Heat dissipation device and inverter

Abstract

The utility model discloses a heat dissipation device and an inverter, the heat dissipation device comprises a box body, the box body is provided with a first part and a second part which are arranged in an L shape, and the second part protrudes out of the first part along a first direction; the first part is provided with a first accommodating cavity, the first accommodating cavity is used for accommodating a main control board and a power board of the inverter, the second part is provided with a second accommodating cavity communicated with the first accommodating cavity, and the second accommodating cavity is used for accommodating a bus capacitor board of the inverter; wherein the size of the second part in the second direction is smaller than that of the first part in the second direction, so that a first mounting space is formed between the second part and the first part; the first heat dissipation assembly is arranged in the first mounting space; the first heat dissipation assembly and the power board in the first containing cavity are oppositely arranged in the first direction so that heat exchange can be conducted between the first heat dissipation assembly and the power board. The first heat dissipation assembly and the second containing cavity are oppositely arranged in the second direction so that heat exchange can be conducted between the first heat dissipation assembly and air in the second containing cavity.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field especially is related to a heat dissipation device and inverter. BACKGROUND

[0002] The inverter for outdoor usually adopts the closed box body design to satisfy the IP protection requirement of dustproof and waterproof. In the related art, the bottom of the box body is usually opened to install the semiconductor device on the external radiator, so that the heat can be directly led out. However, other power devices such as inductors and capacitors in the box body can only rely on the internal fan to circulate air to uniform temperature, and cannot realize efficient heat dissipation. The efficiency of this heat dissipation mode is low, which is easy to cause the accumulation of heat in the inverter and form local high temperature, thereby affecting the reliability and service life of the inverter.

[0003] Therefore, how to maintain high IP protection level while improving the overall heat dissipation efficiency of each device in the inverter is a problem to be solved at present. UTILITY MODEL CONTENTS

[0004] One purpose of the utility model is to provide a heat dissipation device that can solve or at least partially alleviate at least one of the defects in the background art.

[0005] Another purpose of the utility model is to provide an inverter with the heat dissipation device described above.

[0006] To achieve at least one of the above purposes, the utility model adopts the technical scheme of a heat dissipation device, which comprises: a box body provided with a first part and a second part arranged in an L shape, the second part protruding from the first part along a first direction; the first part has a first accommodating cavity capable of accommodating a main control board and a power board of an inverter, the second part has a second accommodating cavity communicating with the first accommodating cavity, and the second accommodating cavity is capable of accommodating a bus capacitor board of the inverter; wherein the size of the second part along a second direction is smaller than the size of the first part along the second direction, so as to form a first mounting space between the second part and the first part; a first heat dissipation assembly is arranged in the first mounting space and is in sealed connection with the box body; the first heat dissipation assembly is arranged opposite to the power board in the first accommodating cavity along the first direction, so as to exchange heat with the power board; the first heat dissipation assembly is arranged opposite to the second accommodating cavity along the second direction, so as to exchange heat with the air in the second accommodating cavity.

[0007] As a preferred, the side of the first part facing the first installation space is defined as a first installation surface, and the first installation surface is provided with an opening; the first heat dissipation assembly comprises a first heat sink which is sealingly installed on the first installation surface; and part of the first heat sink is arranged opposite to the opening, so that the first heat sink is connected with the semiconductor device on the power board.

[0008] As a preferred, the first heat sink has a plurality of flow channels extending along the third direction; and the first heat dissipation assembly further comprises a first fan which is arranged along the third direction with the first heat sink, so that the external air flows through the flow channels in parallel to the third direction.

[0009] As a preferred, the side of the second part facing the first installation space is defined as a second installation surface, and the second installation surface is provided with a first air port and a second air port; and the first heat dissipation assembly further comprises a heat exchanger which is sealingly installed on the second installation surface, and the heat exchanger has an inner passage and an outer passage which are isolated from each other, the outer passage penetrates along the third direction, and the two ends of the inner passage are respectively communicated with the first air port and the second air port, so that the air in the second accommodating cavity is heat-exchanged with the external air through the heat exchanger.

[0010] As a preferred, at least part of the inner passage extends along the third direction; and the first heat dissipation assembly further comprises a second fan which is accommodated in the second accommodating cavity, and the second fan is arranged opposite to the first air port or the second air port, so that the air flows through the inner passage in parallel to the third direction.

