Electronic information wireless signal amplifier

Abstract

The utility model discloses an electronic information wireless signal amplifier, which relates to the technical field of wireless signal amplifiers and comprises an amplifier body and a radiating frame arranged on one side of the amplifier body provided with a plug, and radiating fins are arranged on the radiating frame. A groove is formed in the amplifier body, the whole heat dissipation frame is of an n-shaped structure, and the heat dissipation frame is clamped into the groove through the middle portion and attached to the first heat conduction plate in the groove; the middle portion of the heat dissipation frame is made of a memory alloy material, and in the heated state, the two sides of the middle portion of the heat dissipation frame are turned over outwards and attached to the side wall of the groove, so that the tail end of the n-shaped structure of the heat dissipation frame is attached to a second heat conduction plate on the amplifier body. The heat dissipation fins are arranged on the side face of the portion, attached to the second heat conduction plate, of the heat dissipation frame. The heat dissipation frame can be detached from the amplifier body, the heat dissipation fins can be cleaned, and the maintenance process is simple.

Description

TECHNICAL FIELD

[0001] The utility model relates to wireless signal amplifier technical field, concretely is an electronic information wireless signal amplifier. BACKGROUND

[0002] With the rapid development of electronic information technology, wireless signal amplifier is more and more widely used in various electronic devices and communication systems. In the operation process of many electronic devices, the signal amplifier, as the key component to ensure stable signal transmission and enhancement, plays a vital role. However, during its operation, heat will inevitably be generated due to the current passing through the internal circuit elements. If the heat cannot be dissipated in time, the temperature of the amplifier body will continue to rise.

[0003] The current common wireless signal amplifier on the market has a relatively traditional and single heat dissipation mode. Most of them rely only on their own shells for natural heat dissipation, and the heat dissipation efficiency is extremely limited. Even some products are equipped with heat dissipation devices, such as simple heat dissipation fins, but their heat dissipation structure design lacks flexibility and intelligence. With the passage of time, dust is likely to accumulate on the heat dissipation fins and affect the heat dissipation effect. Once the heat dissipation structure is installed, it is fixed and shaped, and is difficult to disassemble. In the actual use environment, dust is easily attached to the heat dissipation fins, and with the passage of time, a large amount of dust accumulation seriously affects the heat dissipation effect. However, due to the difficulty in disassembling the heat dissipation structure, the cleaning work is extremely inconvenient, and users often need professional tools and complex operations to complete it, or even may damage the equipment due to improper operation. SUMMARY

[0004] In view of the deficiencies of the prior art, the utility model provides an electronic information wireless signal amplifier.

[0005] To achieve the above purpose, the technical scheme of the utility model is as follows:

[0006] An electronic information wireless signal amplifier, comprising an amplifier body and a heat dissipation rack arranged on the side of the amplifier body provided with a plug, wherein the heat dissipation rack is provided with heat dissipation fins;

[0007] The amplifier body is provided with a groove, and the heat dissipation rack has a "J" shaped structure. The heat dissipation rack is clamped into the groove through the middle part and is in close contact with the heat conduction plate one in the groove;

[0008] The middle part of the heat dissipation rack is made of memory alloy material, and in the heated state, the two sides of the middle part of the heat dissipation rack are turned outward and are in close contact with the side wall of the groove, so that the end of the "J" shaped structure of the heat dissipation rack is in close contact with the heat conduction plate two on the amplifier body; and the heat dissipation fins are arranged on the side surface of the heat dissipation rack at the close contact part with the heat conduction plate two.

[0009] Preferably, the middle part of the heat sink is configured as a snap-in part, and the two sides of the snap-in part are connected to the heat-conducting part through connecting parts, and the connecting parts are configured as arc-shaped structures. The heat sink fins are disposed on the heat-conducting part. The angle between the snap-in part and the connecting part in the unheated state is 110° to 130°, and the angle between the connecting part and the heat-conducting part in the unheated state is 70° to 80°.

[0010] Preferably, the connecting part adheres to the side wall of the groove after the snap-in part is heated, and the heat-conducting part adheres to the side wall of the heat-conducting plate after the snap-in part is heated.

[0011] Preferably, the connecting part is provided with a retaining strip, and the side wall of the groove is provided with a retaining groove, and the retaining strip is engaged in the retaining groove after the retaining part is heated.

[0012] Preferably, the heat-conducting part and heat dissipation fins are made of copper alloy or aluminum alloy.

[0013] Preferably, clamping plates are provided at both ends of the middle part of the heat sink, and the clamping plates are inclined toward the side wall of the groove.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. The heat sink is installed on the amplifier body through a specific structure. When dust accumulates on the heat sink fins and affects the heat dissipation effect, the heat sink can be removed from the amplifier body relatively easily to clean the heat sink fins. The maintenance process is simple and helps to maintain the long-term stable heat dissipation performance of the equipment.

