corresponding to the mounting slot.

[0010] As a preferred technical solution of this application, the testing mechanism further includes air pumps that are fixedly connected in a path array inside the testing chamber and are evenly divided into two groups. The output ends of one group of air pumps are fixedly connected to heating pipes, and the output ends of the other group of air pumps are fixedly connected to cooling pipes. The surfaces of the heating pipes and cooling pipes are fixedly connected in a path array to air inlet pipes that communicate with the hollow box.

[0011] As a preferred technical solution of this application, the testing mechanism further includes solenoid valves fixedly connected to the surface of the air inlet pipe in a path array and communicating with the air inlet pipe. One set of the air pumps has a heat inlet pipe fixedly connected to its input end, and another set of the air pumps has a delivery pipe fixedly connected to its input end. The inside of the testing chamber is fixedly connected to a Peltier semiconductor refrigeration module whose hot and cold ends correspond to the heat inlet pipe and the delivery pipe, respectively.

[0012] As a preferred technical solution of this application, the mounting mechanism further includes elastic probes mounted in a path array inside the mounting groove. Several lower surfaces corresponding to the elastic probes are all fixedly connected to pressure sensors that are fixedly connected to the bottom wall of the mounting groove. The surfaces of the elastic probes are fitted with pins, and the surfaces corresponding to the pins are all fixedly connected to chip bodies corresponding to the mounting groove.

[0013] As a preferred technical solution of this application, the hollow box and the protective box are respectively corresponding to the chip body. The two sides of the chip body are respectively attached to the corresponding carrier plate. One side of the test box is provided with a feeding groove corresponding to the mounting plate. One side of the upper surface of the mounting plate is fixedly connected to a heat-insulated box containing a high-precision digital multimeter, oscilloscope and power analyzer.

[0014] As a preferred technical solution of this application, the high-precision digital multimeter, oscilloscope and power analyzer are all electrically connected to the chip body, the heat insulation box is equipped with a power supply, the upper surface of the test box is fixedly connected to a control panel, and one side of the upper surface of the test box is fixedly connected to a power supply component that is electrically connected to the test mechanism.

[0015] As a preferred technical solution of this application, the installation mechanism further includes a push plate fixedly connected to one side of the mounting plate, a lead screw threadedly connected to the surface of the push plate, a servo motor fixedly connected to one end of the lead screw and fixedly connected to the mounting plate, and a guide rod fixedly connected to the mounting plate sleeved on one side of the push plate.

[0016] As a preferred technical solution of this application, a robotic arm corresponding to the mounting plate is fixedly connected to the edge of the upper surface of the mounting plate, and a high-definition camera is fixedly connected to the surface of the end effector of the robotic arm. The robotic arm, the high-definition camera, the mounting slot, and the chip body correspond to each other.

