Coating bubble removing device for laser protection liquid

Abstract

The utility model discloses a laser protection liquid coating bubble removing device, which is applied to the field of wafer processing equipment, and comprises a base and a rotating mechanism, the top of the base is provided with a shell and a fixing plate, one side of the fixing plate is bolted with an ultrasonic defoamer, the top of the shell is provided with a first fixing frame, and the first fixing frame is provided with a second fixing frame. A second fixing frame is arranged at the top of the first fixing frame, a vibration motor is in bolting connection with the interior of the second fixing frame, a fixing spring is in bolting connection between the interior of the second fixing frame and the first fixing frame through a spring fixing piece, and a round frame and a mounting frame are welded to the top and the bottom of the second fixing frame respectively. According to the laser protection liquid coating device, the bubble removing function can be achieved, the coating uniformity of the laser protection liquid on the wafer is guaranteed, badness in the manufacturing process is avoided, the good product output rate is increased, meanwhile, workers can conveniently and rapidly take the wafer, operation is easy and convenient, the working efficiency of the workers is improved, and practicability is high.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment, and in particular to a device for removing bubbles in laser protective liquid coating. Background Technology

[0002] During the wafer packaging process, in the wafer dicing process, for Low-k wafer products, a laser grooving machine is required to coat the wafer surface with laser protective liquid.

[0003] Existing equipment lacks bubble removal capabilities. When the wafer is coated with laser protective solution, tiny bubbles are generated during the extraction of the solution and again after coating. These bubbles break during the spin coating process, resulting in a thinner layer of laser protective solution at the bubble location compared to other areas. This fails to provide protection for the wafer surface and makes it difficult for personnel to handle the wafer. To prevent the wafer from sliding or shifting on the top of the equipment, it is usually placed in a specific circular frame that fits the frame. While this provides stability and facilitates the coating of the protective solution, it is difficult to remove the wafer, requiring personnel to use tools to pry it up, which can easily damage the wafer and reduces its practicality. To address these problems, we propose a laser protective solution coating bubble removal device. Utility Model Content

[0004] The purpose of this invention is to provide a device for removing bubbles in laser protective liquid coating, which solves the problems of existing machines lacking bubble removal function and being inconvenient for quick handling of wafers.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a laser protective liquid coating bubble removal device, comprising a base and a rotating mechanism, wherein a housing and a fixing plate are installed on the top of the base, an ultrasonic defoamer is bolted to one side of the fixing plate, a first fixing frame is provided on the top of the housing, a second fixing frame is provided on the top of the first fixing frame, a vibration motor is bolted inside the second fixing frame, a fixing spring is bolted between the inside of the second fixing frame and the first fixing frame through a spring fixing plate, a circular frame and a mounting bracket are welded to the top and bottom of the second fixing frame respectively, a threaded rod is rotatably connected to the bottom of the second fixing frame, a second motor is fixedly sleeved at the other end of the threaded rod, a threaded plate is threadedly connected to the surface of the threaded rod, and a top plate is bolted to the top of the threaded plate through a support rod.

[0006] The above technical solution can remove air bubbles, ensuring the uniformity of laser protective liquid coating on the wafer, avoiding defects in the process, increasing the yield of good products, and facilitating quick handling of the wafer by personnel. It is simple and convenient to operate, improves the work efficiency of personnel, and is highly practical.

[0007] The present invention is further configured such that: the rotating mechanism includes a rotating shaft, the rotating shaft is rotatably connected inside the housing, the other end of the housing is welded to the bottom of the first fixed frame, a first motor is bolted inside the housing through a pad, a first bevel gear is fixedly sleeved at the output end of the first motor, and a second bevel gear meshing with the first bevel gear is fixedly sleeved on the surface of the rotating shaft.

[0008] By adopting the above technical solution, through the arrangement of the rotating shaft, the first motor, the first bevel gear and the second bevel gear, the device can have a rotation function and drive the wafer located above the second fixed frame to rotate.