[0016] 2. The middle part of the heat sink is made of shape memory alloy. Utilizing the shape change characteristics of shape memory alloy under heat, when the amplifier body temperature rises, the middle part of the heat sink automatically flips outward and fits against the side wall of the groove. At the same time, the end of the heat sink fits against the heat conduction plate. The heat dissipation structure is automatically adjusted to further increase the heat dissipation area and optimize the heat dissipation path. It can make adaptive adjustments according to the temperature changes during the actual operation of the amplifier, effectively improving the intelligent level and reliability of heat dissipation.

[0017] 3. The heat sink has an overall "U"-shaped structure. The middle part is inserted into the groove of the amplifier body and is in contact with the heat-conducting plate 1 in the groove. When heated, the two sides of the middle part of the heat sink flip up so that the ends of the "U"-shaped structure are in contact with the heat-conducting plate 2 on the amplifier body. This design ensures that the heat sink and the amplifier body have a large area of ​​tight contact, and heat can be efficiently conducted from the amplifier body to the heat sink, and then dissipated through the heat sink fins, which greatly optimizes the heat dissipation path. Attached Figure Description

[0018] The disclosure of the present application will be described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes, and are not intended to limit the scope of protection of the present application. In the drawings, the same reference numerals are used to refer to the same parts. Among them:

[0019] Figure 1 is a structural schematic diagram of the present application;

[0020] Figure 2 is a structural schematic diagram of the amplifier body of the present application;

[0021] Figure 3 is an assembly schematic diagram of the heat sink and the amplifier body under the heated state of the heat sink of the present application;

[0022] Figure 4 is a schematic diagram of the heat sink under the heated state of the present application;

[0023] Figure 5 is an assembly schematic diagram of the heat sink and the amplifier body under the unheated state of the heat sink of the present application;

[0024] Figure 6 is a schematic diagram of the heat sink under the unheated state of the present application.

[0025] The figure is marked as follows: 1, amplifier body; 11, groove; 12, heat conduction plate one; 13, heat conduction plate two; 14, clamping groove; 2, heat sink; 21, clamping part; 22, connecting part; 23, heat conduction part; 24, heat dissipation fin; 25, clamping strip; 26, clamping piece. DETAILED DESCRIPTION

[0026] It is easy to understand that according to the technical scheme of the present application, a person skilled in the art can propose a plurality of structure modes and implementation modes which can be replaced with each other without changing the essential spirit of the present application. Therefore, the following specific embodiments and drawings are only exemplary description of the technical scheme of the present application, and should not be regarded as the whole or regarded as the limitation or restriction of the technical scheme of the present application.

[0027] EMBODIMENT

[0028] As Figure 1 shown, an electronic information wireless signal amplifier mainly consists of an amplifier body 1 and a heat sink 2. The heat sink 2 is arranged on the side of the amplifier body 1 with a plug, which is specially used to solve the heat dissipation problem of the amplifier during work.

[0029] The amplifier body 1 is provided with a groove 11, and a first heat conducting plate 12 is arranged in the groove 11. At the same time, a second heat conducting plate 13 is also provided on the amplifier body 1. The first heat conducting plate 12 and the second heat conducting plate 13 respectively correspond to the heat generating parts inside the amplifier body 1, so as to guide the heat outwards. The clamping part 21 of the heat dissipation rack 2 can be clamped into the groove 11 and is in close contact with the first heat conducting plate 12 to achieve initial heat conduction.

[0030] As Figure 3 , Figure 4 , Figure 5 , Figure 6 shown, the overall shape of the heat dissipation rack 2 is "U". The middle part is the clamping part 21, and both sides of the clamping part 21 are connected to the heat conducting part 23 through arc-shaped connecting parts 22. In the unheated state, the included angle between the clamping part 21 and the connecting part 22 is designed to be 110° - 130°. This angle setting makes it convenient for the connecting part 22 not to hinder the clamping process with the side wall of the groove 11 when the clamping part 21 is clamped into the groove 11; the included angle between the connecting part 22 and the heat conducting part 23 is 70° - 80°. This angle setting can make the heat conducting part 23 close to the second heat conducting plate 13 when the clamping part 21 is turned outwards due to heat, so as to ensure the heat conduction and heat dissipation effects.

[0031] Heat dissipation fins 24 are arranged on the heat conducting part 23 and are located on the side of the part in contact with the second heat conducting plate 13. The heat conducting part 23 and the heat dissipation fins 24 are made of copper alloy or aluminum alloy materials. These two materials have good heat conducting performance and can efficiently dissipate heat to the surrounding environment.

[0032] As Figure 2 , Figure 4 shown, a clamping strip 25 is arranged on the connecting part 22, and a clamping groove 14 is opened on the corresponding side wall of the groove 11. After the clamping part 21 is heated, the connecting part 22 turns over, and the clamping strip 25 can be clamped into the clamping groove 14 to further enhance the connection stability between the heat dissipation rack 2 and the amplifier body 1 and ensure the structural stability during the heat dissipation process. In addition, clamping pieces 26 are arranged at both ends of the middle part of the heat dissipation rack 2. The clamping pieces 26 are inclined towards the side wall of the groove 11 and can provide a certain pre-tightening force during installation to assist the heat dissipation rack 2 to be better fixed in the groove 11, so as to ensure the contact between the clamping part 21 and the first heat conducting plate 12 and ensure the stability during the initial heat conduction.