[0017] (III) Beneficial Effects Based on the cooperation of the mounting mechanism and the testing mechanism, the chip body is placed in the mounting slot by a robotic arm and an end effector, so that the pins are in contact with the elastic probes. The chip body position is located by a high-definition camera. According to the chip body position, the drive motor is started, which causes the threaded rod to drive the clamping spring and the carrier plate to move, and the chip body position is finely adjusted to make its positioning more accurate. In addition, the connection pressure between the pins and the elastic probes is monitored in real time by setting a pressure threshold and an electric push rod to move the chip body up and down, and adjust the connection between the pins and the elastic probes to make the connection between the chip body and the elastic probes more accurate. In addition, by using the elastic probes and adjusting the position of the chip body, the test carrier board is avoided from using fixed pin slots or manual soldering to install the chip, which can cause metal point wear and affect the test results of the chip body. Based on the installation mechanism, the chip body is installed by a robotic arm and an end effector. The movement of the chip body is achieved through the cooperation of servo motors and lead screws. This allows for automated testing of the chip body's electrical variables using a high-precision digital multimeter, oscilloscope, and power analyzer. Furthermore, the high-definition camera allows the robotic arm to inspect the surface of the chip body during installation, avoiding testing chips with scratches and reducing the workload of testing. Based on the setup of the testing mechanism and other structures, the chip body is isolated by hollow boxes and protective boxes during chip body testing. Multiple pneumatic push rods allow multiple clamping plates to subject multiple chip bodies to different pressures. At the same time, based on the cooperation of Peltier semiconductor cooling modules and air pumps, different temperatures are controlled inside different hollow boxes. This allows the testing device to test multiple chips under different conditions, enabling comparative testing of multiple chips at different test intensities. This not only improves the efficiency of chip body testing but also further simulates the electrical variable testing of chip bodies under different environments, improving the accuracy of chip body test results. Based on the setup of electromagnetic coils and solenoid valves, when the chip body is tested inside the hollow box, the opening and closing degree of the solenoid valve is controlled according to the test requirements to regulate the temperature of the environment in which the chip body is located. At the same time, the electromagnetic coil generates a magnetic field to simulate the electrical variables of the chip body under different magnetic fields. Furthermore, through the coupling of magnetic field and temperature, the environment is further simulated realistically, and the electrical variables of the chip body under different environments are tested, thereby more accurately testing the state of the chip body. Attached Figure Description Figure 1 This is a schematic diagram of an automated chip testing device. Figure 2 This is a schematic diagram of an automated chip testing device from a second-view perspective. Figure 3This is a schematic diagram of the testing mechanism in an automated chip testing device. Figure 4 This is a schematic diagram of the pneumatic push rod, hollow box, and air pump in an automated chip testing device. Figure 5 This is a schematic diagram of the pneumatic push rod, hollow box, and protective box in an automated chip testing device. Figure 6 This is a schematic diagram of the mounting mechanism in an automated chip testing device. Figure 7 This is a schematic diagram of the structure of a mounting plate, mounting slot, and elastic probe in an automated chip testing device. Figure 8 This is a schematic diagram of the structure of a carrier plate, an electric push rod, and a clamping spring in an automated chip testing device. Figure 9 This is a schematic diagram of the mounting mechanism and the testing mechanism in an automated chip testing device. Figure 10 This is a schematic diagram of the structure of a robotic arm and a high-definition camera in an automated chip testing device.

