Residual glue removing device for chip lead frame

Abstract

The utility model discloses a chip lead frame residual glue removing device, which is used for removing residual glue at a glue injection port of a lead frame and comprises a feeding station, a glue removing station and a discharging station which are sequentially arranged along a first direction, the glue removing station comprises a glue punching table and an upper die which moves up and down relative to the glue punching table, and the upper die is arranged on the discharging station. A lower die used for being supported below the lead frame is arranged on the glue punching table, a through groove corresponding to residual glue at a glue injection opening of the lead frame is formed in the lower die, and a glue punching protrusion corresponding to the through groove is arranged on the upper die. The ejection mechanism can penetrate through the through groove so as to eject out residual glue in the through groove, and then the residual glue falls off from the lead frame.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip production technical field especially relates to a chip lead frame removes glue device. BACKGROUND

[0002] Chip production process needs to connect lead (also known as pin) and injection molding package, for this need lead frame, lead frame is generally a thin copper plate, copper plate is arranged and set up on the lead module for connecting chip, lead module, set up on the lead module, a plurality of leads, chip positioning is placed on each lead module after corresponding with the corresponding lead connection, then through injection molding equipment makes each chip and lead module through injection molding package into the chip product with lead, after injection molding, the excess glue is left at the injection molding water gap of lead frame, as shown in the figure, for this need to remove the excess glue, the injection molding water gap of lead frame is provided with an elongated slit, the excess glue is located on the upper surface of the slit, for this need to turn over the lead frame after injection molding in order to facilitate the use of stamping equipment from the back of the slit inserts and thus removes the excess glue, for this need a kind of mechanical equipment to realize the removal of excess glue. Figure 1 SUMMARY

[0003] To solve the problem of removing excess glue at the injection molding water gap of lead frame, the utility model provides a kind of chip lead frame removes glue device, for the removal of excess glue at the injection molding water gap of lead frame.

[0004] The technical scheme adopted by the utility model is that a kind of chip lead frame removes glue device is designed, for removing the excess glue at the glue water gap of lead frame, including the feeding station, the glue removal station and the discharging station arranged in sequence along the first direction, the feeding station is provided with the first straight line slide rail along the first direction on one side, the discharging station is provided with the second straight line slide rail along the first direction on one side, the first straight line slide rail and the second straight line slide rail are respectively located on the two sides of the first direction, the first straight line slide rail is provided with the first mechanical hand that can move the lead frame between the feeding station and the glue removal station, the second straight line slide rail is provided with the second mechanical hand that can move the lead frame between the glue removal station and the discharging station;The glue removal station includes the glue punching table and the upper die that moves up and down relative to the glue punching table, the glue punching table is provided with the lower die for supporting below the lead frame, the lower die is provided with the through slot corresponding to the excess glue at the glue water gap of the lead frame, the upper die is provided with the glue punching protrusion corresponding to the through slot.

[0005] In some embodiments, the glue punching table is provided with the first photoelectric opposite emitting tube for detecting whether the lead frame is placed above the lower die and the second photoelectric opposite emitting tube for detecting the height of the lead frame.

[0006] ​In some embodiments, the through groove is communicated with a surplus glue falling channel below.

[0007] In some embodiments, a surplus glue recovery barrel is arranged below the surplus glue falling channel.

[0008] In some embodiments, a scavenging device and a dust suction device are arranged on the glue punching table and face the lower mold.

[0009] In some embodiments, the feeding station is a conveying belt, and a turnover frame is arranged on the conveying belt and rotates relative to the conveying belt, the turnover frame is controlled to rotate by a rotating device, the rotation axis of the turnover frame is perpendicular to the conveying belt, so that the turnover frame can rotate from below the lead frame on the conveying belt to above the lead frame.

[0010] In some embodiments, the turnover frame is provided with a slot for inserting the lead frame, when the slot is parallel to the conveying belt, the slot opening corresponds to the lead frame on the conveying belt in the conveying direction, and a limiting stopper is arranged below the turnover frame, when the slot is parallel to the conveying belt, the lower part of the turnover frame is supported on the limiting stopper.

[0011] In some embodiments, the conveying belt comprises two parallel conveying belt bodies, the turnover frame is located between the two conveying belt bodies, the turnover frame comprises two coaxially rotating rod bodies located between the two adjacent conveying belt bodies, the two rod bodies are adjacent to the two conveying belt bodies respectively, and each rod body is provided with the slot.

