Auxiliary device for compound preparation of semiconductor viscosity-reducing film

Abstract

The utility model relates to the technical field of semiconductor viscosity reducing film preparation, and discloses an auxiliary device for composite preparation of a semiconductor viscosity reducing film, which comprises a fixed table, a transmission table is arranged on the inner side of the fixed table, a support frame is fixedly connected to the top of the fixed table, and a spraying and slicking mechanism is arranged in the middle of the top of the support frame. Pressing mechanisms are arranged on the left side and the right side of the top of the supporting frame, the spraying and strickling mechanism comprises a spraying assembly and a strickling assembly, the spraying assembly is arranged on the top of the supporting frame, the strickling assembly is arranged on the top of the spraying assembly, the spraying assembly comprises a connecting plate, and the connecting plate is fixedly connected to the back end of the fixing table. The top of the connecting plate is fixedly connected with a water tank. The first motor drives the worm to rotate, so that the worm drives the first threaded rod to rotate through the worm gear, the first threaded rod drives the scraping plate to move downwards, the scraping plate can scrape glue on the surface of a base material, and the glue is more uniform.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor anti-adhesion film preparation technology, specifically to an auxiliary device for semiconductor anti-adhesion film composite preparation. Background Technology

[0002] Semiconductor anti-adhesion film, also known as semiconductor UV anti-adhesion film or UV anti-adhesion tape, is a special tape widely used in the semiconductor packaging field. The coating of semiconductor anti-adhesion film is one of the key steps in its preparation.

[0003] The paint coating auxiliary device disclosed in CN 220919633 U uses a second servo motor to drive a threaded rod to rotate, causing a movable block to move along the threaded rod while the coating body is sprayed with paint. This effectively solves the problems of inconsistent coating thickness and easy displacement of parts during the coating process due to the lack of a fixing device, which affects the coating quality of traditional parts coating devices.

[0004] This coating auxiliary device sprays coating onto the material surface through the coating body, but it lacks a scraping device to smooth the coated material, resulting in inconsistent coating thickness on the material surface. Therefore, it needs improvement. Utility Model Content

[0005] The purpose of this invention is to provide an auxiliary device for the preparation of semiconductor anti-adhesion film composites, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an auxiliary device for the preparation of semiconductor anti-adhesion film composites, comprising a fixed platform, a transfer platform disposed on the inner side of the fixed platform, a support frame fixedly connected to the top of the fixed platform, a spraying and scraping mechanism disposed in the middle of the top of the support frame, and pressing mechanisms disposed on the left and right sides of the top of the support frame.

[0007] The spraying and leveling mechanism includes a spraying component and a leveling component. The spraying component is disposed on the top of the support frame, and the leveling component is disposed on the top of the spraying component.

[0008] The spraying assembly includes a connecting plate, which is fixedly connected to the back end of the fixed platform. A water tank is fixedly connected to the top of the connecting plate. A transmission pipe is fixedly connected to the inner side of the water tank. A water pump is fixedly connected to the outer side of the transmission pipe. The water pump is fixedly connected to the top of the water tank. A flow divider is fixedly connected to the front of the transmission pipe. A spray head is fixedly connected to the bottom of the flow divider. A linkage plate is fixedly connected to the right side of the flow divider. A slide plate is fixedly connected to the top of the linkage plate. A cylinder is fixedly connected to the right side of the slide plate. A fixing plate is fixedly connected to the left side of the cylinder. The fixing plate is fixedly connected to the top right side of the support frame.

[0009] Preferably, the inner side of the support frame is provided with a sliding groove corresponding to the movement trajectory of the slide plate, and the support frame is slidably connected to the inside of the sliding groove. Through the sliding groove, when the cylinder operates, the slide plate can drive the linkage plate and the diverter plate to move, so that the spray head can spray the glue onto different positions on the surface of the substrate.

[0010] Preferably, the leveling assembly includes a first motor, which is fixedly connected to the top of the linkage plate. A worm gear is fixedly connected to the back end of the first motor. A worm wheel meshes with the right side of the worm gear. A support member is fixedly connected to the bottom periphery of the worm wheel. A first threaded rod is threadedly connected inside the worm wheel. A limit plate is fixedly connected to the top of the first threaded rod. A scraper is fixedly connected to the bottom of the first threaded rod. A slide rod is fixedly connected to the top of the scraper. The slide rod is fixedly connected to the bottom of the limit plate.