[0011] As a preferred, the first heat sink comprises an integral substrate and a plurality of first fins, the substrate is connected with the semiconductor device on the power board, the first fins extend in a plane perpendicular to the substrate, and flow channels are formed between the first fins; and at least part of the first fins is arranged opposite to the second installation surface along the second direction to form an avoiding space which accommodates the heat exchanger.

[0012] As a preferred, the heat dissipation device further comprises a baffle which is fixed to the box body, and at least part of the baffle is arranged opposite to the first part along the first direction to form the first installation space between the baffle and the first part.

[0013] As a preferred, the heat dissipation device further comprises a third fan which is accommodated in the first accommodating cavity, and the third fan and the first heat dissipation assembly are respectively located on opposite sides of the power board, and the air outlet direction of the third fan is towards the power board.

[0014] As a kind of preferred, the size of the second part along third direction is less than the size of the first part along third direction, to form second installation space between the second part and the first part;The side of the first part towards the second installation space is defined as third mounting surface, the third mounting surface is provided with opening;The heat dissipation device further includes at least one second radiator, the second radiator is sealedly installed on the third mounting surface, the second radiator is provided with heat dissipation cavity, the heat dissipation cavity is communicated with the first containing cavity by the opening, and the heat dissipation cavity can accommodate inductor.

[0015] To achieve at least one of the above purposes, the utility model employs the technical scheme that a kind of inverter, comprising: the heat dissipation device described above.

[0016] Compared with prior art, the utility model has the beneficial effects that:

[0017] (1) by first heat dissipation component, can carry out heat exchange with power plate, to improve the heat dissipation efficiency of semiconductor device on power plate;By first heat dissipation component, can also carry out heat exchange with the air in second containing cavity, since second containing cavity is communicated with first containing cavity, so first heat dissipation component can carry out heat exchange with the air in box, to reduce the temperature of the air in box, to improve the heat dissipation efficiency of each capacitor on bus capacitor plate.

[0018] (2) first heat dissipation component is arranged in first installation space, to make the structure between first heat dissipation component and box more compact, beneficial to reduce the overall volume of heat dissipation device and inverter. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the front perspective schematic diagram of heat dissipation device according to some embodiments of the application.

[0020] Figure 2 It is the back perspective schematic diagram of heat dissipation device according to some embodiments of the application.

[0021] Figure 3 It is the schematic diagram that the first containing cavity of box is equipped with main control board and power plate according to some embodiments of the application.

[0022] Figure 4 It is the schematic diagram that the second containing cavity of box is equipped with bus capacitor plate according to some embodiments of the application.

[0023] Figure 5 It is the explosion view of heat dissipation device according to some embodiments of the application.

[0024] Figure 6 It is the back perspective schematic diagram of heat dissipation device when baffle is removed according to some embodiments of the application.

[0025] Figure 7 is a front perspective view of a box according to some embodiments of the present application.

[0026] Figure 8 is a back perspective view of a box according to some embodiments of the present application.

[0027] Figure 9 is a back perspective view of a box according to some other embodiments of the present application.

[0028] Figure 10 is a front perspective view of a first heat sink according to some embodiments of the present application.

[0029] Figure 11 is a back perspective view of a first heat sink according to some embodiments of the present application.

[0030] Figure 12 is a perspective view of a heat exchanger according to some embodiments of the present application.

[0031] Figure 13 is a perspective view of a heat exchanger according to some other embodiments of the present application.

[0032] Figure 14 is a perspective view of a second heat sink according to some embodiments of the present application.