[0012] In some embodiments, the conveying belt is arranged on a support frame, the support frame is arranged on a linear moving device, the moving direction of the linear moving device is perpendicular to the conveying direction of the conveying belt, and the support frame is provided with a fixing frame, and the support frame is supported on the linear moving device by sliding through the fixing frame.

[0013] In some embodiments, a third mechanical hand for grabbing and moving the lead frame is included, the third mechanical hand comprises at least two parallel mechanical claws for grabbing the lead frame, and the mechanical claws are arranged in parallel in the moving direction of the linear moving device.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model discloses a glue removing station includes the glue -injection table and the upper die of the opposite glue -injection table up and down motion, be provided with the lower die for supporting in the glue -injection table below on the glue -injection table, be provided with the through slot corresponding with the surplus glue of the glue -injection port of the lead frame of the lower die, be provided with the glue -injection convex corresponding with the through slot on the upper die, the convex is thin blade shape, and it can pass through the through slot to the surplus glue in through slot and push out, and then fall off from the lead frame, although the surplus glue of glue -injection port and the chip plastic encapsulation glue of surrounding still have some fine glue -injection port surplus glue's connection, but because these fine glue -injection port surplus glue is thin, so when the surplus glue is pushed away, these fine glue -injection port surplus glue will break, thereby make the surplus glue will drop. BRIEF DESCRIPTION OF DRAWINGS

[0016] The utility model will be explained in detail below combining specific embodiment and drawing, in order to show details, facilitate understanding its principle, it is not necessarily drawn in proportion, similar reference signs can be described similar components in different view. The drawing shows the embodiment discussed in this paper with example but not limit. Wherein:

[0017] Figure 1 It is the schematic diagram of lead frame with surplus glue.

[0018] Figure 2 It is the schematic diagram of surplus glue device.

[0019] Figure 3 It is Figure 2 The top view of.

[0020] Figure 4 It is Figure 3 The schematic diagram of of removing upper die.

[0021] Figure 5 It is the schematic diagram of lower die.

[0022] Figure 6 It is the schematic diagram of the lower side of upper die.

[0023] Figure 7 It is the three -dimensional schematic diagram of lead frame conveying mechanism.

[0024] Figure 8 It is the top view schematic diagram of conveying belt mechanism.

[0025] Figure 9 It is the schematic diagram of conveying belt and lead frame is sent into the slot of turnover frame.

[0026] Figure 10 It is the schematic diagram of turnover frame and places lead frame to the conveying belt after turning over.

[0027] Figure 11 It is Figure 8 The axial schematic diagram of.

[0028] Figure 12 is Figure 11 An enlarged schematic view at A in the figure.

[0029] In the figure, 1, conveying belt; 2, turnover frame; 201, slot; 202, notch; 3, lead frame; 4, limiting stop; 5, support frame, 6, linear moving device; 7, fixed frame; 8, turnover motor; 9, transmission belt; 10, driving motor; 11, third mechanical hand; 111, mechanical claw; 12, mechanical arm; 13, lifting mechanism; 14, linear moving mechanism; 31, excess glue; 15, feeding station; 16, glue removing station; 17, discharging station; 18, first linear slide rail; 19, second linear slide rail; 181, first mechanical hand; 191, second mechanical hand; 21, upper mold; 22, lower mold; 211, through slot; 221, glue punching protrusion; 23, chip plastic packaging module; 24, first photoelectric transceiver tube; 25, second photoelectric transceiver tube; 26, excess glue falling channel; 27, excess glue recovery bucket; 28, air jet pipe; 29, dust cover; 30, lifting cylinder; 31, excess glue at glue water injection port. DETAILED DESCRIPTION

[0030] The following are specific embodiments of the present application, and the technical solutions of the present application are further described in conjunction with the drawings, but the present application is not limited to these embodiments, and the following embodiments do not limit the utility model involved in the claims. In addition, all combinations of the features described in the embodiments are not necessarily required by the solution of the utility model.

[0031] The principles and structures of the present application will be described in detail below in conjunction with the drawings and embodiments.

[0032] EMBODIMENT

[0033] As Figure 1 , 2 , 3, 4, a chip lead frame excess glue removing device for removing excess glue 31 at the glue water injection port of the chip lead frame 3, the excess glue removing device comprising a feeding station 15, a glue removing station 16 and a discharging station 17 arranged in sequence along a first direction, the feeding station being provided with a first linear slide rail 18 along the first direction on one side, the discharging station being provided with a second linear slide rail 19 along the first direction on one side, and the first linear slide rail and the second linear slide rail being respectively located on both sides of the first direction, so as to avoid mutual interference of the two mechanical hands. The glue water injection port of the present embodiment includes a middle glue water injection port located between two lead frame sheets, which connects the two lead frame sheets together, and therefore two lead frame sheets need to be processed at the same time each time.