[0011] Preferably, the inner side of the linkage plate is provided with a circular groove corresponding to the movement trajectory of the support member, and the support member is slidably connected inside the circular groove. Through the circular groove, the support member can slide inside the linkage plate. The support member can support the worm gear, making the worm gear more stable during rotation.

[0012] Preferably, there are two slide rods, which are slidably connected inside the linkage plate. The slide rods can limit the movement of the scraper, making the scraper more stable during the lifting and lowering process.

[0013] Preferably, the pressing mechanism includes a servo motor, which is fixedly connected to the left and right sides of the top of the support frame. A second threaded rod is fixedly connected to the bottom of the servo motor. A connecting frame is rotatably connected to the bottom of the second threaded rod. The connecting frame is fixedly connected to the bottom of the support frame. A threaded plate is threadedly connected to the periphery of the second threaded rod. A slide bar is fixedly connected to the bottom of the threaded plate. A pressing plate is fixedly connected to the bottom of the slide bar.

[0014] Preferably, the inner side of the connecting frame is provided with a fixing hole corresponding to the movement trajectory of the slide bar, and the slide bar is slidably connected inside the fixing hole. Through the fixing hole, the slide bar can slide inside the connecting frame. The slide bar can limit the threaded plate, making the threaded plate more stable during the lifting and lowering process.

[0015] Compared with the prior art, the present invention provides an auxiliary device for the preparation of semiconductor anti-adhesion film composites, which has the following beneficial effects:

[0016] 1. This auxiliary device for preparing semiconductor anti-adhesion film composites, through a spraying and leveling mechanism, when preparing semiconductor anti-adhesion films, places the adhesive-bearing substrate on top of the transfer table. A water pump, water tank, transfer pipe, flow divider, and spray head work together to spray the adhesive onto the substrate surface. A cylinder, slide plate, linkage plate, and flow divider work together to move the spray head, allowing it to spray adhesive onto different positions on the substrate surface. When leveling the sprayed adhesive, a first motor, worm gear, worm wheel, first threaded rod, and scraper work together. The scraper moves downwards, scraping the adhesive off the substrate surface to make the adhesive more uniform.

[0017] 2. The auxiliary device for preparing semiconductor anti-adhesion film composites, through the set pressing mechanism, when it is necessary to spray adhesive on the surface of the semiconductor anti-adhesion film substrate, the servo motor drives the second threaded rod to rotate, so that the second threaded rod drives the slide bar and the pressing plate to move downward through the threaded plate, so that the pressing plate can press and fix the substrate, making the substrate more stable when spraying adhesive on the substrate surface. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view structural diagram of the present invention;

[0020] Figure 2 A schematic diagram of the spraying and leveling mechanism;

[0021] Figure 3 This is a schematic diagram of the spraying assembly structure;

[0022] Figure 4 A schematic diagram of the flattening component structure;

[0023] Figure 5 This is a schematic diagram of the pressing mechanism.

[0024] In the diagram: 1. Fixed platform; 2. Transmission platform; 3. Support frame; 4. Pressing mechanism; 41. Second threaded rod; 42. Pressing plate; 43. Sliding bar; 44. Connecting frame; 45. Threaded plate; 46. Servo motor; 5. Spraying and leveling mechanism; 51. Spraying assembly; 511. Cylinder; 512. Fixed plate; 513. Slide plate; 514. Transmission pipe; 515. Water pump; 516. Water tank; 517. Connecting plate; 518. Diverter plate; 519. Spray head; 5191. Linkage plate; 52. Leveling assembly; 521. Support component; 522. Sliding rod; 523. First threaded rod; 524. Scraper; 525. Worm gear; 526. Limiting plate; 527. Worm wheel; 528. First motor. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] This utility model provides the following technical solution: Example 1

[0028] Please see Figure 1-5 This utility model provides a technical solution: an auxiliary device for the preparation of semiconductor anti-adhesion film composite, including a fixed platform 1, a transfer platform 2 arranged inside the fixed platform 1, a support frame 3 fixedly connected to the top of the fixed platform 1, a spraying and scraping mechanism 5 arranged in the middle of the top of the support frame 3, and pressing mechanisms 4 arranged on the left and right sides of the top of the support frame 3.

[0029] The spraying and leveling mechanism 5 includes a spraying component 51 and a leveling component 52. The spraying component 51 is disposed on the top of the support frame 3, and the leveling component 52 is disposed on the top of the spraying component 51.