[0033] During use, align the clamping part 21 of the heat dissipation rack 2 with the groove 11 of the amplifier body 1 so that the clamping part 21 is in close contact with the first heat conducting plate 12 in the groove 11. At this time, the heat dissipation rack 2 is in the initial unheated state, and specific angles are maintained between the clamping part 21, the connecting part 22 and the heat conducting part 23. Due to the inclined setting of the clamping pieces 26, they will exert a certain pressure on the side wall of the groove 11 to initially fix the heat dissipation rack 2.

[0034] When the amplifier body 1 works to generate heat, the heat is transferred to the clamping portion 21 of the heat sink 2 through the heat-conducting plate one 12. Since the clamping portion 21 is made of a memory alloy material, its shape changes after being heated, and the two sides of the middle portion turn outward. With the turning of the clamping portion 21, the connecting portion 22 also turns and is in close contact with the side wall of the groove 11, and meanwhile the clamping strip 25 is clamped into the clamping groove 14 to further fix the connecting portion 22. At this time, the heat-conducting portion 23 also turns with the connecting portion 22 and is in close contact with the side wall of the heat-conducting plate two 13, and the heat is conducted from the heat-conducting plate one 12 to the heat-conducting portion 23 through the clamping portion 21 and the connecting portion 22, and then is radiated to the surrounding environment through the heat-dissipating fins 24 arranged on the side of the heat-conducting portion 23. The self-adaptive shape change of the heat sink 2 increases the contact area with the amplifier body 1, optimizes the heat-dissipating path, and significantly improves the heat-dissipating efficiency.

[0035] When the heat-dissipating fins 24 need to be cleaned, since the heat sink 2 is connected with the amplifier body 1 in a clamping manner, the heat sink 2 can be conveniently taken out of the groove 11. After cleaning, the heat sink 2 is re-installed on the amplifier body 1 according to the installation steps, and then the heat sink 2 can be continuously used, and the maintenance process is simple and convenient, which is helpful to maintain the long-term stable heat-dissipating performance of the equipment.

[0036] The technical scope of the utility model is not limited to the content in the above description, and those skilled in the art can make various deformations and modifications to the above embodiment without departing from the technical thought of the utility model, and these deformations and modifications should all belong to the protection scope of the utility model.

Claims

1. An electronic information wireless signal amplifier, characterized in that: The amplifier body (1) is provided with a heat dissipation rack (2) on the side provided with the plug, and the heat dissipation rack (2) is provided with heat dissipation fins (24). The amplifier body (1) is provided with a groove (11), and the heat dissipation rack (2) is in the shape of a Chinese character "j" and is clamped into the groove (11) through the middle part and is in close contact with the heat conduction plate one (12) in the groove (11). The middle part of the heat dissipation rack (2) is made of memory alloy material, and in the heated state, the two sides of the middle part of the heat dissipation rack (2) are turned outward and are in close contact with the side wall of the groove (11), so that the end of the heat dissipation rack (2) is in close contact with the heat conduction plate two (13) on the amplifier body (1).

2. An electronic information wireless signal amplifier according to claim 1, characterized in that: The middle part of the heat dissipation rack (2) is provided with a clamping part (21), and the two sides of the clamping part (21) are connected with the heat conduction part (23) through the connecting part (22), and the connecting part is provided in the shape of an arc, and the heat dissipation fins (24) are arranged on the heat conduction part (23).

3. An electronic information wireless signal amplifier according to claim 2, characterized in that: The angle between the clamping part (21) and the connecting part (22) is 110°-130° in the unheated state, and the angle between the connecting part (22) and the heat conduction part (23) is 70°-80° in the unheated state.

4. An electronic information wireless signal amplifier according to claim 2, characterized in that: The connecting part (22) is in close contact with the side wall of the groove (11) after the clamping part (21) is heated, and the heat conduction part (23) is in close contact with the side wall of the heat conduction plate two (13) after the clamping part (21) is heated.

5. An electronic information wireless signal amplifier according to claim 2, characterized in that: The connecting part (22) is provided with a clamping strip (25), and the side wall of the groove (11) is provided with a clamping groove (14), and the clamping strip (25) is clamped into the clamping groove (14) after the clamping part (21) is heated.

6. An electronic information wireless signal amplifier according to claim 1 or 2, characterized in that: The heat conduction part (23) and the heat dissipation fins (24) are made of copper alloy or aluminum alloy material. The two ends of the middle part of the heat dissipation rack (2) are provided with clamping pieces (26), and the clamping pieces (26) are inclined to the side wall of the groove (11).

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