[0034] The first straight slide rail is provided with a first mechanical arm 181 capable of moving the lead frame between the feeding station and the glue removing station, so as to move the lead frame at the feeding station to the glue removing station for glue removing; the second straight slide rail is provided with a second mechanical arm 191 capable of moving the lead frame between the glue removing station and the discharging station, so as to move the lead frame after glue removing to the discharging station for glue removing of the next lead frame.

[0035] As shown in Figure 5 , 6 The glue removing station comprises a glue punching table and an upper die 21 moving up and down relative to the glue punching table, the glue punching table is provided with a lower die 22 for supporting below the lead frame, the lower die is provided with a through groove 211 corresponding to the excess glue at the glue injection port of the lead frame, the upper die is provided with a glue punching protrusion 221 corresponding to the through groove, the protrusion is a thin blade shape, which can pass through the through groove to push out the excess glue in the through groove, and then fall off from the lead frame, although the excess glue at the injection port is connected with the surrounding chip plastic package module 23 and some fine excess glue, but since the fine excess glue is thin, when the excess glue is pushed off, the fine excess glue will be broken, so that the excess glue will fall off. The upper die of the embodiment is controlled to move up and down by a lifting cylinder 30.

[0036] The glue punching table is provided with a first photoelectric opposite radiation tube 24 for detecting whether the lead frame is placed above the lower die, and a second photoelectric opposite radiation tube 25 for detecting the height of the lead frame.

[0037] Each of the first photoelectric opposite radiation tubes is used for detecting whether the lead frame is placed on the lower die, and the second photoelectric opposite radiation tube is used for detecting whether the height of the lead frame on all the lower dies exceeds the set height limit, if the height exceeds the preset height, it means that the lead frame is placed incorrectly or the mechanical arm has grabbed more than one lead frame, so that more than one lead frame is placed on the lower die.

[0038] The through groove is communicated with an excess glue falling channel 26 below, and an excess glue recovery bucket 27 is arranged below the lower end of the excess glue falling channel, so that the excess glue punched off falls into the excess glue falling channel and then rolls into the excess glue recovery bucket for collection.

[0039] The glue punching table is provided with a sweeping air device and a dust suction device facing the lower die, the sweeping air device comprises a plurality of air injection pipes 28 located at one end side of the lower die, the dust suction device comprises a dust suction hood 29 arranged at the other end side of the lower die opposite to the air injection pipes, the dust suction hood is communicated with the dust suction device, and the air injection pipes blow air towards the lower die to blow away the debris on the lower die, so as to facilitate the dust suction device to suck away the debris.

[0040] As shown in Figure 7 , the device further comprises a lead frame conveying mechanism, which comprises a third mechanical hand 11 for grabbing and moving the lead frame, the third mechanical hand comprising at least two parallel mechanical claws 111 for grabbing the lead frame. The device further comprises a conveying belt for conveying the lead frame, i.e. the feeding station is a conveying belt, the conveying belt 1 being arranged on a support frame 5, the support frame 5 being arranged on a linear moving device 6, the moving direction of the linear moving device 6 being perpendicular to the conveying direction of the conveying belt 1, so that the conveying belt 1 can be moved as a whole to facilitate conveying the lead frame 3 to different positions, the mechanical claws being arranged in parallel in the moving direction of the linear moving device, the conveying belt being moved by the linear moving device so as to correspond to different mechanical claws respectively, thereby receiving the lead frame on the different mechanical claws.

[0041] As shown in Figure 8 , 9 , 10, 11, 12, the third mechanical hand comprises a mechanical arm 12 above the conveying belt, the mechanical arm being controlled by a lifting mechanism 13 to move up and down relative to the conveying belt, thereby placing the lead frame on the third mechanical hand onto the conveying belt, the lifting mechanism being controlled by a linear moving mechanism 14 to move in the conveying direction of the conveying belt, thereby placing the lead frame on other stations onto the conveying belt.