[0030] The spraying assembly 51 includes a connecting plate 517, which is fixedly connected to the back end of the fixed platform 1. A water tank 516 is fixedly connected to the top of the connecting plate 517. A transmission pipe 514 is fixedly connected to the inside of the water tank 516. A water pump 515 is fixedly connected to the outside of the transmission pipe 514. The water pump 515 is fixedly connected to the top of the water tank 516. A diverter plate 518 is fixedly connected to the front of the transmission pipe 514. A spray head 519 is fixedly connected to the bottom of the diverter plate 518. A linkage plate 5191 is fixedly connected to the right side of the diverter plate 518. A slide plate 513 is fixedly connected to the top of the linkage plate 5191. A cylinder 511 is fixedly connected to the right side of the slide plate 513. A fixing plate 512 is fixedly connected to the left side of the cylinder 511. The fixing plate 512 is fixedly connected to the top right side of the support frame 3.

[0031] Furthermore, the inner side of the support frame 3 is provided with a sliding groove corresponding to the movement trajectory of the slide plate 513, and the support frame 3 is slidably connected to the inside of the sliding groove. Through the sliding groove, when the cylinder 511 operates, it can drive the linkage plate 5191 and the diverter plate 518 to move through the slide plate 513, so that the spray head 519 can spray the glue onto different positions on the surface of the substrate. Example 2

[0032] Please see Figure 1-5 Furthermore, based on Embodiment 1, the scraping assembly 52 further includes a first motor 528, which is fixedly connected to the top of the linkage plate 5191. A worm gear 525 is fixedly connected to the back end of the first motor 528. A worm wheel 527 is meshed on the right side of the worm gear 525. A support member 521 is fixedly connected to the bottom periphery of the worm wheel 527. A first threaded rod 523 is threadedly connected inside the worm wheel 527. A limit plate 526 is fixedly connected to the top of the first threaded rod 523. A scraper 524 is fixedly connected to the bottom of the first threaded rod 523. A slide rod 522 is fixedly connected to the top of the scraper 524. The slide rod 522 is fixedly connected to the bottom of the limit plate 526.

[0033] Furthermore, a circular groove corresponding to the movement trajectory of the support member 521 is provided on the inner side of the linkage plate 5191, and the support member 521 is slidably connected inside the circular groove. Through the circular groove, the support member 521 can slide inside the linkage plate 5191. The support member 521 can support the worm gear 527, making the worm gear 527 more stable during rotation.

[0034] Furthermore, there are two slide rods 522, which are slidably connected inside the linkage plate 5191. The slide rods 522 can limit the scraper 524, making the scraper 524 more stable during the lifting and lowering process. Example 3

[0035] Please see Figure 1-5Furthermore, based on Embodiment 1, the pressing mechanism 4 further includes a servo motor 46, which is fixedly connected to the top left and right sides of the support frame 3. A second threaded rod 41 is fixedly connected to the bottom of the servo motor 46. A connecting frame 44 is rotatably connected to the bottom of the second threaded rod 41. The connecting frame 44 is fixedly connected to the bottom of the support frame 3. A threaded plate 45 is threadedly connected to the periphery of the second threaded rod 41. A slide bar 43 is fixedly connected to the bottom of the threaded plate 45. A pressing plate 42 is fixedly connected to the bottom of the slide bar 43.

[0036] Furthermore, a fixing hole corresponding to the movement trajectory of the slide bar 43 is provided on the inner side of the connecting frame 44, and the slide bar 43 is slidably connected inside the fixing hole. Through the fixing hole, the slide bar 43 can slide inside the connecting frame 44. The slide bar 43 can limit the threaded plate 45, making the threaded plate 45 more stable during the lifting and lowering process.

[0037] In actual operation, when this device is used to prepare a semiconductor anti-adhesion film, the adhesive-bearing substrate is placed on the top of the transfer stage 2. The water pump 515 transfers the adhesive inside the water tank 516 to the transfer pipe 514. The adhesive is then transferred through the transfer pipe 514 to the distribution plate 518, so that the adhesive is sprayed onto the substrate surface through the spray head 519. The cylinder 511 can drive the slide plate 513 and the linkage plate 5191 to move, so that the linkage plate 5191 can drive the distribution plate 518 to move, so that the spray head 519 can spray the adhesive onto different positions on the substrate surface.