[0033] In the figure: 1, heat dissipation device; 10, box; 11, first part; 111, first accommodating cavity; 112, box opening; 113, first mounting surface; 1131, open port; 114, third mounting surface; 1141, opening; 12, second part; 121, second accommodating cavity; 122, second mounting surface; 1221, first air port; 1222, second air port; 1223, ventilation port; 13, first mounting space; 14, second mounting space; 20, box cover; 30, first heat dissipation assembly; 31, first heat sink; 311, base plate; 312, first fin; 313, flow channel; 314, avoidance space; 32, heat exchanger; 321, inner passage; 3211, communication port; 322, outer passage; 323, shell; 324, heat exchange core; 33, first fan; 34, second fan; 40, third fan; 50, baffle; 60, second heat sink; 61, base body; 611, heat dissipation cavity; 62, second fin; 71, first sealing ring; 72, second sealing ring; 73, third sealing ring; 81, main control board; 82, power board; 821, semiconductor device; 83, bus capacitor board; 831, capacitor; 84, inductor device. DETAILED DESCRIPTION

[0034] Hereinafter, the utility model will be further described in conjunction with specific embodiments, it needs to be explained that, in the premise of not conflicting, the following description of each embodiment or each technical feature can be combined to form a new embodiment.

[0035] In the description of the utility model, it needs to be explained that, for the direction word, if the term "center", "transverse", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation and positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and can not be understood as limiting the specific protection scope of the utility model.

[0036] It needs to be explained that the terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0037] A heat dissipation device 1, as shown in Figures 1-14 , comprising: a box body 10 and a first heat dissipation assembly 30. Specifically, as shown in Figures 1-4 , the box body 10 is provided with a first part 11 and a second part 12 arranged in an L shape, wherein the second part 12 protrudes from the first part 11 along a first direction. The first part 11 has a first containing cavity 111, and the first containing cavity 111 is capable of accommodating a main control board 81 and a power board 82 of an inverter. The second part 12 has a second containing cavity 121 in communication with the first containing cavity 111, and the second containing cavity 121 is capable of accommodating a bus capacitor board 83 of the inverter. As shown in Figure 5 and Figure 6 , the size of the second part 12 along the second direction is less than the size of the first part 11 along the second direction, so as to form a first mounting space 13 between the second part 12 and the first part 11. It should be understood that the first containing cavity 111 and the second containing cavity 121 can also accommodate other devices of the inverter, which is not limited in the present application. Wherein, the first direction is parallel to the depth direction of the heat dissipation device 1, and the second direction is perpendicular to the first direction.

[0038] Further, as shown in Figure 5 and Figure 6 , the first heat dissipation assembly 30 is arranged in the first mounting space 13, so that the structure between the first heat dissipation assembly 30 and the box body 10 is more compact, which is beneficial to reduce the overall volume of the heat dissipation device 1 and the inverter. And, the first heat dissipation assembly 30 is sealingly connected with the box body 10, which is beneficial to realize the effect of waterproof and dustproof.

[0039] Specifically, as shown in Figures 3-6 The first heat dissipation assembly 30 is arranged opposite to the power board 82 in the first direction, so as to exchange heat with the power board 82, thereby improving the heat dissipation efficiency of the semiconductor devices 821 on the power board 82. The first heat dissipation assembly 30 is arranged opposite to the second accommodating cavity 121 in the second direction, so as to exchange heat with the air in the second accommodating cavity 121. It is worth mentioning that, since the second accommodating cavity 121 is in communication with the first accommodating cavity 111, the first heat dissipation assembly 30 can exchange heat with the air in the cabinet 10, so as to reduce the overall temperature of the air in the cabinet 10, thereby improving the heat dissipation efficiency of each capacitor 831 on the bus capacitor board 83, and assisting in improving the heat dissipation efficiency of the power board 82 and the main control board 81.

[0040] In some embodiments, as shown in Figures 6-9 The side of the first part 11 facing the first mounting space 13 is defined as a first mounting surface 113, and the first mounting surface 113 is provided with an opening 1131. The first heat dissipation assembly 30 includes a first heat sink 31 which is sealingly mounted on the first mounting surface 113. Part of the first heat sink 31 is arranged opposite to the opening 1131, so that the first heat sink 31 is connected with the semiconductor devices 821 on the power board 82.

[0041] That is, the power board 82 of the inverter is arranged in the first mounting space 13, and the power board 82 is arranged opposite to the first heat sink 31 in the first direction. Through the opening 1131 on the first mounting surface 113, the semiconductor devices 821 on the power board 82 can be attached to the first heat sink 31, and the heat of the semiconductor devices 821 is dissipated to the outside through the first heat sink 31. It should be understood that a thermally conductive insulating pad is arranged between the semiconductor devices 821 and the first heat sink 31, which is beneficial to electrical isolation.