[0042] The device further comprises a turnover frame 2 rotating relative to the conveying belt 1, the turnover frame 2 being controlled by a rotating device to rotate, the rotation axis of the turnover frame 2 being perpendicular to the conveying belt 1, so that the turnover frame 2 can be rotated from below the lead frame 3 on the conveying belt 1 to above the lead frame 3. The lead frame 3 is a sheet or a plate, when the lead frame 3 moves above the turnover frame 2, the turnover frame 2 is rotated upward to make the lead frame 3 stand up relative to the conveying belt 1 and then move downward in the conveying direction, thereby realizing the lead frame 3 being conveyed while being turned upside down.

[0043] Further, the turnover frame 2 is provided with a slot 201 for inserting the lead frame 3, when the slot 201 is parallel to the conveying belt 1, the slot opening 202 of the slot 201 corresponds to the lead frame 3 on the conveying belt 1 in the conveying direction, so that the slot opening 202 faces the opposite direction of the conveying direction of the conveying belt 1, so that the conveying belt 1 conveys the lead frame 3 into the slot 201, then the turnover frame 2 rotates to stand up so that the lead frame 3 rotates with the slot 201, so that the slot opening 202 faces the conveying direction of the conveying belt 1, at this time, the lead frame 3 is placed on the conveying belt 1 again and moves away from the slot 201 with the conveying belt 1, then the slot 201 rotates reversely to receive the next lead frame 3 for turnover.

[0044] Further, the turnover frame 2 is provided with a slot 201 for inserting the lead frame 3, when the slot 201 is parallel to the conveying belt 1, the slot opening 202 of the slot 201 corresponds to the lead frame 3 on the conveying belt 1 in the conveying direction, so that the slot opening 202 faces the opposite direction of the conveying direction of the conveying belt 1, so that the conveying belt 1 conveys the lead frame 3 into the slot 201, then the turnover frame 2 rotates to stand up so that the lead frame 3 rotates with the slot 201, so that the slot opening 202 faces the conveying direction of the conveying belt 1, at this time, the lead frame 3 is placed on the conveying belt 1 again and moves away from the slot 201 with the conveying belt 1, then the slot 201 rotates reversely to receive the next lead frame 3 for turnover.

[0045] Further, the conveying belt 1 comprises two parallel conveying belt 1 bodies, and the turnover frame 2 is located between the two conveying belt 1 bodies, so that the device structure is compact, located inside the conveying belt 1, does not occupy additional space of the conveying belt 1, and is also beneficial to the position balance of the lead frame 3 in the slot 201, so that the slot 201 is located at the middle position of the lead frame 3, thereby facilitating the stable turnover of the lead frame 3.

[0046] Further, the turnover frame 2 comprises two coaxially rotating rod bodies located between two adjacent conveying belt 1 bodies, and the two rod bodies are adjacent to the two conveying belt 1 bodies respectively, and each rod body is provided with the slot 201, so that the slot 201 part is as close to the conveying belt 1 body as possible, so that the slot 201 can have a larger width, which is beneficial to the stable positioning of the lead frame 3 relative to the turnover frame 2, and at the same time, using two rod bodies instead of one plate body is beneficial to reducing the structure weight and does not affect the positioning and turnover of the lead frame 3.

[0047] Further, the support frame 5 is also provided with a driving motor 10 for driving the conveying belt 1 to rotate. The linear moving device 6 is, for example, a linear motor or the like which can move the support frame 5 along a linear guide rail or the like.

[0048] The rotating device is a turnover motor 8, the rotating shaft of the turnover frame 2 is arranged on the support frame 5, the turnover motor 8 drives the rotating shaft to rotate through a transmission belt 9, the turnover motor 8 is fixed relative to the support frame 5, so that the turnover frame 2 moves together with the conveying belt 1, and the transmission belt 9 is located between the two rod bodies of the turnover frame 2. The turnover frame 2 is located at the discharging end side of the conveying belt 1, so as to facilitate discharging of the lead frame 3 after turnover.

[0049] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art of the present application can make various modifications or supplements to the described specific embodiments or use similar ways to replace them, without departing from the spirit of the present application or exceeding the scope defined by the appended claims.

[0050] Although some terms are used more frequently herein, the possibility of using other terms is not excluded. The use of these terms is merely for the convenience of describing and explaining the essence of the present application; any interpretation of them as any kind of additional limitation is contrary to the spirit of the present application. The order of execution of actions, steps, etc. in the devices and methods shown in the specification and drawings can be implemented in any order, as long as there is no specific order limitation, and the output of the previous processing is not used in the subsequent processing. The use of similar ordinal terms (for example, "first", "then", "second", "again", "then" and the like) for the convenience of description does not mean that the order must be implemented in such order.