[0018] In the picture: 1. Working plate; 2. Mounting mechanism; 201. Mounting plate; 202. Mounting slot; 203. Support plate; 204. Clamping spring; 205. Threaded rod; 206. Threaded cylinder; 207. Drive motor; 208. Electric push rod; 209. Elastic probe; 210. Pressure sensor; 211. Pin; 212. Chip body; 213. Push plate; 214. Lead screw; 215. Servo motor; 3. Testing mechanism; 301. Test box; 302. Mounting bracket; 303, pneumatic push rod; 304, hollow box; 305, clamping plate; 306, return spring; 307, protective box; 308, electromagnetic coil; 309, air pump; 310, heating tube; 311, cooling tube; 312, air inlet tube; 313, solenoid valve; 314, heat inlet tube; 315, delivery tube; 316, Peltier semiconductor refrigeration module; 4, heat insulation box; 5, control panel; 6, power supply assembly; 7, robotic arm; 8, high-definition camera. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] This invention provides an automated chip testing device, with reference to... Figures 1-10 As shown, three embodiments are provided: Example 1: The automated chip testing device includes a working board 1 and a support leg fixedly connected to the lower surface of the working board 1. An installation mechanism 2 is installed on the upper surface of the working board 1, and a testing mechanism 3 is installed on one side of the upper surface of the working board 1. A robotic arm 7 corresponding to the mounting plate 201 is fixedly connected to the edge of the upper surface of the mounting plate 201. A high-definition camera 8 is fixedly connected to the surface of the end effector of the robotic arm 7. The robotic arm 7, the high-definition camera 8, the mounting slot 202, and the chip body 212 correspond to the robotic arm 7, the high-definition camera 8, the mounting slot 202, and the chip body 212. Among them, the robotic arm 7 and the end effector are used to clamp and install the chip; Among them, the high-definition camera 8 is used to display the chip status; The mounting mechanism 2 includes a mounting plate 201 slidably connected to the upper surface of the working plate 1. The upper surface of the mounting plate 201 has mounting grooves 202 arranged in a rectangular array. The two inner walls of the mounting grooves 202 are slidably connected to a bearing plate 203. The two outer edges of the bearing plate 203 are fixedly connected to a retaining spring 204. One end of the two retaining springs 204 is fixedly connected to a threaded rod 205. The surface of the threaded rod 205 is threaded with a threaded sleeve 206. One end of the threaded sleeve 206 is fixedly connected to a drive motor 207 slidably connected to the mounting plate 201 by bolts. The lower surface of the drive motor 207 is fixedly connected to an electric push rod 208 fixedly connected to the mounting plate 201. Among them, mounting plate 201 is used for transmitting chips and mounting chips; The mounting slot 202 and the carrier plate 203 are used to limit the position of the chip; The clamping spring 204 and the support plate 203 work together to clamp and position the chip. Among them, the threaded rod 205, the threaded cylinder 206, and the drive motor 207 are used to adjust the position of the chip; Among them, the electric push rod 208 is used to adjust the installation strength between the chip and the mounting mechanism 2; Specifically, the robotic arm 7 is activated, causing the end effector to clamp the chip. The high-definition camera 8 takes a picture of the chip to observe whether there are scratches on the chip surface. Chips with scratches are directly classified as defective and will not be installed inside the mounting slot 202. Chips without scratches are installed inside the mounting slot 202 by the end effector. Based on the cooperation of the support plate 203 and the clamping spring 204, the chip is clamped and the action of inserting the chip into the mounting slot 202 is completed. At the same time, the high-definition camera 8 locates the position of the chip inside the mounting slot 202. When the position is offset, the drive motor 207 is started, and its output end drives the threaded cylinder 206 to rotate, which causes the threaded rod 205 to move, which drives the corresponding clamping spring 204 and the support plate 203 to move, which causes the corresponding support plate 203 to push the chip to move, thus fine-tuning the position of the chip and making the chip installation position more accurate. The mounting mechanism 2 also includes elastic probes 209 arranged in a path array inside the mounting groove 202. The lower surfaces of several corresponding elastic probes 209 are all fixedly connected to pressure sensors 210 that are fixedly connected to the bottom wall of the mounting groove 202. The surfaces of the elastic probes 209 are attached with pins 211, and the surfaces of the corresponding pins 211 are all fixedly connected to chip bodies 212 corresponding to the mounting groove 202. Among them, the elastic probe 209 is used to connect to the pin 211 of the chip body 212; Among them, the pressure sensor 210 is used to monitor the connection pressure between the pin 211 and the elastic probe 209 in real time; Specifically, after the chip body 212 is inserted into the mounting slot 202, the pin 211 contacts the elastic probe 209. Based on the setting of the pressure sensor 210, the pressure of the pin 211 in contact with the elastic probe 209 is monitored. When the pressure exceeds the threshold, the electric push rod 208 is activated, and its output end drives the drive motor 207 to move upward. Based on the threaded rod 205 and the clamping spring 204, the corresponding carrier plate 203 is moved. At the same time, based on the elastic force of the clamping spring 204, the chip body 212 and the carrier plate 203 are more tightly attached, thereby driving the other carrier plate 203 to move, realizing the position adjustment of the chip body 212, thereby realizing the adjustment of the connection pressure of the pin 211 and the elastic probe 209, making the connection between the chip body 212 and the elastic probe 209 more accurate, avoiding the wear of metal points caused by the test carrier board using fixed pin slots or manual soldering to install the chip, which would affect the test results of the chip body 212. The mounting mechanism 2 also includes a push plate 213 fixedly connected to one side of the mounting plate 201. A lead screw 214 is threadedly connected to the surface of the push plate 213. A servo motor 215 fixedly connected to the mounting plate 201 is fixedly connected to one end of the lead screw 214. A guide rod fixedly connected to the mounting plate 201 is sleeved on one side of the push plate 213. Among them, the push plate 213 corresponds to the feed groove and achieves a sealing effect on the feed groove. At the same time, the push plate 213 is used to push the mounting plate 201 to realize the transfer of the chip body 212. Among them, the lead screw 214 and the servo motor 215 are used to drive the push plate 213 to move; Specifically, after the chip body 212 is installed, the servo motor 215 is started, and its output end drives the lead screw 214 to rotate, so that the push plate 213 slides on the working plate 1, thereby causing the mounting plate 201 to carry the chip body 212 to the inside of the test box 301.