[0042] In some embodiments, as shown in Figure 5 , Figure 6 and Figure 10 The first heat sink 31 includes an integrally formed base plate 311 and a plurality of first fins 312. Specifically, the base plate 311 is connected with the semiconductor devices 821 on the power board 82, in other words, the base plate 311 is attached to the semiconductor devices 821 on the power board 82 through a thermally conductive insulating pad, so as to exchange heat with the semiconductor devices 821. The first fins 312 extend in a plane perpendicular to the base plate 311, and flow channels 313 are formed between each of the first fins 312. It should be understood that the first fins 312 can increase the surface area of the first heat sink 31, improve the heat exchange efficiency of the first heat sink 31 with the outside air, and thereby improve the heat dissipation efficiency of the semiconductor devices 821.

[0043] In at least one embodiment, as shown in Figure 11 The first sealing ring 71 is arranged between the substrate 311 and the first mounting surface 113, and surrounds the outer periphery of the opening 1131, so as to seal the first heat sink 31 and the cabinet 10, and further seal the first accommodating cavity 111 and the second accommodating cavity 121 of the cabinet 10, thereby preventing dust, liquid water, high humidity air, corrosive gas and the like from entering the first accommodating cavity 111 and the second accommodating cavity 121, protecting the devices in the cabinet 10, ensuring that the heat dissipation device 1 meets the IP level, and further improving the stability of the inverter and prolonging the service life of the inverter.

[0044] In some embodiments, as shown in Figure 5 , Figure 6 and Figure 10 The first heat sink 31 has a plurality of flow channels 313 extending in the third direction; the first heat dissipation assembly 30 further comprises a first fan 33, which is arranged with the first heat sink 31 in the third direction, so that the external air flows through the flow channels 313 parallel to the third direction, improving the heat dissipation efficiency of the first heat sink 31. The third direction is perpendicular to the first direction and the second direction.

[0045] It should be understood that the first heat sink 31 and the second part 12 of the cabinet 10 are arranged opposite to each other in the second direction. If the flow channels 313 extend in the second direction, the second part 12 of the cabinet 10 will block the flow channels 313, thereby hindering the air flow. In the present embodiment, the flow channels 313 extend in the third direction, which is beneficial to avoid the two ends of the flow channels 313 being blocked, so that the air can flow smoothly, and the heat exchange efficiency between the first heat sink 31 and the external air is improved.

[0046] It is worth mentioning that the air outlet of the first fan 33 can be directed towards the first heat sink 31, so that the airflow flows from the first fan 33 to the flow channels 313 of the first heat sink 31; the air outlet of the first fan 33 can also be directed away from the first heat sink 31, so that the airflow flows from the flow channels 313 of the first heat sink 31 to the first fan 33, which is not specifically limited in the present application.

[0047] In some embodiments, as shown in Figures 4-9As shown, the side of the second portion 12 facing the first installation space 13 is defined as a second installation surface 122, and the first air port 1221 and the second air port 1222 are arranged on the second installation surface 122; the first heat dissipation assembly 30 further comprises a heat exchanger 32, the heat exchanger 32 is sealingly installed on the second installation surface 122, and the heat exchanger 32 has an inner passage 321 and an outer passage 322 which are isolated from each other, the outer passage 322 extends along the third direction, and the two ends of the inner passage 321 are in communication with the first air port 1221 and the second air port 1222 respectively, so that the air in the second containing cavity 121 can be heat-exchanged with the air outside through the heat exchanger 32.

[0048] That is, the inner passage 321 of the heat exchanger 32 is sealingly communicated with the second containing cavity 121, and then the air in the second containing cavity 121 and the first containing cavity 111 can flow in the inner passage 321. The outer passage 322 of the heat exchanger 32 is isolated from the inner passage 321, which can not only make the low-temperature air in the outer passage 322 heat-exchanged with the high-temperature air in the inner passage 321, but also prevent dust, liquid water, high-humidity air, corrosive gas and the like from entering the first containing cavity 111 and the second containing cavity 121.