[0038] When it is necessary to smooth the sprayed glue, the first motor 528 drives the worm 525 to rotate, which in turn drives the first threaded rod 523 to rotate through the worm wheel 527. The first threaded rod 523 then drives the scraper 524 to move downward, so that the scraper 524 can scrape the glue on the surface of the substrate, making the glue more even.

[0039] When it is necessary to spray adhesive onto the surface of the semiconductor anti-adhesion film substrate, the servo motor 46 drives the second threaded rod 41 to rotate, so that the second threaded rod 41 drives the slide bar 43 and the pressing plate 42 to move downward through the threaded plate 45, so that the pressing plate 42 can press and fix the substrate, making the substrate more stable when spraying adhesive onto the substrate surface.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. An auxiliary device for preparing semiconductor anti-adhesion film composites, comprising a fixed stage (1), characterized in that: A transmission platform (2) is provided inside the fixed platform (1), a support frame (3) is fixedly connected to the top of the fixed platform (1), a spraying and scraping mechanism (5) is provided in the middle of the top of the support frame (3), and a pressing mechanism (4) is provided on the left and right sides of the top of the support frame (3). The spraying and leveling mechanism (5) includes a spraying component (51) and a leveling component (52). The spraying component (51) is disposed on the top of the support frame (3), and the leveling component (52) is disposed on the top of the spraying component (51). The spraying assembly (51) includes a connecting plate (517), which is fixedly connected to the back end of the fixed platform (1). A water tank (516) is fixedly connected to the top of the connecting plate (517). A transmission pipe (514) is fixedly connected to the inside of the water tank (516). A water pump (515) is fixedly connected to the outside of the transmission pipe (514). The water pump (515) is fixedly connected to the top of the water tank (516). A branch is fixedly connected to the front of the transmission pipe (514). A flow plate (518) is fixedly connected to a spray head (519) at the bottom of the flow plate (518). A linkage plate (5191) is fixedly connected to the right side of the flow plate (518). A sliding plate (513) is fixedly connected to the top of the linkage plate (5191). A cylinder (511) is fixedly connected to the right side of the sliding plate (513). A fixing plate (512) is fixedly connected to the left side of the cylinder (511). The fixing plate (512) is fixedly connected to the top right side of the support frame (3).

2. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 1, characterized in that: The inner side of the support frame (3) is provided with a sliding groove corresponding to the movement trajectory of the slide plate (513), and the support frame (3) is slidably connected to the inside of the sliding groove.

3. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 1, characterized in that: The leveling assembly (52) includes a first motor (528), which is fixedly connected to the top of the linkage plate (5191). A worm gear (525) is fixedly connected to the back end of the first motor (528). A worm wheel (527) is meshed on the right side of the worm gear (525). A support member (521) is fixedly connected to the bottom periphery of the worm wheel (527). A first threaded rod (523) is threaded inside the worm wheel (527). A limit plate (526) is fixedly connected to the top of the first threaded rod (523). A scraper (524) is fixedly connected to the bottom of the first threaded rod (523). A slide rod (522) is fixedly connected to the top of the scraper (524). The slide rod (522) is fixedly connected to the bottom of the limit plate (526).

4. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 3, characterized in that: The inner side of the linkage plate (5191) is provided with a circular groove corresponding to the movement trajectory of the support member (521), and the support member (521) is slidably connected inside the circular groove.

5. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 3, characterized in that: There are two slide rods (522), and the two slide rods (522) are slidably connected inside the linkage plate (5191).

6. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 1, characterized in that: The pressing mechanism (4) includes a servo motor (46), which is fixedly connected to the top left and right sides of the support frame (3). A second threaded rod (41) is fixedly connected to the bottom of the servo motor (46). A connecting frame (44) is rotatably connected to the bottom of the second threaded rod (41). The connecting frame (44) is fixedly connected to the bottom of the support frame (3). A threaded plate (45) is threadedly connected to the outer periphery of the second threaded rod (41). A slide bar (43) is fixedly connected to the bottom of the threaded plate (45). A pressing plate (42) is fixedly connected to the bottom of the slide bar (43).

7. The auxiliary device for preparing semiconductor anti-adhesion film composites according to claim 6, characterized in that: The inner side of the connecting frame (44) is provided with a fixing hole corresponding to the movement trajectory of the slide bar (43), and the slide bar (43) is slidably connected inside the fixing hole.

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