[0009] The present invention is further configured such that: two heat dissipation grooves are provided at the bottom of the first fixing frame, and two dustproof nets are bolted to the bottom of the first fixing frame.

[0010] By adopting the above technical solution, the ventilation effect within the first fixed frame can be improved and the entry of dust can be reduced through the setting of heat dissipation grooves and dustproof nets.

[0011] The present invention is further configured such that: two slide rails are bolted inside the mounting bracket, and sliders that are slidably connected to the slide rails are welded to both sides of the threaded plate.

[0012] By adopting the above technical solution, the threaded plate can be limited by the setting of slide rail and slider, preventing the threaded plate from flipping over during the up and down movement.

[0013] The present invention is further configured such that the surfaces of the base, the housing and the fixing plate are all coated with anti-corrosion coating.

[0014] By adopting the above technical solution and applying anti-corrosion coating, the anti-corrosion and moisture-proof effects of the base, shell and fixing plate surfaces can be improved.

[0015] The present invention is further configured such that the fixing spring is made of carbon spring steel.

[0016] Using the above technical solution, the fixed spring has the characteristics of excellent mechanical properties, good anti-elasticity, low temperature resistance and corrosion resistance.

[0017] The present invention is further configured such that the mounting bracket, threaded rod and threaded plate are all made of stainless steel.

[0018] Using the above technical solution, the mounting bracket, threaded rod, and threaded plate have the characteristics of high strength, low density, and excellent corrosion resistance.

[0019] In summary, this utility model has the following beneficial effects:

[0020] 1. This utility model involves first placing the wafer into a circular frame, and then spraying laser protective liquid downwards from the upper nozzle. After the protective liquid is sprayed onto the wafer, an ultrasonic defoamer and a vibration motor are simultaneously activated. The ultrasonic defoamer creates cavitation, causing the bubbles to burst. The vibration motor, in conjunction with a fixed spring, causes the second fixed frame to vibrate. The vibration energy is then transmitted upwards to the laser protective liquid, thus achieving a bubble removal function. This ensures the uniformity of the laser protective liquid coating on the wafer, avoids defects in the process, and increases the yield of good products.

[0021] 2. This utility model involves starting a second motor after the protective liquid is applied. After starting, the second motor drives the threaded rod to rotate under the fixation of the mounting bracket. When the threaded rod rotates, it drives the threaded plate to move upward through the cooperation of the slide rail and the slider. When the threaded plate moves upward, it drives the top plate to lift the wafer under the fixation of the support rod. This makes it easy for personnel to quickly pick up the wafer, and the operation is simple and convenient, improving the work efficiency of personnel and making it highly practical. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural view of the present invention;

[0023] Figure 2 This is a front sectional view of the structure of this utility model;

[0024] Figure 3 This is a utility model Figure 2 Enlarged view of the structure at point A in the middle.

[0025] Reference numerals: 1. Base; 2. Housing; 3. Fixing plate; 4. Rotating mechanism; 41. Rotating shaft; 42. First motor; 43. First bevel gear; 44. Second bevel gear; 5. Ultrasonic defoamer; 6. First fixing frame; 7. Second fixing frame; 8. Vibration motor; 9. Fixing spring; 10. Circular frame; 11. Mounting bracket; 12. Threaded rod; 13. Second motor; 14. Threaded plate; 15. Top plate; 16. Heat dissipation groove; 17. Dustproof net; 18. Slide rail; 19. Slider. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings.