[0049] It should be understood that, as described above, in combination with Figures 4-9 As shown, the bus capacitor plate 83 is arranged in the second containing cavity 121, and in this embodiment, the inner passage 321 of the heat exchanger 32 is directly communicated with the second containing cavity 121 through the first air port 1221 and the second air port 1222, which is conducive to preferentially cooling the air in the second containing cavity 121, thereby improving the heat dissipation efficiency of each capacitor 831 on the bus capacitor plate 83. Further, since the first containing cavity 111 and the second containing cavity 121 are communicated, the overall temperature of the air in the first containing cavity 111 and the second containing cavity 121 can be reduced through the heat exchanger 32, thereby assisting to improve the heat dissipation efficiency of the power plate 82 and the main control plate 81.

[0050] It is worth mentioning that the outer passage 322 of the heat exchanger 32 extends along the third direction, and then the air outside can flow through the outer passage 322 parallel to the third direction through the first fan 33, so as to improve the heat exchange efficiency of the second heat dissipation assembly 60. In other words, the first fan 33 can provide air flow for the first heat dissipation assembly 31 and the heat exchanger 32 at the same time, thereby avoiding the additional arrangement of a heat dissipation fan corresponding to the heat exchanger 32, and making the structure of the heat dissipation device 1 simpler and reducing the production cost of the heat dissipation device 1.

[0051] In some embodiments, in combination with Figures 4-9As shown, at least part of the inner channel 321 extends along the third direction. The first heat dissipation assembly 30 further comprises a second fan 34, which is accommodated in the second accommodating cavity 121 and is arranged opposite to the first air port 1221 or the second air port 1222 to make the air flow through the inner channel 321 parallel to the third direction. It can be understood that the second fan 34 is beneficial to circulate the air between the second accommodating cavity 121 and the inner channel 321, and thus to realize heat exchange between the high-temperature air in the cabinet 10 and the low-temperature air outside. It is worth mentioning that the high-temperature air in the inner channel 321 and the low-temperature air in the outer channel 322 flow in opposite directions parallel to the third direction, which is beneficial to maintain a high temperature difference and thus improve the heat exchange efficiency.

[0052] In at least one embodiment, as shown in Figure 8 and Figure 12 , the first air port 1221 and the second air port 1222 are spaced apart along the third direction, and the inner channel 321 of the heat exchanger 32 has a communication port 3211 that is in communication with the first air port 1221 and the second air port 1222. It can be understood that this can make the air circulate between the second accommodating cavity 121 and the inner channel 321, and can reduce the processing difficulty of the heat exchanger 32.

[0053] In another at least one embodiment, as shown in Figure 9 and Figure 13 , the first air port 1221 and the second air port 1222 are in communication to form an air vent 1223, and the inner channel 321 of the heat exchanger 32 has two communication ports 3211 spaced apart along the third direction, the two communication ports 3211 are in communication with the air vent 1223, and the second fan 34 is arranged opposite to one of the communication ports 3211. It can be understood that this can make the air circulate between the second accommodating cavity 121 and the inner channel 321, and can reduce the processing difficulty of the cabinet 10.

[0054] In at least one embodiment, as shown in Figure 12 and Figure 13 , the heat exchanger 32 comprises a shell 323 and a heat exchange core 324 welded to the shell 323, and the inner channel 321 and the outer channel 322 are formed between the shell 323 and the heat exchange core 324. Further, the second sealing ring 72 is clamped between the shell 323 and the second mounting surface 122, and surrounds the outer circumferential side of the first air port 1221 and the second air port 1222, so as to seal the connection between the inner channel 321 of the heat exchanger 32 and the cabinet 10, and thus keep the first accommodating cavity 111 and the second accommodating cavity 121 of the cabinet 10 airtight, to ensure that the heat dissipation device 1 meets the IP level. In a specific embodiment, the heat exchange core 324 is implemented as an aluminum foil heat exchange core, so as to improve the heat exchange efficiency of the heat exchanger 32.

[0055] In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter. Figure 6 Figure 10 In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter.

[0056] In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter.

[0057] In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter. Figure 2 Figure 5 In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter.

[0058] In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter. Figure 2 In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter.