[0021] In Example 2, based on Example 1, the testing mechanism 3 further includes a test box 301 fixedly connected to one side of the upper surface of the work plate 1. A mounting frame 302 is fixedly connected inside the test box 301. A pneumatic push rod 303 is fixedly connected in a rectangular array on the lower surface of the mounting frame 302. A hollow box 304 is fixedly connected to the output end of the pneumatic push rod 303. A clamping plate 305 is fixedly connected inside the hollow box 304. Among them, test chamber 301 is used to isolate the external environment; The mounting bracket 302 is used to mount the pneumatic push rod 303; Among them, the pneumatic push rod 303 is used to drive the hollow box 304 and the clamping plate 305 to move; The hollow box 304 is used to isolate the chip body 212; The clamping plate 305 is used to provide downward pressure on the chip body 212; The testing mechanism 3 also includes a set of return springs 306 fixedly connected in a rectangular array inside the hollow box 304. One end of several set of return springs 306 is fixedly connected to a protective box 307 that is slidably connected to the hollow box 304. The protective box 307 corresponds to the mounting groove 202. Both inner walls of the protective box 307 are fixedly connected in a path array to electromagnetic coils 308 corresponding to the mounting groove 202. Among them, the return spring 306 is used to reset the protective box 307; The protective box 307 is slidably connected to the inside of the hollow box 304, so that after the pneumatic push rod 303 moves the hollow box 304, it can adjust the downward pressure of the clamping plate 305 on the chip body 212. Among them, the electromagnetic coil 308 is used to simulate the change of the surrounding magnetic field during the use of the chip body 212; Specifically, after the chip body 212 moves into the test chamber 301, the pneumatic push rod 303 is activated, causing its output end to drive the hollow box 304, the clamping plate 305, and the protective box 307 to move downwards, so that the protective box 307 and the hollow box 304 isolate the chip body 212. Then, based on the sliding connection between the protective box 307 and the hollow box 304, the pneumatic push rod 303 can adjust the downward pressure of the hollow box 304 and the clamping plate 305 on the chip body 212, thereby testing the electrical variables of the chip body 212 under different pressures. Simultaneously, according to the testing requirements, the electromagnetic coil 308 is activated to form a magnetic field inside the hollow box 304 and the protective box 307, simulating the change of the surrounding magnetic field of the chip body 212 during use, making the test results of the chip body 212 more accurate. Furthermore, according to the multiple pneumatic push rods 303, the multiple clamping plates 305 enable multiple chip bodies 212 to bear different pressures, realizing the comparative test of multiple chip bodies 212 with different test intensities. This not only improves the testing efficiency of the chip body 212, but also further simulates the electrical variable test of the chip body 212 under different environments. The testing mechanism 3 also includes air pumps 309 that are fixedly connected in a path array inside the test chamber 301 and are evenly divided into two groups. The output ends of one group of air pumps 309 are fixedly connected to heating tubes 310, and the output ends of the other group of air pumps 309 are fixedly connected to cooling tubes 311. The surfaces of the heating tubes 310 and the cooling tubes 311 are fixedly connected in a path array to air inlet tubes 312 that communicate with the hollow box 304. Among them, the air pump 309 is used for gas transmission; Among them, heating pipe 310 is used to transport hot air, and cooling pipe 311 is used to transport cold air; The intake pipe 312 is used to guide hot or cold air. The testing mechanism 3 also includes solenoid valves 313 that are fixedly connected to the surface of the air inlet pipe 312 in a path array and are connected to the air inlet pipe 312. The input end of one set of air pumps 309 is fixedly connected to the heat inlet pipe 314, and the input end of another set of air pumps 309 is fixedly connected to the delivery pipe 315. The interior of the testing chamber 301 is fixedly connected to a Peltier semiconductor refrigeration module 316 whose hot and cold ends correspond to the heat inlet pipe 314 and the delivery pipe 315, respectively. Among them, the solenoid valve 313 is used to control the opening and closing degree of the intake pipe 312; Among them, the heat inlet pipe 314 and the delivery pipe 315 are used to transfer hot air or cold air to the corresponding hollow box 304 and protective box 307, respectively. Among them, the hot and cold ends of the Peltier semiconductor refrigeration module 316 are used to generate cold or hot air; Specifically, after the clamping plate 305 clamps the chip body 212, based on the testing requirements, the air pump 309 is activated to transmit cold air and hot air to the corresponding air inlet pipe 312 respectively. According to the internal temperature requirements of the corresponding hollow box 304, the solenoid valve 313 is activated to control the opening and closing degree of the air inlet pipe 312, thereby controlling the transmission of cold air and hot air. This allows the cold air and hot air to be neutralized inside the hollow box 304, thereby regulating the internal temperature of the hollow box 304. This enables the simultaneous testing of the changes in electrical variables of multiple chip bodies 212 under different environments. By coupling magnetic field and temperature, a realistic simulation of the environment is further achieved, and the electrical variables of the chip body 212 under different environments are tested, thereby more accurately testing the state of the chip body.