[0027] Example 1:

[0028] refer to Figure 1 and Figure 2A device for removing bubbles in laser protective liquid coating includes a base 1 and a rotating mechanism 4. A housing 2 and a fixing plate 3 are mounted on the top of the base 1. An ultrasonic defoamer 5 is bolted to one side of the fixing plate 3. A first fixing frame 6 is provided on the top of the housing 2, and a second fixing frame 7 is provided on the top of the first fixing frame 6. A vibration motor 8 is bolted inside the second fixing frame 7. A fixing spring 9 is bolted between the inside of the second fixing frame 7 and the first fixing frame 6 through a spring fixing plate. The device works by first placing a wafer into a circular frame 10. After the wafer is placed, the laser protective liquid is sprayed downwards from the upper nozzle. After the protective liquid is sprayed onto the wafer, the ultrasonic defoamer 5 and the vibration motor 8 are activated simultaneously. After the ultrasonic defoamer 5 is activated, it creates cavitation, causing the bubbles to burst. After the vibration motor 8 is activated, it causes the second fixing frame 7 to vibrate with the cooperation of the fixing spring 9. The vibration energy is transmitted upwards to the laser protective liquid, thus achieving the function of bubble removal. This ensures the uniformity of the laser protective liquid coating on the wafer, avoids defects in the process, and improves the yield of good products.

[0029] The ultrasonic defoamer 5 first generates a high-frequency oscillation signal through an internal ultrasonic generator. This signal is converted into high-frequency mechanical oscillation by a transducer and propagates into the cleaning fluid, generating a cavitation effect. The transducer converts electrical energy into mechanical energy, causing the liquid in the cleaning fluid to generate a large number of tiny bubbles. These bubbles form and grow in the negative pressure zone of the ultrasonic waves and rapidly close in the positive pressure zone, generating strong shock waves and instantaneous high pressure. This causes the liquid to generate a large number of microbubbles, which, under the action of ultrasonic waves, form and close, producing a cavitation effect.

[0030] refer to Figure 2 The rotating mechanism 4 includes a rotating shaft 41, which is rotatably connected inside the housing 2. The other end of the housing 2 is welded to the bottom of the first fixed frame 6. A first motor 42 is bolted inside the housing 2 through a pad. A first bevel gear 43 is fixedly sleeved at the output end of the first motor 42. A second bevel gear 44 that meshes with the first bevel gear 43 is fixedly sleeved on the surface of the rotating shaft 41. Through the arrangement of the rotating shaft 41, the first motor 42, the first bevel gear 43 and the second bevel gear 44, the mechanism can have a rotating function and drive the wafer located above the second fixed frame 7 to rotate.

[0031] refer to Figure 2 Two heat dissipation slots 16 are provided at the bottom of the first fixed frame 6, and two dustproof nets 17 are bolted to the bottom of the first fixed frame 6. The heat dissipation slots 16 and dustproof nets 17 can improve the ventilation effect inside the first fixed frame 6 and reduce the entry of dust.

[0032] refer to Figure 1 and Figure 2The surfaces of the base 1, the shell 2, and the fixing plate 3 are all coated with anti-corrosion paint. The anti-corrosion and moisture-proof effects of the base 1, the shell 2, and the fixing plate 3 can be improved by the application of anti-corrosion paint.

[0033] refer to Figure 2 The fixed spring 9 is made of carbon spring steel and has excellent mechanical properties, good spring damping performance, low temperature resistance and corrosion resistance.

[0034] Brief description of the usage process: First, the wafer is placed into the circular frame 10. After the wafer is placed, the laser protective liquid is sprayed downward from the upper nozzle. After the protective liquid is sprayed onto the wafer, the ultrasonic defoamer 5 and the vibration motor 8 are activated simultaneously. After the ultrasonic defoamer 5 is activated, it will create cavitation and cause the bubbles to burst. After the vibration motor 8 is activated, it will cause the second fixed frame 7 to vibrate in cooperation with the fixed spring 9. After the vibration energy is formed, it will be transmitted upward to the laser protective liquid.