[0051] Those of ordinary skill in the art will understand that all directional references (for example, upper, lower, upward, up, downward, down, top, bottom, left, right, vertical, horizontal, etc.) used herein are descriptive used in the drawings to help the reader's understanding, and do not represent (for example, to the position, orientation or use, etc.) limitations on the scope of the present application defined by the appended claims, and only for the convenience of describing the present application and simplifying the description, without the opposite indication, these orientation words do not indicate and imply that the indicated device or element must have a particular orientation or be constructed and operated in a particular orientation, the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component itself.

[0052] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical" and "horizontal" as can be perceived herein relative to the figures referred to describe a device or feature as positioned in relation to other devices or features as shown in the figures. It is to be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device described herein as "above" or "up" another device or structure is inverted, then the device which is described as "above" or "up" can be oriented "below" or "down" relative to the other device or structure. Accordingly, the exemplary term "above" can encompass both an orientation of above and below. The devices can be oriented in other ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. The terms "first", "second", and the like, as can be perceived herein, do not necessarily denote any ordinal, chronological or spatial relationship, but are merely meant to distinguish one element from another, unless otherwise indicated by the context.

[0053] In addition, some imprecise terms (for example, substantially, certain, generally, etc.) can refer to slight inaccuracy or slight deviation of conditions, quantities, values or sizes, etc., some of which are within manufacturing deviation or tolerance range. It should be noted that the use of the terms "first", "second", etc. to define parts only facilitates the distinction of the corresponding parts, and the above terms have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

Claims

1. A device for removing excess glue from a lead frame, for removing excess glue from a glue port of a lead frame, characterized in that, The device comprises a feeding station, a glue removing station and a discharging station arranged in sequence along a first direction. The feeding station is provided with a first linear slide rail along the first direction on one side. The discharging station is provided with a second linear slide rail along the first direction on one side. The first linear slide rail and the second linear slide rail are respectively located on two sides of the first direction. The first linear slide rail is provided with a first mechanical hand capable of moving the lead frame between the feeding station and the glue removing station. The second linear slide rail is provided with a second mechanical hand capable of moving the lead frame between the glue removing station and the discharging station. The glue removing station comprises a glue punching table and an upper die moving up and down relative to the glue punching table. The glue punching table is provided with a lower die for supporting below the lead frame. The lower die is provided with a through groove corresponding to the excess glue at the glue injection port of the lead frame. The upper die is provided with a glue punching protrusion corresponding to the through groove.

2. The apparatus according to claim 1, wherein The glue punching table is provided with a first photoelectric tube for detecting whether the lead frame is placed above the lower die and a second photoelectric tube for detecting the height of the lead frame.

3. The apparatus according to claim 1, wherein The through groove is communicated with an excess glue falling channel below.

4. The apparatus according to claim 3, wherein The excess glue falling channel is provided with an excess glue recovery bucket below.

5. The apparatus according to claim 1, wherein The glue punching table is provided with an air sweeping device and a dust suction device towards the lower die.

6. The apparatus according to claim 1, wherein The feeding station is a conveying belt provided with a turnover frame rotating relative to the conveying belt. The turnover frame is controlled to rotate by a rotating device. The rotation shaft of the turnover frame is perpendicular to the conveying belt, so that the turnover frame can rotate from below the lead frame on the conveying belt to above the lead frame.

7. The apparatus according to claim 6, wherein The turnover frame is provided with a slot for inserting the lead frame. When the slot is parallel to the conveying belt, the slot opening corresponds to the lead frame on the conveying belt in the conveying direction. The turnover frame is supported on a limiting stopper below when the slot is parallel to the conveying belt.

8. The apparatus according to claim 7, wherein The conveying belt comprises two parallel conveying belt bodies. The turnover frame is located between the two conveying belt bodies. The turnover frame comprises two coaxially rotating rod bodies between the two adjacent conveying belt bodies. The two rod bodies are adjacent to the two conveying belt bodies respectively. Each rod body is provided with the slot.

9. The apparatus according to claim 6, wherein The conveying belt is arranged on a support frame. The support frame is arranged on a linear moving device. The moving direction of the linear moving device is perpendicular to the conveying direction of the conveying belt. The support frame is provided with a fixing frame. The support frame is supported on the linear moving device by sliding through the fixing frame.

10. The apparatus according to claim 9, wherein The device comprises a third mechanical hand for grabbing and moving the lead frame. The mechanical hand comprises at least two parallel mechanical claws for grabbing the lead frame. The mechanical claws are arranged in parallel in the moving direction of the linear moving device.

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