[0022] In Example 3, based on Example 1 and Example 2, the hollow box 304 and the protective box 307 are respectively corresponding to the chip body 212. The two sides of the chip body 212 are respectively attached to the corresponding carrier plate 203. The test box 301 has a feeding groove on one side corresponding to the mounting plate 201. A heat insulation box 4 containing a high-precision digital multimeter, oscilloscope and power analyzer is fixedly connected to one side of the upper surface of the mounting plate 201. Among them, the protective box 307 corresponds to the chip body 212 to achieve better protection and isolation for the chip body 212; The feeding slot is used by the mounting plate 201 to transfer the chip body 212 to the inside of the test box 301, and the feeding slot is sealed by the push plate 213 to prevent the external environment from affecting the inside of the test box 301. Among them, the heat insulation box 4 is used to isolate the temperature inside the test box 301 to avoid the temperature from affecting the high-precision digital multimeter, oscilloscope and power analyzer, and affecting the accuracy of the electrical variable test of the high-precision digital multimeter, oscilloscope and power analyzer; The high-precision digital multimeter, oscilloscope and power analyzer are all electrically connected to the chip body 212. The heat insulation box 4 is equipped with a power supply. The control panel 5 is fixedly connected to the upper surface of the test box 301. A power supply component 6, which is electrically connected to the test mechanism 3, is fixedly connected to one side of the upper surface of the test box 301. Among them, a high-precision digital multimeter, an oscilloscope, and a power analyzer are used to detect and record the electrical variables of the chip body 212; Control panel 5 is used to control the electrical components in the automated chip testing device; The power supply assembly 6 is used to supply power to the electrical components in the test mechanism 3.

[0023] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An automated chip testing device, characterized in that: It includes a work plate (1) and a support leg fixedly connected to the lower surface of the work plate (1). An installation mechanism (2) is installed on the upper surface of the work plate (1), and a testing mechanism (3) is installed on one side of the upper surface of the work plate (1). The mounting mechanism (2) includes a mounting plate (201) slidably connected to the upper surface of the working plate (1). The upper surface of the mounting plate (201) is provided with mounting grooves (202) in a rectangular array. The two inner walls of the mounting grooves (202) are slidably connected with bearing plates (203). The two outer edges of the bearing plates (203) are fixedly connected with clamping springs (204). One end of the two clamping springs (204) is fixedly connected with a threaded rod (205). The surface of the threaded rod (205) is threaded with a threaded cylinder (206). One end of the threaded cylinder (206) is fixedly connected with a drive motor (207) slidably connected to the mounting plate (201) by bolts. The lower surface of the drive motor (207) is fixedly connected with an electric push rod (208) fixedly connected to the mounting plate (201).