[0059] Figure 3 In some embodiments, as shown in Figs. 1 and 2, the first fins 312 of the first heat sink 31 are spaced apart from the second mounting surface 122 along the second direction to form an avoiding space 314, which is capable of accommodating the heat exchanger 32, so as to make the structure of the first heat dissipation assembly 30 more compact, and facilitate reducing the overall volume of the heat dissipation device 1 and the inverter.

[0060] ​​​In some embodiments, combined with Figures 5-9 As shown, the second portion 12 has a smaller dimension along the third direction than the first portion 11, forming a second mounting space 14 between the second portion 12 and the first portion 11. The side of the first portion 11 facing the second mounting space 14 is defined as a third mounting surface 114, and an opening 1141 is provided on the third mounting surface 114. The heat dissipation device 1 also includes at least one second heat sink 60, which is sealed and mounted on the third mounting surface 114. The second heat sink 60 has a heat dissipation cavity 611, which communicates with the first receiving cavity 111 through the opening 1141, and the heat dissipation cavity 611 can accommodate the inductor 84. In at least one embodiment, the first mounting surface 113 and the second mounting surface 122 are both located on the bottom surface of the first portion 11 of the housing 10, i.e., the first mounting surface 113 and the second mounting surface 122 are coplanar.

[0061] In other words, the second heat sink 60 is disposed in the second mounting space 14, which makes the structure between the second heat sink 60 and the housing 10 more compact, which is beneficial to reducing the overall structure of the heat dissipation device 1 and the inverter. Furthermore, the heat dissipation cavity 611 of the second heat sink 60 is sealed and connected to the first receiving cavity 111, so that the inductor 84 can be housed in the heat dissipation cavity 611 to improve the heat dissipation efficiency of the inductor 84.

[0062] In some embodiments, such as Figure 14 As shown, the second heat sink 60 includes an integrally formed base 61 and a plurality of second fins 62. Specifically, a heat dissipation cavity 611 is formed on the base 61 to accommodate the inductor 84; the second fins 62 are connected to the outer periphery of the base 61 to increase the surface area of ​​the second heat sink 60, improve the heat exchange efficiency between the second heat sink 60 and the outside air, and thus help improve the heat dissipation efficiency of the inductor 84.

[0063] In at least one embodiment, such as Figure 14 As shown, a third sealing ring 73 is sandwiched between the base 61 of the second radiator 60 and the third mounting surface 114. The third sealing ring 73 surrounds the outer periphery of the opening 1141, so that the second radiator 60 and the housing 10 are sealed together, thereby keeping the first receiving cavity 111 and the second receiving cavity 121 of the housing 10 sealed, so as to ensure that the heat dissipation device 1 meets the IP rating.

[0064] In at least one embodiment, such as Figure 6 As shown, the bottom surface of the second heat sink 60 does not have the second fins 62, and the bottom surface of the second heat sink 60 is flush with or nearly flush with the bottom surface of the second part 12 of the housing 10, thereby making the back of the heat sink 1 relatively flat, so as to facilitate the installation of the heat sink 1 on the wall; it also allows the second heat sink 60 to have a deeper heat dissipation cavity 611 for accommodating the inductor 84.

[0065] In at least one embodiment, as shown in Figure 1 and Figure 2 the first portion 11 of the box 10 has a box opening 112 on the side facing away from the second portion 12, which is in communication with the outside, so as to facilitate the installation of various devices into the first accommodating cavity 111 and the second accommodating cavity 121. Further, the heat dissipation device 1 further comprises a box cover 20, which is hingedly connected to the box 10 and can cover the box opening 112. In addition, the box cover 20 is sealingly connected to the box 10, so as to keep the first accommodating cavity 111 and the second accommodating cavity 121 of the box 10 airtight, so as to ensure that the heat dissipation device 1 meets the IP level.

[0066] An inverter, comprising the heat dissipation device 1 described above. It should be understood that the box 10 of the heat dissipation device 1 can accommodate various devices such as the main control board 81, the power board 82 and the bus capacitor board 83. Through the first heat dissipation assembly 30 of the heat dissipation device 1, the semiconductor devices 821 on the power board 82 can be cooled, and the air in the box 10 can be cooled, so as to reduce the temperature of the semiconductor devices 821 and the capacitor 831. Through the second heat sink 60, the inductor 84 can be cooled, so as to reduce the temperature of the inductor 84. It is worth mentioning that the first heat dissipation assembly 30 and the second heat sink 60 of the heat dissipation device 1 are both installed on the outside of the box 10, so as to facilitate later maintenance, maintenance and replacement.