[0035] Example 2:

[0036] refer to Figure 1 , Figure 2 and Figure 3 A laser protective liquid coating bubble removal device is disclosed. A circular frame 10 and a mounting bracket 11 are welded to the top and bottom of a second fixed frame 7, respectively. A threaded rod 12 is rotatably connected to the bottom of the second fixed frame 7. A second motor 13 is fixedly sleeved at the other end of the threaded rod 12. A threaded plate 14 is threadedly connected to the surface of the threaded rod 12. A top plate 15 is bolted to the top of the threaded plate 14 via a support rod. When the protective liquid is applied, the second motor 13 is activated. After activation, the second motor 13, fixed by the mounting bracket 11, drives the threaded rod 12 to rotate. During rotation, the threaded rod 12, through the cooperation of a slide rail 18 and a slider 19, drives the threaded plate 14 to move upward. As the threaded plate 14 moves upward, it, fixed by the support rod, drives the top plate 15 to lift the wafer. This device facilitates quick wafer handling, is simple and convenient to operate, improves work efficiency, and is highly practical.

[0037] refer to Figure 3 The mounting bracket 11 has two slide rails 18 bolted inside. Both sides of the threaded plate 14 are welded with sliders 19 that are slidably connected to the slide rails 18. The slide rails 18 and sliders 19 can limit the threaded plate 14 and prevent it from flipping over during the up and down movement.

[0038] refer to Figure 2 and Figure 3 The mounting bracket 11, threaded rod 12 and threaded plate 14 are all made of stainless steel. The mounting bracket 11, threaded rod 12 and threaded plate 14 have the characteristics of high strength, low density and excellent corrosion resistance.

[0039] Brief description of the usage process: After the protective liquid is applied, the second motor 13 is started. After starting, the second motor 13 will drive the threaded rod 12 to rotate under the fixation of the mounting bracket 11. When the threaded rod 12 rotates, it will drive the threaded plate 14 to move upward through the cooperation of the slide rail 18 and the slider 19. When the threaded plate 14 moves upward, it will drive the top plate 15 to lift the wafer under the fixation of the support rod.

[0040] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A device for removing air bubbles in laser protective liquid coating, comprising a base (1) and a rotating mechanism (4), characterized in that: The base (1) is equipped with a housing (2) and a fixing plate (3) on its top. An ultrasonic defoamer (5) is bolted to one side of the fixing plate (3). A first fixing frame (6) is provided on the top of the housing (2). A second fixing frame (7) is provided on the top of the first fixing frame (6). A vibration motor (8) is bolted inside the second fixing frame (7). A fixing spring (9) is bolted between the inside of the second fixing frame (7) and the first fixing frame (6) through a spring fixing plate. A round frame (10) and a mounting bracket (11) are welded to the top and bottom of the second fixing frame (7) respectively. A threaded rod (12) is rotatably connected to the bottom of the second fixing frame (7). A second motor (13) is fixedly sleeved at the other end of the threaded rod (12). A threaded plate (14) is threadedly connected to the surface of the threaded rod (12). A top plate (15) is bolted to the top of the threaded plate (14) through a support rod.

2. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, The rotating mechanism (4) includes a rotating shaft (41) which is rotatably connected inside the housing (2). The other end of the housing (2) is welded to the bottom of the first fixed frame (6). A first motor (42) is bolted inside the housing (2) through a pad. A first bevel gear (43) is fixedly sleeved on the output end of the first motor (42). A second bevel gear (44) that meshes with the first bevel gear (43) is fixedly sleeved on the surface of the rotating shaft (41).

3. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, Two heat dissipation slots (16) are provided at the bottom of the first fixed frame (6), and two dustproof nets (17) are bolted to the bottom of the first fixed frame (6).

4. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, The mounting bracket (11) has two slide rails (18) bolted inside, and the threaded plate (14) has sliders (19) welded to both sides of the slide rails (18) for sliding connection.

5. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, The surfaces of the base (1), the shell (2), and the fixing plate (3) are all coated with anti-corrosion paint.

6. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, The fixed spring (9) is made of carbon spring steel.

7. The laser protective liquid coating bubble removal device according to claim 1, characterized in that, The mounting bracket (11), threaded rod (12), and threaded plate (14) are all made of stainless steel.

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