2. The automated chip testing device according to claim 1, characterized in that: The testing mechanism (3) includes a test box (301) fixedly connected to one side of the upper surface of the work plate (1). A mounting frame (302) is fixedly connected inside the test box (301). A pneumatic push rod (303) is fixedly connected in a rectangular array on the lower surface of the mounting frame (302). A hollow box (304) is fixedly connected to the output end of the pneumatic push rod (303). A clamping plate (305) is fixedly connected inside the hollow box (304).

3. The automated chip testing device according to claim 2, characterized in that: The testing mechanism (3) also includes a set of return springs (306) fixedly connected in a rectangular array inside the hollow box (304). One end of several set of return springs (306) is fixedly connected to a protective box (307) that is slidably connected to the hollow box (304). The protective box (307) corresponds to the mounting groove (202). The two inner walls of the protective box (307) are fixedly connected in a path array to electromagnetic coils (308) corresponding to the mounting groove (202).

4. The automated chip testing device according to claim 3, characterized in that: The testing mechanism (3) also includes air pumps (309) that are fixedly connected in a path array inside the test box (301) and are divided into two groups on average. The output end of one group of air pumps (309) is fixedly connected to a heating tube (310), and the output end of the other group of air pumps (309) is fixedly connected to a cooling tube (311). The surfaces of the heating tube (310) and the cooling tube (311) are fixedly connected in a path array to an air inlet pipe (312) that communicates with the hollow box (304).

5. The automated chip testing device according to claim 4, characterized in that: The test mechanism (3) also includes solenoid valves (313) that are fixedly connected to the surface of the air inlet pipe (312) in a path array and are connected to the air inlet pipe (312). One set of air pumps (309) has a heat inlet pipe (314) fixedly connected to its input end, and another set of air pumps (309) has a delivery pipe (315) fixedly connected to its input end. The test chamber (301) has a Peltier semiconductor refrigeration module (316) whose hot and cold ends correspond to the heat inlet pipe (314) and the delivery pipe (315) respectively.

6. The automated chip testing device according to claim 3, characterized in that: The mounting mechanism (2) also includes elastic probes (209) arranged in a path array inside the mounting groove (202). Several lower surfaces of the elastic probes (209) are fixedly connected to pressure sensors (210) that are fixedly connected to the bottom wall of the mounting groove (202). The surface of the elastic probes (209) is attached with pins (211), and the surface of the pins (211) is fixedly connected to a chip body (212) corresponding to the mounting groove (202).

7. The automated chip testing device according to claim 6, characterized in that: The hollow box (304) and the protective box (307) are both corresponding to the chip body (212). The two sides of the chip body (212) are respectively attached to the corresponding carrier plate (203). The test box (301) has a feeding groove on one side corresponding to the mounting plate (201). The upper surface of the mounting plate (201) is fixedly connected to a heat insulation box (4) which is equipped with a high-precision digital multimeter, oscilloscope and power analyzer.

8. The automated chip testing device according to claim 7, characterized in that: The high-precision digital multimeter, oscilloscope and power analyzer are all electrically connected to the chip body (212). The heat insulation box (4) is equipped with a power supply. The upper surface of the test box (301) is fixedly connected to a control panel (5). One side of the upper surface of the test box (301) is fixedly connected to a power supply component (6) that is electrically connected to the test mechanism (3).

9. An automated chip testing device according to claim 6, characterized in that: The mounting mechanism (2) further includes a push plate (213) fixedly connected to one side of the mounting plate (201). A lead screw (214) is threadedly connected to the surface of the push plate (213). A servo motor (215) fixedly connected to the mounting plate (201) is fixedly connected to one end of the lead screw (214). A guide rod fixedly connected to the mounting plate (201) is sleeved on one side of the push plate (213).

10. An automated chip testing device according to claim 6, characterized in that: A robotic arm (7) corresponding to the mounting plate (201) is fixedly connected to the edge of the upper surface of the mounting plate (201). A high-definition camera (8) is fixedly connected to the surface of the end effector of the robotic arm (7). The robotic arm (7), the high-definition camera (8), the mounting slot (202), and the chip body (212) correspond to each other.

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