[0067] The above describes the basic principles, main features and advantages of the present application. It should be understood by those skilled in the art that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection required by the present application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating device, characterized by, The utility model relates to a box body, the box body is provided with first part and second part of L-shaped arrangement, the second part is protruding from the first part along the first direction, The first part has first accommodating cavity, the first accommodating cavity is housed the main control board and power board of inverter, the second part has the second accommodating cavity with the first accommodating cavity communication, the second accommodating cavity is housed the bus capacitor board of inverter, wherein, the size of the second part along the second direction is less than the size of the first part along the second direction, to form the first installation space between the second part and the first part, The first heat dissipation assembly is arranged in the first installation space and is sealedly connected with the box body, the first heat dissipation assembly is oppositely arranged with the power board in the first accommodating cavity along the first direction, to exchange heat with the power board, the first heat dissipation assembly is oppositely arranged with the second accommodating cavity along the second direction, to exchange heat with the air in the second accommodating cavity. The side of the first part towards the first installation space is defined as the first mounting surface, and the first mounting surface is provided with an opening; the first heat dissipation assembly comprises a first radiator which is sealingly mounted on the first mounting surface; part of the first radiator is oppositely arranged with the opening, so that the first radiator is connected with the semiconductor device on the power board.

2. The heat dissipating device according to claim 1, wherein The first radiator has a plurality of flow channels extending along a third direction; the first heat dissipation assembly further comprises a first fan which is arranged along the third direction with the first radiator, so that external air flows through the flow channels in parallel to the third direction.

3. The heat dissipating device according to claim 2, wherein The side of the second part towards the first installation space is defined as the second mounting surface, and the second mounting surface is provided with a first air port and a second air port; the first heat dissipation assembly further comprises a heat exchanger which is sealingly mounted on the second mounting surface, the heat exchanger has an inner channel and an outer channel which are isolated from each other, the outer channel penetrates along the third direction, and the two ends of the inner channel are respectively communicated with the first air port and the second air port, so that the air in the second accommodating cavity exchanges heat with external air through the heat exchanger.

4. The heat dissipating device of claim 2, wherein At least part of the inner channel extends along the third direction; the first heat dissipation assembly further comprises a second fan which is accommodated in the second accommodating cavity, the second fan is oppositely arranged with the first air port or the second air port, so that air flows through the inner channel in parallel to the third direction.

5. The heat dissipating device of claim 4, wherein The first radiator comprises an integral base plate and a plurality of first fins, the base plate is connectable with the semiconductor device on the power board, the first fins extend in a plane perpendicular to the base plate, and each of the first fins forms a flow channel; at least part of the first fins is spaced apart from the second mounting surface along the second direction to form an avoiding space, and the avoiding space is capable of accommodating the heat exchanger.

6. The heat dissipating device of claim 4, wherein ​ 7. The heat dissipating device according to any one of claims 1 to 6, wherein The heat dissipation device further comprises a baffle fixed to the box body, at least part of the baffle and the first part are oppositely arranged along a first direction to form the first mounting space between the baffle and the first part.

8. The heat dissipating device according to any one of claims 1 to 6, wherein The heat dissipation device further comprises a third fan accommodated in the first accommodating cavity, the third fan and the first heat dissipation assembly are respectively located on opposite sides of the power board, and an air outlet direction of the third fan is towards the power board.

9. The heat dissipating device according to any one of claims 1 to 6, wherein A size of the second part along a third direction is less than a size of the first part along the third direction to form a second mounting space between the second part and the first part; a side of the first part towards the second mounting space is defined as a third mounting surface, the third mounting surface is provided with an opening; the heat dissipation device further comprises at least one second heat sink, the second heat sink is sealingly mounted on the third mounting surface, the second heat sink is provided with a heat dissipation cavity, the heat dissipation cavity is communicated with the first accommodating cavity through the opening, and the heat dissipation cavity is capable of accommodating inductor devices.

10. An inverter, characterized by comprising: The heat dissipation device comprises: The heat dissipation device according to any one of claims 1-9.

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